DE10333877A1 - Cooling of power electronics is provided by closed fluid circuit having evaporator and condenser together with a fan - Google Patents

Abstract

The primary cooling circuit has an evaporator [3] mounted adjacent to the power electronics [2]. The evaporator has a matrix of tubes [15] and the evaporated fluid is fed [5] to the condenser [4]. The cooled liquid is returned to the evaporator. A secondary cooling effect is provided by a fan [8] providing forced convection.

Description

The The invention relates to a cooling device, in particular for cooling of components of the power electronics by means of a heat transfer circuit, the one from a coupled to the electronic component heat transfer coupled as well from a primary coolant acted evaporator part and one externally from a secondary coolant acted on capacitor part, in which the primary coolant chilled and its vapor phase is condensed, the primary coolant either under its gravity or by means of a pump from the condenser section promoted to the evaporator part is.

With the ever-increasing demand for high-performance electronic components inevitably increases too the heat released that of electric currents flowed through electronic components. These amounts of heat must be as quick and extensive be removed from the arrangement space of the electronic components, because otherwise, both in their function and in theirs Lifespan affected become. It is always the requirement of the cooling devices as compact as possible Size on the one hand and as high as possible heat transported away On the other hand, therefore, two demands that in some Way in an adversarial opposition.

When most powerful have cooling devices the genus mentioned above, which is an evaporation process a primary refrigerant operate within a thermodynamic Clausius-Rankine process because in the vapor phase of the primary Coolant from the amount of heat removed by the electronic components by means of a liquid Phase of a primary refrigerant transported away amount of heat far surpasses.

From the DE 100 07 066 A1 a cooling device of the type mentioned is known, in which a heat transfer plate made of aluminum or an aluminum alloy protrudes with an evaporator part in an area with the electronic components, wherein the evaporator part is separated by a wall to a capacitor part is performed, which with the largest possible and therefore finned heat transfer surface is formed for contact with the secondary coolant. By means of other disclosure in this cooling device, the return transport of the condensed primary coolant takes place under gravity. From the disproportion of the heat transfer surfaces of the evaporator part to the condenser part becomes clear that with such a cooling device only a very limited heat transfer from the electronic component to the secondary coolant - here air - can be done.

From the DE 100 17 971 A1 a further cooling device of the type mentioned is disclosed, in which the return transport of condensed refrigerant in the condenser part can be done either via a pump not shown there or under gravity back into the evaporator part. Although in this document is always talk of "refrigerant", but obviously a coolant is meant, since one usually understands a refrigerant from Frigen to hydrocarbons whose use expressly in this document due to the associated sealing problems and the amount the vapor pressure is properly rejected.

• 1. die Filmverdampfung im niederen Leistungsbereich (Verdunstungskühlung) und
• 2. die Blasenverdampfung im hohen Leistungsbereich (Kühlung durch Sieden).

The cooling device disclosed therein is to consist of a micro-heat exchanger in no specific disclosed, the evaporator part of the refrigerant evaporates partially and the liquid and the vapor phase of the primary coolant to a similarly not disclosed capacitor part passes, in which the vapor phase liquefies and again under Gravity or be returned by a pump to the evaporator section. The micro-Wärmeübertxager is to form a large heat transfer surface by a plurality of channels through which in turn are to be acted upon by a suitable primary and secondary coolant. These task-related disclosures miss any concrete indication of the formation of the evaporator part and the condenser part. As any person skilled in the art of heat engineering in question will know, the evaporator part is of particular importance because its heat transfer performance is essentially determined by the properties of the primary coolant, the highest possible heat flux and the structure of the heat transfer surfaces. In turn, the heat flow density is divided into two areas, which are characterized by the evaporation behavior of the primary coolant, namely

• 1. the film evaporation in the low power range (evaporative cooling) and
• 2. the bubble evaporation in the high power range (cooling by boiling).

As effective while the amounts of heat from the electronic component by film or bubble evaporation on the primary Transfer coolant can be hangs again from the properties of the surface structure, namely especially the size of the surface, of the capillarity and wetting rate, of its porosity and its mechanical strength from.

