DE102022125219B3 - Processing device for processing a processing object, method, computer program and computer-readable medium - Google Patents

Abstract

The invention relates to a processing device (1) for processing a processing object (7) with at least one processing control device (3). The processing device (1) is designed to guide a contact element (8) into a predetermined docking position (33) in relation to the processing object (7) in an approach process and/or to move the processing object (7) into a predetermined processing position (34). lead. The processing device (1) is designed to fix the processing object (7) in the predetermined processing position (34) of the processing object (7) with respect to a predetermined reference system (R1) for laser processing in a fixing method using the contact element (8). The processing device (1) comprises a measuring device (10) with at least one measurement control device (12), which is set up to determine an actual position of the processing object (7) in relation to the predetermined reference system (R1) in at least one measuring process during the approach process. to determine, and / or to determine the actual position of the contact element (8) in relation to the predetermined reference system (R1).

Description

The invention relates to a processing device for processing a processing object according to the features of the preamble of claim 1. The invention also relates to a method for operating a processing device according to the features of the preamble of claim 16, a computer program according to the features of the preamble of claim 17 and a computer-readable Medium according to the features of the preamble of claim 18.

Processing devices for laser-based processing of a processing object are known from the prior art and are used, for example, in the surface processing of metal processing objects. Another area of application for processing devices for laser-based processing is medical technology. The laser-based processing devices are used in medical technology, for example, to correct optical ametropia and/or pathological or unnaturally changed areas of the cornea. For example, a pulsed laser and a beam focusing device can be designed such that laser pulses cause photodisruption and/or photoablation in a focus located within an organic tissue in order to remove a tissue, in particular a tissue lenticule, from the cornea.

The beam focusing device is set up to focus the processing laser for processing the processing object on predetermined points, the positions of which are defined in relation to the processing object. The predetermined points can be arranged in a predetermined pattern in or on the processing object in order, for example, to be able to provide a predetermined separation surface. During the processing of the processing object, the processing laser beam can be sequentially focused on the predetermined points by the processing device in order to incorporate the predetermined pattern into the processing object and/or to cut the processing object along the predetermined points.

In order to be able to focus the processing laser reliably on the predetermined points, it is necessary that the processing object to be processed is arranged in a predetermined target position and remains in the predetermined target position during processing. In order to be able to hold the processing object to be processed in the predetermined target position during processing, it may be necessary to arrange a so-called contact element on the processing object. The contact element can be an object arranged in a beam path of the processing laser and can be at least partially transparent with respect to the processing laser. The contact element is arranged in such a way that the processing laser enters an entry surface facing the processing laser and exits again at a contact surface of the contact element, wherein the contact surface of the contact element can lie opposite the entry surface and, for example, can rest directly on a surface of the processing object.

When carrying out an approach process of the contact element, it is necessary to ensure that the processing object is in the predetermined target position after the end of the approach process. It is therefore necessary during the approach process that an actual position of the processing object is continuously monitored in order to correct the actual position of the actual object if the actual position of the processing object deviates from the target position above a predetermined threshold value. According to the prior art, the correction is carried out manually, for example, by displaying the current actual position of the processing object to a user so that the user can manually adjust the actual position.

In the field of eye surgery, the processing object can be a human or an animal eye. In this application, it is common to ensure that the eye is in the desired position by providing a point or a pattern to which a patient has to direct his gaze. The actual position of the eye is determined, for example, by recording Purkinje reflexes. If a deviation of the actual position of the eye from the target position of the eye exceeds a threshold value, signals are, for example, output to the operator of the processing device so that he can manually adjust a position of a head holder for holding a patient's head. Alternatively, the position of the head holder is changed automatically depending on the deviation. In addition to monitoring the position of the eye, monitoring the position of the contact element before, during and/or after the approach process is necessary to ensure that the arrangement of the contacting element in the predetermined target contacting position in relation to the processing object is ensured.

The DE 10 2019 103 211 A1 describes a method and system for machining a workpiece with a machining steel and a device for determining the position of a workpiece to be machined relative to one Machining steel and a use thereof.

The DE 10 2006 053 098 A1 describes an ophthalmological device and an ophthalmological method for positioning a patient's eye in a predetermined target position.

The DE 10 2017 201 529 A1 describes a method for detecting an actual position of a component before carrying out a processing step, wherein before carrying out the processing step the component is moved from a detected actual position into a target position by means of a carrier device holding the component, and wherein the actual position of the component is detected by means of a first detection device.

The DE 10 2017 126 786 A1 discloses a device and a method for determining a position and/or orientation of a workpiece relative to a processing unit.

The DE 10 2019 133 431 B3 describes a method for determining a current position of a patient interface of an eye surgical laser based on a Purkinje image.

The invention is based on the object of enabling a determination of an actual position of a processing object and/or a contact element for carrying out an approach process of the contact element into a predetermined docking position with respect to the processing object.

This object is achieved by the processing device according to the invention according to the features of claim 1, the method according to the invention according to the features of claim 16, the computer program according to the invention according to the features of claim 17 and the computer-readable medium according to the invention according to the features of claim 18. Advantageous embodiments with useful developments of the invention are specified in the respective subclaims, with advantageous embodiments of each aspect of the invention being viewed as advantageous embodiments of the other aspects of the invention.

A first aspect of the invention relates to a processing device for processing a processing object with at least one processing control device, a processing laser beam source which is set up to output a processing laser beam, a beam deflection device and a focusing device.

The processing device is set up to guide a contact element into a predetermined docking position in relation to the processing object in an approach process, and to fix the processing object in a predetermined processing position of the processing object in relation to a predetermined reference system for laser processing in a fixing method by means of the contact element,

The processing device is set up to guide the contact element into the predetermined docking position in relation to the processing object during the approach process. Additionally or alternatively, the processing device is set up to guide the processing object into a predetermined processing position. The processing device is set up to fix the processing object in the predetermined processing position of the processing object with respect to the predetermined reference system for laser processing according to the fixing method by means of the contact element. The processing device can have at least one processing control device in order to control the processing device to carry out the approach process.

The processing control device can be set up to determine the processing position of the processing object for laser processing of the processing object. The processing position can, for example, specify a position and/or an orientation that the processing object must have in order to carry out the laser processing of the processing object. The processing position can depend, for example, on the type of laser processing of the processing object by a processing laser. The processing position can depend in particular on a location of the processing object that is to be processed in laser processing. The processing position can also be stored in the processing control device or received from the processing control device. The machining position can be determined, for example, by the machining control device and/or a measurement control device or can be stored in the machining control device and/or the measurement control device.

The processing device includes a measuring device that includes at least one measurement control device. The measuring device is set up to carry out at least one measuring process in the approach process.

The processing device is set up to carry out at least one measuring process at least to capture an actual position of the processing object.

The measuring device is set up to determine, in the at least one measuring process from reflection point coordinates of at least one reflection point on a surface of the processing object in relation to the predetermined reference system, the actual position of the processing object in relation to the predetermined reference system using a position determination method, and the actual position of the processing object with respect to the predetermined reference system to the processing control device of the processing device.

The at least one processing control device can be set up to compare the actual position of the processing object with a target position of the processing object and to output control data to the processing device depending on a deviation of the actual position from the target position. In other words, the processing control device can be provided to determine the deviation of the actual position of the processing object from the target position of the processing object. The deviation can, for example, include a translational and a rotational deviation of the actual position of the processing object from the target position of the processing object. The at least one processing control device is set up to output, for example, control data to the processing device depending on the determined deviation. The control data can include the deviation of the actual position of the processing object from the target position of the processing object and/or include commands that can instruct the processing device to carry out steps to reduce the deviation.

Additionally or alternatively, the measuring device is set up to determine the actual position of the contact element in relation to the predetermined reference system in the at least one measuring process from reflection point coordinates of at least one reflection point on a surface of the contact element in relation to the predetermined reference system according to a position determination method, and output the actual position of the contact element in relation to the predetermined reference system to the processing control device of the processing device.

The at least one processing control device can be set up to compare the actual position of the contact element with a target position of the contact element and to output control data to the processing device depending on a deviation of the actual position from the target position. In other words, the processing control device can be provided to determine the deviation of the actual position of the contact element from the target position of the contact element. The deviation can, for example, include a translational and a rotational deviation of the actual position of the contact element from the target position of the contact element. The at least one processing control device is set up to output, for example, control data to the processing device depending on the determined deviation. The control data can include the deviation of the actual position of the contact element from the target position of the contact element and/or include commands that can instruct the processing device to carry out steps to reduce the deviation.

It is provided that the measuring device comprises at least one laser diode measuring beam device, which is set up to output at least one measuring beam along a predetermined respective beam path for projecting a predetermined measuring pattern area onto at least one of the two surfaces in the at least one measuring process.

In other words, the measuring device comprises the at least one laser diode measuring beam device, which is set up to output at least one measuring beam along a predetermined respective beam path in a respective measuring process for projecting a predetermined measuring pattern area at least onto at least one of the two surfaces. In other words, the laser diode measuring beam device is set up to output the at least one measuring beam at least onto the processing object or the contact element along the predetermined beam path in order to image the predetermined measurement pattern area at least on the surface of the processing object or at least on the surface of the contact element. The predetermined measurement pattern area can be defined by predetermined geometric relationships of the predetermined beam path of the at least one measuring beam in relation to the processing object, or beam paths of other measuring beams. The predetermined measurement pattern surface can specify a predetermined arrangement of reflection points of respective measurement beams and/or a reflection surface to be generated by the at least one measurement beam on the at least one surface. The reflection surface can have a predetermined or known local intensity distribution. The laser diode measuring beam device can, for example, have at least one lens mirror device, which can in particular be set up as a MEMS, which at least one, by means of an actuator, in a predetermined Directionally orientable mirror unit can have. The processing device can have one or a plurality of radiation sources. The one or more radiation sources can be aligned in predetermined directions by one or more actuators. Additionally or alternatively, it can be provided that the laser diode measuring beam device is set up as an array, which can have several of the radiation sources. Due to the exemplary features, the measuring beam device can be set up to output the at least one measuring beam in a respective, predetermined direction. The measurement control device can be set up to control the laser diode measuring beam device. It can be provided that the laser diode measuring beam device is set up as a digital mirror device which has several mirrors. The mirrors can be individually adjusted to either output the respective measuring beam or to block the output. By designing it as a digital mirror device, it can be possible to provide the measurement sample area by adjusting the respective mirrors. A respective mirror can be assigned to each of the radiation sources. The laser diode measuring beam device can also be set up to align the measuring beam in a predetermined direction by positioning the mirror. The alignment of the mirror can be adjusted by the laser diode measuring beam device in order to emit the measuring beam in different directions during a measuring process, for example to enable scanning of the surface. The laser diode measuring beam device can be set up to set a wavelength of the measuring beam within a predetermined spectrum. The laser diode measuring beam device can be set up, for example, as a tunable laser device.

