DE1814805A1 - Electrical cross connection between two or more levels of printed circuit boards - Google Patents

Description

STANDARD ELEKTRIK LORENZ AG 181 4 8 0 5

7ooo Stuttgart-Zuffenhausen
Hellmuth-Hirth-Str. 42

J. Duhm «5

Electrical cross-connection between two or more conductor levels of printed circuits.

The invention relates to an electrical cross-connection between two or more conductor levels on insulating plates or foils applied to printed circuits.

Due to the high packing density in today's electronic devices, insulating material plates are used as a carrier for the wiring with a printed circuit applied on both sides or several layers of insulating material with printed circuit boards Circuits used. This results in the task of creating a favorable through connection between the individual lei = create tiers in the desired places.

In the case of insulating panels with conductor tracks on both sides It has been proposed to make holes at the desired connection points, rivets or rivets in these holes Insert pins and solder these rivets or pins to the conductor tracks on both sides of the insulating plate, The disadvantage of this additional component and its difficult installation were discussed in another To avoid through-connection type by inserting rivets into the holes at the desired connection points Structures were used in which, when soldering one side, tin rises to the other side and after solidification forms a through connection.

11/11/1968 Wr / Wa './.

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τ η * * ο 18U805

J. Duhm - 5 - 2 -

In order to avoid the disadvantages of through-connection types with additional components, difficult installation, high costs, It has been suggested that the through connections by galvanic deposits on the Loohwandungen of the required To reach holes at the connection points. It was found that there is often only an unsafe Durohm contact has been achieved and that high costs are incurred.

In the case of multilayer printed circuits, it is known to make the electrical cross connections by means of conductive pins. These pins or the connecting wires of the components used are guided at the edges in notches or holes in the circuit boards. The pins or leads can sit loosely in the holes and be soldered only at the junctions with the respective conductive tracks, they may be also pressed and to produce the desired compound by the clamping with the conductor tracks.

The disadvantage of this type of connection is the additional component, the exact alignment of all superimposed Sun holes and the different diameters of the holes.

The invention is based on the object of avoiding the above-mentioned disadvantages and an electrical cross-connection between two and multi-layer conductor levels of printed circuits to create a secure Contact is guaranteed and does not require any additional components. According to the invention this is achieved in that at least one copper foil in the area of the hole in which the electrical cross connection or through connection is made, Has tabs and these tabs are pulled through in the hole area or folded over to the next conductor level and After soldering the printed circuit, the solder creates the electrical connection between the conductor levels.

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This creates an economical and safe electrical connection between several printed conductor levels Circuits achieved. The electrical cross-connection does not require any additional component and it does not matter whether it is in the Through connection hole a connection pin of components is used or not.

To refine the invention, it is used if the copper foils are cut out on only three sides and the The resulting tongues are placed on one side on the next conductor level in the direction of the soldering side. This results in a work simplification, because the flaps are only folded on one side.

In a further embodiment of the invention, the conductor foils are only cut out, so that when equipping the connecting pins of the components press the tabs apart. This results in a certain self-retention of the components in the time from the assembly to the soldering process.

It is also advantageous if the insulating panels with the printed circuits to increase the rigidity are applied to a thick carrier plate. The connection can be done through an adhesive or through the tabs of the through connection.

It is also possible, when using conductor foils, that the flaps of the through-connection are made before gluing are folded over with the carrier plates and fixed by soldering or welding.

Further advantages of the invention can also be seen from the description. In the drawings for the description shows:

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Pig. la to e the through-connection in the case of one-sided laminated

Plates as raw material;

FIG. 2 shows the through connection according to FIG. 1 with inserted Component;

3 shows the through connection according to FIG. 1 without a component;

Fig. 4a to ο a variant of the through connection according to Fig.l;

Fig. 5a, b a through connection with one-sided bent Lobes;

Fig. 6a to ο a through connection in the unlaminated

Plates as raw material;

7 and 8 show the through connection in the case of multilayer insulating material panels;

9 and Io show a through connection in the case of two-sided account Conductor foils;

11, 12, 13 show a variant of the through connection

Conductor foils;

14, 15, 16 through connections in multi-layer conductor foils;

Fig. 17a, b a through connection with simultaneous

Adaptation to the component connection;

18 conductor foils on fixed rows of pins;

19 shows a through connection in the case of multilayer conductor foils with simultaneous adaptation to the Component connection.

