DE1067938B - - Google Patents

Description

The invention relates to a socket for small tubes which are provided with flexible lead-through pins. The downsizing of electronic Structural elements gave rise to all sorts of problems in construction, both in terms of the actual operational functions as well as dimensions and strength for the purpose of manufacture and interruption of satisfactory and conductive connections. These problems were caused by the fact makes it difficult that at the same time the frequencies up into the range of high and ultra high frequencies where good electrical contacts for the good functioning of the system are not extended are only desired, they are even absolutely necessary.

The reduction in size of the electron tubes resulted for example, to reduce the size of the tube contact pins to such an extent that that these contacts are currently referred to as small-diameter wires rather than rigid metal pins are. As a result, only a relatively low pressure can be applied when inserting a miniature tube can be used in a socket without danger. Stronger exerted on such thin wire contacts Pressure would destroy them or at least bend them in such a way that they could be inserted into the corresponding sockets provided pin holder elements could not insert quickly and accurately. The do not make the required good contact quickly and easily.

Embodiments of sockets for small tubes are known, which are provided with flexible lead-through pins, in which the socket body consists of a narrow, elongated molded part which has holes in its longitudinal axis into which the Feed-through pins are inserted. There are also versions known in which in each hole the socket is fitted with a pin holding element, the flag of which is an electrical conductor with a circuit can be connected.

However, the special features of such embodiments are not yet capable of special ones To solve problems that lead to the disadvantages mentioned above. This only works with one version for small ducts with flexible lead-through pins, consisting of a narrow, elongated one Body with intended for inserting the lead-through pins, in the longitudinal axis of the same arranged holes according to the invention in that the socket body consists of a at the melting point a solder without deformation resistant insulating material that in each of the holes of the Socket body a solder ball and a flexible lead wire connected to the solder Socket for small tubes

Applicant:

Montecatini, Societa Generale

per rindustria Mineraria e Chimica,

Milan (Italy)

Representative:

Dipl.-Ing. Dipl.-Chem. Dr. phil. Dr. techn. J; Reitstötter, Patent attorney, Munich 15, Haydnstr. 5

Merritt A. Rudner, Haddonfield, N.J. (V. St. A.) has been identified as the inventor

conductive connection are arranged with an external circuit and that before the insertion of the tube pins into the socket, the solder can be melted by applying a soldering iron to the side wall of the socket. ■. · · _; ;

Fluoroplastics have proven to be substances with such properties. They stand out when used of the frequencies in the mentioned altitude ranges as excellent isolators and carriers for the required metallic conductors, and contacts to a large extent. Particularly worth mentioning also polytetrafluoroethylene and polymonochlorotrifluoroethylene, which are good chemical, physical and electrical properties because of their manifold uses. For the sake of simplicity the term fluoroplastics is used in general in the following.

One of the most prominent physical characteristics of fluoroplastics is network strength and lubricity. They are impermeable to water and moisture. The specific resistance these substances are very large and the loss angle is low. These properties make such substances ideally suited for electronics. In addition, they withstand high temperatures, which are well over those approved for electronic components. Polytetrafluoroethylene itself is an example Still resistant to heating to 260 ° C without changing structure or insulating properties. In the drawings, two versions of sockets for small tubes are shown and described.

909 640/337

Claims (2)

Fig. 1 shows an elevation of a socket; Fig. 2 is a side elevational view of the blank of Fig. 1, with a portion thereof removed, to show a cavity for receiving a pin and the location of the solder therein and that for making a conductive connection of the outward contact with the tail piece for connection to the external circuit; 3 shows a schematic perspective view for explaining the insertion of a miniature tube into the socket using a soldering iron to heat and melt the solder in the cavities. According to FIGS. 1, 2 and 3, the socket 10 according to the invention consists of a molding 11 made of insulating material with five cavities 12 to 16 provided for inserting the pins, with a spherical solder 17 in each of these cavities and with a metal conductor 18 which is connected to one end 19 is conductively immersed in the molten solder ball 17 and extends outward through the boundary surface 20 of the holder 11. The other end of this conductor 21 is provided as a tail piece (soldering lug) for connection to an external element or circuit. For the installation of the socket in a chassis or on another suitable base, the molding is provided with two lugs 22 and 23 in which bores 24 and 25 are provided for receiving suitable fastening bolts. The molding 11 of the socket is made of insulating material, namely from an insulating material that can withstand the maximum temperature that occurs when using a normal soldering iron, that is about 175 ° C. This temperature is sufficient for the soldering material used for electrical contacts and wires to melt. Therefore, when a soldering iron (see Fig. 3) is applied to one of the side boundary surfaces of the molding 11, the temperature of the molding 11 will rise to a value above the melting point of the solder 17 within a short time, and then a miniature tube 30 can be easily insert into the cavities 12 to 16 of the socket. If the tube with its contact pins has penetrated the molten solder of the socket, the soldering iron is removed, whereupon the solder solidifies and a highly conductive connection is established. In the same way, if the tube is to be pulled out of the socket, the soldering iron 29 is applied to the lateral boundary surface of the tube socket until the solder has softened so far that the pins can be pulled out without damage. The molten solder maintains its position in the provided cavities and adheres to the inner ends 19 of the metal conductors 18 which are provided in the corresponding cavities of the molding. The miniature tubes and miniature sockets are in reality smaller in relation to the soldering iron than is shown in FIG. 3. The molding of the socket 10 according to FIG. 2 is, for example, approximately 12.7 mm long, 4.1 mm wide and 4.8 mm high. The cavities have a diameter of 0.6 mm and a depth of 10.6 mm. The space between the cavities is 2 mm and the conductor 19 extends inward to about 3.2 mm. In the frequency range greater than 200 megahertz (200 x 10 3 Hz), the use of soldered contacts is essential to prevent the noise caused by any loose connections. P λ τι: ν τ \, \ s i'ii ('ei 11 · ;; - 1. Socket for small tubes with flexible lead-through pins, consisting of a narrow, elongated body with intended for inserting the feed-through pins (31), holes (12 to 16) arranged in the longitudinal axis thereof, characterized in that the Socket body made of a resistant at the melting point of a solder without deformation Insulating material consists in that in each of the holes a solder ball and one connected to the solder flexible lead wire arranged for conductive connection to an external circuit are and that before the insertion of the tube pins into the socket, the solder by applying a soldering iron is fusible to the side wall of the socket. 2. socket for small tubes according to claim 1, characterized in that it consists of a molding consists of fluoroplastic, which is resistant to heating to 260 ° C without changing Structure and insulating capacity is resistant. Considered publications:
British Patent Nos. 698,705, 730,762;
U.S. Patent No. 2,613,244. 1 sheet of drawings