DE10292664D2 - Process for the production of heat exchangers in the sintering process - Google Patents

Process for the production of heat exchangers in the sintering process

Info

Publication number
DE10292664D2
DE10292664D2 DE10292664T DE10292664T DE10292664D2 DE 10292664 D2 DE10292664 D2 DE 10292664D2 DE 10292664 T DE10292664 T DE 10292664T DE 10292664 T DE10292664 T DE 10292664T DE 10292664 D2 DE10292664 D2 DE 10292664D2
Authority
DE
Germany
Prior art keywords
production
heat exchangers
sintering
sintering process
exchangers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE10292664T
Other languages
German (de)
Inventor
Hubert Hamm
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to DE10292664T priority Critical patent/DE10292664D2/en
Application granted granted Critical
Publication of DE10292664D2 publication Critical patent/DE10292664D2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3733—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh, porous structures
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
    • B22F3/10—Sintering only
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
    • F28F21/08—Constructions of heat-exchange apparatus characterised by the selection of particular materials of metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2998/00—Supplementary information concerning processes or compositions relating to powder metallurgy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
DE10292664T 2001-06-15 2002-06-14 Process for the production of heat exchangers in the sintering process Expired - Fee Related DE10292664D2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE10292664T DE10292664D2 (en) 2001-06-15 2002-06-14 Process for the production of heat exchangers in the sintering process

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE10129047 2001-06-15
DE10292664T DE10292664D2 (en) 2001-06-15 2002-06-14 Process for the production of heat exchangers in the sintering process
PCT/DE2002/002192 WO2002103271A1 (en) 2001-06-15 2002-06-14 Method for producing heat exchangers in a sintering method

Publications (1)

Publication Number Publication Date
DE10292664D2 true DE10292664D2 (en) 2004-04-29

Family

ID=7688389

Family Applications (1)

Application Number Title Priority Date Filing Date
DE10292664T Expired - Fee Related DE10292664D2 (en) 2001-06-15 2002-06-14 Process for the production of heat exchangers in the sintering process

Country Status (2)

Country Link
DE (1) DE10292664D2 (en)
WO (1) WO2002103271A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102008031266B4 (en) * 2008-07-02 2013-05-29 Eads Deutschland Gmbh Use of a thermogenerator on an aircraft

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3828348A1 (en) * 1988-08-20 1990-02-22 Schwaebische Huettenwerke Gmbh DEVICE FOR HEAT TRANSFER
JP2507561B2 (en) * 1988-10-19 1996-06-12 株式会社日立製作所 Semiconductor cooling system
US5205353A (en) * 1989-11-30 1993-04-27 Akzo N.V. Heat exchanging member
US5552634A (en) * 1993-12-14 1996-09-03 Lsi Logic Corporation Method and apparatus for dissipating heat in an electronic device
DE19934554A1 (en) 1999-07-22 2001-01-25 Michael Stollenwerk Heat exchanger has cooling body with channel structure for introducing the cooling medium
DE20008938U1 (en) * 2000-05-19 2000-08-31 Pepatec Gmbh Heat exchanger and device for tempering a surface or a volume

Also Published As

Publication number Publication date
WO2002103271A1 (en) 2002-12-27

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Legal Events

Date Code Title Description
8139 Disposal/non-payment of the annual fee