DE1302175B - - Google Patents
Info
- Publication number
- DE1302175B DE1302175B DE1302175A DE1302175DA DE1302175B DE 1302175 B DE1302175 B DE 1302175B DE 1302175 A DE1302175 A DE 1302175A DE 1302175D A DE1302175D A DE 1302175DA DE 1302175 B DE1302175 B DE 1302175B
- Authority
- DE
- Germany
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P50/00—Etching of wafers, substrates or parts of devices
- H10P50/60—Wet etching
- H10P50/64—Wet etching of semiconductor materials
- H10P50/642—Chemical etching
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P50/00—Etching of wafers, substrates or parts of devices
- H10P50/20—Dry etching; Plasma etching; Reactive-ion etching
- H10P50/24—Dry etching; Plasma etching; Reactive-ion etching of semiconductor materials
- H10P50/242—Dry etching; Plasma etching; Reactive-ion etching of semiconductor materials of Group IV materials
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DES0087502 | 1963-09-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE1302175B true DE1302175B (OSRAM) | 1970-07-23 |
Family
ID=7513808
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE1302175A Pending DE1302175B (OSRAM) | 1963-09-25 | 1963-09-25 |
Country Status (1)
| Country | Link |
|---|---|
| DE (1) | DE1302175B (OSRAM) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0020935A1 (en) * | 1979-06-29 | 1981-01-07 | International Business Machines Corporation | A dry method of etching and an apparatus using solid masking materials for etch rate modification |
| EP0536752A3 (en) * | 1991-10-11 | 1993-05-26 | Air Products And Chemicals, Inc. | Cleaning agents used during the fabrication of integrated circuits and associated process |
| WO1994027315A1 (en) * | 1993-05-13 | 1994-11-24 | Interuniversitair Microelektronica Centrum | Method for semiconductor processing using mixtures of hf and carboxylic acid |
| US5922624A (en) * | 1993-05-13 | 1999-07-13 | Imec Vzw | Method for semiconductor processing using mixtures of HF and carboxylic acid |
-
1963
- 1963-09-25 DE DE1302175A patent/DE1302175B/de active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0020935A1 (en) * | 1979-06-29 | 1981-01-07 | International Business Machines Corporation | A dry method of etching and an apparatus using solid masking materials for etch rate modification |
| EP0536752A3 (en) * | 1991-10-11 | 1993-05-26 | Air Products And Chemicals, Inc. | Cleaning agents used during the fabrication of integrated circuits and associated process |
| WO1994027315A1 (en) * | 1993-05-13 | 1994-11-24 | Interuniversitair Microelektronica Centrum | Method for semiconductor processing using mixtures of hf and carboxylic acid |
| US5922624A (en) * | 1993-05-13 | 1999-07-13 | Imec Vzw | Method for semiconductor processing using mixtures of HF and carboxylic acid |