DE10308048A1 - Producing carrier elements from a network unit, by partitioning network unit along designated breaking points such that the unit is cut from these points towards a defined distance until reaching the channels within the unit - Google Patents
Producing carrier elements from a network unit, by partitioning network unit along designated breaking points such that the unit is cut from these points towards a defined distance until reaching the channels within the unit Download PDFInfo
- Publication number
- DE10308048A1 DE10308048A1 DE2003108048 DE10308048A DE10308048A1 DE 10308048 A1 DE10308048 A1 DE 10308048A1 DE 2003108048 DE2003108048 DE 2003108048 DE 10308048 A DE10308048 A DE 10308048A DE 10308048 A1 DE10308048 A1 DE 10308048A1
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- DE
- Germany
- Prior art keywords
- unit
- points
- channels
- carrier elements
- breaking points
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00865—Multistep processes for the separation of wafers into individual elements
- B81C1/00873—Multistep processes for the separation of wafers into individual elements characterised by special arrangements of the devices, allowing an easier separation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00865—Multistep processes for the separation of wafers into individual elements
- B81C1/00888—Multistep processes involving only mechanical separation, e.g. grooving followed by cleaving
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Sampling And Sample Adjustment (AREA)
Abstract
Description
Die Erfindung betrifft ein Verfahren zur Herstellung von Trägerelementen für die Mikrotechnik gemäß dem Oberbegriff des Patentanspruchs 1.The invention relates to a method for the production of carrier elements for the Microtechnology according to the generic term of claim 1.
Solche Trägerelemente dienen beispielsweise zur Aufnahme von Messeinrichtungen, Sensoren und Vorratsbehältern, die in der Mikrotechnik benötigt werden. Da diese Bauelemente sehr kleine Abmessungen aufweisen, sind sie oftmals schwer zu handhaben. Aus diesem Grund werden sie in Trägerelemente integriert. Diese können so ausgebildet werden, dass bei Bedarf ganze Analysegeräte darin untergebracht werden können.Such carrier elements serve, for example to accommodate measuring devices, sensors and storage containers that needed in microtechnology become. Since these components have very small dimensions, they are often difficult to handle. Because of this, they will in support elements integrated. these can be designed so that entire analysis devices can be accommodated in it can be.
Die Trägerelemente werden im Verbund gefertigt, und anschließen voneinander getrennt. Damit werden die Herstellungskosten gegenüber einer Einzelfertigung deutlich gesenkt. Durch die innere Struktur eines solchen Verbundes wird die Anzahl der Trägerelemente festgelegt. In diese Anzahl von Trägerelementen kann der Verbund nach seiner Fertigstellung aufgeteilt werden. Ein solcher Verbund wird aus zwei flächigen Bauelementen gefertigt, wovon das ein Bauelement oftmals aus Silizium und das andere aus Glas hergestellt ist. Für die Aufnahme von Messeinrichtungen, Sensoren, Vorratsbehältern und dergleichen wird wenigstens eines der Bauelemente in seiner Oberfläche mit Ausnehmungen versehen, die durch das Verbinden der beiden Bauelemente nach außen verschlossen werden. Die in den Ausnehmungen angeordneten Einrichtungen können über Kanäle miteinander oder mit dem Außenbereich des Trägerelements verbunden sein. Die Kanäle werden ebenfalls durch Ausnehmungen in der Oberfläche mindestens eines Bauelements ausgebildet, und durch das zweite Bauelement nach außen abgegrenzt. Ein solcher Verbund kann beispielsweise mit Hilfe einer Dia mantsäge in die einzelnen Trägerelemente aufgeteilt werden. Um die Lebensdauer des Sägeblatts zu erhöhen, wird dieses beim Sägen mit einer Flüssigkeit gekühlt, die auch gleichzeitig dazu dient, die dabei anfallenden Teilchen aus Silizium und Glas zu entfernen. Dabei lässt es sich jedoch nicht vermieden, dass eine größere Menge dieser Teilchen in die Kanäle gelangt. Da die Durchmesser der Kanäle kleiner als 200μm sind, ist eine Reinigung derselben nach dem Trennen des Verbundes nur bedingt oder überhaupt nicht möglich.The carrier elements are combined manufactured, and connect separated from each other. Thus, the manufacturing costs compared to one Individual production significantly reduced. Due to the internal structure of a such a network, the number of carrier elements is determined. In this number of support elements the composite can be divided after its completion. On such a network is made up of two planes Components manufactured, of which a component is often made of silicon and the other is made of glass. For the inclusion of measuring devices, Sensors, storage containers and the like at least one of the components in it surface provided with recesses by connecting the two components outward be closed. The devices arranged in the recesses can cross channels with each other or with the outside area of the carrier element be connected. The canals are also at least by recesses in the surface formed of a component, and by the second component Outside demarcated. Such a composite can, for example, with the help of a Slide saw into the individual support elements be divided. To increase the life of the saw blade, this while sawing with a liquid cooled, which also serves at the same time, the resulting particles to remove from silicon and glass. However, it cannot be avoided that a larger amount of these particles in the channels arrives. Since the diameter of the channels is smaller than 200μm, a cleaning of the same after the separation of the composite only to a limited extent or at all not possible.
