DE1071842B - - Google Patents
Info
- Publication number
- DE1071842B DE1071842B DENDAT1071842D DE1071842DA DE1071842B DE 1071842 B DE1071842 B DE 1071842B DE NDAT1071842 D DENDAT1071842 D DE NDAT1071842D DE 1071842D A DE1071842D A DE 1071842DA DE 1071842 B DE1071842 B DE 1071842B
- Authority
- DE
- Germany
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
- H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DEP0018414 | 1957-04-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE1071842B true DE1071842B (enExample) |
Family
ID=7367004
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DENDAT1071842D Pending DE1071842B (enExample) | 1957-04-25 |
Country Status (1)
| Country | Link |
|---|---|
| DE (1) | DE1071842B (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1230912B (de) * | 1960-06-09 | 1966-12-22 | Siemens Ag | Verfahren zum Herstellen einer Halbleiteranordnung |
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0
- DE DENDAT1071842D patent/DE1071842B/de active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1230912B (de) * | 1960-06-09 | 1966-12-22 | Siemens Ag | Verfahren zum Herstellen einer Halbleiteranordnung |