For the size of the heat dissipation is also the specific embodiment of the capacitor part, whose Heat transfer performance to the secondary coolant as well as the dripping of the condensate and thus the condition its heat transmitting Surfaces, namely how and in what form the heat transferring Surfaces of Condensate flooded and returned this to the evaporator becomes, crucial. This is what the two aforementioned publications provide no Information.

From the DE 101 02 869 A1 a non-generic cooling device is disclosed in which the primary refrigerant is supplied in a compressed manner to the component to be cooled and a means for decompressing the coolant is provided. Obviously, this device is a heat pump, which in the TS diagram represents the reversal of the Rankine cycle. Such a heat pump not only requires a compressor on the evaporator side, but also a pressure reducing valve on the condenser side. The evaporator part and the condenser part are under relatively high pressure and must be sealed accordingly. Again, only a known for decades cooling method is given, without specifically address the actual problems, namely the specific design of the surface structure of the heat transfer surfaces, the primary and secondary coolant on the additional energies to be used for the compressor.

A Another, albeit generic generic cooling device is from the US 2003/0056940 A1 become known. This one gets under once Gravity and once by means of a pump from an air flow as a secondary coolant chilled primary coolant from a storage tank to an evaporator part, which on the one hand transfer heat coupled with the electronic component and on the other hand, the evaporated primary Coolant with releases its enthalpy into the environment of the evaporator part. apart from the disadvantage of a constant to be fed primary Coolant, is this cooler with the disadvantage that the Steam exiting the evaporator section into the environment will evaporate on colder surfaces, e.g. on housing surfaces of the Electronic components, knock down, there condense and on Electronic components can drip, resulting in uncontrollable Kriechströmungen and thus can lead to malfunction of the electronic components. An open evaporation process is therefore, for these reasons for the cooling of Reject electronic components.

In addition to these cooling devices, a number of older non-generic cooling devices are known, which can be summarized under the generic term "heat pipe." Such a heat pipe is for example in the DE 101 45 311 A1 disclosed. The evaporator portion of this heat pipe is connected to the electronic part and the condenser part, which is provided with a large outer heat transfer surface for the secondary coolant (here air) is placed above it and is located with the evaporator part in a common tubular housing. Since the condenser part of the heat pipe is arranged vertically above the evaporator part, the condensed primary coolant flows back under gravity into the evaporator part. Again, the principle of arranging a heat pipe and its connection to an electronic component, but the surface structure of the heat transfer surfaces is not critical for the heat transfer, what is also not covered in this document.

Other arrangements and variants of a heat pipe are in the US 6,517,221 B1 and in US 2002/0080584 A1.

From this closest one Based on the prior art, the invention is based on the object a cooling device to create the genus mentioned in the beginning, the compact design to be used evaporator and condenser part as well as relative Low energy use large amounts of heat from the electronic component on the primary and secondary coolant can dissipate.

These Task becomes in connection with the genus term mentioned above according to the invention Evaporator parts solved by that with the component of the power electronics heat transfer coupled evaporator part from a variety of matrix-like on a base surface of a Evaporator arranged Rods, tubes, plane or curved Plates or a combination thereof made of copper or aluminum, their surface in whole or in part with protrusions is covered in the form of ordered microstructures by means of a microporous polymer membrane on the surface of the Bars, pipes or plates are galvanized and have a pin shape, which is with its longitudinal axis either perpendicular or at an angle to the surface of the bars, Pipes or plates extends.

Since copper and aluminum have a high thermal conductivity, significant amounts of heat can be transferred from the power electronics component via the base surface to the copper or aluminum rods. Due to the arranged on the outer surface of these copper and aluminum rods microstructures whose surface is up magnified forty times over a smooth surface. Since the pin shape of the microstructures is integrally bonded to the copper or aluminum bars by electroplating, a large heat transfer capacity is ensured from the base surface of the evaporator part via the copper or aluminum bars to their surface structure formed by pin-shaped projections in a stochastic arrangement. By this surface structure can develop unhindered in the micro-areas between the pin-shaped projections during the evaporation process vapor bubbles that arise at a minimum required overheating of the boiling liquid with a corresponding temperature difference bubbles of large dimensions, after the demolition in the open cavities between the individual pins again germinate vapor bubbles and can expand, so that not only a high bubble density, but also a high bubble frequency is guaranteed. Accordingly high is the size of the heat energy transport per unit time.

