DE1066282B - - Google Patents

Info

Publication number
DE1066282B
DE1066282B DENDAT1066282D DE1066282DA DE1066282B DE 1066282 B DE1066282 B DE 1066282B DE NDAT1066282 D DENDAT1066282 D DE NDAT1066282D DE 1066282D A DE1066282D A DE 1066282DA DE 1066282 B DE1066282 B DE 1066282B
Authority
DE
Germany
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DENDAT1066282D
Other languages
German (de)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Publication date
Publication of DE1066282B publication Critical patent/DE1066282B/de
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49799—Providing transitory integral holding or handling portion
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4981—Utilizing transitory attached element or associated separate material
    • Y10T29/49812—Temporary protective coating, impregnation, or cast layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/04—Processes
    • Y10T83/0405—With preparatory or simultaneous ancillary treatment of work

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
DENDAT1066282D 1958-03-26 Pending DE1066282B (no)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DES0057549 1958-03-26

Publications (1)

Publication Number Publication Date
DE1066282B true DE1066282B (no) 1900-01-01

Family

ID=7491902

Family Applications (1)

Application Number Title Priority Date Filing Date
DENDAT1066282D Pending DE1066282B (no) 1958-03-26

Country Status (3)

Country Link
US (1) US3078549A (no)
DE (1) DE1066282B (no)
FR (1) FR1230530A (no)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1224192B (de) * 1963-06-01 1966-09-01 Siemens Ag Verfahren zum Umhuellen eines Halbleiterstabes zum Zwecke des anschliessenden Abtrennens von Scheiben

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3320485A (en) * 1964-03-30 1967-05-16 Trw Inc Dielectric isolation for monolithic circuit
US3358362A (en) * 1965-01-21 1967-12-19 Int Resistance Co Method of making an electrical resistor
FR2108218B1 (no) * 1970-09-08 1977-06-03 Sony Corp
JPS6051280B2 (ja) * 1976-10-06 1985-11-13 株式会社東芝 タンタル酸リチウム単結晶ウエハ−の製造方法
US4773951A (en) * 1986-01-07 1988-09-27 Atlantic Richfield Company Method of manufacturing wafers of semiconductor material
DE3711262A1 (de) * 1987-04-03 1988-10-13 Wacker Chemitronic Verfahren und mittel zum entfernen von saegehilfsmittelresten von scheiben
US20130251940A1 (en) * 2012-03-23 2013-09-26 Sheng Sun Method of cutting an ingot for solar cell fabrication
JP6267203B2 (ja) * 2012-08-31 2018-01-24 セミコンダクター テクノロジーズ アンド インストゥルメンツ ピーティーイー リミテッド 多機能ウェハー及びフィルムフレームハンドリングシステム

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2062486A (en) * 1934-04-27 1936-12-01 Cooper Sparkelite Ltd Method of making pyrophoric flints
US2264698A (en) * 1939-09-30 1941-12-02 Rca Corp Method of cutting quartz
US2436819A (en) * 1944-06-23 1948-03-02 Standard Telephones Cables Ltd Method of forming glass beads
US2619438A (en) * 1945-04-16 1952-11-25 Sperry Corp Method of making a grid structure
US2511962A (en) * 1946-07-17 1950-06-20 Linde Air Prod Co Forming jewel bearing blanks
US2762954A (en) * 1950-09-09 1956-09-11 Sylvania Electric Prod Method for assembling transistors
US2864013A (en) * 1953-06-29 1958-12-09 Electro Voice Sensitive strain responsive transducer and method of construction
US2865082A (en) * 1953-07-16 1958-12-23 Sylvania Electric Prod Semiconductor mount and method
US2760314A (en) * 1954-07-02 1956-08-28 Erie Resistor Corp Method of making ceramic pieces
US2752662A (en) * 1954-12-27 1956-07-03 Erie Resistor Corp Method of making thin flat electroded ceramic elements
US2930115A (en) * 1956-10-25 1960-03-29 Sr Otto Dietzsch Method of producing a modular body for controlled mixing or emission of a plurality of fluids
US2911773A (en) * 1957-06-18 1959-11-10 Itt Method of cutting semiconductive material

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1224192B (de) * 1963-06-01 1966-09-01 Siemens Ag Verfahren zum Umhuellen eines Halbleiterstabes zum Zwecke des anschliessenden Abtrennens von Scheiben

Also Published As

Publication number Publication date
US3078549A (en) 1963-02-26
FR1230530A (fr) 1960-09-16

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