DE1778242U - CARRIER PLATE FOR PRINTED CIRCUITS. - Google Patents

CARRIER PLATE FOR PRINTED CIRCUITS.

Info

Publication number
DE1778242U
DE1778242U DE1958T0009857 DET0009857U DE1778242U DE 1778242 U DE1778242 U DE 1778242U DE 1958T0009857 DE1958T0009857 DE 1958T0009857 DE T0009857 U DET0009857 U DE T0009857U DE 1778242 U DE1778242 U DE 1778242U
Authority
DE
Germany
Prior art keywords
heat
carrier plate
arrangement
attached
marked
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE1958T0009857
Other languages
German (de)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Metz Transformatoren & App
Original Assignee
Metz Transformatoren & App
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Metz Transformatoren & App filed Critical Metz Transformatoren & App
Priority to DE1958T0009857 priority Critical patent/DE1778242U/en
Publication of DE1778242U publication Critical patent/DE1778242U/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10553—Component over metal, i.e. metal plate in between bottom of component and surface of PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10969—Metallic case or integral heatsink of component electrically connected to a pad on PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Description

Trägerplatte für gedruckte Schaltungen Es hat sich als mißlich herausgestellt, daß beim Auftreten örtlieher Überhitzung durch ein Bauelement die Leiterplatte einer gedruckten Schaltung beschädigt werden kann, was in den meisten Fällen dann die Auswechslung der gesamten bestückten Platte zur Folge hat.Printed Circuit Board Support Plate It has been found annoying that when occurring Local overheating caused by a component on the circuit board a printed circuit can be damaged, which in most cases then results in the replacement of the entire populated board.

Gemäß der Neuerung wird die Trägerplatte einer gedruckten Schaltung auf der, den Leitungszügen abgewendeten Seite, also auf der Seite der Bauelemente mit einer wärmeableitenden metallischen Schutzbelag versehen, der an den Stellen der Anschlußdurchführungen und gegebenenfalls gegenüber Leitungszügen, die besondeers geringe Kapazität gegen masse haben sollen, ausgespart ist, versehen. Zur elektrischen Isolierung wird dieser metallische, ebenfalls mit den Mitteln des Leitungsdruckes aufgebrachte Überzug mit einem wärmeabsorbierenden und wärmeabstrahlenden Schutzlack versehen.According to the innovation, the carrier plate becomes a printed circuit on the side facing away from the cable runs, i.e. on the side of the components provided with a heat-dissipating metallic protective coating on the points the connection bushings and, if necessary, against cable runs, the special should have low capacitance to ground, is recessed, provided. For electrical This insulation becomes metallic, also by means of the line pressure applied coating with a heat-absorbing and heat-radiating protective varnish Mistake.

Der Vorteil der Neuerung ist zweierlei : 1.) Für den Fall der WärmezerstSrung eines Bauelementes wird das Auftreten örtlicher Überhitzungen und damit eine Schädigung der Leiterplatte unterbunden und 2.) bringt die allgemeine Veerbesserung der Wärmeableitung eine Erhöhung der Belastbarkeit der Bauelemente und damit einen weiteren Schritt zur stetig fortschreitenden Miniaturisierung.The advantage of the innovation is twofold: 1.) In the event of heat destruction of a component is the occurrence of local overheating and thus damage the circuit board prevented and 2.) brings the general improvement of the heat dissipation an increase in the resilience of the components and thus a further step to the ever advancing miniaturization.

Die Abbildung zeigt die Anordnung gemäß der Neuerung.The figure shows the arrangement according to the innovation.

1 stellt die trägerplatte der gedruckten Schaltung dar, 2 sind einige im Durchschnitt gezeigte, gedruckte leiterzüge, 3 der wärmeableitende metallische Schutzbelag mit Aussparungen, 4 der elektrisch isolierende und gleichzeitig den Wärmeaustausch fördernde Schutzlack und 5 ein Bauelement mit den Anschlußfahnen 6.1 represents the printed circuit board, 2 are some Printed conductors shown on average, 3 the heat-dissipating metallic ones Protective covering with recesses, 4 the electrically insulating and at the same time the Heat exchange promoting protective varnish and 5 a component with the terminal lugs 6th

Claims (1)

