DE102022210961A1 - Adhesives for assembling printed circuit boards, printed circuit boards comprising this and their use - Google Patents
Adhesives for assembling printed circuit boards, printed circuit boards comprising this and their use Download PDFInfo
- Publication number
- DE102022210961A1 DE102022210961A1 DE102022210961.9A DE102022210961A DE102022210961A1 DE 102022210961 A1 DE102022210961 A1 DE 102022210961A1 DE 102022210961 A DE102022210961 A DE 102022210961A DE 102022210961 A1 DE102022210961 A1 DE 102022210961A1
- Authority
- DE
- Germany
- Prior art keywords
- adhesive
- circuit board
- electronic component
- printed circuit
- circuit boards
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 86
- 239000000853 adhesive Substances 0.000 title claims abstract description 80
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 13
- 239000007787 solid Substances 0.000 claims abstract description 6
- 239000002904 solvent Substances 0.000 claims description 5
- 229930195733 hydrocarbon Natural products 0.000 claims description 4
- 150000002430 hydrocarbons Chemical class 0.000 claims description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 3
- BVKZGUZCCUSVTD-UHFFFAOYSA-N carbonic acid Chemical class OC(O)=O BVKZGUZCCUSVTD-UHFFFAOYSA-N 0.000 claims description 3
- 150000008049 diazo compounds Chemical class 0.000 claims description 3
- 239000003822 epoxy resin Substances 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims description 3
- 229920002635 polyurethane Polymers 0.000 claims description 3
- 239000004814 polyurethane Substances 0.000 claims description 3
- 239000011148 porous material Substances 0.000 claims description 3
- 229920001169 thermoplastic Polymers 0.000 claims description 3
- 239000004925 Acrylic resin Substances 0.000 claims description 2
- 229920000178 Acrylic resin Polymers 0.000 claims description 2
- 239000004831 Hot glue Substances 0.000 claims description 2
- 239000004215 Carbon black (E152) Substances 0.000 claims 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims 1
- 238000000034 method Methods 0.000 description 8
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- 238000009835 boiling Methods 0.000 description 3
- 239000003990 capacitor Substances 0.000 description 3
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- UIIMBOGNXHQVGW-UHFFFAOYSA-M Sodium bicarbonate Chemical compound [Na+].OC([O-])=O UIIMBOGNXHQVGW-UHFFFAOYSA-M 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 2
- 238000013459 approach Methods 0.000 description 2
- 239000011324 bead Substances 0.000 description 2
- NKWPZUCBCARRDP-UHFFFAOYSA-L calcium bicarbonate Chemical compound [Ca+2].OC([O-])=O.OC([O-])=O NKWPZUCBCARRDP-UHFFFAOYSA-L 0.000 description 2
- 235000010216 calcium carbonate Nutrition 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 239000002861 polymer material Substances 0.000 description 2
- 235000017557 sodium bicarbonate Nutrition 0.000 description 2
- BUHVIAUBTBOHAG-FOYDDCNASA-N (2r,3r,4s,5r)-2-[6-[[2-(3,5-dimethoxyphenyl)-2-(2-methylphenyl)ethyl]amino]purin-9-yl]-5-(hydroxymethyl)oxolane-3,4-diol Chemical compound COC1=CC(OC)=CC(C(CNC=2C=3N=CN(C=3N=CN=2)[C@H]2[C@@H]([C@H](O)[C@@H](CO)O2)O)C=2C(=CC=CC=2)C)=C1 BUHVIAUBTBOHAG-FOYDDCNASA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 229910000020 calcium bicarbonate Inorganic materials 0.000 description 1
- VTYYLEPIZMXCLO-UHFFFAOYSA-L calcium carbonate Substances [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 229910000030 sodium bicarbonate Inorganic materials 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/10—Adhesives in the form of films or foils without carriers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
- H05K3/305—Affixing by adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/366—Assembling printed circuits with other printed circuits substantially perpendicularly to each other
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/24—Acids; Salts thereof
- C08K3/26—Carbonates; Bicarbonates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/01—Hydrocarbons
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/02—Halogenated hydrocarbons
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/05—Alcohols; Metal alcoholates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/22—Compounds containing nitrogen bound to another nitrogen atom
- C08K5/23—Azo-compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
- C09J2301/124—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape
- C09J2301/1242—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape the opposite adhesive layers being different
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/20—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself
- C09J2301/208—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself the adhesive layer being constituted by at least two or more adjacent or superposed adhesive layers, e.g. multilayer adhesive
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/304—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being heat-activatable, i.e. not tacky at temperatures inferior to 30°C
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2433/00—Presence of (meth)acrylic polymer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2463/00—Presence of epoxy resin
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2475/00—Presence of polyurethane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0133—Elastomeric or compliant polymer
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Es wird ein Klebemittel zur Bestückung einer Leiterplatte beschrieben, wobei das Klebemittel (10) eine flächige Gestalt aufweist und aus einem Klebstoff (12) ausgeführt ist, welcher bei Raumtemperatur eine feste Konsistenz zeigt und welcher bei einer erhöhten Temperatur eine erweichte, klebrige Konsistenz zeigt, und wobei im Klebstoff (12) des Klebemittels (10) ein Expansionsmittel (14) enthalten ist, welches bei der erhöhten Temperatur eine Volumenzunahme zeigt.An adhesive for assembling a printed circuit board is described, wherein the adhesive (10) has a flat shape and is made of an adhesive (12) which has a solid consistency at room temperature and which has a softened, sticky consistency at an elevated temperature, and wherein the adhesive (12) of the adhesive (10) contains an expansion agent (14) which shows an increase in volume at the elevated temperature.
Description
Die vorliegende Erfindung bezieht sich auf ein Klebemittel zur Bestückung von Leiterplatten, eine Leiterplatte dieses enthaltend, sowie deren Verwendung gemäß dem Oberbegriff der unabhängigen Ansprüche.The present invention relates to an adhesive for assembling printed circuit boards, a printed circuit board containing the same, and the use thereof according to the preamble of the independent claims.
Stand der TechnikState of the art
Es ist gängige Technik, Leiterplatten oberflächlich mit Bauteilen zu bestücken. Diese Art der Technik wird auch als SMD-Technik bezeichnet (Surface Mounted Device). Oftmals wird eine Vielzahl von elektronischen Bauteilen auf die Oberfläche derselben Leiterplatte aufgebracht. Werden dabei auch elektronische Bauteile verwendet, die während des späteren Betriebs beispielsweise mechanische Schwingungen oder Geräusche erzeugen, so kann die Funktionstüchtigkeit benachbarter weiterer elektronischer Bauteile beeinträchtigt werden. Hier ist eine geeignete Vibrationsentkopplung wünschenswert. Derartige mechanische Geräusche zeigen sich beispielsweise bei der Verwendung von Drossel- oder Elektrolytkondensatoren. Befinden sich in der Nachbarschaft derartiger Kondensatoren beispielsweise Sensoren, so werden diese Geräusche bzw. Vibrationen von den Sensoren gemessen und führen zu einem verschlechterten Signal-Rausch-Verhältnis der Sensoren im Betrieb.It is common practice to mount components on the surface of circuit boards. This type of technology is also known as SMD technology (Surface Mounted Device). Often, a large number of electronic components are applied to the surface of the same circuit board. If electronic components are used that generate mechanical vibrations or noise during later operation, for example, the functionality of other neighboring electronic components can be impaired. In this case, suitable vibration decoupling is desirable. Such mechanical noises can be seen, for example, when using choke or electrolytic capacitors. If there are sensors in the vicinity of such capacitors, for example, these noises or vibrations are measured by the sensors and lead to a deterioration in the signal-to-noise ratio of the sensors during operation.
Ein Lösungsansatz hierfür ist beispielsweise eine Vermeidung von Bauteilen, welche das Risiko bergen, in einem späteren Betrieb Geräusche oder Vibrationen zu verursachen oder die Verwendung von Bauteilen, die in einem separaten Klebeprozess mit der Oberfläche einer Leiterplatte verklebt werden. Beide Ansätze haben jedoch kostentechnische Nachteile, da entweder spezielle Ersatzbauteile verwendet werden müssen oder ein separater Prozessschritt für ein Verkleben entsprechender Bauteile vorgesehen sein muss.One approach to solving this problem is, for example, to avoid components that pose the risk of causing noise or vibrations during later operation or to use components that are bonded to the surface of a circuit board in a separate bonding process. However, both approaches have cost disadvantages, as either special replacement components have to be used or a separate process step has to be provided for bonding the corresponding components.
