DE1261205B - Method for the production of electrical assemblies with component carriers arranged in several levels and arrangement for implementation - Google Patents

Description

Process for the production of electrical assemblies with in several Component carriers arranged in planes and arrangement for carrying out the invention relates to a method for manufacturing electrical assemblies with in arranged on several levels, executed in the manner of a so-called printed circuit Component carriers, in particular for assemblies in telecommunications technology.

Printed circuits are understood to mean component carriers which the connecting and connecting lines necessary for the components as thin conductive layers applied to an insulated base and with this are firmly connected. It is irrelevant for the present invention which known methods are applied to the cable runs on the insulating pad became. For the sake of completeness, some of the known manufacturing methods are therefore included briefly mentioned. So z. B. first thin cable runs by a printing process applied to the insulating base and these are later reinforced. It can but also from a z. B. assumed with copper-clad insulating plate or foil be on the z. B. the desired by pressure by means of an etch-resistant paint Cable runs are applied, whereupon the uncovered areas by etching removed. Here, too, the conductor structure can be reinforced later if necessary will. Another known method is that the desired line runs vaporized and then also reinforced.

Should now be extensive in terms of circuitry on such component carriers Assemblies are accommodated, so there are essentially two-dimensional structures with a relatively large base area, which, however, have the advantage that on them all elements of the assembly are contained and these as a whole in one Operation can be manufactured and tested, especially if the connections are in take place in a known manner by plug connections. Also maintenance, repair or replacement the assemblies is relatively easy to carry out.

For a compact design of systems, however, it is now advantageous if the assemblies have cuboid dimensions that are as large as possible approximate a cube, i.e. dimensions that are largely due to the earlier cup construction were achieved. For this purpose, individual function groups of the assembly can now be clicked on housed separate component carriers of the same dimensions and then stacked them and connected to each other by edge wiring. Such arrangements are known from the so-called micromodule technology. You could also use the component carrier For the whole assembly, divide them into several component carriers, these next to each other arrange them and connect them to one another by wiring on one or two sides. Such a connection of the individual component carriers could also be by means of Plug connections take place.

Such arrangements are also known. Disadvantages of these arrangements are that several individual component carriers must be manufactured individually, whose overall function can only be tested after complete assembly, if not special test facilities are created for this. For maintenance and repair is it is necessary to sever the connections between the component carriers, so that the individual components are accessible.

Now is from American patents 2,880,378 and 3,039 177 a construction is known in which an initially planar line carrier is deformed into a U-shaped trough. Either a flat sheet-like one is used here Conductor carrier with the interposition of an insulating film on a U-shaped metal rail attached to their inner walls or a flat, stronger, thermoplastic one Cable carrier formed into a self-supporting U-rail by bending. The components are attached to the inside of the U-rail. It can with this arrangement If the components are in a suitable position, they may even be soldered in by so-called Dip soldering already done in the still flat conductor carrier, whereby a Functional test can already take place in this manufacturing state. After being converted into the U-shape it is possible to return it to the flat, two-dimensional form using simple means to test and repair work is no longer possible.

The Swiss patent 332 284 describes the structure of a overlay receiver, in the case of an initially flat film-shaped conductor carrier is assumed. By partially applying further foil-shaped line support parts an at least partially multilayer circuit carrier is obtained, which with part of the required components is fitted. Another part of the components is located in self-contained additional three-dimensional structural units, which are connected to the circuit board and their connections to the cable runs of the circuit carrier are soldered, wherein the film-shaped circuit carrier rests against one or more walls of these structural units. Through the partially multilayer structure of the circuit carrier and attachment of the additional structural units soldering is through on both sides of the foil-shaped circuit carrier Dip soldering is no longer possible. This construction method results in a good use of space, the film-shaped, partially multilayer circuit carrier can also be used attached additional three-dimensional structural units to the carrier housing remove again and transfer to an approximately flat form for testing purposes, without that the majority of the soldered connections need to be separated. Is disadvantageous however, that repair work is difficult to carry out due to the multi-layer structure are, in particular a repair of the additional three-dimensional structural units can practically only be done by replacing the entire unit.

The invention now has the task of providing a method for production of electrical assemblies with arranged in several levels, like a so-called printed circuit executed flat component carriers, the Component carrier using thin, film-shaped insulating materials which the desired lines are applied, are constructed, in particular for assemblies of telecommunications technology to indicate that the disadvantages described above avoids and enables the entire assembly to be assembled in a single operation. Here, starting from a flat circuit carrier, the components should be on stiffened component carriers that are parts of the circuit carrier, are located. The component carriers should then be able to move without producing only one Transfer another additional solder connection into the position of the assembled module leave and also back in the flat form, so that components for testing and repair, Soldering points and cable runs are freely accessible.