The measuring device comprises at least one detector device which is set up to detect at least one reflection point of the predetermined measurement pattern surface on the respective surface.

The at least one detector device is set up to determine the reflection point coordinates of the at least one reflection point in relation to the predetermined reference system using a coordinate determination method.

The processing device comprises at least one detector device, which is set up to determine reflection point coordinates with respect to the predetermined reference system of at least one reflection point on the at least one surface in the respective measuring process according to a coordinate determination method. The detector device is set up to determine the reflection point coordinates of the at least one reflection point in relation to the predetermined reference system, for example using a method according to the prior art, for example by means of triangulation, intensity measurement and/or transit time detection. The detector device can, for example, be set up to detect reflected measurement beams that emanate from the reflection point and to determine the assigned reflection points from the reflected measurement beams. The detector device can be set up to determine the reflection point coordinates of the reflection point in relation to the predetermined reference system based on the at least one reflected measuring beam.

The at least one detector device can be set up to detect both reflection points of the processing object and reflection points of the contact element in the measuring process. The detector device can be set up to detect the reflection points that lie on the surface of the processing object and the reflection points that lie on the surface of the contact element. The detector device can be set up to assign the reflection points to the processing object or the contact element according to a predetermined assignment criterion. In other words, the detector device can be set up to determine whether a respective reflection point is a reflection point that is located on the surface of the contact element or that is located on the surface of the processing object. The assignment can be carried out by the at least one detector device based on the predetermined assignment criterion. The predetermined assignment criterion can include, for example, criteria relating to the position of the reflection point coordinates, or criteria relating to an intensity of the reflection points. For example, it can be provided that the at least one measuring beam generates at least one reflection point on the contact element and generates at least one reflection point on the processing object. The measuring beam can pass through the contact element, whereby the intensity of the measuring beam can have decreased after passing through the contact element. As a result, a reflection point on the processing object can emit a reflected measuring beam of the measuring beam, which can have a lower intensity than a reflected measuring beam of the reflection point on the contact element. The reflected measuring beam from the reflection point of the processing object can also pass through the contact element and thereby be further weakened. The detector device can be set up to measure the intensity of each to determine reflected measurement beams and to assign measurement beams which have an intensity below a threshold value to the processing object and to assign measurement beams which have an intensity above the threshold value to the contact element. As a result, the detector device can be set up to distinguish whether the reflection point from which the reflected measuring beam emanates is a reflection point on the surface of the processing object or a reflection point on the surface of the contact element.

The at least one measurement control device is set up to determine the actual position of the processing object and/or the actual position of the contact element in the reference system according to a position determination method depending on the reflection point coordinates of the at least one reflection point in relation to the predetermined reference system. In other words, the measurement control device is set up to determine from the reflection point coordinates of the at least one reflection point determined by the at least one detector device which actual position the processing object and/or the contact element has in the reference system. For example, it can be provided that a shape of the processing object and/or the contact element is stored in the measurement control device. Based on this, the measurement control device can, for example, determine the position at which the reflection point is located on the processing object and/or the contact element. From possible geometric relations stored in the measurement control device, the measurement control device can be able to determine the actual position of the processing object and/or the contact element in the reference system.

In an alternative, the measuring device is set up as a transit time measurement lidar. In other words, the measuring device is a lidar device which is set up to determine a distance of a reflection point from the sensor device or another reference via a transit time measurement. Lidar means Light detection and ranging or Light imaging, detection and ranging. The laser diode measuring beam device is set up to output the at least one measuring beam in pulsed form. In other words, it is provided that the at least one measuring beam is not output as a continuous wave, but as a sequence of several time-limited pulses with a predetermined respective pulse duration. The at least one measuring beam is thus output in such a way that the respective output has a predetermined start time and a predetermined end time during the measurement process. The at least one detector device is set up to detect the reflection point coordinates of the at least one reflection point using a transit time measurement, which measures a transit time of the respective reflected measuring beam from a time of emission by the laser diode measuring beam device to a time of reception of the reflected measuring beam by the detector device describes. In other words, the detector device is set up to determine a point in time from which the emitted pulse is received by the detector device. The measuring device is set up to determine the transit time from the time at which the pulse is transmitted and the time at which the pulse is received by the measuring device. Taking into account geometric relationships that can be stored in the detector device, the distance between the reflection point and the detector device can be determined from the transit time. Taking into account the determined distance, the reflection point coordinates of the respective reflection point can be determined by the detector device. The measuring device can, for example, be set up to determine a reception time at which the respective reflected measuring beam is detected by the detector device. The measuring device can, for example, be set up to specify a respective emission time of the measuring beam by the laser diode measuring beam device and/or to retrieve it in the laser diode measuring beam device. The measuring device can be set up to retrieve the reception time of the reflected measuring beam from the detector device by the detector device and to determine a transit time of the measuring beam from a time difference between the transmission time and the reception time. With a known beam path of the measuring beam, a distance between the reflection point and the detector device and thus the surface of the object can be determined by the measuring device from the transit time of the measuring beam. The measuring device can also be set up to determine a direction of the reflection point in relation to the at least one detector device. For this purpose, the detector device can, for example, have a predetermined two-dimensional pattern of detector units. The detector device can be set up to determine which of the detector units receives the reflected measuring beam. As a result, an impact position of the reflected measuring beam on the detector device is known. The detector device can, for example, be set up to determine the reflection point coordinates from a position of the detector device, a position of the laser diode measuring beam device, the beam path and the transit time of the measuring beam To determine the reflection point in relation to the predetermined reference system.

Additionally or alternatively, the measuring device is set up in an alternative as a modulated continuous wave lidar. In other words, the measuring device is set up to output the at least one measuring beam over a predetermined period of time during the measuring process, the at least one measuring beam having a time-dependent predetermined modulation. The modulation can, for example, relate to a frequency of the at least one measuring beam. The at least one detector device is set up to determine the coordinates of the respective reflection points using a modulation deviation between a current modulation and a detected modulation of the reflected measuring beam. In other words, the modulation that the reflected measuring beam detected by the detector device has can be related to the emitted at least one measuring beam, whereby a transit time can be determined.

Additionally or alternatively, the measuring device is set up in an alternative as an intensity lidar, wherein the at least one laser diode measuring beam device is set up to output the at least one measuring beam with an output intensity, and the at least one detector device is set up to detect a reception intensity of the respective reflected measuring beam. The at least one detector device is set up to determine the reflection point coordinates of the respective at least one reflection point depending on an intensity difference between the output intensity and the reception intensity. In other words, it is provided that the measuring device is set up to determine the reflection point coordinates of the at least one reflection point from a difference between an intensity of the measuring beam emitted by the laser diode measuring beam device and an intensity of the reflected measuring beam received by at least one detector device.

The invention has the advantage that both the actual position of the contact element and the actual position of the processing object can be determined.

The invention also includes further developments that result in additional advantages.

A further development of the invention provides that the at least one measurement control device is set up to produce an actual relative position of the contact element in relation to the actual position of the processing object in relation to the predetermined reference system and the actual contact element position of the contact element in relation to the predetermined reference system To determine reference to the processing object and to transmit it to the at least one processing control device. The at least one processing control device is set up to respond to a deviation of the actual relative position of the contact element in relation to the processing object from the predetermined docking position below a predetermined threshold value and at the same time a deviation of the actual position of the processing object in relation to the predetermined reference system from the predetermined processing position of the processing object in relation to the predetermined reference system below a predetermined threshold value, to control the processing device for fixing the contacting element to the processing object according to the fixing method.

A further development of the invention provides that the at least one measurement control device is set up to determine an actual position of the contact element in relation to the processing object from the actual position of the processing object and the actual position of the contact element. In other words, the measurement control device is set up to determine the actual position of the contact element in relation to the processing object from the determined actual position of the processing object in the reference system and the determined actual position of the contact element in the reference system. In other words, the measurement control device is set up to output the actual position that the contact element has in relation to the processing object. This makes it possible, for example, to determine a geometric relationship between the contact element and the processing object. The at least one measurement control device is set up to compare the deviation between the actual position of the contact element in relation to the processing object with the predetermined docking position. In other words, the at least one measurement control device is set up to determine whether and to what extent the actual position of the contact element in relation to the processing object deviates from the predetermined docking position of the contact element in relation to the processing object. The at least one measurement control device is set up to output control data for fixing the contacting element to the processing object according to a fixing method to the processing control device in the event of a deviation between the actual position of the contact element in relation to the processing object and the predetermined docking position below a predetermined threshold value. In other words, the at least one measurement control device is set up to determine whether the deviation between the actual position of the contact element ment in relation to the processing object and the predetermined docking position of the contact element in relation to the processing object is above or below the predetermined threshold value. In the event that the deviation is below the predetermined threshold value, the measurement control device is set up to output the control data to the processing control device in order to initiate the fixing process by the processing device. The processing control device can be set up to control the processing device in order to fix the contacting element on the processing object. The processing control device can, for example, be set up to control a vacuum pump to generate a vacuum. The vacuum can be generated, for example, in a vacuum volume, which can be formed by a surface of the contact element and a surface of the processing object. The predetermined docking position can, for example, specify a target position of the contact element in relation to the processing object, in which the contact element must be arranged so that the processing object can be fixed in the processing position by means of the contacting element after the fixing method. The further development has the advantage that before the processing object is fixed, it is checked whether the actual position of the contacting element in relation to the processing object corresponds to the docking position.

