DE1777388U - COMPONENT FOR PRINTED CIRCUITS. - Google Patents
COMPONENT FOR PRINTED CIRCUITS.Info
- Publication number
- DE1777388U DE1777388U DER17019U DER0017019U DE1777388U DE 1777388 U DE1777388 U DE 1777388U DE R17019 U DER17019 U DE R17019U DE R0017019 U DER0017019 U DE R0017019U DE 1777388 U DE1777388 U DE 1777388U
- Authority
- DE
- Germany
- Prior art keywords
- printed circuits
- component
- plate
- components
- connection contacts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
- H05K3/308—Adaptations of leads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Metallurgy (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Description
Bauelemente fär gedruckte Schaltungen Bei gedruckten Schaltungen (genauer ausgedrückt, geätzten Leiterplatten) ist auf einer Isolierplatte (meist Hartpapier) eine Kupferschicht aufgeklebt, aus der alle Teile ausgeätzt wurden, die nicht als Verdrahtung zwischen den einzelnen Bauelement-Anschlüssen dienen. Also bleiben die Leistungverbindungen stehen. Die Drahtanschlüsse der einzelnen Bauelemente ragen durch eingestanzte Löcher durch die Platte hindurch. Einer der Vorteile ist, daß alle diese Anschlüsse in einem Tauchlötverfahren auf einmal verlötet werden.Components for printed circuits In printed circuits (more precisely expressed, etched circuit boards) is on an insulating plate (usually hard paper) glued on a copper layer from which all parts were etched out that were not considered Wiring between the individual component connections are used. So they stay Performance connections. The wire connections of the individual components protrude through punched holes through the plate. One of the advantages is that all of these connections are soldered at once in a dip soldering process.
Vor dem Lötvorgang werden diese geätzten Leiterplatten bestückt, und zwar von Hand oder auch automatisch. Die einzelnen Bauelemente werden an der betreffenden Stelle eingesetzt und sollen so ausgeführt sein, daß sie bei der folgenden Bestückung der anderen Bauelemente aus der Platte nicht wieder herausfallen, bis dann durch den Tauchlötvorgang die endgültige Festlegung erfolgt.Before the soldering process, these etched circuit boards are assembled, and by hand or automatically. The individual components are attached to the relevant Place used and should be designed so that they can be used in the following assembly the other components do not fall out of the plate again until then through the final determination is made during the dip soldering process.
Von den vielen vorkommenden Bauelementen werden im folgenden nur Widerstände (im besonderen drahtgewickelte Widerstände) und keramische Kondensatoren behandelt. Mit Rücksicht auf die bedingt zulässige Erwärmung der Hartfaserplatte-besonders durch Widerstände-ist in bekannter Weise durch an Lötfahnen befindliche Schultern oder andere Abstützungen Vorsorge getroffen, daß die widerstände in dem Gewünschten Abstand über der Platte gehalten werden.Of the many components that occur, only resistors are discussed below (especially wire-wound resistors) and ceramic capacitors. With regard to the conditionally permissible heating of the hardboard - especially through resistors - is in a known manner through shoulders located on soldering lugs or other supports, provision has been made that the resistances in the desired Distance above the plate.
Die Neuerung betrifft eine solche Ausbildung der Anschlußkontakte.
Diese werden unterhalb der Stützschulter in einem die Stärke von Isolierplatte und
Kupferbahn berücksichtigenden Abstand in sich verformt, damit einfederndes Einrasten,
das durch das Zusammenwirken beider Anschlußkontakte und der Befestigungslöcher
zustande kommt, die Bauelemente gegen späteres unbeabsichtigtes Herausfallen gesichert
sind. Bekannt ist wohl das federnde Einrasten von Bauelementen durch sogenannte
"snap-in"-Anschlüsse, die jedoch einen gänzlich anderen Aufbau aufweisen.
Figur 1 zeigt einen Widerstand gemäß der Neuerung in Längsrichtung
im eingerasteten Zustand, wobei die Hartpa-
Figur 4 zeigt einen Widerstand mit federnden Anschlußfahnen gemäß der Neuerung, kurz vor dem Einrasten in die Hartpapierplatte.Figure 4 shows a resistor with resilient terminal lugs according to the innovation, just before it snaps into the hard paper plate.
Figur 5 zeigt im vergrößerten Maßstab ein Fahnenende (a) des widerstandes, eingerastet in die Hartpapierplatte (b), vor dem Verlöten mit der aufgeklebten Kupferschicht (c).Figure 5 shows on an enlarged scale a flag end (a) of the resistor, snapped into the hard paper plate (b), before soldering with the glued-on copper layer (c).
Claims (1)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DER17019U DE1777388U (en) | 1958-09-12 | 1958-09-12 | COMPONENT FOR PRINTED CIRCUITS. |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DER17019U DE1777388U (en) | 1958-09-12 | 1958-09-12 | COMPONENT FOR PRINTED CIRCUITS. |
Publications (1)
Publication Number | Publication Date |
---|---|
DE1777388U true DE1777388U (en) | 1958-11-13 |
Family
ID=32838709
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DER17019U Expired DE1777388U (en) | 1958-09-12 | 1958-09-12 | COMPONENT FOR PRINTED CIRCUITS. |
Country Status (1)
Country | Link |
---|---|
DE (1) | DE1777388U (en) |
-
1958
- 1958-09-12 DE DER17019U patent/DE1777388U/en not_active Expired
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