The given task is achieved through successive application the following process steps, some of which are known per se, have been solved: a) Manufacture a flat circuit carrier made of film-shaped, flexible insulating material which the required cable runs in a known manner by etching an applied conductive layer and / or by vapor deposition of conductive materials, in such a way that all later parallel one above the other, in one through the dimensions the components to be arranged on a certain distance individual component carriers this planar circuit carrier are arranged side by side in one plane that the individual component carriers through each other on the flat circuit carrier intended planar connecting parts with cable runs attached to them are connected that also the connecting cable runs for the electrical assembly on planar connection parts also provided on the flat line carrier are applied, the free ends of which are attached to the contacts of a connector on the connector Connector part are connected; b) stiffening of the individual component carriers before or after equipping with components by attaching to the surface or the outline of the component carrier stiffening surfaces with the same configuration, ribs or frames by gluing or riveting or pouring or spraying on hardenable material; c) Connect the components to the circuit of the planar Circuit carrier by dip soldering; d) Cutting out or punching out each Component carriers and the connecting and connecting parts connected to them, in such a way that they can be moved relative to one another; e) Assembling the assembly by rotating the component carrier in the desired position, with the positional fixation by inserting them into a support frame or by placing them on top of each other with correspondingly reinforced edges Component carriers and riveting, screwing or nesting of the edge stiffeners takes place and from this form for testing and repair purposes back into the flat form can be transferred.

To carry out the individual process steps are still appropriate arrangements are given. Here is for the individual process steps Suggested: for a) the circuit carrier double-sided, printed or as a multi-layer circuit, possibly self-adhesive; for b) either on the side facing away from the soldering side Side of the component carrier to apply a plate, at least at the points the soldered connections for inserting the components bores, preferably conical or pyramidal shape, these bores also in the form of a Lattice-shaped grid can be arranged, or on the side facing away from the soldering side Side of the component carrier after populating with components a layer curable Material by pouring or spraying on or the insulating film of the Component carrier on the side facing away from the soldering side by attaching an edge frame to stiffen. The cable runs can be wholly or partially covered by adhesive tape be protected with insulating film; for c) when soldering the components to the Connection lines of the component carriers by dip soldering at the same time the connections to connect the connector to the terminals of a plug connection; for d) stiffened by applying a plate or applying a hardenable material, now plate-shaped component carrier in guide rivets one Insert the holder frame or on the edge stiffeners of the component carrier Reinforcements with holes to accommodate connecting elements such as screws, Rivets, strips and retaining elements to be provided for fastening a plug connection.

The invention will now be described in detail with reference to the figures. It shows F i g. 1 an example of one used for the construction of an assembly flat circuit carrier, F i g. 2 a to 2 c examples of the stiffening of each Component carrier, F i g. 3 and 4 examples of the assembly of the assembly.

In Fig. 1 let 1 be a sheet with a conductive layer, e.g. B. copper-clad insulating film. The shape of three component carriers, which are connected to a connecting part 3 by means of the planar connecting parts 4 , is indicated by 2. Connections between the component carriers 2 are made by means of the also planar connecting parts 5. On this laminated sheet of film, z. B. by screen printing, the designated cable runs are covered in an etch-proof manner and the desired cable configuration is obtained by etching. However, this can also be done by printing or vapor deposition in the manner already mentioned. In a manner known per se, holes, slots, etc., for example by punching, drilling, etc., are made at the locations of later soldered connections for the connecting wires or lugs of the components.

So that the thin circuit carrier foil 1 will later carry the components can, the component carrier parts 2 must be stiffened mechanically. These are in Fig. 2 shows three exemplary embodiments. In Fig. 2 a is on the den A stiffening plate 7 is applied to the side of the carrier film 1 facing away from the lines of conductors. They can be connected to the film half by gluing, riveting, etc. At Corresponding bores 8 are provided for the locations of the soldered connections z. B. for easier insertion of the connecting elements of the components 9 conical can be formed. The plate 7 can also be provided with holes, which are arranged in the form of a grid and so for different circuit configurations be usable. The component carriers 9 are fitted after they have been stiffened the component carrier.

F i g. 2 b shows another possibility for stiffening the component carrier 2. Here, a curable material 10, for. B. Cast resin, applied and so stiffened the surface. This has the advantage that the components 9 for later soldering, for. B. by dip soldering, are already fixed in their position. The equipping with components 9 must therefore take place here before the component carrier 2 is stiffened.

F i g. 2 c now shows a further possibility of stiffening the component carrier 2. Here, the film surface 1 of the component carrier 2 is clamped in a frame 11 and thus stiffened. This frame is also on the side facing away from the soldering side of the film surface 1 of the component carrier 2, for. B. by gluing attached. Such a frame 11 has the advantage that it simultaneously protects the components 9 and later enables the assembled component carriers 2 to be easily stacked one on top of the other. The component carriers stiffened in this way can be equipped here before or after stiffening. There is even the possibility of stiffening the component carriers 2 according to FIG. 2 b or 2 c can also only be carried out after dip soldering.

The components are then connected to the assigned cable runs by dip soldering. Here z. B. the connector 3 can be connected to a connector 12 (Fig. 3 and 4). The processes for dip soldering, e.g. B. immersion, continuous tin wave, etc., are known per se so that they do not need to be specifically described. After the soldering is complete, the in F i g. 1 separated areas 6 shown hatched, z. B. by cutting, punching, etc. As a result, the component carriers 2 can be moved relative to one another, insofar as this is made possible by the shape of the planar connecting parts 4 and 5.

