DE112019002224A5 - Bauteil/Bauteilverbund und deren Herstellungsverfahren - Google Patents

Bauteil/Bauteilverbund und deren Herstellungsverfahren Download PDF

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Publication number
DE112019002224A5
DE112019002224A5 DE112019002224.5T DE112019002224T DE112019002224A5 DE 112019002224 A5 DE112019002224 A5 DE 112019002224A5 DE 112019002224 T DE112019002224 T DE 112019002224T DE 112019002224 A5 DE112019002224 A5 DE 112019002224A5
Authority
DE
Germany
Prior art keywords
component
manufacturing process
composite
composite component
manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE112019002224.5T
Other languages
English (en)
Inventor
Rainer Hartmann
Clemens Vierheilig
Tobias Meyer
Andreas Rückerl
Tilman Schimpke
Michael Binder
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Osram Oled GmbH
Original Assignee
Osram Oled GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Oled GmbH filed Critical Osram Oled GmbH
Publication of DE112019002224A5 publication Critical patent/DE112019002224A5/de
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005—Processes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005—Processes
    • H01L33/0093—Wafer bonding; Removal of the growth substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005—Processes
    • H01L33/0095—Post-treatment of devices, e.g. annealing, recrystallisation or short-circuit elimination
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/12—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a stress relaxation structure, e.g. buffer layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/54—Encapsulations having a particular shape

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Led Devices (AREA)
DE112019002224.5T 2018-04-30 2019-04-26 Bauteil/Bauteilverbund und deren Herstellungsverfahren Pending DE112019002224A5 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102018110344.1A DE102018110344A1 (de) 2018-04-30 2018-04-30 Bauteil, bauteilverbund und verfahren zur herstellung eines bauteils oder bauteilverbunds
DE102018110344.1 2018-04-30
PCT/EP2019/060759 WO2019211193A1 (de) 2018-04-30 2019-04-26 Bauteil/bauteilverbund und deren herstellungsverfahren

Publications (1)

Publication Number Publication Date
DE112019002224A5 true DE112019002224A5 (de) 2021-02-25

Family

ID=66429337

Family Applications (2)

Application Number Title Priority Date Filing Date
DE102018110344.1A Withdrawn DE102018110344A1 (de) 2018-04-30 2018-04-30 Bauteil, bauteilverbund und verfahren zur herstellung eines bauteils oder bauteilverbunds
DE112019002224.5T Pending DE112019002224A5 (de) 2018-04-30 2019-04-26 Bauteil/Bauteilverbund und deren Herstellungsverfahren

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE102018110344.1A Withdrawn DE102018110344A1 (de) 2018-04-30 2018-04-30 Bauteil, bauteilverbund und verfahren zur herstellung eines bauteils oder bauteilverbunds

Country Status (3)

Country Link
US (1) US11804568B2 (de)
DE (2) DE102018110344A1 (de)
WO (1) WO2019211193A1 (de)

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010177390A (ja) 2009-01-29 2010-08-12 Sony Corp 素子の移載方法および表示装置の製造方法
TWI403003B (zh) * 2009-10-02 2013-07-21 Chi Mei Lighting Tech Corp 發光二極體及其製造方法
DE102010012711A1 (de) * 2010-03-25 2011-09-29 Osram Opto Semiconductors Gmbh Strahlungsemittierendes Halbleiterbauelement und Verfahren zur Herstellung eines strahlungsemittierenden Halbleiterbauelements
US8476637B2 (en) * 2010-06-08 2013-07-02 Sundiode Inc. Nanostructure optoelectronic device having sidewall electrical contact
US20170236807A1 (en) * 2014-10-28 2017-08-17 The Regents Of The University Of California Iii-v micro-led arrays and methods for preparing the same
WO2016122725A1 (en) 2015-01-30 2016-08-04 Technologies Llc Sxaymiq Micro-light emitting diode with metal side mirror
FR3068515B1 (fr) * 2017-06-30 2019-10-25 Aledia Dispositif optoélectronique comprenant des diodes électroluminescentes
KR102413330B1 (ko) * 2017-09-12 2022-06-27 엘지전자 주식회사 반도체 발광소자를 이용한 디스플레이 장치
WO2019219703A1 (en) * 2018-05-15 2019-11-21 Rockley Photonics Limited Integration of photonic components on soi platform
KR102110871B1 (ko) * 2018-07-04 2020-05-14 엘지전자 주식회사 반도체 발광소자를 이용한 디스플레이 장치
KR102560919B1 (ko) * 2018-08-06 2023-07-31 엘지전자 주식회사 반도체 발광소자를 이용한 디스플레이 장치
KR102608987B1 (ko) * 2018-09-07 2023-12-05 삼성디스플레이 주식회사 발광 소자, 그의 제조 방법, 및 발광 소자를 구비한 표시 장치
KR20200102615A (ko) * 2019-02-21 2020-09-01 삼성디스플레이 주식회사 발광 소자 및 이를 구비한 표시 장치

Also Published As

Publication number Publication date
WO2019211193A1 (de) 2019-11-07
US11804568B2 (en) 2023-10-31
US20210043796A1 (en) 2021-02-11
DE102018110344A1 (de) 2019-10-31

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