Sohutzanspra. ehe
1.) trägerplatte für lieitungzzug und eaueleraen « be einer gedruckten Schaltng dadueh gekennzeichnet daß die denBauelementen zugekehie Seite der Tägerpiatte mit einer wärmeableitenden metallischem Belag versehen wird.
2.)Anordnung naoh Anspruch 1, dadurch gekennzeichnet, daß dermetallische elag mit einem eektrisch isolierenden SchutaDerug ersehen ist, de außerdem wärme abstrahlend und wärmeabsorbierend wirkt umd darit die w rmeableitenäe und temperaturausgleichende Wirkung des Netallbelages unterstützte
3.) Anordnung : rduung 1 und 2> dadurch gel, e-nnzeiehnotg daß der Wärmeschutzbelag an den Stellen der Lotfahnenanschlüa so und gegenüber besonders kapazitätsarm zu führender Leitungsüge ausgespart ist.
4<) Anordnung nach Anyehen 1 bis 3 dadurch gekennzeieh- net, daß der wärNeäbleiteNdemetallische Belag nr an den Stellen steuer Tärmebeanspxuahung der Trägerplatte angebrachtwird.
Sohutzanspra. before
1.) Carrier plate for cable pull and eaueleraen «on one printed circuit dadueh marked that the The side of the carrier plate is attached to the structural elements a heat-dissipating metallic coating is provided.
2.) arrangement naoh claim 1, characterized in that dermetallic elag with an electrically insulating SchutaDerug can also be seen to emit heat and thus the heat dissipation has a heat-absorbing effect and temperature-equalizing effect of the Netall covering supported
3.) Arrangement: rounding 1 and 2> thus gel, e-nnzeiehnotg that the heat protection coating at the points of the solder lugs so and opposite particularly low-capacity to be leader Line is left out.
4 <) Arrangement according to Anyehen 1 to 3 thereby marked net that the heat-conducting metallic coating no the bodies control heat exposure of the carrier plate is attached.
DE1958T0009857 1958-09-23 1958-09-23 CARRIER PLATE FOR PRINTED CIRCUITS. Expired DE1778242U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE1958T0009857 DE1778242U (en) 1958-09-23 1958-09-23 CARRIER PLATE FOR PRINTED CIRCUITS.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE1958T0009857 DE1778242U (en) 1958-09-23 1958-09-23 CARRIER PLATE FOR PRINTED CIRCUITS.

Publications (1)

Publication Number Publication Date
DE1778242U true DE1778242U (en) 1958-11-27

Family

ID=32840512

Family Applications (1)

Application Number Title Priority Date Filing Date
DE1958T0009857 Expired DE1778242U (en) 1958-09-23 1958-09-23 CARRIER PLATE FOR PRINTED CIRCUITS.

Country Status (1)

Country Link
DE (1) DE1778242U (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1243254B (en) * 1964-08-07 1967-06-29 Telefunken Patent Support body for microcircuits
DE1280355B (en) * 1961-09-29 1968-10-17 Siemens Ag Plate assembly for devices and systems of electrical communications engineering
DE1591199B1 (en) * 1966-06-13 1970-12-10 Ibm Circuit arrangement for electronic circuits
DE1766144B1 (en) * 1968-04-09 1971-01-07 Telefunken Patent Housing with a carrier plate to accommodate integrated circuits
DE2833480A1 (en) * 1978-07-31 1980-02-14 Siemens Ag Circuit board for communication equipment - consists of foil with holes broken in it for component leads soldered to foil edges
DE8623251U1 (en) * 1986-08-29 1987-12-23 Robert Bosch Gmbh, 7000 Stuttgart Disc-shaped dielectric carrier plate

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1280355B (en) * 1961-09-29 1968-10-17 Siemens Ag Plate assembly for devices and systems of electrical communications engineering
DE1243254B (en) * 1964-08-07 1967-06-29 Telefunken Patent Support body for microcircuits
DE1591199B1 (en) * 1966-06-13 1970-12-10 Ibm Circuit arrangement for electronic circuits
DE1766144B1 (en) * 1968-04-09 1971-01-07 Telefunken Patent Housing with a carrier plate to accommodate integrated circuits
DE2833480A1 (en) * 1978-07-31 1980-02-14 Siemens Ag Circuit board for communication equipment - consists of foil with holes broken in it for component leads soldered to foil edges
DE8623251U1 (en) * 1986-08-29 1987-12-23 Robert Bosch Gmbh, 7000 Stuttgart Disc-shaped dielectric carrier plate

Similar Documents

Publication Publication Date Title
EP1601016A2 (en) Apparatus in screw pressure contact with a power semiconductor module
DE4218112B4 (en) Electrical apparatus, in particular switching and control apparatus for motor vehicles
DE102015215133A1 (en) Semiconductor device
DE112021000451T5 (en) POWER CONVERSION DEVICE
DE69400397T2 (en) Device for shielding and / or cooling the electronic components
DE102014109515A1 (en) Semiconductor device to be attached to a heat radiating element
DE3627372C2 (en)
DE1778242U (en) CARRIER PLATE FOR PRINTED CIRCUITS.
DE2336878A1 (en) Electric component heat conductive housing - has heat conductive support plates for heat generating component with cover plates
GB1258485A (en)
DE2543968A1 (en) INTEGRATED CIRCUIT ARRANGEMENT
DE112015001037B4 (en) Electronic device module and power supply module
DE7505830U (en) DEVICE FOR HIGH-VOLTAGE-PROOF AND GOOD THERMAL CONDUCTING INSTALLATION OF SEMICONDUCTOR COMPONENTS
EP0061518A1 (en) Heat dissipation device for electronic circuits mounted without a casing
DE102021102445A1 (en) Semiconductor device and manufacturing method of semiconductor device
DE6910426U (en) ELECTRICAL ASSEMBLY.
DE1288631B (en) Television receiver from a number of prefabricated separate transistorized stages
DE1246836B (en) Pluggable module in the form of a printed circuit card
DE3412129A1 (en) Push-in assembly
DE8108938U1 (en) Unit for communications engineering equipment
DE19501895A1 (en) Electrical circuit with heat-dissipating casting for motor vehicle
JPS6344980Y2 (en)
DE7040339U (en) COOLER FOR TRANSISTORS IN PLASTIC HOUSING
DE1146165B (en) Device for cooling electrical switching elements
DE1845840U (en) COVER PLATE FOR PRINTED CIRCUITS.