Der Erfindung liegt die Aufgabe zugrunde, ein Verfahren aufzuzeigen, mit dem die in einem Verbund hergestellten Trägerelementen so voneinander getrennt werden können, das ein Verschmutzen der Kanäle in den Trägerelementen durch die beim Trennen verwendete Flüssigkeiten und die dabei anfallenden Teilchen unterbunden wird.The invention is based on the object To demonstrate the process by which those produced in a composite support elements can be separated from each other this is a contamination of the channels in the support elements due to the liquids used in the separation and the resulting Particle is prevented.
Diese Aufgabe wird durch die Merkmale des Patentanspruchs 1 gelöst.This task is due to the characteristics of claim 1 solved.
Weitere erfinderische Merkmale sind in den abhängigen Ansprüchen gekennzeichnet.Other inventive features are in the dependent claims characterized.
Die Erfindung wird nachfolgend an Hand von schematischen Zeichnungen näher erläutert.The invention will follow Hand explained in more detail by schematic drawings.
Es zeigen:Show it:
Nach dem die Sollbruchstellen
Die nach außen gerichtete Öffnung des
Kanals
Die Erfindung beschränkt sich nicht nur auf das hier beschriebene Ausführungsbeispiel. Vielmehr umfasst sie alle Variationen des Verfahrens die dem Kern der Erfindung zugeordnet werden können.The invention is limited not only on the embodiment described here. Rather includes they all variations of the method associated with the essence of the invention can be.
Claims (3)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE2003108048 DE10308048A1 (en) | 2003-02-26 | 2003-02-26 | Producing carrier elements from a network unit, by partitioning network unit along designated breaking points such that the unit is cut from these points towards a defined distance until reaching the channels within the unit |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE2003108048 DE10308048A1 (en) | 2003-02-26 | 2003-02-26 | Producing carrier elements from a network unit, by partitioning network unit along designated breaking points such that the unit is cut from these points towards a defined distance until reaching the channels within the unit |
Publications (1)
Publication Number | Publication Date |
---|---|
DE10308048A1 true DE10308048A1 (en) | 2004-09-09 |
Family
ID=32841865
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE2003108048 Withdrawn DE10308048A1 (en) | 2003-02-26 | 2003-02-26 | Producing carrier elements from a network unit, by partitioning network unit along designated breaking points such that the unit is cut from these points towards a defined distance until reaching the channels within the unit |
Country Status (1)
Country | Link |
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DE (1) | DE10308048A1 (en) |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4342890A1 (en) * | 1993-12-16 | 1995-06-22 | Mannesmann Kienzle Gmbh | Process for sealing manufacturing-related openings on micromechanical acceleration sensors |
DE19508222C1 (en) * | 1995-03-08 | 1996-06-05 | Siemens Ag | Opto-electronic converter |
DE4415132C2 (en) * | 1994-04-29 | 1997-03-20 | Siemens Ag | Process for shaping thin wafers and solar cells from crystalline silicon |
DE19709520A1 (en) * | 1997-03-10 | 1998-09-17 | Gemac Ges Fuer Mikroelektronik | Capacitive acceleration sensor element of differential capacitor type |
DE19945470A1 (en) * | 1999-09-22 | 2001-04-12 | Fraunhofer Ges Forschung | Method of making a composite microfunctional device |
DE10053865C1 (en) * | 2000-10-27 | 2002-04-04 | Inst Physikalische Hochtech Ev | Process for anodically bonding materials with glass components used in microsystems for joining glass with silicon comprises using niobium or tantalum phosphate glass having a specified alkali ion conductivity |
DE10153176A1 (en) * | 2001-08-24 | 2003-03-13 | Schott Glas | Integrated circuit component encased in carrier material has contacts which are connected by channels through a thinned under layer |
-
2003
- 2003-02-26 DE DE2003108048 patent/DE10308048A1/en not_active Withdrawn
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4342890A1 (en) * | 1993-12-16 | 1995-06-22 | Mannesmann Kienzle Gmbh | Process for sealing manufacturing-related openings on micromechanical acceleration sensors |
DE4415132C2 (en) * | 1994-04-29 | 1997-03-20 | Siemens Ag | Process for shaping thin wafers and solar cells from crystalline silicon |
DE19508222C1 (en) * | 1995-03-08 | 1996-06-05 | Siemens Ag | Opto-electronic converter |
DE19709520A1 (en) * | 1997-03-10 | 1998-09-17 | Gemac Ges Fuer Mikroelektronik | Capacitive acceleration sensor element of differential capacitor type |
DE19945470A1 (en) * | 1999-09-22 | 2001-04-12 | Fraunhofer Ges Forschung | Method of making a composite microfunctional device |
DE10053865C1 (en) * | 2000-10-27 | 2002-04-04 | Inst Physikalische Hochtech Ev | Process for anodically bonding materials with glass components used in microsystems for joining glass with silicon comprises using niobium or tantalum phosphate glass having a specified alkali ion conductivity |
DE10153176A1 (en) * | 2001-08-24 | 2003-03-13 | Schott Glas | Integrated circuit component encased in carrier material has contacts which are connected by channels through a thinned under layer |
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Legal Events
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OM8 | Search report available as to paragraph 43 lit. 1 sentence 1 patent law | ||
8139 | Disposal/non-payment of the annual fee |