With respect to the condenser part, the object is achieved in connection with the abovementioned generic term in that the condenser part designed as a tube bundle, rod bundle or plate capacitor and the acted upon by the primary coolant outside of the tubes, rods or plates made of copper or aluminum within a capacitor housing completely or partially provided with projections in the form of ordered, electroplated microstructures which are electroplated onto the surface by means of a microporous polymer membrane and have a pin shape extending either longitudinally or at an angle to the surface of the tubes, rods or plates extends. Thus, the outer surface of the tubes or plates is increased by the aufgalvanisierten microstructures in stochastic order to one to forty times compared to the smooth surface. Since now uniformly open cavities form between the electrodes aufgalvanisierten, excellent film condensation is ensured, the liquid film can always flow evenly in all directions as well as unhindered. This ensures an excellent thermal efficiency and an unusually large heat transfer from the thus designed heat transfer surfaces. The surface density and the thickness of the pin-shaped projections can be varied both in the evaporator and the condenser part depending on the viscosity of the fluid acted, namely between 10 ² / cm ² and 10 ⁸ / cm ² at a thickness of 100 microns and 0.2 microns ,

The production and construction of heat transfer surfaces made of copper or aluminum with a galvanized microstructure is from the DE 201 19 741 U1 known.

To An advantageous development of the invention are to ensure a compact design, the tubes of the capacitor made of copper or Aluminum with an internal diameter of at least 5 mm, and as well the plates have a minimum thickness of 0.5 mm. It is the Capacitor designed as a disposable capacitor, between the tube sheets the Tubes are arranged parallel to each other and each with a Inlet and outlet for the secondary coolant and with one intake and outlet for the primary coolant is provided.

For smaller ones dissipated Amounts of heat from relevant component of the power electronics allows the invention also, the evaporator part and the condenser part as one-piece, compact cooling tube in the form of a heat pipe. The cross-sectional shape of this cooling pipe may be circular, oval, elliptical or polygonal.

specially For this Use is according to a particularly advantageous development the invention, the capacitor part as the evaporator part and thus Equally formed and arranged separately in the same housing offset by 180 ° to each other, the base area the condenser part with a leading out of the sealed housing as well as secondary coolant acted upon heat exchanger cohesively or non-positively is coupled.

The Pins of the microstructures have a minimum height of 10 .mu.m, which are between 10 .mu.m and 100 .mu.m can. The angle α of Pins to their base surface can be between 30 ° and Extend 90 °.

The Inlet temperature of the secondary coolant in the condenser part is always below the condensation temperature of the primary coolant held, especially if the secondary coolant from air or water consists.

When primary coolant Advantageously Frigen, alcohol or ammonia is used. These coolant are in particular for the temperature ranges of interest in power electronics from -70 ° C to + 200 ° C can be used. Generally, the primary coolant should be not flammable and not toxic and good electrical Possess resistance. Furthermore, a low surface tension for the Capillary action of the microstructures and a boiling point in the temperature range of 30 ° C up to 100 ° C at atmospheric pressure he wishes.

The inner surface of the tubes of the tube bundle condenser is a fan with the Cooling air or acted upon by a pump with water. If the shell-and-tube condenser can be used above the evaporator part and thus the condensed primary coolant can flow back under gravity to the evaporator part, the energy input for the fan is the only factor to be considered in the operating costs. In a delivery process by means of a pump would still their - low - added drive energy.

to warranty a big one heat transport by heat conduction is the base of the Evaporator with the heat transferring area the electronic component connected either cohesively and / or non-positively. In this case, the cohesive Compound from a soldering, Bonding, a welding or consist of a merger.

The frictional Connection in turn can be made by a pressfit, a pressing, a Crimping, wedging, screwing or tangling the contacting surfaces the electronic component on the one hand with the base surface of the On the other hand be made evaporator.