Is the stiffening of the component carrier 2 according to FIG. 2 a or 2 b takes place, the resulting component carrier plates, for. B. in holding frame 13, as in F i g. 3 shown, are inserted. In the case of a stiffening according to FIG. 2 c, the component carriers, as in FIG. 4, are stacked and connected to one another by means of screws or rivets drawn through the stiffening frame 11. Nesting of the component carriers is also possible by means of knobs, grooves, etc. attached to the stiffening frame.

In summary, the advantages of one according to the invention are again Process of assembled assembly listed. Despite using through the use manufactured in the manner of the so-called printed circuit boards Component carriers 2 can be a compact, in its outer dimensions A cube-like structure can also be achieved for larger assemblies. The whole assembly can be made as a single flat piece, taking to assemble them no additional connecting lines need to be established. The use of Plug connections are limited to the connecting cables. An examination of the Assembly is possible before assembly, and this can be used for maintenance and repair without interrupting their electrical functionality to the original level Form are disassembled so that soldering points and components are easily accessible.

Claims (11)

Claims: 1. A method for producing electrical assemblies with arranged in several levels, in the manner of a so-called printed circuit executed planar component carriers, these component carriers using thin film-shaped insulating materials to which the desired cable runs are applied are, are constructed, in particular for modules of telecommunications technology, are marked through the successive application of the following process steps, some of which are known per se: a) Manufacture of a flat circuit carrier from film-shaped, flexible insulating material, on which the required cable runs in a known manner by etching a applied conductive layer and / or by vapor deposition of conductive materials are produced in such a way that all later parallel one above the other, in one by the dimensions of the components certain distance to be arranged individual Component carrier (2) on this flat circuit carrier (1) in one plane next to one another are arranged so that the individual component carriers (2) through each other planar connecting parts (4, 5) are connected to cable runs that are attached to it, and the connecting cable runs for the electrical assembly also provided on the flat conductor carrier (1) Flat connection parts (3) are applied, the free ends of which with the contacts a plug connection part (12) fastened to the connection part (3) can be connected; b) stiffening of the individual component carriers (2) before or after being fitted with Components (9) by attaching with the surface or the outline of the component carrier stiffening surfaces of the same configuration (7 or 10), ribs or frames (11) by gluing or riveting or pouring or spraying on hardenable material; c) connecting the components (9) to the circuit of the flat circuit carrier (1) by dip soldering; d) Cutting out or punching out the individual component carriers (2) and the connecting parts (3) and connecting parts (4, 5) connected to them, in such a way that that these are mutually movable; e) Assembling the assembly by twisting it the component carrier (2) in the desired position, the position fixing by Insertion into a carrier frame or superimposing appropriately stiffened edges Component carriers and riveting, screwing or nesting of the edge stiffeners takes place and from this form for testing and repair purposes back into the flat form can be transferred. 2. Specification for the implementation of the procedural step a) of claim 1, characterized in that the circuit carrier (1) is double-sided is printed or designed as a multi-layer circuit. 3. Order for implementation of method step a) of claim 1, characterized in that the circuit carrier (1) is designed as a self-adhesive film. 4. Arrangement for carrying out the process step b) of claim 1, characterized in that facing away from the soldering side Side of the component carrier (2) a plate (7) is applied, which at least at the points of the soldered connections for inserting the connection elements of the components (9) bores (8), preferably conical or pyramidal shape, 5. Arrangement according to Claim 4, characterized in that the bores (8) in the plate (7) are arranged in the manner of a grid-shaped grid. 6. Order for implementation of process step b) of claim 1, characterized in that on the the side of the component carrier (2) facing away from the soldering side after having been fitted with components (9) A layer of curable material (10) is applied by pouring or spraying on will. 7. Arrangement for performing process step b) of claim 1, characterized in that the insulating film (1) of the component carrier (2) on the the side facing away from the soldering side stiffened by attaching an edge frame (11) will. B. Arrangement according to one of Claims 4 to 7, characterized in that the cable runs are completely or partially protected by covering them with insulating film. 9. An arrangement for performing method step c) of claim 1, characterized characterized in that when soldering the components (9) to the connecting lines the component carrier (2) by dip soldering at the same time the connections of the connection part (3) can be connected to the connections of a plug connection (11). 10. Arrangement for carrying out process step e) of claim 1, characterized in that that by applying a plate (7) or by applying a curable Materials (10) stiffened, now plate-shaped component carriers (2) in guide grooves a holding frame (13) can be inserted. 11. Arrangement for the implementation of the Method step e) of claim 1, characterized in that the edge reinforcement (11) the component carrier (2) reinforcements with holes to accommodate the connecting elements, such as screws, rivets, strips and retaining elements for attaching a connector (12). Publications considered: Swiss patent specification No. 332 284; IEEE-Spectrum ”, June 1964, pp. 62 to 71.