1 shows how a second lamination is applied to a printed circuit board 1 laminated on one side and the through connection is established. After punching the printed circuit board 1, which is laminated on one side, and possibly

j5o roughening the surface 3 and rounding the hole edges a copper foil 2 provided with an adhesive layer 4 under the action of pressure and temperature on the pretreated Surface 3 applied (Fig. Ib). This circuit board 1, which is now laminated on both sides, is made by known methods printed on both sides or treated photo-chemically and that

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desired conductor pattern etched out (Pig. lc). The adhesive layer 4 on the side facing the hole 5 afterwards The applied copper foil 2 acts as an etching resist. Shaped perforated needles press the copper foil 2 in the area

. 5 of the hole 5 in the direction of the later Lö'tseite

(Pig. Ld). The resulting flaps 6 are placed on the . The solder eye of the first lamination on the underside of the circuit board 1 is turned over (Pig. Le). During the subsequent soldering process the electrical connection between the two conductor levels is established.

In Fig. 2, a circuit board 1 is shown with a soldered component that is used for stiffening on a carrier plate 7 was glued on. In the left half of the figure, the flap 6 is not folded over, in contrast to the right Figure side. The solder 9 connects the component 8 with the two conductor levels and these with each other.

Fig. J5 shows a © through connection without an inserted component, left with open hole 5 * right with Lot 9 closed hole 5.

A modification of the through connection is shown in FIG. A thick carrier plate lo that doubles as a stiffening plate is used, is punched, provided with a copper foil and applied the desired conductor pattern 11. on this carrier plate Io is a thin, one-sided mltr a Conductor pattern provided and perforated circuit board 12 glued. The glue can be made either from an adhesive film or from an adhesive film 13 applied to the non-laminated side of the printed circuit board 12 (FIG. 4b). How nice will now be described on the insulating plate Io Applied copper foil pressed through and the resulting tabs 14 folded over. It is also possible that the mechanical Connection between the carrier plate Io and the circuit board 12 by the folded flaps 14 instead of one

Glue takes place. /

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Pig. Figure 5 shows a through connection after that in Pig. 2 described type. Here, the subsequently applied copper foil is only cut on three sides in the hole area, so that a tongue 15 is formed which is folded over on one side.

In Fig. 6 is the establishment of a through connection between two conductor levels shown with unclad starting material. An unkasohierte Isolierstoffplatte 16 is on one side is laminated with a copper foil 17 and this after gluing with to the holes 18 in the insulating plate 16 concentrically extending smaller holes 19 provided (Fig. 6a). Then the lamination of the second side created and the desired conductor pattern generated on both sides, the adhesive layers 2o again act as an etching residue (Fig. 6b). Then the Laminations formed by needles (Fig. 6c right Side) and the resulting flaps 21 folded (Fig. 6c left side). During the subsequent soldering process, the two Conductor levels and a possibly inserted component connected to one another.

The application of the through connection in multilayer printed circuit boards is shown in FIGS. A perforated insulating material plate 22 is subsequently provided with a copper foil on one side and the desired conductor pattern 2J> is produced using known methods. The second side of the insulating plate 22 is now provided with an adhesive film (FIG. 7a). The printed circuit boards produced in this way are glued to one another in the desired number (four in the example). The lowermost insulating material plate 22 can be provided with a conductor pattern on both sides (FIG. 7b). Thereafter , the copper foils in the area of the holes are shaped into tabs 25 in the manner already described and bent in the direction of the later soldering side, the multilayer

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circuit assembled and soldered (Fig. 7c, ^% left with, right without component). The solder 26 connects the individual conductor levels and the component 2? together. If no component is inserted into one of the through-connection holes, a short resilient hollow pin can be inserted into the hole if it appears necessary. The hollow pin can be plated with a solder with a higher melting point and, for example, soldered to the laminations by means of resistance heating.

If pre-perforated, double-sided laminated printed circuit boards 28 are to be used in a multilayer circuit, then As shown in Fig. 8, the adhesive layer between the individual circuit boards 28 to form an adhesive and insulating layer to expand. The electrical connection is also made here through the tabs already described; 5o after the Soldering process.

Not all levels of multilayer circuits are supposed to be electrical are connected to each other, the corresponding conductor tracks are not up to the holes in which the Through connection happens, led.

Instead of insulating panels with copper cladding Conductor foils laminated on both sides can also be used. Such conductor foils 34 are shown in FIGS. 9 and 10 on perforated carrier plates 31, which are made of cheap insulating material can exist, for example by gluing, ruffled. The adhesive layer 32 may take the shape of a corresponding one have perforated adhesive film on the carrier plate 31 or have already been applied to the carrier plate 31 as KLebefiXm be. After gluing, a punching tool is fitted with appropriately shaped punching needles is, lobes 37 in the drawn W-eJse in the direction of the Solder side pushed out. In Fig. 9 there is a pad 33

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with three and in Pig. Io drawn with four lobes 37. the electrical connection between the conductor levels and the component 35 is produced by the solder 30, which favors due to the advantageous adaptation of the breakthrough to the component connection cross-section and the resulting Capillaries capable of flowing around all three components to be connected. In Pig. Io is the through connection shown on the left without and on the right with component.