Several embodiments The invention are illustrated in the drawings. Showing:

1 the schematic representation of the coupled with the electronic component to be cooled evaporator part and thus connected via pipes to a closed circuit capacitor part, which is acted upon by a fan of air as a secondary coolant,

2 the device-technical representation of 1 in which the condensed primary coolant flows back under gravity from the condenser part to the evaporator part,

3 the perspective top view of a first embodiment of the evaporator part with on the top of a barred base surface whose surfaces with a microstructure (s 3 ),

4 the representation of a single rod of 3 with a detail enlargement of its microstructure,

5 a perspective view of a first embodiment of the condenser part in the form of a tube bundle evaporator,

6 a section of a pipe in the vertical position of the tube bundle evaporator of 5 with an enlarged detail view of its galvanized microstructure,

7 A second embodiment of an evaporator part with plate-shaped evaporator surfaces whose surfaces are provided with a microstructure (see enlarged detail),

8th the formation of a second embodiment of the capacitor part with plate-shaped capacitor surfaces, which are provided with holes and their surfaces with a microstructured surface,

9 the view in the direction of the arrow IX of 8th on the superimposed plates with the staggered hole arrangement,

10 a third embodiment of the capacitor part with capacitor plates that are mutually inclined,

11 the arrangement of an evaporator and a condenser part within a cooling pipe in the form of a heat pipe,

12 a rod or tubular body wrapped by a microporous polymer membrane prior to its insertion into a plating bath for application of the microstructures and

13 a micrograph of a microstructure.

The in the 1 and 2 shown cooling device 1 for cooling components of the power electronics 2 has an evaporator 3 and a capacitor 4 on that through two pipes 5 . 6 connected to each other to a closed circuit. The pipeline 5 this becomes the primary coolant 7 symbolizing arrows in vapor phase and the pipeline 6 flows through the primary coolant in the liquid phase. About a fan 8th the condenser 4 is the secondary coolant 9 , here air, charged.

How clear 2 can be taken, which is the electronic component 2 to the evaporator 3 amount of heat released from the primary coolant 7 and this automatically in vapor form over the pipe socket 10 and the line 5 to the inlet 11 of the housing 4a the capacitor part 4 directed. The inner surface 12b (S. 6 ) of the pipes 12 of the condenser part designed as a tube bundle condenser 4 is from the secondary coolant 9 impinged, which via inlet openings 9a into and through the outlet openings 9b comes out. The outer surface 12a the pipes 12 is first of the vapor phase of the primary coolant 7 applied. The condensed and thus liquid phase of the primary coolant 7 leaves the tube bundle capacitor 4 over the pipe socket 13 and flows under gravity through the second pipeline 6 to the inlet 14 of the evaporator part 3 , The base area 3a of the evaporator part 3 is in the illustrated case with a variety of matrix-like arranged on her rods 15 provided, the outer surface 15a with projections 16 in the form of ordered microstructures 16a covered by means of a micropores 17 provided polymer membrane 18 (S. 12 ) on the surface 15a of the bars 15 galvanized and have a pin shape that aligns with its longitudinal axis 19 (S. 2 ) either as shown perpendicular or at an angle α between 30 ° and 90 °.

Efficiency of evaporation is as uniform a liquid film as possible 30 in the of the microstructure 16a formed and open to all sides cavities 31 he wishes. As 3 and the related microstructure 16a the pin-like projections 16 shows clearly, germinates first near the surface 15a of the bars 15 a bubble that is steady with the temperature difference along the bar 15 and along the protrusions 16 grows and the inside width W (s. 4 ) between two microstructured protrusions 16 penetrates, there first a small bubble 20 , then a medium bubble 21 and finally a big bubble 22 forms, which breaks off and grows to a relatively large radius. After the demolition of the big bubble 22 or shortly before forms between the pin-shaped projections 16 again a bubble germ 23 in the manner described above until the tearing of a large bubble 22 increases. Since between the minimum required overheating ΔT of the boiling liquid on the outside 15a of the bars 15 and the radius of the torn blisters 22 the dependence exists that with increasing radius the minimum required overheating ΔT decreases, it is clear that the heat transfer due to the microstructure 16a Not only because of the increase in the heat transfer area up to forty times over a smooth surface, but also because of the above-described physical conditions of blistering increases significantly.

