DE112009003564A5 - Abgesenktes Sieb - Google Patents

Abgesenktes Sieb Download PDF

Info

Publication number
DE112009003564A5
DE112009003564A5 DE112009003564T DE112009003564T DE112009003564A5 DE 112009003564 A5 DE112009003564 A5 DE 112009003564A5 DE 112009003564 T DE112009003564 T DE 112009003564T DE 112009003564 T DE112009003564 T DE 112009003564T DE 112009003564 A5 DE112009003564 A5 DE 112009003564A5
Authority
DE
Germany
Prior art keywords
sieve
lowered
lowered sieve
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE112009003564T
Other languages
English (en)
Inventor
Terry R. Bloom
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CTS Corp
Original Assignee
CTS Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by CTS Corp filed Critical CTS Corp
Publication of DE112009003564A5 publication Critical patent/DE112009003564A5/de
Withdrawn legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/12—Production of screen printing forms or similar printing forms, e.g. stencils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H05K3/1225—Screens or stencils; Holders therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1453—Applying the circuit pattern before another process, e.g. before filling of vias with conductive paste, before making printed resistors

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Manufacturing Of Printed Wiring (AREA)
DE112009003564T 2008-12-10 2009-12-08 Abgesenktes Sieb Withdrawn DE112009003564A5 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US20140208P 2008-12-10 2008-12-10
US61/201,402 2008-12-10
PCT/US2009/006432 WO2010068256A2 (en) 2008-12-10 2009-12-08 Counter sunk screen

Publications (1)

Publication Number Publication Date
DE112009003564A5 true DE112009003564A5 (de) 2011-11-10

Family

ID=41572529

Family Applications (1)

Application Number Title Priority Date Filing Date
DE112009003564T Withdrawn DE112009003564A5 (de) 2008-12-10 2009-12-08 Abgesenktes Sieb

Country Status (4)

Country Link
US (1) US20100139561A1 (de)
CN (1) CN202281900U (de)
DE (1) DE112009003564A5 (de)
WO (1) WO2010068256A2 (de)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102998905B (zh) * 2011-09-15 2014-10-08 茂迪股份有限公司 印刷用网布及其制造方法
BR112015026129A2 (pt) * 2013-04-19 2017-10-17 Bayer Cropscience Ag método para combater pragas
DE102013020189B4 (de) * 2013-12-02 2015-11-05 Cadilac Laser Gmbh Cad Industrial Lasercutting Druckschablone sowie Verfahren zu deren Herstellung
JP2017100367A (ja) * 2015-12-02 2017-06-08 ミタニマイクロニクス九州株式会社 スクリーンマスク及びスクリーンマスクの製造方法
JP7329359B2 (ja) * 2019-04-26 2023-08-18 マクセル株式会社 スクリーン印刷用マスク
EP4102943A1 (de) * 2021-06-11 2022-12-14 ZF CV Systems Europe BV Leiterplatte (pcb) und verfahren zur herstellung davon

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4678531A (en) * 1986-03-24 1987-07-07 General Motors Corporation Method and apparatus for screen printing solder paste onto a substrate with device premounted thereon
GB8607976D0 (en) * 1986-04-01 1986-05-08 Dowty Seals Ltd Seal/gasket
EP0464402A3 (en) * 1990-06-18 1992-09-09 Asahi Glass Company Ltd. A method of producing a screen for printing a heating line pattern and a method of forming a heating line pattern on a glass plate
US5368883A (en) * 1993-05-21 1994-11-29 Delco Electronics Corp. Method and stencil design for printing non-planar hybrid circuits
US5740730A (en) * 1996-09-03 1998-04-21 Micron Electronics, Inc. Apparatus for depositing solder and adhesive materials onto a printed circuit board
US6089151A (en) * 1998-02-24 2000-07-18 Micron Technology, Inc. Method and stencil for extruding material on a substrate
AU4003200A (en) * 1999-02-19 2000-09-04 Fry's Metals, Inc. Improved stencil
JP2001068833A (ja) * 1999-08-27 2001-03-16 Minami Kk 部品実装済基板への接着剤の塗布方法
JP2001068831A (ja) * 1999-08-27 2001-03-16 Minami Kk 部品実装済基板への腐食防止材の塗布方法
JP2001062993A (ja) * 1999-08-31 2001-03-13 Minami Kk スクリーン印刷機
US6631675B2 (en) * 2001-04-27 2003-10-14 International Business Machines Corporation Screening method for double pass screening

Also Published As

Publication number Publication date
US20100139561A1 (en) 2010-06-10
CN202281900U (zh) 2012-06-20
WO2010068256A3 (en) 2010-09-16
WO2010068256A2 (en) 2010-06-17

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Legal Events

Date Code Title Description
R082 Change of representative

Representative=s name: BOEHMERT & BOEHMERT ANWALTSPARTNERSCHAFT MBB -, DE

Representative=s name: BOEHMERT & BOEHMERT, DE

Representative=s name: BOEHMERT & BOEHMERT, 80336 MUENCHEN, DE

R119 Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee