DE1225463B - Acid electrolyte for direct copper plating of iron without intermediate treatment - Google Patents

Acid electrolyte for direct copper plating of iron without intermediate treatment

Info

Publication number
DE1225463B
DE1225463B DER37964A DER0037964A DE1225463B DE 1225463 B DE1225463 B DE 1225463B DE R37964 A DER37964 A DE R37964A DE R0037964 A DER0037964 A DE R0037964A DE 1225463 B DE1225463 B DE 1225463B
Authority
DE
Germany
Prior art keywords
iron
copper plating
intermediate treatment
acid electrolyte
direct copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DER37964A
Other languages
German (de)
Inventor
Dipl-Chem Dipl-Ing Gre Michael
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Riedel and Co
Original Assignee
Riedel and Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Riedel and Co filed Critical Riedel and Co
Priority to DER37964A priority Critical patent/DE1225463B/en
Publication of DE1225463B publication Critical patent/DE1225463B/en
Pending legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/38Electroplating: Baths therefor from solutions of copper

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)

Description

Saurer Elektrolyt zur Direktverkupferung von Eisen ohne Zwischenbehandlung Die Erfindung betrifft einen sauren Elektrolyten zur Direktverkupferung von Eisen ohne Zwischenbehandlung mit einem Gehalt an Alkyl-Aryl-Polyglykoläther. Die Wirkungsweise dieser Inhibitoren besteht bekanntlich darin, daß sie den elektrolytischen Austausch zwischen der Eisenoberfläche und den Kupferionen sowie die Sauerstoffbeladung des zu verkupfernden Eisens wirksam vermindern. Die meisten Inhibitoren versagen jedoch insofern, als sie bei höheren Konzentrationen zwar gut inhibieren, aber spröde bzw. narbige oder matte elektrolytische Metallniederschläge verursachen.Acid electrolyte for direct copper plating of iron without intermediate treatment The invention relates to an acidic electrolyte for direct copper plating of iron without intermediate treatment with an alkyl-aryl-polyglycol ether content. The mode of action These inhibitors are known to be that they promote electrolytic exchange between the iron surface and the copper ions as well as the oxygen loading of the effectively reduce iron to be copper-plated. Most inhibitors fail, however insofar as they inhibit well at higher concentrations, but are brittle or cause pitted or matt electrolytic metal deposits.

Nach der Erfindung enthält der Elektrolyt als Inhibitor ein Äthylenoxydderivat mit einem Molekulargewicht von etwa 400 bis 2000 in einer Menge von etwa 2 bis 10 g/1.According to the invention, the electrolyte contains an ethylene oxide derivative as an inhibitor having a molecular weight of about 400 to 2000 in an amount of about 2 to 10 g / 1.

Der neue Inhibitor bringt den Vorteil, daß er die Zementierung des unedlen Metalls besonders stark hemmt, da er in höheren Konzentrationen anwendbar ist, ohne spröde und narbige oder matte elektrolytische Metallniederschläge zu verursachen, so daß sich mit ihm besonders fest haftende Edelmetallniederschläge auf den unedlen Metallen erzielen lassen. Das Kriterium bzw. das Merkmal für die wichtige erforderliche Konzentration des Inhibitors, nämlich daß der Inhibitor die Auflösung von Eisen in 4n-Schwefelsäure um mindestens 50°/o herabsetzen muß, läßt sich leicht ermitteln, ohne große Reihenversuche anstellen zu müssen. Man braucht nur so viel des betreffenden Inhibitors zuzusetzen, daß die Wasserstoffentwicklung beim Angriff' der vierfach normalen Schwefelsäure auf Eisen um 50 °/o und mehr abnimmt, und man hat die geeignete Konzentration des Inhibitors. Wird die so festgestellte Konzentration des Inhibitors beispielsweise zur Verkupferung des Eisens in einem sauren Elektrolytbad angewandt, so entsteht auf dem Eisen durch ein sekundenschnelles Tauchen ein zusammenhängender porenfreier festhaftender Kupfermetallfilm, auf dem dann bei nachfolgendem Stromschluß eine weitere elektrolytische Kupferschicht gut haftet.The new inhibitor has the advantage that it is the cementation of the base metal is particularly strong, since it can be used in higher concentrations is without causing brittle, pitted or dull electrolytic metal deposits, so that with it particularly firmly adhering precious metal deposits form on the base Let metals achieve. The criterion or characteristic for the important required Concentration of the inhibitor, namely that the inhibitor is the dissolution of iron must be reduced by at least 50% in 4N sulfuric acid, it can easily be determined without having to make large series of tests. All you need is so much of it Add inhibitor that the hydrogen evolution when attacked 'the fourfold normal sulfuric acid on iron decreases by 50 per cent and more, and one has the appropriate one Concentration of the inhibitor. The concentration of the inhibitor determined in this way used, for example, for the copper-plating of iron in an acidic electrolyte bath, a coherent one is created on the iron by immersing it in a matter of seconds pore-free, firmly adhering copper metal film, on which then in the event of a subsequent electrical connection another electrolytic copper layer adheres well.