In the embodiment of 5 and 6 is the capacitor part 4 designed as a tube bundle capacitor. Of course, a plate capacitor is also possible, which will be discussed later.

The pipes 12 the capacitor part 4 be on their outside 12a from the primary coolant 7 applied. On the inside 12b become the pipes 12 by the fan 8th introduced secondary coolant 9 - here air - charged.

The outside 12a the pipes 12 is wholly or partially with protrusions 16 in the form of ordered, electroplated microstructures 16a provided, as the evaporator part 3 have a pin shape that aligns with its longitudinal axis 19 either as shown vertically (= 90 °) or at an angle α between 30 ° and 90 ° to the surface 12a the pipes 12 extends.

That of the condenser part 4 heated secondary coolant 9 becomes far away from the location of the electronic component 2 discharged, eg into the outside atmosphere.

At the condenser part 4 occurs between the microstructures 16a the pin-shaped projections 16 a film condensation that with a condensation skin on the pin-shaped projections 16 starts. At a low surface tension results in a driving pressure gradient in the condensate film, which far exceeds the corresponding values in the range of the usual single-phase flows. As a result, the condensation is not only due to the microstructures 16a Up to forty times compared to a smooth surface enlarged surface of the tubes 15a but also by the uniformity of the condensate film 30 as well as its free outflow through the interstices 31 of the microstructures 16a favored. This condensate of the primary coolant 7 then flows through the outlet 13 the capacitor part 4 under its gravity and passes through the line 6 to the evaporator part 3 back. To increase the efficiency, it is of course also possible between the capacitor part 4 and the evaporator part 3 to arrange a buffer tank with downstream pump, thus a liquid primary coolant 7 faster and more even from the condenser part 4 to the evaporator part 3 to get to. However, in this case, the energy required to drive the pump must be offset.

In 7 is the evaporator part 3 from 2 instead of the bars 15 with plates 24 equipped, their surfaces 24a likewise of microstructures 16a in the form of pin-shaped projections 16 are covered. The plates 24 are with their foot area 24b in grooves 3b the base area 3a of the evaporator part 3 admitted. Because the the surface 24a the plates 24 covering microstructures 16a have a high capillarity, especially in liquid coolants with low surface tension, for example in dichloromethane, methanol or chloroform, that is the bottom of the base surface 3a of the evaporator part 3 covering primary coolant as from a pump through the microstructure 16a sucked up, causing a thin liquid film on the surface 24a the plates 24 whose thickness is determined by the height of the pin-shaped projections 16 the microstructure tures 16a is predetermined. At the same time sets the evaporation process of the primary coolant 7 resulting in rapid heat removal and cooling of the microstructures 16a leads and thus also to the cooling of the surfaces 24a the plates 24 that are wetted by the primary coolant. Initial experiments with methanol for the primary coolant have surprisingly revealed that thereby the methanol could be cooled from originally 23 ° C within 15 minutes to -5 ° C. Since there is no capillarity on smooth surfaces, the cooling effect of smooth surfaces is considerably lower for this reason alone.

In the 8th and 9 is a second embodiment of a capacitor part 4 represented, which also plates 25 with surfaces 25a that has microstructures 16a in the form of pin-shaped projections 16 are provided. In addition, the plates have 25 holes 26 to ensure a faster departure of the condensate as soon as the pin-shaped projections 16 are flooded by the condensate. This will remove from the holes 26 formed an overflow, for the most uniform flooding of the pin-shaped projections 16 should take care of.

In 10 is a third embodiment of a capacitor part 4 represented, in which the surfaces 27a of cascaded panels 27 with microstructures 16a in the form of pin-shaped projections 16 equipped and inclined to each other at an angle to each other, also for the most uniform condensate overflow of the pin-shaped projections 16 to care. In this case, the holes are 26 the embodiment of the 8th and 9 dispensable.

In 11 is a second embodiment of a cooling device 1a in the form of a cooling pipe (heat pipe) shown schematically. With the 1 to 4 Matching parts are designated by the same reference numerals. The housing 28 is provided with a circular cross-section. However, it is also possible the case 28 box-shaped and form, for example, with an oval, elliptical or polygonal cross-section.