Diesbezüglich ist der
Offenbarung der ErfindungDisclosure of the invention
Gemäß der vorliegenden Erfindung wird ein Klebemittel zur Bestückung von Leiterplatten, eine Leiterplatte dieses umfassend sowie deren Verwendung mit den kennzeichnenden Merkmalen der unabhängigen Patentansprüche bereitgestellt.According to the present invention, an adhesive for assembling printed circuit boards, a printed circuit board comprising the same and their use with the characterizing features of the independent patent claims are provided.
Vorteile der ErfindungAdvantages of the invention
Erfindungsgemäß wird ein Klebemittel zur Bestückung von Leiterplatten zur Verfügung gestellt, welches eine flächige Gestalt aufweist und welches aus einem Klebstoff gebildet ist, der bei Raumtemperatur eine feste Konsistenz zeigt und bei einer erhöhten Temperatur eine weiche, fließende oder flüssige Konsistenz annimmt und klebrig wirkt. Im Klebstoff des Klebemittels ist ein Expansionsmittel enthalten, welches bei der erhöhten Temperatur aktiviert wird und dabei eine Volumenzunahme zeigt.According to the invention, an adhesive for assembling printed circuit boards is provided, which has a flat shape and which is formed from an adhesive which has a solid consistency at room temperature and assumes a soft, flowing or liquid consistency and has a sticky effect at an elevated temperature. The adhesive of the adhesive contains an expansion agent which is activated at the elevated temperature and thereby shows an increase in volume.
Ein derartig ausgeführtes Klebemittel ermöglicht in vorteilhafter Weise beispielsweise eine SMD-Bestückung von Leiterplatten. Wird ein derartiges Klebemittel beispielsweise in Form eines Klebepads auf die Oberfläche der Leiterplatte aufgebracht, so ist eine derartige Aufbringung aufgrund der flächigen Gestalt des Klebepads und seiner festen Konsistenz besonders einfach ausführbar. Wird zum Aufbringen eines oberflächlichen Bauteils das Klebemittel einer erhöhten Temperatur ausgesetzt, so führt dies zu einer Erweichung des Klebstoffs des Klebemittels und somit zu einer möglichen Fixierung von Bauteilen auf der Oberfläche der Leiterplatte.An adhesive designed in this way advantageously enables, for example, SMD assembly of circuit boards. If such an adhesive is applied to the surface of the circuit board in the form of an adhesive pad, for example, such application is particularly easy to carry out due to the flat shape of the adhesive pad and its solid consistency. If the adhesive is exposed to an increased temperature in order to apply a surface component, this leads to a softening of the adhesive in the adhesive and thus to a possible fixation of components on the surface of the circuit board.
Da zusätzlich im Klebstoff des Klebemittels ein Expansionsmittel enthalten ist, welches bei erhöhter Temperatur aktiviert wird und zu einer Volumenzunahme des Klebemittels führt, kommt es zum einen zu einer Vibrationsentkopplung des mittels des Klebemittels auf der Oberfläche der Leiterplatte aufgebrachten Bauteils gegenüber der Leiterplatte und zum anderen in einem gewissen Umfang zu einem Umfassen des auf diese Art fixierten Bauteils durch die Volumenzunahme des Klebstoffs des Klebemittels um das Bauteil herum. Im Idealfall bildet sich dabei eine Form von Kleberaupe um das auf der Oberfläche der Leiterplatte fixierte Bauteil herum. Diesem Vorgang kann neben einer wirksamen Fixierung des Bauteils auf der Oberfläche der Leiterplatte zusätzlich auch eine gegenüber externen Medien abdichtende Wirkung zugerechnet werden.Since the adhesive also contains an expansion agent which is activated at elevated temperatures and causes the adhesive to increase in volume, this results in a vibration decoupling of the component attached to the surface of the circuit board using the adhesive from the circuit board and, to a certain extent, the component fixed in this way is enclosed by the increase in volume of the adhesive around the component. Ideally, this creates a bead of adhesive around the component fixed to the surface of the circuit board. In addition to effectively fixing the component to the surface of the circuit board, this process can also be attributed with a sealing effect against external media.
Weitere vorteilhafte Ausführungsformen der vorliegenden Erfindung sind Gegenstand der Unteransprüche.Further advantageous embodiments of the present invention are the subject of the subclaims.
So ist es von Vorteil, wenn als Klebstoff des Klebemittels ein thermoplastischer Kunststoff, ein Polyurethan-Schmelzklebstoff oder ein Acryl- bzw. Epoxidharz zum Einsatz kommt. Die genannten polymeren Werkstoffe sind bei Raumtemperatur im Wesentlichen fester Natur und zeigen bei erhöhter Temperatur ein Erweichen, dem eine klebende Wirkung zugeordnet werden kann.It is therefore advantageous if the adhesive used is a thermoplastic plastic, a polyurethane hot melt adhesive or an acrylic or polyurethane adhesive. Epoxy resin is used. The polymer materials mentioned are essentially solid at room temperature and soften at higher temperatures, which can be attributed to an adhesive effect.
Weiterhin ist von Vorteil, wenn dem Klebstoff des Klebemittels als Expansionsmittel definierte Mengen an Lösungsmittel zugesetzt werden. Dies kann beispielsweise geschehen, indem Poren des Klebstoffs mit einem Lösungsmittel befüllt sind. Als Lösungsmittel kommen hierbei beispielsweise neben Wasser auch organische Lösungsmittel wie beispielsweise Alkohole oder fluorierte, niedrig siedende Kohlenwasserstoffe in Betracht.It is also advantageous if defined amounts of solvent are added to the adhesive as an expansion agent. This can be done, for example, by filling the pores of the adhesive with a solvent. In addition to water, organic solvents such as alcohols or fluorinated, low-boiling hydrocarbons can also be used as solvents.
Gemäß einer weiteren vorteilhaften Ausführungsform der vorliegenden Erfindung sind dem Klebstoff des Klebemittels als Expansionsmittel Hydrogencarbonate, wie beispielsweise Natriumhydrogencarbonat oder Calciumhydrogencarbonat zugesetzt. Diese zeigen bei erhöhter Temperatur eine Zersetzung unter Freisetzung von Kohlendioxid und somit eine definierte Volumenzunahme in Form eines Aufschäumens. Weiterhin eignen sich in diesem Zusammenhang Diazoverbindungen, die bei Erwärmung Stickstoff freisetzen. Gemäß einer besonders vorteilhaften Ausführungsform der vorliegenden Erfindung ist das Klebemittel auf mindestens einer seiner Großflächen mit einer zusätzlichen Schicht eines Klebstoffs versehen, wobei der betreffende Klebstoff der zusätzlichen Schicht bereits bei Raumtemperatur eine klebende Wirkung zeigt und somit eine ortsfeste Fixierung des Klebemittels, beispielsweise auf der Oberfläche einer zu bestückenden Leiterplatte zuverlässig ermöglicht.According to a further advantageous embodiment of the present invention, hydrogen carbonates, such as sodium hydrogen carbonate or calcium hydrogen carbonate, are added to the adhesive of the adhesive as an expansion agent. At elevated temperatures, these decompose with the release of carbon dioxide and thus show a defined increase in volume in the form of foaming. Diazo compounds that release nitrogen when heated are also suitable in this context. According to a particularly advantageous embodiment of the present invention, the adhesive is provided with an additional layer of adhesive on at least one of its large surfaces, the adhesive in question of the additional layer already showing an adhesive effect at room temperature and thus reliably enabling the adhesive to be fixed in place, for example on the surface of a circuit board to be assembled.
Die Erfindung umfasst weiterhin ein elektronisches Bauelement, welches eine Leiterplatte umfasst, auf der mindestens ein elektronisches Bauteil befestigt ist. Die Befestigung des elektronischen Bauteils auf der Oberfläche der Leiterplatte des elektronischen Bauelements erfolgt dabei mittels des vorbeschriebenen Klebemittels. Der besondere Vorteil dieses elektronischen Bauelements besteht darin, dass die Befestigung des elektronischen Bauteils auf der Oberfläche der Leiterplatte mittels eines Klebepads erfolgt, das insbesondere eine Entkopplung des elektronischen Bauteils von der Leiterplatte in Hinsicht auf Geräusch bzw. Vibrationen ermöglicht.The invention further comprises an electronic component which comprises a circuit board on which at least one electronic component is attached. The electronic component is attached to the surface of the circuit board of the electronic component using the adhesive described above. The particular advantage of this electronic component is that the electronic component is attached to the surface of the circuit board using an adhesive pad, which in particular enables the electronic component to be decoupled from the circuit board with regard to noise or vibrations.
Gemäß einer besonders vorteilhaften Ausführungsform umfasst das elektronische Bauelement neben dem auf einer Oberfläche der Leiterplatte befestigten elektronischen Bauteil zusätzlich ein Sensorelement, welches ebenfalls auf der Oberfläche der Leiterplatte des elektronischen Bauelements befestigt ist. Handelt es sich bei dem Sensorelement beispielsweise um einen Beschleunigungssensor, so ist eine Vibrationsentkopplung des elektronischen Bauteils von dem ebenfalls auf der Leiterplatte befestigten Sensorelement von besonderer Bedeutung, da ansonsten Schwingungen, die von dem elektronischen Bauteil während des Betriebs ausgehen, von dem Sensorelement miterfasst und zu einer schlechteren Signalqualität des Sensorelements führen würden.According to a particularly advantageous embodiment, the electronic component comprises, in addition to the electronic component attached to a surface of the circuit board, a sensor element which is also attached to the surface of the circuit board of the electronic component. If the sensor element is, for example, an acceleration sensor, vibration decoupling of the electronic component from the sensor element which is also attached to the circuit board is particularly important, since otherwise vibrations which emanate from the electronic component during operation would also be detected by the sensor element and would lead to poorer signal quality of the sensor element.
Das erfindungsgemäße elektronische Bauelement lässt sich in vorteilhafter Weise verwenden für Steuergeräte, insbesondere für Steuergeräte für passive Sicherheitssysteme von Kraftfahrzeugen, wie beispielsweise Airbag-Anwendungen.The electronic component according to the invention can be used advantageously for control devices, in particular for control devices for passive safety systems of motor vehicles, such as airbag applications.
Kurze Beschreibung der ZeichnungShort description of the drawing
Ausführungsformen der vorliegenden Erfindung sind in der Zeichnung dargestellt und in der nachfolgenden Figurenbeschreibung näher erläutert. Es zeigt:
-
1 die schematische Schnittdarstellung eines Klebemittels gemäß einer Ausführungsform der vorliegenden Erfindung und -
2 die schematische Darstellung eines elektronischen Bauelements, enthaltend ein Klebemittel gemäß1 gemäß einer Ausführungsform der vorliegenden Erfindung.
-
1 the schematic sectional view of an adhesive according to an embodiment of the present invention and -
2 the schematic representation of an electronic component containing an adhesive according to1 according to an embodiment of the present invention.
FigurenbeschreibungCharacter description
In
Darüber hinaus umfasst das Klebemittel 10 zusätzlich ein Expansionsmittel 14, welches, wie beispielweise hier dargestellt, aus mit einem Lösungsmittel gefüllten Poren des Klebemittels 10 ausgeführt ist. Das Expansionsmittel 14 kann alternativ jedoch auch innerhalb des Klebstoffs 12 des Klebemittels 10 dispergiert sein. In diesem Fall bietet sich die Verwendung beispielsweise von Hydrogencarbonaten, wie Natrium- oder Calciumhydrogencarbonaten an. Darüber hinaus eignen sich Diazoverbindungen, die bei Erwärmung Stickstoff freisetzen sowie ggf. fluorierte, niedrig siedende Kohlenwasserstoffe.In addition, the adhesive 10 additionally comprises an expansion agent 14, which, as shown here, is made of pores of the adhesive 10 filled with a solvent. Alternatively, the expansion agent 14 can also be dispersed within the adhesive 12 of the adhesive 10. In this case, the use of hydrogen carbonates, such as sodium or calcium hydrogen carbonates, is recommended. Diazo compounds that release nitrogen when heated and possibly fluorinated, low-boiling hydrocarbons are also suitable.
Darüber hinaus kann das Klebemittel 10 zusätzlich auf einer Großfläche eine Klebstoffschicht 16 umfassen, welche aus einem zweiten Klebstoff gebildet ist, der bereits bei Raumtemperatur klebende Eigenschaften zeigt. Dies ermöglicht die Positionierung des Klebemittels 10 beispielsweise auf der Oberfläche einer Leiterplatte, wobei es aufgrund der Klebstoffschicht 16 zu einer ortsfesten Fixierung des Klebemittels 10 auf der Oberfläche der Leiterplatte kommt.In addition, the adhesive 10 can additionally comprise an adhesive layer 16 on a large surface, which is formed from a second adhesive that already exhibits adhesive properties at room temperature. This enables the positioning of the adhesive 10, for example, on the surface of a circuit board, with the adhesive layer 16 resulting in a fixed fixation of the adhesive 10 on the surface of the circuit board.
In
Das elektronische Bauelement 20 umfasst beispielsweise eine elektronische Leiterplatte 22, auf der beispielsweise elektronische Bauteile befestigt sind. Exemplarisch ist ein solches elektronisches Bauteil 24 dargestellt, welches beispielsweise in Form eines Elektrolytkondensators ausgeführt ist. Das elektronische Bauteil 24 umfasst beispielsweise eine Kunststoffplatte 26, mittels der das elektronische Bauteil 24 auf der Oberfläche der elektronischen Leiterplatte 22 befestigt ist. Zur Befestigung des elektronischen Bauteils 24 auf der Oberfläche der elektronischen Leiterplatte 22 ist beispielsweise die Verwendung eines Klebemittels in der vorbeschriebenen Form vorgesehen.The electronic component 20 comprises, for example, an electronic circuit board 22, on which, for example, electronic components are attached. One such electronic component 24 is shown as an example, which is designed, for example, in the form of an electrolytic capacitor. The electronic component 24 comprises, for example, a plastic plate 26, by means of which the electronic component 24 is attached to the surface of the electronic circuit board 22. To attach the electronic component 24 to the surface of the electronic circuit board 22, the use of an adhesive in the form described above is provided, for example.
Dabei ist in
Dabei bildet sich, wie in
Um in einem Arbeitsgang mehrere elektronische Bauteile und gegebenenfalls auch zugehörige verbindende Bauelemente wie beispielsweise Stecker oder vorverdrahtete Bauelemente mitzuverkleben, kann eine Verlängerung der klebenden Phase des Klebemittels 10 in Betracht gezogen werden.In order to bond several electronic components and possibly also associated connecting components such as plugs or pre-wired components in one operation, an extension of the adhesive phase of the adhesive 10 can be considered.
In einer weiteren alternativen Ausführungsform kann das Expansionsmittel 14 so gewählt werden, dass sich dieses nach dem Klebevorgang bei eintretender Abkühlung in seinem Volumen wieder zusammenzieht. Hier eignen sich insbesondere ggf fluorierte, niedrig siedende Kohlenwasserstoffe als Expansionsmittel.In a further alternative embodiment, the expansion agent 14 can be selected such that it contracts in volume again after the bonding process when it cools down. In this case, fluorinated, low-boiling hydrocarbons are particularly suitable as expansion agents.
ZITATE ENTHALTEN IN DER BESCHREIBUNGQUOTES INCLUDED IN THE DESCRIPTION
Diese Liste der vom Anmelder aufgeführten Dokumente wurde automatisiert erzeugt und ist ausschließlich zur besseren Information des Lesers aufgenommen. Die Liste ist nicht Bestandteil der deutschen Patent- bzw. Gebrauchsmusteranmeldung. Das DPMA übernimmt keinerlei Haftung für etwaige Fehler oder Auslassungen.This list of documents listed by the applicant was generated automatically and is included solely for the better information of the reader. The list is not part of the German patent or utility model application. The DPMA accepts no liability for any errors or omissions.