Since the breakthroughs are only made after gluing, sioh inaccuracies act between the conductor or. Loohblldern of the two layers less. Any glue that may ooze is also much less of a hindrance. Because the hole 38 in the carrier plate Jl is larger and the hole in the conductor foil is smaller than the component connection cross-section, is a light fitting and a certain self-retention of the components up to Soldering process guaranteed.

Like in Pig. 5 is also described in Pig. Il shows how, when using conductor foils Jk- which are applied to carrier plates 31 by an adhesive layer 32, the foils are only cut out on three occasions and the tongue 37 formed is folded over on one side onto the soldering side of the conductor foil 34. The solder 36 effects the electrical connection between the component 35 and the conductor planes. In Fig. 12 the same through connection is shown as in Fig. 11 without inserted component. It is also possible to use the conductor foils without a carrier plate if there are enough retaining pins of components (Fig. 13).

In Fig. 14 to 16 through connections are shown in multi-layer conductor foils. A double-sided laminated conductor foil 39 and a conductor foil 4o laminated on one side

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The solder J6 takes over the electrical connection between the individual conductive foils and the component 35, the tabs IbZW ₉ tongues 3? can be turned over or only pushed through to hold the components (FIGS. 14, 15). Two conductive foils 39 laminated on both sides are. Pig, 16 " connected by an adhesive and insulating layer 4l. Since no component is used in the through connection shown, the shaped tabs are folded over and the conductor levels are connected to one another by the solder 36.

If different cross-sections of component connections are used, it is advantageous if the conductor foils 43 are only incised in the area of the soldering eyes 42 (FIG. 17a). Depending on the diameter of the connecting pins of the components, the resulting tabs are now more or less pressed apart (FIG. 1B). This X'iivd achieved a good adaptation to the Ansohlußstifte and a good contact. This type of through connection in the case of double-sided laminated conductor foils without a carrier plate can be used, for example, as shown in FIG. 18, for wiring fixed rows of pins. It is possible that the sharpened pins 45 of the pin strip 46 in the conductor foil 4? create their own breakthrough.

19 shows the adaptation of the through connection again shown in a multilayer circuit. On a support plate 48 are two by one. Adhesive layer 49 isolated Conductor foils laminated on both sides are applied 5o. In the manner shown, lobes are formed in the area of the soldering eyes 51 shaped. The connecting pins 52 widen during assembly the components on the tabs accordingly. Lot 53 establishes the electrical connection between the soldering eyes of the four conductor levels and the component connection.

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In the case of permanent connections of conductor foils with folded over These can also be folded over with cloths before gluing and fixed by soldering or welding will. The holes in the carrier plates and foils can also be made by known methods of etching technology to be created.

6 claims
Sheet of Drawings, 19th Pig.

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Claims (6)

J. Duhra - 5 -IX- 18U805 claims 1. Electrical cross-connection between two or more conductor levels of printed circuits applied to insulating material plates or foils, characterized in that at least one copper foil (2, 17) in the area of the hole (5 * l8> 38) # in which the electrical cross-connection or through-connection happens, has tabs (6) and these tabs (6, 14, 21, 25, 3o, 37) are pulled through in the hole area or turned over to the next conductor level and after soldering the printed circuit the solder (9, 26, 36, 53 ) establishes the electrical connection between the conductor levels. 2. Electrical cross connection according to claim 1, characterized in that the copper foils only on three Sides are cut out and the resulting tongues (15 * 37) on one side on the next in the direction of the soldering side Ladder levels are moved. 3 «Electrical cross-connection according to claim I _3, characterized in that the conductor foils (43, 5o) are only cut into in the area of the soldering eyes (42, 51) and the connecting pins (44) of the components press the tabs apart and the component is thus held in place« , 4 * Electrical cross connection according to claim 1, characterized in that the insulating material plates (1, 12) with the printed circuits to increase the rigidity are applied to a disc carrier plate (7 * lo) «, IX.11.1968 Wr / Wa ./. 009840/0479 5. Electrical cross connection according to claim 1 and 4,
characterized in that the insulating st off plates (1, 12) are connected to the carrier plates (7, Io) by an adhesive or by the tabs of the through connection. 6. Electrical cross connection according to claim 1, characterized in that, when using conductor foils, the tabs of the through connection are folded over and through before gluing to the carrier plates
Soldering or welding are fixed. 009840/0479