In the lower part of the housing 28 is the evaporator part 3 with the structure of 3 and 4 arranged. In the upper part of the housing is the condenser part 4 which also with bars 15 is provided, however, by 180 ° with respect to the bars 15 of the evaporator part 3 offset in the housing 28 is arranged. The housing 28 is sealed from the outside atmosphere. The capacitor part 4 is also with plate-shaped cooling fins 29 equipped by a natural convection airflow or by a fan 8th supplied forced air stream or can be acted upon by water as a secondary coolant.

Also the cooling fins 29 allow several variants, for example, with cooling fins ribbed rods, which are acted upon by air or water as a secondary coolant.

This heat pipe is the one of the electronic component 2 to the evaporator part 3 amount of heat released from the primary coolant 7 recorded, which in the already to the 3 and 4 described manner in its vapor phase in the housing 28 ascends, thereby to the capacitor part 4 passes and condenses there in the manner already described also.

In the 12 and 13 is a bar 15 or a pipe 12 with one with micropores 17 provided polymer membrane 18 wrapped and then placed in a galvanizing bath until the pin-shaped projections 16 , which may also have a mushroom shape, the micropores 17 have penetrated completely or partially and an ordered microstructure 16a of pin-shaped projections 16 form in a stochastic arrangement.

Upon completion of the plating process, the polymer membrane becomes 18 removed, causing the out 13 apparent pin-shaped projections 16 be exposed. Because these pin-shaped projections 16 with the surface 15a of the bars 15 and the surface 12a the pipes 12 are cohesively connected, an excellent heat transfer is ensured in the manner described.

1, 1a

Kühlvomchtung

2

power electronics 2

3

evaporator part 3

3a

Base surface of the evaporator part 3

3b

Grooves in base area 3a

4

condenser part

4a

capacitor case

5, 6

piping

7

primary coolant

8th

fan

9

secondary coolant

9a

inlet opening

9b

outlet opening

10

pipe socket

11

inlet connection of

condenser part 4

12

Tube 12

12a

Outside of the pipes 12

12b

Inside of the pipes 12

13

pipe socket 13

14

inlet connection of

evaporator part 3

15

rods

15a

Outside surface of the bars 15

16

pencils 16

16a

microstructures

17

micropores

18

polymer membrane

19

longitudinal axis

20

small bladder

21

medium sized bubble

22

big bubble

23

bubble nucleation

24 25, 27

plates

24a, 25a, 27a

Surface of the plates 24 . 25 . 27

24b

footer the plates

26

holes

28

casing

29

cooling fins

30

liquid film

31

cavities

H

Height of the pins 16

W

clear width between the pins 16

Tilt angle of the pins 16

α

to surface

Claims (17)