A further development of the invention provides that the measuring device is set up to determine the actual relative position of the contact element at least once after completion of the fixing process and to transmit it to the at least one processing control device. The at least one processing control device is set up to control the processing device to release the contacting element if the actual relative position deviates from a fixing position above a threshold value. In other words, it is provided that the measuring device is set up to determine the actual relative position of the contact element in relation to the processing object at least once after the fixation process has been completed. The measuring device is set up to determine the actual position of the contact element in relation to the processing object from the actual position of the processing object and the actual position of the contact element and to determine a deviation of the actual position of the contact element in relation to the processing object to determine the fixation position. The measurement control device is set up to output control data to the processing control device for releasing the contacting element if the actual position of the contact element with respect to the processing object deviates from the fixing position above a threshold value. In other words, the measurement control device checks whether the contact element is arranged in the fixing position in relation to the processing object after carrying out the fixing method. The measurement control device is set up to output the control data to the processing control device in the event that the threshold value is exceeded in order to release the contacting element from the processing object by the processing device. It can be provided that the contact element is fixed to the processing object by generating a vacuum by a pump of the processing device. If the measurement control device determines that the deviation exceeds the threshold value after the vacuum has been provided, control data can be output, which leads to the processing control device controlling the pump in order to remove the vacuum and thus release the fixation of the contacting element from the processing object. This has the advantage that the fixation is released if it is faulty.

A further development of the invention provides that the measuring device is set up to determine an actual curvature of at least one predetermined curvature surface of the processing object and/or the contact element at least once after completion of the fixing process after a curvature measurement process. The at least one processing control device is set up to control the processing device depending on the actual curvature in order to regulate a predetermined target curvature. The laser diode measuring beam device is set up to output the at least one measuring beam along the predetermined respective beam path in the curvature measurement process for projecting the predetermined measurement pattern surface onto the curvature surface. The at least one detector device is set up to detect at least one reflection point of the predetermined measurement pattern surface on the curvature surface, and to determine the actual curvature of the curvature surface from the reflection point coordinates of the at least one reflection point on the curvature surface. A further development of the invention provides that the processing device is set up to detect an actual curvature of the processing object at least once after the fixing method. In other words, the processing device is set up to output the at least one measuring beam and to determine a curvature of the processing object from reflection point coordinates of reflection points on the processing object. The curvature can in particular affect a predetermined surface of the processing object, which, for example wise delimits a volume of a vacuum for fixation. The measurement control device is set up to compare the actual curvature of the processing object with a target curvature of the processing object and to determine a deviation between the target curvature and the actual curvature. The measurement control device is set up to output warning data to the processing control device if the actual curvature of the processing object deviates from the target curvature of the processing object above a threshold value. The warning data can be set up to initiate activation of a pump of the processing device by the processing control device in order to adjust a vacuum between the processing object and the contact element. For example, it can be provided that the contact element is fixed to the processing object by means of the vacuum. Due to the provision of a vacuum, at least one surface of the processing object can bulge, which limits a volume of the vacuum. If there is a pressure to be set, the surface of the processing object can have the desired curvature. In the event that the vacuum has a pressure that is too high or too low, the actual curvature may deviate from the target curvature. For example, it can happen that air enters the vacuum and the pressure of the vacuum changes as a result. This can cause the fixation to come loose in an unfavorable case. By outputting the warning data through the measurement control device, the processing control device can, for example, control a pump of the processing device to maintain the vacuum.

A further development of the invention provides that the measuring device is set up to determine the actual position of the processing element at least once after completion of the fixing process and to transmit it to the at least one processing control device. The at least one processing control device is set up to control the processing device to release the contacting element if the actual position deviates from a processing position above a threshold value.

A further development of the invention provides that the at least one laser diode measuring beam device is set up to output the at least one measuring beam as a collimated beam. In other words, the laser diode measuring beam device is set up to output the at least one measuring beam with a focal point that approaches infinity. The at least one laser diode measuring beam device can, for example, have a collimator through which the generated measuring beam can be guided before it is guided onto the object.

A further development of the invention provides that the at least one laser diode measuring beam device has at least one expansion element in the respective beam path of the at least one measuring beam, which is set up to expand the at least one measuring beam to a predetermined optical beam diameter in order to include the at least one reflection point of the measuring pattern surface a predetermined reflection surface on the surface. In other words, it is provided that the laser diode measuring beam device is set up to provide the at least one measuring beam with a predetermined optical beam diameter. To provide the measuring beam with the predetermined optical beam diameter, the laser diode measuring beam device comprises at least one expansion element. The expansion element can, for example, comprise lenses that are arranged in a reverse Galilean arrangement and can have a converging lens and a diverging lens. The laser diode measuring beam device is set up to guide the measuring beam through the expansion element so that the optical beam diameter of the measuring beam is increased to the predetermined optical beam diameter by the expansion element. For example, it can be provided that the laser diode measuring beam device can provide the measuring beam with an optical beam diameter of 2-4 mm by means of the expansion element. In other words, the measuring beam provided by the laser diode measuring beam device can have a beam diameter that is, for example, 2.0 mm, 2.1 mm, 2.2 mm, 2.3 mm, 2.4 mm, 2.5 mm, 2.6 mm , 2.7mm, 2.8mm, 2.9mm, 3.0mm, 3.1mm, 3.2mm, 3.3mm, 3.4mm, 3.5mm, 3.6mm , 3.7 mm, 3.8 mm, 3.9 mm or 4.0 mm. The beam diameter of 2 mm to 4 mm can be provided, for example, if a measuring pattern area for detecting an apex of a cornea is to be provided by the at least one measuring beam. The laser diode measuring beam device can also be set up to provide the measuring beam with a beam diameter of up to 3 cm. In other words, the beam diameter can be 0.1cm, 0.2cm, 0.3cm, 0.4cm, 0.5cm, 0.6cm, 0.7cm, 0.8cm, 0.9cm , 1.0cm, 1.1cm, 1.2cm, 1.3cm, 1.4cm, 1.5cm, 1.6cm, 1.7cm, 1.8cm, 1.9cm , 2.0cm, 2.1cm, 2.2cm, 2.3cm, 2.4cm, 2.5cm, 2.6cm, 2.7cm, 2.8cm, 2.9cm or 3.0 cm. Provision of this beam diameter can be provided, for example, if the measurement pattern area is to be provided for detecting an eye. The extensions of the measuring beam make it possible, for example, to cover the measuring pattern surface with the at least one measuring beam alone generate. It can also be provided that several measuring beams are guided through respective expansion elements or the at least one expansion element in order to increase their beam diameter.

A further development of the invention provides that the laser diode measuring beam device is set up to output several measuring beams along predetermined respective beam paths in the respective measuring process for projecting the predetermined measuring pattern area onto the surface. In other words, it is provided that the laser diode measuring beam device is set up to emit several of the measuring beams in the respective measuring process in order to project the predetermined measuring pattern area onto the surface of the object. It is therefore provided that the predetermined measurement pattern area is generated by several measurement beams. The measuring beams can be guided along respective, different beam paths, so that the predetermined measuring pattern surface can have several reflection points. The further development has the advantage that the measurement pattern surface can have a plurality of reflection points generated by respective measurement beams, which can have respective reflection point coordinates. This makes it possible to determine the position of the referencing feature from several of the reflection point coordinates.

A further development of the invention provides that the laser diode measuring beam device is set up to output the measuring beams simultaneously. In other words, the measuring beams are emitted at an identical time during a measuring process. For example, it can be provided that the measuring beams are emitted by dividing an original beam into the plurality of measuring beams using an optic. The further development has the advantage that the duration of a measuring process can be reduced.

A further development of the invention provides that the laser diode measuring beam device is set up to output the measuring beams sequentially in a measuring process. In other words, the respective measuring beams are output one after the other in time. For example, it can be provided that the surface is scanned during a measuring process, with the individual measuring beams being emitted one after the other. The measuring device can, for example, be set up to direct the original beam onto a mirror and to change an orientation of the mirror during the measuring process in order to provide the individual measuring beams along the respective beam paths.

A further development of the invention provides that the at least one laser diode measuring beam device is set up to output the at least one measuring beam guided onto the contact element with a different wavelength than the at least one measuring beam guided onto the processing device.

A further development of the invention provides that the at least one laser diode measuring beam device is set up to project a different measuring pattern surface with the at least one measuring beam guided onto the contact element than with the at least one measuring beam guided onto the processing object.

A further development of the invention provides that the laser diode measuring beam device comprises at least one surface emitter unit. In other words, the measuring device is set up to emit measuring beams through the at least one surface emitter unit. The surface emitter unit is designed in particular as a semiconductor element, which is designed to emit a measuring beam perpendicular to the plane of the semiconductor element. The further development of the invention results in the advantage that the laser diode measuring beam device can be provided in a space-saving and inexpensive manner.

A further development of the invention provides that the laser diode measuring beam device comprises at least one surface emitter array. In other words, the laser diode measuring beam device has at least one array for outputting the measuring beams, which comprises several of the surface emitter units. The surface emitter array can be a one-dimensional or two-dimensional arrangement of surface emitter units in a plane. The surface emitter units can be provided in a checkerboard pattern, for example. The further development has the advantage that the laser diode measuring beam device enables the emission of several measuring beams.

A further development of the invention provides that the laser diode measuring beam device is set up to emit the at least one measuring beam in an infrared spectrum and/or a near-infrared spectrum. In other words, the measuring beams that are emitted by the laser diode measuring beam device have wavelengths in the infrared spectrum and/or in the near-infrared spectrum. The measuring beams can therefore have a wavelength in the near-infrared spectrum between 780 to 3000 nm, in particular in the infrared spectrum between 780 nm to 1000 nm. The further development has the advantage that the measuring beams have a wavelength range which causes little damage to surfaces. This makes it possible to use the measuring device even on sensitive surfaces, in particular biological surfaces.

A further development of the invention provides that the object is a human or animal eye.

A further aspect of the invention relates to a method for operating a processing device for processing a processing object with at least one processing control device, a processing laser beam source which is set up to output a processing laser beam, a beam deflection device and a focusing device.

In the method, the processing device guides a contact element into a predetermined docking position in relation to the processing object in an approach process. Additionally or alternatively, in the approach process, the processing object is guided into a predetermined processing position. The processing object is fixed by the processing device in a predetermined processing position of the processing object with respect to a predetermined reference system for laser processing in a fixing method using the contact element.

In the method, at least one measuring process is carried out in the approach process by a measuring device of the processing device, which comprises at least one measuring control device.

In the at least one measuring process, the measuring device uses reflection point coordinates of at least one reflection point on a surface of the processing object in relation to the predetermined reference system to determine the actual position of the processing object in relation to the predetermined reference system using a position determination method. The measuring device outputs the actual position of the processing object in relation to the predetermined reference system to the processing control device of the processing device.

Additionally or alternatively, the measuring device determines the actual position of the contact element in relation to the predetermined reference system in the at least one measuring process from reflection point coordinates of at least one reflection point on a surface of the contact element in relation to the predetermined reference system using a position determination method. The measuring device outputs the actual position of the contact element in relation to the predetermined reference system to the processing control device of the processing device.

It is provided that at least one measuring beam is output by at least one laser diode measuring beam device of the measuring device in the at least one measuring process along a predetermined respective beam path for projecting a predetermined measuring pattern area onto at least one of the two surfaces.

At least one reflection point of the predetermined measurement pattern surface on the respective surface is detected by at least one detector device of the measuring device in the at least one measuring process.

The reflection point coordinates of the at least one reflection point are determined by the at least one detector device in relation to the predetermined reference system using a coordinate determination method.

The respective method can include at least one additional step, which is carried out exactly when a use case or an application situation occurs that has not been explicitly described here. The step may include, for example, issuing an error message and/or issuing a request for user feedback. Additionally or alternatively, it can be provided that a standard setting and/or a predetermined initial state is set.

A further aspect of the invention relates to a measurement control device which is designed to carry out the steps of at least one embodiment of one or both of the previously described methods. For this purpose, the measurement control device can have a computing unit for electronic data processing, such as a processor. The computing unit can comprise at least one microcontroller and/or at least one microprocessor. The computing unit can be designed as an integrated circuit and/or microchip. Furthermore, the measurement control device can include an (electronic) data memory or a storage unit. Program code can be stored on the data memory, through which the steps of the respective embodiment of the respective method are coded. The program code can include the control data for the respective laser. The program code can be executed by means of the computing unit, which causes the measurement control device to execute the respective embodiment. The measurement control Direction can be designed as a control chip or control device. The measurement control device can, for example, be comprised of a computer or computer network.

Another aspect of the invention relates to a computer program. The computer program includes instructions that form, for example, a program code. The program code can include at least one control data record with the respective control data for the respective laser. When the program code is executed using a computer or a computer network, it is caused to execute the previously described method or at least one embodiment thereof.

A further aspect of the invention relates to a computer-readable medium (storage medium) on which the aforementioned computer program or its instructions are stored. To execute the computer program, a computer or a computer network can access the computer-readable medium and read out its contents. The storage medium is designed, for example, as a data memory, in particular at least partially as a volatile or non-volatile data memory. A non-volatile data storage can be a flash memory and/or an SSD (solid state drive) and/or a hard drive. A volatile data storage can be a RAM (random access memory). The commands can be present, for example, as source code of a programming language and/or as assembler and/or as binary code.

Further features and advantages of one of the described aspects of the invention can result from the developments of another of the aspects of the invention. The features of the embodiments of the invention can therefore be present in any combination with one another, unless they have been explicitly described as mutually exclusive.

• 1 eine schematische Darstellung einer Bearbeitungsvorrichtung;
• 2 eine schematische Darstellung einer Messvorrichtung;
• 3 eine weitere schematische Darstellung einer Messvorrichtung;
• 4 eine weitere schematische Darstellung einer Messvorrichtung;
• 5 eine weitere schematische Darstellung einer Messvorrichtung; und
• 6 eine schematische Darstellung eines Ablaufs eines Verfahrens zum Betreiben einer Bearbeitungsvorrichtung.

Additional features and advantages of the invention are described below using the figures in the form of advantageous exemplary embodiments. The features or combinations of features of the exemplary embodiments described below can be present in any combination with one another and/or the features of the embodiments. That is, the features of the embodiments may complement and/or replace the features of the embodiments and vice versa. Embodiments that are not explicitly shown or explained in the figures, but which emerge from the exemplary embodiments and/or embodiments and can be generated by separate combinations of features are therefore also to be regarded as encompassed and disclosed by the invention. Therefore, configurations that do not have all the features of an originally formulated claim or that go beyond or deviate from the combinations of features set out in the references to the claims are also to be regarded as disclosed. The exemplary embodiments show:

• 1 a schematic representation of a processing device;
• 2 a schematic representation of a measuring device;
• 3 a further schematic representation of a measuring device;
• 4 a further schematic representation of a measuring device;
• 5 a further schematic representation of a measuring device; and
• 6 a schematic representation of a sequence of a method for operating a processing device.

In the figures, identical or functionally identical elements are provided with the same reference numerals.

1 shows a schematic representation of a processing device.

1 shows a schematic representation of the processing device 1, which can have a processing laser beam source 2 and a processing control device 3. The processing laser beam source 2 can be set up to output a processing laser beam 4, which can be intended to process a surface 9 of a processing object 7 to be processed. The processing control device 3 can be set up to control the laser beam source and a beam deflection device 5 as well as a focusing device 6 in order to focus the processing laser beam 4 on predetermined processing points on the processing object 7 to be processed. The processing laser beam 4 can be guided by the processing control device 3 in such a way that a predetermined pattern can be generated on a surface 9 of the processing object 7. It can be provided that in order to process the processing object 7, a predetermined power and/or energy density must be exceeded by the processing laser beam 4 at the positions of the processing points, for example to enable melting and/or an optical breakthrough in the processing object 7. For this reason, it may be necessary for the processing object 7 to remain in a predetermined, constant processing position 34 during processing. This can ensure, for example, that the processing laser beam 4 is focused on the predetermined depth and that the processing object 7 is prevented from drifting during processing and thus distortion of the pattern can be prevented. In order to fix the processing object 7, it may be necessary to provide a contact element 8, which can be intended to fix the processing object 7 in the predetermined processing position 34. In order to enable the processing object 7 to be fixed, it can be provided that the contact element 8 is moved by an actuator device in an approach process into a docking position 33 with respect to the processing object 7 when the processing object 7 is in the predetermined processing position 34. In addition to fixing the processing object 7 in the desired position, the contact element 8 can be provided to guide the at least one processing laser beam 4 onto the processing object 7. For this purpose, the contact element 8 can, for example, be designed to be at least partially transparent. In addition to detecting the current actual position of the processing object 7, it may be necessary to record the actual position of the contact element 8 during the approach process and to monitor it during the approach process. This may be necessary, for example, in order to be able to detect a deviation of the contact element 8 from an intended position or a deviation of a movement of the contact element from an intended movement by the actuators. For this purpose, the current position of the contact element 8 can be recorded before the approach process is initiated.

In order to ensure a predetermined approach process, it can be provided to carry out several measuring processes in order to record the actual positions of the processing object 7 and/or the contact element 8.

In order to enable the processing object 7 to be fixed by the contact element 8, it may therefore be necessary to record the actual position of the processing object 7 as well as the actual position of the contact element 8 at least once or continuously in at least one respective measuring process during the approach process.

It can be provided that the processing position 34 of the processing object 7 is determined by the processing device 1, in which the processing object 7 must be located so that the processing object 7 can be processed by the processing laser of the processing device 1 in accordance with given specifications.

It can be provided that the processing device 1 includes a measuring device 10 with at least one measurement control device 12.

The measuring device 10 can be set up to detect an actual position of the processing object 7 in relation to the predetermined reference system R1 during the approach process in the at least one measuring process. The measuring device 10 can be set up to additionally or alternatively detect an actual position of the contact element 8 in relation to the predetermined reference system R1 during the approach process in the at least one measuring process. The measuring device 10 can be set up to output the actual position of the processing object 7 in relation to the predetermined reference system R1 and/or the actual position of the contact element 8 in relation to the predetermined reference system R1 to the processing control device 3 of the processing device 1.

The processing control device 3 can be set up to compare the actual position of the processing object 7 in relation to the predetermined reference system R1 with a target position of the processing object 7 in relation to the predetermined reference system R1 in order to detect a deviation in the actual position of the processing object 7 in relation to the predetermined reference system R1 to determine the target position of the processing object 7 in relation to the predetermined reference system R1. The processing control device 3 can be set up to compare the actual position of the contact element 8 in relation to the predetermined reference system R1 with a target position of the contact element 8 in relation to the predetermined reference system R1 in order to detect a deviation in the actual position of the contact element 8 in relation to the predetermined reference system R1 from the target position of the contact element 8 in relation to the predetermined reference system R1. In other words, the at least one measurement control device 12 can be provided to compare the detected actual position of the processing object 7 with the target position of the processing object 7 and to determine the deviation between the actual position and the target position.

The target position of the processing object 7 can be defined, for example, in relation to a beam path of the processing laser beam 4. This target position can include a translational position of the processing object 7 as well as a rotational orientation. The at least one measurement control device 12 can be set up to use the actual position of the processing object 7 in relation to the predetermined reference system R1 and the actual contact element position of the contact element 8 in relation to the predetermined reference system R1, to determine an actual relative position of the contact element 8 in relation to the processing object 7 and to transmit it to the at least one processing control device 3.

In the at least one processing control device 3, a predetermined threshold value can be specified in relation to the processing object 7, which can describe a permissible deviation of the target position of the processing object 7 from the actual position of the processing object 7. In the event that the deviation between the target position of the processing object 7 and the actual position of the processing object 7 is below the predetermined threshold value, it can be provided that the measurement control device 12 depends on the deviation of the actual position from the target -Location control data is output to the processing control device 3 of the processing device 1. The control data can be intended to instruct the processing control device 3 to continue the approach process and/or to correct the position of the processing object 7.

