DE152826C - - Google Patents
Info
- Publication number
- DE152826C DE152826C DE1902152826D DE152826DA DE152826C DE 152826 C DE152826 C DE 152826C DE 1902152826 D DE1902152826 D DE 1902152826D DE 152826D A DE152826D A DE 152826DA DE 152826 C DE152826 C DE 152826C
- Authority
- DE
- Germany
- Prior art keywords
- copper
- objects
- plating
- electricity
- conductive objects
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 9
- 229910052802 copper Inorganic materials 0.000 claims description 9
- 239000010949 copper Substances 0.000 claims description 9
- 238000007747 plating Methods 0.000 claims description 5
- 229910001174 tin-lead alloy Inorganic materials 0.000 claims description 2
- 230000005611 electricity Effects 0.000 claims 2
- 239000000428 dust Substances 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000000875 corresponding Effects 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1646—Characteristics of the product obtained
- C23C18/165—Multilayered product
- C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Description
KAISERLICHESIMPERIAL
PATENTAMT.PATENT OFFICE.
Vorliegende Erfindung bezieht sich aufThe present invention relates to
ein Verfahren zur Vorbereitung von nicht leitenden Gegenständen' für die galvanische Plattierung durch vorausgehende Verkupferung. a method of preparing non-conductive objects' for galvanic Plating through previous copper plating.
An sich ist es bereits bekannt, leitende Gegenstände durch Eintauchen in ein entsprechendes Bad mit Kupfer zu überziehen; es war jedoch bisher im allgemeinen nurIt is already known per se, conductive objects by immersion in a corresponding To coat the bath with copper; however, so far it has generally only been
ίο möglich, auf Grundlagen von Zink und Eisen ohne Anwendung eines Kontaktkörpers eine brauchbare Verkupferung zu erzielen. Derartige Grundlagen sind jedoch für nicht leitende Gegenstände in der Praxis nur schwer herzustellen. Dagegen können mit Sicherheit nach dem Verfahren der vorliegenden Erfindung nicht leitende Gegenstände mit einem dünnen Kupferüberzug versehen werden. Das Verfahren besteht darin, daß die metallisch zu überziehenden Gegenstände mit einer Harzlösung überzogen werden, welche vor ihrem gänzlichen Trocknen mit dem feinen Staube einer Zinn-Bleilegierung (dem im Handel für andere Zwecke erhältlichen Silberschliff) eingestaubt wird, worauf nach as gänzlichem Trocknen der überschüssige Staub leicht weggepinselt oder weggeblasen wird. Auf derart vorbereitete Gegenstände schlägt sich beim Einbringen in ein Kupferbad auch ohne Anwendung eines elektrischen Stromes und ohne Anwesenheit eines Kontaktkörpers eine dünne, hauchartige Kupferschicht nieder, welche für den nachher aufzubringenden elektrolytischen Niederschlag eine gute Grundlage abgibt.ίο possible based on zinc and iron to achieve a usable copper plating without the use of a contact body. Such Basics, however, are for non-conductive objects in practice only difficult to manufacture. On the other hand, according to the method of the present Invention non-conductive objects are provided with a thin copper coating. The method consists in that the objects to be coated with metal a resin solution are coated, which before their complete drying with the fine dust of a tin-lead alloy (the one commercially available for other purposes Silver cut) is dusted, whereupon after as the excess dust is easily brushed away or blown away when it is completely dry. Objects prepared in this way also strike when they are placed in a copper bath without the application of an electric current and without the presence of a contact body a thin, puff-like copper layer, which is to be applied afterwards electrolytic precipitate provides a good foundation.
Claims (1)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| AT23978D AT23978B (en) | 1902-12-08 | 1904-08-04 | Process for preparing non-conductive objects for electroplating by prior copper plating. |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE152826C true DE152826C (en) |
Family
ID=419514
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE1902152826D Expired - Lifetime DE152826C (en) | 1902-12-08 | 1902-12-08 |
Country Status (1)
| Country | Link |
|---|---|
| DE (1) | DE152826C (en) |
-
1902
- 1902-12-08 DE DE1902152826D patent/DE152826C/de not_active Expired - Lifetime
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