Ausführungsbeispiel In einem Bad mit 250 g/1 Kupfersulfat, 30 g/1 Schwefelsäure, 1 g/1 Dimethyl-disulfodiphenyl-ammoniumchlorid und 2 g/1 Alkyl-Aryl-Polyglykole mit einem Molekulargewicht 790 erzielt man bei Stromdichten bis 5 A/dm2 und Zimmertemperatur zwar halbglänzende, jedoch auf Eisenuntergrund schlecht haftende Kupferüberzüge. Erhöht man dagegen in diesem Bad die Konzentration des Alkyl-Aryl-Polyglykoläthers von 2 auf 10 g/1 und des Dimethyldisulfodiphenyl-ammoniumchlorids von 1 auf 8 g/1, so bekommt man bei gleichen Abscheidungsbedingungen sehr gut auf Eisen haftende Kupferüberzüge.Exemplary embodiment In a bath with 250 g / l copper sulfate, 30 g / l Sulfuric acid, 1 g / 1 dimethyl-disulfodiphenyl-ammonium chloride and 2 g / 1 alkyl-aryl-polyglycols With a molecular weight of 790, current densities of up to 5 A / dm2 and room temperature are achieved Although semi-glossy, but poorly adhering copper coatings to the iron substrate. If, on the other hand, the concentration of the alkyl aryl polyglycol ether is increased in this bath from 2 to 10 g / 1 and of the dimethyldisulfodiphenylammonium chloride from 1 to 8 g / 1, in this way, with the same deposition conditions, one gets very good adhesion to iron Copper coatings.

Claims (1)

Patentanspruch: Saurer Elektrolyt zur Direktverkupferung von Eisen ohne Zwischenbehandlung mit einem Gehalt an Alkyl-Aryl-Polyglykoläther, dadurch gekennzeichnet, daß er das Äthylenoxydderivat mit einem Molekulargewicht von 400 bis 2000 in einer Menge von 2 bis 10 g/1 enthält. In Betracht gezogene Druckschriften: Deutsche Auslegeschrift Nr. 1027 482.Claim: Acid electrolyte for direct copper plating of iron without intermediate treatment with a content of alkyl aryl polyglycol ether, thereby characterized in that it is the ethylene oxide derivative with a molecular weight of 400 to 2000 in an amount of 2 to 10 g / l. Considered publications: German publication No. 1027 482.
DER37964A 1958-12-20 1958-12-20 Acid electrolyte for direct copper plating of iron without intermediate treatment Pending DE1225463B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DER37964A DE1225463B (en) 1958-12-20 1958-12-20 Acid electrolyte for direct copper plating of iron without intermediate treatment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DER37964A DE1225463B (en) 1958-12-20 1958-12-20 Acid electrolyte for direct copper plating of iron without intermediate treatment

Publications (1)

Publication Number Publication Date
DE1225463B true DE1225463B (en) 1966-09-22

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
DER37964A Pending DE1225463B (en) 1958-12-20 1958-12-20 Acid electrolyte for direct copper plating of iron without intermediate treatment

Country Status (1)

Country Link
DE (1) DE1225463B (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1027482B (en) * 1954-09-28 1958-04-03 Riedel & Co Direct copper plating of iron in acidic electrolytes without intermediate treatment

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1027482B (en) * 1954-09-28 1958-04-03 Riedel & Co Direct copper plating of iron in acidic electrolytes without intermediate treatment

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