In the at least one processing control device 3, a predetermined threshold value can be specified in relation to the contact element 8, which can describe a permissible deviation of the target position of the contact element 8 from the actual position of the contact element 8. In the event that the deviation between the target position of the contact element 8 and the actual position of the contact element 8 is below the predetermined threshold value, it can be provided that the measurement control device 12 depends on the deviation of the actual position from the target -Location control data is output to the processing control device 3 of the processing device 1. The control data can be intended to instruct the processing control device 3 to continue the approach process and/or to correct the position of the contact element 8.

The processing control device 3 can be set up to respond when the respective threshold value is exceeded due to the deviation between the target position of the contact element 8 and the actual position of the contact element 8 and/or the deviation between the target position of the processing object 7 and the actual position of the Processing object 7 to control the processing device 1 in order to cancel the approach process. This can be provided if the deviation has a value that cannot be corrected and does not allow the processing object 7 to be fixed.

The approach process can be intended to move the contact element 8 into the predetermined docking position 33 with respect to the processing object 7. The docking position 33 can, for example, describe a target position of the contact element 8 in relation to the processing object 7, in which the processing object 7 can be fixed. The contact element 8 can, for example, rest against the processing object 7 in the predetermined docking position 33, a space being formed between the processing object 7 and the contact element 8, in which a vacuum can be generated for fixing by the processing device 1 in the fixing process.

In particular, at the end of the approach process, it can be provided that before the contact element is fixed to the processing object 7, it is checked by providing a vacuum to see whether the processing object 7 is in the desired position and/or the contact element 8 is in the specified position Contacting position in relation to the processing object 7 is located.

The processing device 1 can be set up to determine the actual position of the contact element 8 in relation to the processing object 7 from the actual position of the processing object 7 and the actual position of the contact element 8, at least when the approach process is completed and before the fixing process is carried out to determine and to determine a deviation between the actual position of the contact element 8 in relation to the processing object 7 and the predetermined docking position 33. If there is a deviation between the actual position of the contact element 8 in relation to the processing object 7 and the predetermined docking position 33 below a predetermined threshold value, the measurement control device 12 can output the control data for fixing the contact element 8 to the processing object 7 according to a fixing method to the processing control device 3.

In other words, the at least one processing control device 3 can be set up to respond to a deviation in the actual relative position of the contact element 8 with respect to the processing object 7 from the predetermined docking position 33 below a predetermined threshold value and at the same time a deviation in the actual position of the processing object 7 With reference to the predetermined reference system R1 from the predetermined processing position 34 of the processing object 7 in relation to the predetermined reference system R1 below a predetermined threshold value, the processing device 1 for fixing the contact element 8 on the processing object 7 to be controlled according to the fixing method.

If there is a deviation in the positions that is above the respective threshold value, it can be provided that the approach process is aborted or is repeated. In the event that both the processing object 7 is in its target position and the contact element 8 is in the predetermined desired contacting position with respect to the processing object 7, the processing object 7 can be moved by means of a vacuum in a between a surface 9 of the processing object 7 and a surface 9 The chamber located in the contact element 8 can be fixed. After fixation, another measurement can be carried out to ensure fixation. This can be done by detecting an actual curvature of at least one predetermined curvature surface of the processing object 7 and/or the contact element 8. The curvature surface can delimit the chamber of the vacuum and can be bulged when the vacuum is generated, whereby the curvature can depend on the pressure of the vacuum. By monitoring the curvature, it may be possible to ensure compliance with the vacuum for fixing the processing object 7.

The measuring device 10 can be set up to carry out a curvature measurement process at least once after completion of the fixing process in order to determine an actual curvature of at least the predetermined curvature surface of the processing object 7 and/or the contact element 8. The laser diode measuring beam device 11 can be set up to output the at least one measuring beam 14 along the predetermined respective beam path in the curvature measurement process for projecting the predetermined measurement pattern surface 29 onto the curvature surface. The at least one detector device 13 can be set up to detect at least one reflection point 16 of the predetermined measurement pattern surface 29 on the curvature surface, and to determine the actual curvature of the curvature surface from the reflection point coordinates 17 of the at least one reflection point 16 on the curvature surface. The at least one processing control device 3 can be set up to control the processing device 1 depending on the actual curvature in order to regulate a predetermined target curvature. The control can, for example, include changing the operation of a vacuum pump to provide the vacuum.

While bringing the contact element 8 closer to the processing object 7 or during the processing of the processing object 7, it may be necessary to determine an exact object position of the contact element 8. The contact element 8 can be designed in such a way that it is at least partially transparent for the processing laser, so that the processing laser can be guided through the contact element 8 onto the processing object 7. In order to enable the determination of the object position of the contact element 8 in a predetermined reference system R1 R, which can be related to the processing device 1, for example, the processing device 1 can have a measuring device 10. The measuring device 10 can have at least one laser diode measuring beam device 11, which can be operated by a measurement control device 12 of the measuring device 10. The measuring device 10 can also have at least one detector device 13. The laser diode measuring beam device 11 can be set up to output measuring beams 14 along predetermined respective beam paths during a measuring process. The measuring beams 14 can have predetermined geometric relationships to one another, so that they can be arranged in a predetermined geometric measuring pattern. It can be provided that the emission of the measuring beams 14 by the laser diode measuring beam device 11 can take place in such a way that no adjustment of a focus of the respective measuring beams 14 takes place. The detector device 13 can be set up to detect reflected measuring beams 14, which were reflected at reflection points 16 on the surface 9 of the contact element 8. The detector device 13 can be set up to detect respective reflection point coordinates 17 for at least some of the reflection points 16 on the surface 9 of the contact element 8. The reflection points 16 can be arranged on the entrance surface 18, which can face the processing laser, or on the contact surface 19, which can face the processing object 7. The detector device 13 can be set up to provide the reflection point coordinates 17 of the reflection points 16 to the measurement control device 12. The measurement control device 12 can be set up to determine a surface topology 20 of the surface 9 from the reflection point coordinates 17. The measurement control device 12 can be set up to arrange the reflection points 16 at respective reflection point coordinates 17 in a point cloud and to connect them to one another according to a predetermined method in order to be able to reconstruct the surface 9. The reflection point coordinates 17 can be described in the reference system R1R. This makes it possible for the measurement control device 12 to be set up to also describe the surface topology 20 in the reference system R1. A position of the entry surface 18 or the contact surface 19 in the reference system R1 R can thus be determined. The determination of the object position of the contact element 8 in the reference system R1 can be carried out by the measurement control device 12 by providing the measurement control device 12 with a volume model 21 of the contact element 8, which can describe the volume of the contact element 8. The measurement control device 12 can be set up to measure the detected surface topology 20 to identify and locate in the volume element. This makes it possible to determine a position of the surface topology 20 in relation to the volume model 21. The surface topology 20 can be done in the volume model 21, for example, by determining a maximum match of the detected surface topology 20 with a local topology of the volume model 21. It can be provided that the volume model 21, which corresponds to the contact element 8, is specified in advance. Alternatively, it can be provided that the measurement control device 12 is provided with several known volume models 21, which can be assigned to respective contact elements 8. The contact elements 8 and the known volume models 21 can differ from one another in their geometry. In a first step, the measurement control device 12 can compare a match of the detected surface topology 20 with the topology of the respective known volume models 21 and, if there is a match, select the respective known volume model 21 as the selected volume model 21. Because the position of the surface topology 20 in the reference system R1 R is known and the position of the surface topology 20 in the volume model 21, it is possible to derive the object position of the volume model 21 with the reference system R1. Since the volume model 21 describes the volume of the contact element 8, the object position of the contact element 8 can thus be determined in the reference system R1 R.

The measuring device 10 can further be set up to detect reflected measuring beams 14 of the further measuring beams 14 in a respective further measuring process, which are reflected at reflection points 16 of the measuring beams 14 onto a surface 9 of the contact element 8, and to determine reflection point coordinates 17 of at least some of the reflection points 16 . The at least one measurement control device 12 can be set up to determine the actual position of the contact element 8 from the reflection point coordinates 17 of the reflection points 16 of the respective further measurement process. To detect the position of the contact element 8, a separate laser diode measuring beam device 11 and/or a separate detector device 13 can be provided. It can also be provided that the detection of the actual position of the processing object 7 as well as the detection of the actual position of the processing object 7 is carried out by the same laser diode measuring beam device 11 and/or the same detector device 13. Instead of providing respective measuring pattern surfaces 29 for detecting the actual position of the processing object 7 and the actual position of the contact element 8, it can be provided that the measuring beams 14 and the further measuring beams 14 are emitted in a common measuring pattern surface 29 and from the reflected measuring beams 15 of the measuring beams 14 of the common measuring pattern surface 29, the reflection point coordinates 17 of the reflection points 16 on the contact element 8 and the reflection point coordinates 17 of the reflection points 16 on the processing object 7 are determined. A respective one of the measuring beams 14 can be reflected, for example, at two reflection points 16, from which respective reflected measuring beams 14 of the measuring beam 14 can emanate. For example, it may be the case that the measuring beams 14 are on one. Reflection point 16 is reflected on the contact element 8 and from the. Reflection point 16 a reflected measuring beam 14 is emitted and a non-reflected portion of the measuring beam 14 is reflected by the processing object 7 at a reflection point 16, from which. Reflection point 16 another reflected measuring beams 14 of the beam emanates. This makes it possible in particular to detect both the position of the contact element 8 and the position of the processing object 7 before fixing or after fixing.

In a further step, it may be possible for the processing device 1 to be set up to output the processing laser beam 4 depending on the determined object position of the contact element 8 and/or to move the contact element 8 into a desired position by means of a holding device 23.