Cooling device, in particular for cooling components of the power electronics by means of a heat transfer circuit consisting of a heat transfer coupled to the electronic component and acted upon by a primary coolant evaporator part and externally acted upon by a secondary coolant condenser part in which the primary coolant cooled and its vapor phase is condensed in which the primary coolant is conveyed either under its gravitational force or by means of a pump from the condenser part to the evaporator part, characterized in that that with the component ( 2 ) of the power electronics heat transfer coupled evaporator part ( 3 ) of a plurality of matrix-like on a base surface ( 3a ) of an evaporator housing ( 3b ) arranged rods ( 15 ), Pipes or flat or curved plates ( 24 ) or a combination thereof of copper or aluminum whose surface ( 15a . 24a ) in whole or in part with projections ( 16 ) in the form of ordered microstructures ( 16a ) covered by one with micropores ( 17 ) provided polymer membrane ( 18 ) on the surface ( 15a ) of the bars ( 15 ), Pipes or plates ( 24 ) are galvanized and have a pin shape, which with its longitudinal axis ( 19 ) either perpendicular or at an angle (α) to the surface ( 15a . 24a ) of the bars ( 15 ), Pipes or plates ( 24 ). Cooling device, in particular for cooling components of the power electronics by means of a heat transfer circuit consisting of a heat transfer coupled to the electronic component and acted upon by a primary coolant evaporator part and externally acted upon by a secondary coolant condenser part in which the primary coolant cooled and its vapor phase is condensed in which the primary coolant is conveyed either under its gravity or by means of a pump from the condenser part to the evaporator part, characterized in that the condenser part ( 4 ) is designed as a tube bundle, rod bundle or plate capacitor and that of the primary coolant ( 7 ) acted upon outside ( 12a ) of the pipes ( 12 ), Rods ( 15 ) or plates ( 25 . 27 ) made of copper or aluminum within a capacitor housing ( 4a ) in whole or in part with projections ( 16 ) in the form of ordered, electroplated microstructures ( 16a ) provided by means of a microporous ( 17 ) provided polymer membrane ( 18 ) on the surface ( 12a . 15a . 25a . 27a ) are galvanized and have a pin shape, which with its longitudinal axis ( 19 ) either perpendicular or at an angle (α) to the surface ( 12a . 15a . 24a . 25a . 27a ) of the pipes ( 12 ), Rods ( 15 ) or plates ( 24 . 25 . 27 ). Cooling device according to claim 2, characterized in that the pipes ( 12 ) of the capacitor part ( 4 ) an inner diameter of at least 5 mm and the plates ( 24 . 25 . 27 ) have a minimum thickness of 0.5 mm. Cooling device according to claim 2 or 3, characterized in that the condenser part ( 4 ) is designed as a disposable capacitor, between the tube sheets, the tubes ( 12 ) are arranged parallel to each other and each having an entrance ( 9a ) and outlet ( 9b ) for the secondary coolant ( 9 ) and each with an inlet ( 11 ) and outlet ( 13 ) for the primary cattle ( 7 ) is provided. Cooling device according to Claims 1 and 2, characterized in that the evaporator part ( 3 ) and the capacitor part ( 4 ) as a one-piece cooling tube in the form of a heat pipe ( 1a ) is trained. Cooling device according to claim 5, characterized in that the cross-sectional shape of the cooling tube ( 1a ) is circular, oval, elliptical or polygonal configured. Cooling device according to claim 5 or 6, characterized in that the condenser part ( 4 ) like the evaporator part ( 3 ) formed and separated in the same housing ( 28 ) is arranged offset by 180 ° to each other, wherein the base surface of the capacitor part ( 4 ) with one from the sealed housing ( 28 ) as well as secondary coolant ( 9 ) acted upon heat exchanger ( 29 ) is coupled cohesively or non-positively. Cooling device according to one of claims 1 to 7, characterized in that the pins ( 16 ) of the microstructures ( 16a ) have a minimum height (h) of 10 microns. Cooling device according to one of claims 1 to 8, characterized in that the pins ( 16 ) of the microstructure ( 16a ) are provided with a height (h) between 10 .mu.m and 100 .mu.m. Cooling device according to one of claims 1 to 9, characterized in that the angle (α) of the pins ( 16 ) to the surface ( 12a . 15a . 24a . 25a . 27a ) of its base is between 30 ° and 90 °. Cooling device according to one of claims 1 to 10, characterized in that the inlet temperature of the secondary coolant ( 9 ) in the condenser part ( 4 ) always below the condensation temperature of the primary coolant ( 7 ) is held. Cooling device according to one of claims 1 to 11, characterized in that the secondary coolant ( 9 ) consists of air or water. Cooling device according to one of claims 1 to 12, characterized in that the primary coolant ( 7 ) consists of Frigen, alcohol or ammonia. Cooling device according to one of claims 1 to 13, characterized in that the inner surface ( 12b ) of the pipes ( 12 ) of the tube bundle capacitor ( 4 ) from a fan ( 8th ) with the cooling air ( 9 ) or is supplied by a pump with water. Cooling device according to one of claims 1 to 14, characterized in that the base surface of the evaporator part ( 3 ) with the heat transfer surface of the electronic component ( 2 ) is connected either cohesively and / or non-positively. cooler according to claim 15, characterized in that the cohesive connection of a soldering, Gluing, welding or consists of a merger. Cooling device according to claim 15, characterized in that the frictional connection of a press-fitting, pressing, a squeezing, a wedging, a screw connection or an entanglement of the contacting surfaces of the electronic component ( 2 ) on the one hand with the base surface ( 3a ) of the evaporator part ( 3 ) On the other hand.