Zitierte PatentliteraturCited patent literature
- US 20210247569 A1 [0004]US 20210247569 A1 [0004]
- DE 102005031181 A1 [0004]DE 102005031181 A1 [0004]
- WO 2016113225 A1 [0004]WO 2016113225 A1 [0004]
Claims (8)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102022210961.9A DE102022210961A1 (en) | 2022-10-18 | 2022-10-18 | Adhesives for assembling printed circuit boards, printed circuit boards comprising this and their use |
| PCT/EP2023/076245 WO2024083444A1 (en) | 2022-10-18 | 2023-09-22 | Bonding agent for populating printed circuit boards, printed circuit board comprising said bonding agent and use thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102022210961.9A DE102022210961A1 (en) | 2022-10-18 | 2022-10-18 | Adhesives for assembling printed circuit boards, printed circuit boards comprising this and their use |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE102022210961A1 true DE102022210961A1 (en) | 2024-04-18 |
Family
ID=88197123
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE102022210961.9A Pending DE102022210961A1 (en) | 2022-10-18 | 2022-10-18 | Adhesives for assembling printed circuit boards, printed circuit boards comprising this and their use |
Country Status (2)
| Country | Link |
|---|---|
| DE (1) | DE102022210961A1 (en) |
| WO (1) | WO2024083444A1 (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102005031181A1 (en) | 2005-07-01 | 2007-01-04 | Endress + Hauser Gmbh + Co. Kg | Circuit board with a surface having a plurality of contact surfaces, method for coating contact surfaces of a printed circuit board |
| DE202007019297U1 (en) | 2007-10-19 | 2011-11-14 | Nitto Denko Corp. | An adhesive tape |
| WO2016113225A1 (en) | 2015-01-14 | 2016-07-21 | Automotive Lighting Reutlingen Gmbh | Method for placing an smd semiconductor light source component of an illumination device for a motor vehicle |
| DE102019220633A1 (en) | 2019-12-30 | 2021-07-01 | Edag Engineering Gmbh | Structural connection arrangement, use of a mixture of an adhesive and thermally expanding particles and method for utilizing a structural connection arrangement |
| US20210247569A1 (en) | 2020-02-11 | 2021-08-12 | Cisco Technology, Inc. | Solder reflow compatible connections between optical components |
| WO2021251099A1 (en) | 2020-06-12 | 2021-12-16 | 国立大学法人九州大学 | Easily disintegrable adhesive material, article and disintegration method |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPWO2012111507A1 (en) * | 2011-02-14 | 2014-07-03 | リンテック株式会社 | Hot melt adhesive composition, hot melt adhesive sheet and bonding method |
| WO2016099926A1 (en) * | 2014-12-18 | 2016-06-23 | Henkel IP & Holding GmbH | Foamable hot melt gasket sealants and use thereof |
| US20180179418A1 (en) * | 2015-03-04 | 2018-06-28 | Sika Technology Ag | Adhering sealing membranes onto electrically conductive substrates by means of induction |
| US20190161653A1 (en) * | 2017-11-28 | 2019-05-30 | Tesa Se | Sealing tape and methods of making the same |
-
2022
- 2022-10-18 DE DE102022210961.9A patent/DE102022210961A1/en active Pending
-
2023
- 2023-09-22 WO PCT/EP2023/076245 patent/WO2024083444A1/en unknown
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102005031181A1 (en) | 2005-07-01 | 2007-01-04 | Endress + Hauser Gmbh + Co. Kg | Circuit board with a surface having a plurality of contact surfaces, method for coating contact surfaces of a printed circuit board |
| DE202007019297U1 (en) | 2007-10-19 | 2011-11-14 | Nitto Denko Corp. | An adhesive tape |
| WO2016113225A1 (en) | 2015-01-14 | 2016-07-21 | Automotive Lighting Reutlingen Gmbh | Method for placing an smd semiconductor light source component of an illumination device for a motor vehicle |
| DE102019220633A1 (en) | 2019-12-30 | 2021-07-01 | Edag Engineering Gmbh | Structural connection arrangement, use of a mixture of an adhesive and thermally expanding particles and method for utilizing a structural connection arrangement |
| US20210247569A1 (en) | 2020-02-11 | 2021-08-12 | Cisco Technology, Inc. | Solder reflow compatible connections between optical components |
| WO2021251099A1 (en) | 2020-06-12 | 2021-12-16 | 国立大学法人九州大学 | Easily disintegrable adhesive material, article and disintegration method |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2024083444A1 (en) | 2024-04-25 |
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