The at least one detector device 13 can be set up to detect at least one reflected measuring beam 14 of the at least one measuring beam 14, which is at a respective reflection point 16 of the at least one measuring beam 14 of the predetermined measuring pattern surface 29 on the surface 9 of the processing object 7 and/or the contact element 8 is reflected, and to determine the reflection point coordinates 17 of the at least one reflection point 16 with respect to the predetermined reference system R1. The at least one measurement control device 12 can be set up to, according to a predetermined identification method, use the at least one reflection point 16 of the predetermined measurement pattern surface 29 on the surface 9 of the processing object 7 and/or the contact element 8 of the respective measuring process to determine a predetermined referencing feature 32 of the processing object 7 and/or the contact element 8 to identify, wherein a predetermined position of the predetermined referencing feature 32 in relation to the processing object 7 and/or the contact element 8 is stored in the at least one measurement control device 12. The at least one measurement control device 12 can be set up to determine a position of the predetermined referencing feature 32 according to a predetermined position determination method To determine reference to the predetermined reference system R1 as a function of the reflection point coordinates 17 of the at least one reflection point 16 in relation to the predetermined reference system R1. The at least one measurement control device 12 can be set up to determine the position of the processing object 7 and/or the contact element 8 from the position of the referencing feature 32 in relation to the predetermined reference system R1 and the position of the referencing feature 32 in relation to the processing object 7 and/or the contact element 8 in the reference system R1 of the respective measuring process.

The measuring device 10 comprises at least one detector device 13, which is set up to detect at least one reflected measuring beam 14 of the measuring beam 14 in the respective measuring process. The at least one reflected measuring beam 14 can be the at least one measuring beam 14, which is reflected by a reflection of the measuring beam 14 emitted by the laser diode measuring beam device 11 at at least one respective reflection point 16 on the surface 9 of the processing object 7 and/or the contact element 8 is. The detector device 13 can be set up to determine reflection point coordinates 17 of the at least one reflection point 16 of the measurement pattern surface 29 in relation to the predetermined reference system R1. In other words, the measuring device 10 has the at least one detector device 13, which is set up to detect the at least one reflected measuring beam 14 and the reflection point coordinates 17 of the at least one reflection point 16, at which the at least one measuring beam 14 on the surface 9 of the processing object 7 and or the contact element 8 is reflected to determine.

The detector device 13 can be set up to determine the reflection point coordinates 17 of the at least one reflection point 16 with respect to the predetermined reference system R1 using a method according to the prior art, for example by means of triangulation, intensity measurement and/or transit time detection.

The at least one measurement control device 12 can be set up to identify a predetermined referencing feature 32 in relation to the processing object 7 and/or the contact element 8 according to a predetermined identification method by means of the at least one reflection point 16 of the predetermined measurement pattern surface 29 of the respective measurement process. The predetermined referencing feature 32 is stored in the at least one measurement control device 12. The predetermined referencing feature 32 can, for example, be an area of the processing object 7 and/or the contact element 8, which can be identified, for example, due to a special nature of the processing object 7 and/or the contact element 8, and for determining the position of the processing object 7 and/or the contact element 8 may be particularly suitable.

The at least one measurement control device 12 can be set up to determine a position of the predetermined referencing feature 32 with respect to the predetermined reference system R1 as a function of the reflection point coordinates 17 of the at least one reflection point 16 of the measurement pattern surface 29. In other words, the measurement control device 12 is intended to use the at least one reflection point 16 in the predetermined identification method in order to identify the predetermined referencing feature 32 of the processing object 7 and/or the contact element 8. In the predetermined identification method, for example, a detected intensity of the reflection point 16 or the reflection point coordinates 17 can be used to identify the referencing feature 32 of the processing object 7 and/or the contact element 8. For example, it can be provided that the presence of the predetermined referencing feature 32 is detected by the at least one measurement control device 12 when the detected intensity of the at least one reflection point 16 exceeds a predetermined threshold value. This can be the case, for example, if the referencing feature 32 is a predetermined point of the processing object 7 and/or the contact element 8, which can be easily delimited from other areas of the processing object 7 and/or the contact element 8 based on its reflection properties. The position of the referencing feature 32 in relation to the processing object 7 and/or the contact element 8 is stored in the at least one measurement control device 12.

The at least one measurement control device 12 can be set up to determine, according to a predetermined position determination method, a position of the predetermined referencing feature 32 in relation to the predetermined reference system R1 as a function of the reflection point coordinates 17 of the at least one reflection point 16 in relation to the predetermined reference system R1. In the said case, it can be provided that the reflection point coordinates 17 of the reflection point 16, whose intensity value exceeds the predetermined threshold value, are defined as reflection point coordinates 17 of the reference feature with respect to the predetermined reference system R1. In other words, the predetermined position determination process determines at which location the reference feature of the processing object 7 and/or the contact element 8 is located in the reference system R1.

The at least one measurement control device 12 can be set up to determine the position of the processing object 7 and/or the contact element 8 from the position of the referencing feature 32 in relation to the predetermined reference system R1 and the position of the referencing feature 32 in relation to the processing object 7 and/or the contact element 8 in the reference system R1 of the respective measuring process. In other words, the position of the predetermined referencing feature 32 of the processing object 7 and/or the contact element 8 is known both in relation to the predetermined reference system R1 and in relation to the processing object 7 and/or the contact element 8. Due to the known position of the predetermined referencing feature 32 in relation to the reference system R1 and the known position of the predetermined referencing feature 32 in relation to the processing object 7 and/or the contact element 8, the at least one measurement control device 12 is able to determine the position of the processing object 7 and/or the contact element 8 to determine in relation to the predetermined reference system R1.

The measuring device 10 can be set up to determine the actual position of the contact element 8 and the actual position of the processing object 7 in the at least one measuring process, or the actual position of the contact element 8 and the actual position of the processing object 7 separately in respective ones Measurement processes can be determined individually, whereby the respective measurement processes can be carried out at different times from one another. In other words, the detection of the actual position of the processing object 7 after the measuring process and the detection of the actual position of the contact element 8 after the further measuring process take place at a time offset from one another. For example, it can be provided that first the measuring process for detecting the actual position of the processing object 7 is carried out and after determining the actual position of the processing object 7, the further measuring process is carried out in order to determine the actual position of the contact element 8.

The measuring device 10 can be set up to carry out the actual position of the contact element 8 and the actual position of the processing object 7 simultaneously in the at least one measuring process. It can be provided that the at least one measuring beam 14 is output onto the surface 9 of the contact element 8 by the at least one laser diode measuring beam device 11 and the at least one measuring beam 14 is output onto the surface 9 of the processing object 7 at the same time by the laser diode measuring beam device 11. It can be provided that the respective measuring beams 14 differ from one another in a predetermined feature in order to enable an assignment of the reflection points to the contact element 8 or the processing object 7. For example, it can be provided that the respective measuring beams 14 differ in their wavelength. It can be provided that the at least one detector device 13 is set up to detect the features of the reflected measuring beams 14 and, depending on the feature of the detected reflected measuring beam 14, the reflection point as a reflection point 16 on a surface 9 of the processing object 7 or as a reflection point 16 on a surface 9 of the contact element 8 to identify. This results in the advantage that the detection of the actual position of the contact element 8 and the detection of the actual position of the processing object 7 can take place at the same time.

A further development of the invention provides that the at least one measurement control device 12 is set up to provide a predetermined referencing feature 32 of the object of the respective measurement process using the at least one reflection point 16 of the predetermined measurement pattern surface 29 on the surface 9 of the object of the respective measurement process To identify the processing object 7 and/or the contact element 8, wherein a predetermined position of the predetermined referencing feature 32 in relation to the processing object 7 and/or the contact element 8 is stored in the at least one measurement control device 12. The at least one measurement control device 12 can be set up to determine, according to a predetermined referencing feature position determination method, a position of the predetermined referencing feature 32 in relation to the predetermined reference system R1 as a function of the reflection point coordinates 17 of the at least one reflection point 16 in relation to the predetermined reference system R1, and out the position of the referencing feature 32 in relation to the predetermined reference system R1 and the position of the referencing feature 32 in relation to the processing object 7 and/or the contact element 8 to determine the position of the processing object 7 and/or the contact element 8 in the reference system R1 of the respective measuring process.

The measurement control device 12 can be set up to determine an intensity distribution of the measurement pattern surface 29 on the surface 9 of the processing object 7 and/or the contact element 8 in the predetermined identification method. In other words, the at least one detector device 13 is set up to determine what intensity the previous one is has the correct measurement pattern surface 29 at respective positions on the surface 9 of the processing object 7 and/or the contact element 8. In other words, the measurement control device 12 is set up for spatially resolved intensity detection of the measurement pattern area 29. For example, it can be provided that the measurement pattern surface 29 has a plurality of reflection points 16. The measurement control device 12 can be set up to detect the intensity which the at least one measurement beam 14 reflected by a respective reflection point 16 has. As a result, the intensity of the respective reflected measuring beam 14 can be assigned to each of the reflection points 16. Additionally or alternatively, it can be provided that the measurement control device 12 is set up to determine the intensity distribution within a respective reflection point 16. This is particularly advantageous if the reflection point 16 is generated by the at least one measuring beam 14 with an enlarged beam diameter 31. The measurement control device 12 can thus be set up to determine how the intensity is distributed within the respective reflection point 16. The measuring device 10 can be set up to identify the predetermined referencing feature 32 of the processing object 7 and/or the contact element 8 in the predetermined identification method as a function of a predetermined intensity feature of the predetermined referencing feature 32. The predetermined intensity feature can, for example, describe a property that is related to the intensity of the referencing feature 32 and enables the referencing feature 32 to be identified based on the intensity. The predetermined intensity feature can, for example, specify a threshold value, whereby the referencing feature 32 can be identified by the intensity falling below or exceeding the threshold value. This may make it possible, for example, to identify referencing features 32 defined as points or areas based on their reflection behavior. For example, it can be provided that the referencing feature 32 comprises a predetermined area. This can have a surface texture that has an absorbing effect, whereby reflection points 16 within the predetermined area can have a lower intensity than reflection points 16 that are arranged outside the predetermined area.

This makes it possible to identify the specified area by falling below the intensity of the respective reflection points 16.

