DE112019000925A5 - Opto-elektronische baugruppe, verfahren und formteil - Google Patents

Opto-elektronische baugruppe, verfahren und formteil Download PDF

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Publication number
DE112019000925A5
DE112019000925A5 DE112019000925.7T DE112019000925T DE112019000925A5 DE 112019000925 A5 DE112019000925 A5 DE 112019000925A5 DE 112019000925 T DE112019000925 T DE 112019000925T DE 112019000925 A5 DE112019000925 A5 DE 112019000925A5
Authority
DE
Germany
Prior art keywords
opto
molded part
electronic assembly
electronic
assembly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE112019000925.7T
Other languages
English (en)
Inventor
Frank Singer
Siegfried Herrmann
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Osram Oled GmbH
Original Assignee
Osram Oled GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Oled GmbH filed Critical Osram Oled GmbH
Publication of DE112019000925A5 publication Critical patent/DE112019000925A5/de
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4246—Bidirectionally operating package structures
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4292—Coupling light guides with opto-electronic elements the light guide being disconnectable from the opto-electronic element, e.g. mutually self aligning arrangements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/038—Textiles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V33/00—Structural combinations of lighting devices with other articles, not otherwise provided for
    • F21V33/0004—Personal or domestic articles
    • F21V33/0008—Clothing or clothing accessories, e.g. scarfs, gloves or belts
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09263—Meander
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/10886—Other details
    • H05K2201/10946—Leads attached onto leadless component after manufacturing the component

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Textile Engineering (AREA)
  • Led Device Packages (AREA)
DE112019000925.7T 2018-02-23 2019-02-22 Opto-elektronische baugruppe, verfahren und formteil Pending DE112019000925A5 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102018104169.1A DE102018104169A1 (de) 2018-02-23 2018-02-23 Opto-elektronische Baugruppe, Verfahren und Formteil
DE102018104169.1 2018-02-23
PCT/EP2019/054448 WO2019162443A1 (de) 2018-02-23 2019-02-22 Opto-elektronische baugruppe, verfahren und formteil

Publications (1)

Publication Number Publication Date
DE112019000925A5 true DE112019000925A5 (de) 2020-11-19

Family

ID=65635641

Family Applications (2)

Application Number Title Priority Date Filing Date
DE102018104169.1A Withdrawn DE102018104169A1 (de) 2018-02-23 2018-02-23 Opto-elektronische Baugruppe, Verfahren und Formteil
DE112019000925.7T Pending DE112019000925A5 (de) 2018-02-23 2019-02-22 Opto-elektronische baugruppe, verfahren und formteil

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE102018104169.1A Withdrawn DE102018104169A1 (de) 2018-02-23 2018-02-23 Opto-elektronische Baugruppe, Verfahren und Formteil

Country Status (3)

Country Link
US (1) US11527689B2 (de)
DE (2) DE102018104169A1 (de)
WO (1) WO2019162443A1 (de)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP1641301S (de) * 2019-04-12 2019-09-17
WO2023076319A1 (en) * 2021-10-26 2023-05-04 Avicenatech Corp. Visible led-based flex waveguide interconnects

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7144830B2 (en) * 2002-05-10 2006-12-05 Sarnoff Corporation Plural layer woven electronic textile, article and method
US7579218B2 (en) * 2003-07-23 2009-08-25 Onscreen Technologies Electronic assembly/system with reduced cost, mass, and volume and increased efficiency and power density
CN101467503B (zh) * 2006-06-08 2011-05-18 皇家飞利浦电子股份有限公司 用于电子部件的次基台
WO2008064370A2 (en) * 2006-11-24 2008-05-29 Waters, Colin Fashion illumination system
WO2010086033A1 (en) * 2009-01-30 2010-08-05 Interuniversitair Microelektronica Centrum Vzw Stretchable electronic device
WO2012008233A1 (ja) 2010-07-14 2012-01-19 三菱電機株式会社 表面実装型発光装置、および表示ユニット
US9831393B2 (en) * 2010-07-30 2017-11-28 Cree Hong Kong Limited Water resistant surface mount device package
TW201208217A (en) 2010-08-09 2012-02-16 Kings Metal Fiber Technologies Electrical connection structure and light emitting device, fabric circuits, and singal fabric having the same
US8198109B2 (en) * 2010-08-27 2012-06-12 Quarkstar Llc Manufacturing methods for solid state light sheet or strip with LEDs connected in series for general illumination
EP2640168A1 (de) * 2012-03-15 2013-09-18 Nederlandse Organisatie voor toegepast-natuurwetenschappelijk Onderzoek TNO Unterbau, Anordnung mit dem Unterbau, Verfahren zur Anordnung und Anordnungsvorrichtung
JP2014135471A (ja) * 2012-12-10 2014-07-24 Nitto Denko Corp 発光装置、発光装置集合体および電極付基板
US9706647B2 (en) * 2013-05-14 2017-07-11 Mc10, Inc. Conformal electronics including nested serpentine interconnects
US20150263256A1 (en) * 2014-03-14 2015-09-17 Epistar Corporation Light-emitting array
KR102340855B1 (ko) 2015-01-15 2021-12-17 삼성디스플레이 주식회사 신축성 표시 장치
US10066829B2 (en) 2015-04-28 2018-09-04 William S. Wong Electronic fabric
US10064270B2 (en) * 2015-06-05 2018-08-28 North Carolina State University Flexible interconnects, systems, and uses thereof
DE102015109333A1 (de) 2015-06-11 2016-12-15 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement

Also Published As

Publication number Publication date
US20210091283A1 (en) 2021-03-25
US11527689B2 (en) 2022-12-13
DE102018104169A1 (de) 2019-08-29
WO2019162443A1 (de) 2019-08-29

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R012 Request for examination validly filed
R082 Change of representative

Representative=s name: SCHEELE JAEGER WETZEL PATENTANWAELTE PARTNERSC, DE

Representative=s name: SCHEELE JAEGER PATENTANWAELTE PARTG MBB, DE

R016 Response to examination communication
R082 Change of representative

Representative=s name: SCHEELE JAEGER PATENTANWAELTE PARTG MBB, DE