DE112007003690A5 - Method for equipping a placement device - Google Patents

Method for equipping a placement device Download PDF

Info

Publication number
DE112007003690A5
DE112007003690A5 DE112007003690T DE112007003690T DE112007003690A5 DE 112007003690 A5 DE112007003690 A5 DE 112007003690A5 DE 112007003690 T DE112007003690 T DE 112007003690T DE 112007003690 T DE112007003690 T DE 112007003690T DE 112007003690 A5 DE112007003690 A5 DE 112007003690A5
Authority
DE
Germany
Prior art keywords
equipping
placement device
placement
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE112007003690T
Other languages
German (de)
Inventor
Robert Huber
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ASMPT GmbH and Co KG
Original Assignee
Siemens Electronic Assembly Systems GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Electronic Assembly Systems GmbH and Co KG filed Critical Siemens Electronic Assembly Systems GmbH and Co KG
Publication of DE112007003690A5 publication Critical patent/DE112007003690A5/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0417—Feeding with belts or tapes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/085—Production planning, e.g. of allocation of products to machines, of mounting sequences at machine or facility level
    • H05K13/0857—Product-specific machine setup; Changeover of machines or assembly lines to new product type
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/086—Supply management, e.g. supply of components or of substrates
DE112007003690T 2007-11-12 2007-11-12 Method for equipping a placement device Withdrawn DE112007003690A5 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/EP2007/009783 WO2009062524A1 (en) 2007-11-12 2007-11-12 Method for fitting an equipping device

Publications (1)

Publication Number Publication Date
DE112007003690A5 true DE112007003690A5 (en) 2010-08-26

Family

ID=39709343

Family Applications (1)

Application Number Title Priority Date Filing Date
DE112007003690T Withdrawn DE112007003690A5 (en) 2007-11-12 2007-11-12 Method for equipping a placement device

Country Status (3)

Country Link
CN (1) CN101855955B (en)
DE (1) DE112007003690A5 (en)
WO (1) WO2009062524A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018127956A1 (en) * 2017-01-05 2018-07-12 株式会社Ｆｕｊｉ System for managing component mounting line
CN107771023B (en) * 2017-10-31 2021-01-26 福建摩尔软件有限公司 Quick wire cutting and replacing method and device for chip mounter
US11943870B2 (en) * 2018-05-31 2024-03-26 Fuji Corporation Component mounting line
CN112292918B (en) * 2018-06-26 2022-03-04 株式会社富士 Method for determining arrangement of component supply unit and component mounting system

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5553376A (en) * 1995-02-15 1996-09-10 Motorola, Inc. Method of and apparatus for changing a production setup
JP3566785B2 (en) * 1995-06-20 2004-09-15 松下電器産業株式会社 Component layout optimization method
JP3425504B2 (en) * 1996-05-22 2003-07-14 ヤマハ発動機株式会社 Component supply method for mounting machine
CN1250064C (en) * 1998-09-10 2006-04-05 松下技术有限公司 Method of supplying components to electronic component mounting or insertion machine
JP2003059955A (en) * 2001-08-08 2003-02-28 Matsushita Electric Ind Co Ltd Apparatus and method for packaging electronic component

Also Published As

Publication number Publication date
CN101855955B (en) 2014-03-19
WO2009062524A1 (en) 2009-05-22
CN101855955A (en) 2010-10-06

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Legal Events

Date Code Title Description
R081 Change of applicant/patentee

Owner name: ASM ASSEMBLY SYSTEMS GMBH & CO. KG, DE

Free format text: FORMER OWNER: SIEMENS ELECTRONICS ASSEMBLY SYSTEMS GMBH & CO. KG, 81379 MUENCHEN, DE

Effective date: 20110706

R082 Change of representative

Representative=s name: DILG HAEUSLER SCHINDELMANN PATENTANWALTSGESELL, DE

Effective date: 20110706

Representative=s name: DILG HAEUSLER SCHINDELMANN PATENTANWALTSGESELLSCHA

R012 Request for examination validly filed

Effective date: 20110511

R120 Application withdrawn or ip right abandoned

Effective date: 20140716