A further development of the invention provides that the at least one measurement control device 12 is set up to determine a height distribution of the measurement pattern surface 29 in the predetermined identification method and the predetermined referencing feature 32 of the processing object 7 and/or the contact element 8 as a function of a predetermined height feature of the predetermined referencing feature 32 to identify. In other words, the measurement control device 12 is set up to determine the height distribution of the measurement pattern surface 29 on the surface 9 of the processing object 7 and/or the contact element 8. The height distribution of the measurement pattern surface 29 can be determined, for example, from reflection point coordinates 17 of the reflection points 16 on the surface 9. The measuring device 10 can be set up to carry out the predetermined identification method, taking into account the determined height distribution of the measuring pattern surface 29, to identify the predetermined referencing feature 32. The referencing feature 32 of the processing object 7 and/or the contact element 8 is identified in the measurement pattern surface 29 as a function of the predetermined height feature of the processing object 7 and/or the contact element 8. It can be provided that the predetermined height feature describes a predetermined threshold value, which describes a height difference of the referencing feature 32 to other areas of the processing object 7 and/or the contact element 8. The predetermined height feature can, for example, specify that a referencing feature 32 provided as a referencing point has a maximum height in relation to a reference surface of the processing object 7 and/or the contact element 8. In particular, it can be provided to identify an apex of an eye as a reference feature of the processing object 7 and/or the contact element 8 as a height feature using a characteristic height profile.

A further development of the invention provides that the referencing feature 32 includes at least one predetermined referencing point of the processing object 7 and/or the contact element 8. In other words, the referencing feature 32 includes at least one predetermined referencing point. The referencing feature 32 can also have several of the referencing points. For example, it can be provided that the referencing feature 32 can have one or more referencing points that can be reliably detected by the measuring device 10. The predetermined referencing points can also be characterized in that their respective position in relation to the processing object 7 and/or the contact element 8 is precisely known and can be detected relatively independently of the boundary conditions of the measuring process on the object. It It can be provided that the at least one referencing feature 32 includes at least one referencing point of the processing object 7 and/or the contact element 8, which is arranged on a relatively rigid area of the processing object 7 and/or the contact element 8. This results in the advantage that it can be assumed that the position of the referencing point in relation to the processing object 7 and/or the contact element 8 does not change due to local deformations of the processing object 7 and/or the contact element 8.

A further development of the invention provides that the referencing feature 32 includes a predetermined surface topology 20 of the surface 9 of the processing object 7 and/or the contact element 8. In other words, it is provided that the measuring device 10 is set up to identify the predetermined surface topology 20 of the surface 9 of the processing object 7 and/or the contact element 8 and to determine the position of the surface topology 20. It can be provided that the at least one referencing feature 32 comprises a characteristic depression in a height profile of the processing object 7 and/or the contact element 8. In other words, it is provided that the measuring device 10 is set up to detect the predetermined surface topology 20 of the surface 9 of the processing object 7 and/or the contact element 8. Because the reflection point coordinates 17 of the reflection points 16 are specified in relation to the predetermined reference system R1, the measurement control device 12 is able to determine the surface topology 20 of the surface 9 of the processing object 7 and/or the contact element 8 also in relation to the predetermined reference system R1. The at least one measurement control device 12 can, for example, be set up to arrange the respective reflection point coordinates 17 of the reflection points 16 in a point cloud and to connect the reflection points 16 of the point cloud to one another according to a predetermined method, such as a marching cubes algorithm. The position determination can, for example, include a search for a section of the surface 9 of the processing object 7 and/or the contact element 8, the surface topology 20 of which has a maximum match with the predetermined surface topology 20. The position of the surface topology 20 in the object can be determined, for example, in a coordinate system of the processing object 7 and/or the contact element 8.

A further development of the invention provides that the at least one referencing feature 32 comprises a predetermined volume model 21 of the processing object 7 and/or the contact element 8. In other words, it is provided that the measuring device 10 is set up to detect a predetermined volume model 21 of the processing object 7 and/or the contact element 8 as a referencing feature 32. The at least one measurement control device 12 can be set up to identify the predetermined volume model 21 of the processing object 7 and/or the contact element 8 and to determine a position of the volume model 21 of the processing object 7 and/or the contact element 8.

A further development of the invention provides that the at least one control device is set up to determine the predetermined volume model 21 of the processing object 7 and/or the contact element 8 from known volume models 21 as a function of the surface topology 20. The known volume models 21 of known objects can be stored in the control device or provided to the control device. In other words, the at least one control device is provided with several known volume models 21, which describe volumes of respective known objects. The control device can be set up to select the volume model 21 that corresponds to the object from the volume models 21 provided, depending on the detected surface topology 20. For example, it can be provided that the detected surface topology 20 is compared with the surfaces 9 of the respective volume models 21 and the volume model 21 is selected from the volume models 21 provided, which has a surface 9 which has the greatest correspondence with the detected surface topology 20.

A further development of the invention provides that the measuring device 10 is set up to determine the predetermined volume model 21 of the processing object 7 and/or the contact element 8 in a predetermined pre-process. In other words, the measuring device 10 is set up to examine the processing object 7 and/or the contact element 8 in the predetermined pre-process and to generate the volume model 21 of the processing object 7 and/or the contact element 8. It can be provided that the measuring device 10 is set up to scan the processing object 7 and/or the contact element 8 with a further measuring beam 14 or several further measuring beams 14 in the predetermined pre-process in order to increase the volume of the processing object 7 and/or the contact element 8 capture. The measuring device 10 can determine the volume model 21 of the processing object 7 and/or the contact based on the measurements determine elements 8 and specify the at least one referencing feature 32 of the processing object 7 and/or the contact element 8 according to predetermined criteria. This results in the advantage that a volume model 21 can be created from unknown objects or objects that deviate from standards.

2 shows a schematic representation of a measuring device.

It can be provided that the measuring pattern surface 29 is to be projected onto the surface 9 of the processing object 7 and/or the contact element 8 by the at least one measuring beam 14, it being possible for the measuring beam 14 to have a predetermined beam diameter 31 in order to pass through the measuring beam 14 images a surface on the surface 9 of the processing object 7 and/or the contact element 8. The laser diode measuring beam device 11 can have a widening element 30, which can be set up to widen the measuring beam 14 to the predetermined beam diameter 31. The measuring device 10 can have a surface emitter unit 25 as a laser diode measuring beam device 11, which can be set up to emit the at least one measuring beam 14. The laser diode measuring beam device 11 can be set up to guide the measuring beam 14 emitted by the surface emitter unit 25 through the expansion element 30 in order to provide a predetermined beam diameter 31. For example, an original beam 28 can be guided from the surface emitter unit 25 onto the expansion element 30. The beam diameter 31 can be widened, for example, to a value of 4 mm, whereby the measuring pattern surface 29 formed by the at least one measuring beam 14 can have a predetermined size.

The expanded measuring beam 14 can image a continuous measuring pattern area 29 on the surface 9 of the processing object 7 and/or the contact element 8. The measuring beam 14 can image the measuring pattern surface 29 on the entrance surface 18 and/or the contact surface 19 of the object 8. The detector device 13 can be set up to detect a plurality of reflection points 16 which are formed by the at least one measuring beam 14 on the surface 9 of the contact element 8 on the entrance surface 18 and/or the contact surface 19 of the contact element 8. A respective reflected measuring beam 15 is emitted at each of the reflection points 16. Each of the reflected measuring beams 15 can have a respective intensity. The detector device 13 can be set up to determine the intensity of the respective reflected measuring beam 15. The intensity can, for example, depend on an intensity of the expanded measuring beam 14 that was reflected at the respective reflection point 16. It may be the case, for example, that the measuring beam 14 has a maximum intensity in a center and that the intensity of the measuring beam 14 decreases towards the edge of the measuring beam 14. The intensity of the reflected measuring beam 15 can also be influenced by an angle of the surface 9 or by a local reflectivity of the surface 9 of the object 8.

The detector device 13 can be set up to detect respective reflection points 16 in the measurement pattern surface 29 on the surface 9 of the contact element 8, in particular on the entrance surface 18 and/or the contact surface 19 of the contact element 8, and to determine their reflection point coordinates 17 and their respective intensity. Due to the continuous measurement pattern, the measurement pattern surface 29 can have an infinite number of reflection points 16. For this reason, the detector device 13 can select reflection points 16 according to a predetermined criterion. For example, it can be provided that reflections which are at predetermined distances from one another are recorded as reflection points 16. From the respective reflection point coordinates 17 of the reflection points 16, the detector device 13 can determine a height profile of the surface 9 of the contact element 8. From the respective intensities, the detector device 13 can determine an intensity distribution of the measurement pattern surface 29 on the surface 9 of the contact element 8. The detector device 13 can be set up to identify the referencing feature 32 based on the reflection points 16. The referencing feature 32 can, for example, include a predetermined surface topology 20 of the contact element 8 and/or a predetermined reference point of the contact element 8. The referencing feature 32 can, for example, have a height feature and an intensity feature, through which the detector device 13 detects the referencing feature 32, for example in the height profile or the intensity distribution can identify. In the figure shown, the referencing feature 32 can include a referencing point, which can be arranged at a high point of the contact surface 19. The high point can identify the referencing point, which can be opposite, for example, an apex of the processing object 7 when the contact element 8 is arranged on the processing object. The position of the referencing feature 32 in relation to the contact element 8 can be stored in the system R2 in the measurement control device 12. The referencing feature 32 can, for example, have the height feature that it is the lowest point of a curvature of the Contact surface 19 in the contact element 8 is. For example, it can be provided that the detector device 13 can evaluate a height profile of the surface 9 in order to identify the referencing feature 32. From the reflection point coordinates 17 of the respective reflection points 16, the detector device 13 can determine the position of the referencing feature 32 in relation to the predetermined reference system R. From the position of the referencing feature 32 in relation to the predetermined reference system R1 and from the position of the referencing feature 32 stored in the measurement control device 12 in relation to the contact element 8 in the system R2, the measurement control device 12 can determine the position of the contact element 8 in the reference system R1.

3 shows a schematic representation of a measuring device 10.

The measuring device 10 can have a surface emitter array 24 as a laser diode measuring beam device 11, which can have a plurality of surface emitter units 25, which can be arranged one-dimensionally or two-dimensionally in a predetermined pattern. The detector device 13 can be arranged in combination in the laser diode measuring beam device 11 and have a plurality of detector units 26, which can also be arranged in a predetermined pattern. The laser diode measuring beam device 11 can be set up to emit respective measuring beams 14 by means of the surface emitters, which are arranged in the predetermined pattern relative to one another. The predetermined pattern can be defined, for example, by means of distances and/or angles between the individual measuring beams 14. The measuring beams 14 can be guided onto the contact element 8 and, for example, can be directed onto the entrance surface 18 of the contact element 8. The measuring beams 14 can be reflected at respective reflection points 16 and sent back as reflected measuring beams 14. The reflected measuring beams 14 can be detected by the detector units 26 of the detector device 13. The measuring beams 14 can be output in a pulsed manner in a respective measuring cycle, so that an emission time of the measuring beams 14 by the respective surface emitter units 25 is known. The detector units 26 of the detector device 13 can be set up to detect the reflected pulses and to measure the detection times of the reflected pulses. As a result, the measuring device 10 can be set up to determine a transit time of the measuring beam 14 to the reflection point 16 and from the reflection point 16 to the detector unit 26. Taking the speed of light into account, a path length of the pulse can be determined. With a known direction of the detected reflected measuring beams 14, it is therefore possible to determine three-dimensional reflection point coordinates 17 of the respective reflection points 16. The reflection point coordinates 17 can be provided to the measurement control device 12, which can use them to reconstruct the surface topology 20 of the contact element 8. The surface topology 20 can, for example, include a general orientation of the entrance surface 18 and/or unevenness of the entrance surface 18. Alternatively, it can also be provided that the measuring beams 14 are output in a modulated manner, for example by means of a so-called chirping, in which case the measuring beams 14 are not pulsed, but rather continuous, in which the measuring beam 14 is modulated in a predetermined manner over time. For example, it can be provided to modulate a frequency of the measuring beam 14 and to determine the time and thus the path length of the measuring beam 14 and the reflected measuring beam 14 by superimposing a frequency of an emitted measuring beam 14 with a frequency of a detected reflected measuring beam 14. It can be provided that the measuring device 10 works in a so-called flash lidar method, whereby the measuring beams 14 are emitted at the same time and the arrival times of the respective reflected measuring beams 14 are detected by the detector device 13 at the respective times. This makes it possible to carry out a simultaneous measurement in contrast to a rasterized measurement, in which an emitted measuring beam 14 is guided sequentially along several directions.

4 shows a further schematic representation of a possible measuring device 10.

The measuring device 10 shown can have laser diode measuring beam devices 11 and detector devices 13 that are locally separated from one another. It may be possible for several of the detector devices 13 to be provided, which detect respective reflection point coordinates 17 of at least some of the reflection points 16. The reflection point coordinates 17 can then be combined into a surface topology 20 by the measurement control device 12.

5 shows a further schematic representation of a measuring device 10.

The measuring device 10 can have a deflection unit 27, which can be, for example, a mirror that can reflect a provided original laser beam 28 in different directions at different times, so that the respective measuring beams 14 can be provided along the respective beam paths. In this case one can sequential scanning of the surface 9 of the contact element 8 takes place. In this case, the detector device 13 can also be spatially resolving, but it can also be possible for the detector device 13 to be set up only to detect a transit time of the respective measuring beams.

6 shows a schematic representation of a possible sequence of a method for operating a processing device for processing a processing object.

6 shows a schematic representation of a possible sequence of a method for operating a processing device 1 for processing a processing object 7.

Through the processing device 1, a contact element 8 can be guided into a predetermined docking position 33 with respect to the processing object 7 in an approach process, and/or the processing object 7 can be guided into a predetermined processing position 34. The processing object 7 is fixed in a predetermined processing position 34 of the processing object 7 with respect to a predetermined reference system R1 for laser processing in a fixing method by means of the contact element 8.

In a step S1, at least one measuring process in the approach process can be carried out by a measuring device 10 with at least one measuring control device 12 of the processing device 1.

In a step S2, at least one measuring beam 14 can be output by at least one laser diode measuring beam device 11 of the measuring device 10 in the at least one measuring process along a predetermined respective beam path for projecting a predetermined measuring pattern surface 29 onto at least one of the two surfaces 9.

In a step S3, at least one reflection point 16 of the predetermined measurement pattern surface 29 on the respective surface 9 can be detected by at least one detector device 13 of the measuring device 10 in the at least one measuring process, and the reflection point coordinates 17 of the at least one reflection point 16 can be detected by the at least one detector device 13 can be determined in relation to the predetermined reference system R1.

In a step S4A, the measuring device 10 can use the reflection point coordinates 17 of at least one reflection point 16 on a surface 9 of the processing object 7 in relation to the predetermined reference system R1 to determine the actual position of the processing object 7 in relation to the predetermined reference system R1 using a position determination method , and the actual position of the processing object 7 with respect to the predetermined reference system R1 is output to the processing control device 3 of the processing device 1.

In a step S4B, the measuring device 10 can determine the actual position of the contact element 8 in relation to the predetermined reference system R1 from reflection point coordinates 17 of at least one reflection point 16 on a surface 9 of the processing object 7 in relation to the predetermined reference system R1 using a position determination method, and the actual position of the contact element 8 with respect to the predetermined reference system R1 is output to the processing control device 3 of the processing device 1.

Overall, the examples show how a determination of an actual position of a processing object and/or a contact element can be made possible for carrying out an approach process of the contact element into a predetermined docking position with respect to the processing object.

Claims (18)

Processing device (1) for processing a processing object (7) with at least one processing control device (3), a processing laser beam source (2) which is set up to output a processing laser beam (4), a beam deflection device (5) and a focusing device (6), whereby - the processing device (1) is set up to guide a contact element (8) into a predetermined docking position (33) with respect to the processing object (7) in an approach process and/or to move the processing object (7) into a predetermined processing position (34). guide, and to fix the processing object (7) in the predetermined processing position (34) of the processing object (7) with respect to a predetermined reference system (R1) for laser processing in a fixing method by means of the contact element (8), - the processing device (1) a measuring device (10) with at least one measurement control device (12), which is set up to, in the approach process, in at least one measuring process, from reflection point coordinates (17) of at least one reflection point (16) on a surface (9) of the processing object (7). To determine the actual position of the processing object (7) in relation to the predetermined reference system (R1) in relation to the predetermined reference system (R1) according to a position determination method, and the Output the actual position of the processing object (7) with respect to the predetermined reference system (R1) to the processing control device (3) of the processing device (1), and/or from reflection point coordinates (17) of at least one reflection point (16) on a surface (9) of the contact element (8) in relation to the predetermined reference system (R1) according to a position determination method to determine the actual position of the contact element (8) in relation to the predetermined reference system (R1), and the actual position of the contact element (8) in relation on the predetermined reference system (R1) to the processing control device (3) of the processing device (1), and wherein - the measuring device (10) comprises at least one laser diode measuring beam device (11), which is set up to in the at least one measuring process at least one measuring beam ( 14) along a predetermined respective beam path for projecting a predetermined measurement pattern surface (29) onto at least one of the two surfaces (9), and - the measuring device (10) comprises at least one detector device (13) which is set up to detect at least one reflection point ( 16) to detect the predetermined measurement pattern surface (29) on the respective surface (9), and to determine the reflection point coordinates (17) of the at least one reflection point (16) with respect to the predetermined reference system (R1) according to a coordinate determination method, characterized in that - the processing device (1) is set up as a transit time measurement lidar, the at least one laser diode measuring beam device (11) being set up to output the at least one measuring beam (14) in a pulsed manner, the at least one detector device (13) being set up to detect the reflection point coordinates (17). of the respective at least one reflection point (16) using a transit time measurement, which is a measurement of a transit time of the respective reflected measuring beam (15) from a time of emission of the measuring beam (14) by the laser diode measuring beam device (11) to a time of reception of the reflected measuring beam (15) by the detector device (13), and / or - the processing device (1) is set up as a modulated continuous wave lidar, wherein the at least one laser diode measuring beam device (11) is set up to output the at least one measuring beam (14) in a time-modulated manner , and the at least one detector device (13) is set up to determine the reflection point coordinates (17) of the respective at least one reflection point (16) using a modulation deviation between a current modulation of the measuring beam (14) and a detected modulation of the reflected measuring beam (15). determine, and/or - the processing device (1) is set up as an intensity lidar, wherein the at least one laser diode measuring beam device (11) is set up to output the at least one measuring beam (14) with a predetermined output intensity, and the at least one detector device (13) for this purpose is set up to detect a reception intensity of the respective reflected measuring beam (15), the at least one detector device (13) being set up to detect the reflection point coordinates (17) of the respective at least one reflection point (16) depending on an intensity difference between the output intensity and the reception intensity to determine. Processing device (1). Claim 1 , wherein the at least one measurement control device (12) is set up to - from the actual position of the processing object (7) in relation to the predetermined reference system (R1) and the actual contact element position of the contact element (8) in relation to the predetermined reference system ( R1), to determine an actual relative position of the contact element (8) in relation to the processing object (7) and to transmit it to the at least one processing control device (3), and - the at least one processing control device (3) is set up to do so in the event of a deviation the actual relative position of the contact element (8) in relation to the processing object (7) from the predetermined docking position (33) below a predetermined threshold value and at the same time a deviation of the actual position of the processing object (7) in relation to the predetermined reference system (R1) from the predetermined processing position (34) of the processing object (7) in relation to the predetermined reference system (R1) below a predetermined threshold value, to control the processing device (1) for fixing the contacting element on the processing object (7) according to the fixing method. Processing device (1). Claim 2 , wherein the at least one measurement control device (12) is set up to determine the actual relative position of the contact element (8) at least once after completion of the fixing process and to transmit it to the at least one processing control device (3), - the at least one processing control device (3) is set up to control the processing device (1) to release the contact element (8) if the actual relative position deviates from a predetermined fixing position above a threshold value. Processing device (1). Claim 3 , wherein - the measuring device (10) is set up to determine an actual curvature of at least one predetermined curvature surface of the processing object (7) and / or the contact element (8) at least once after completion of the fixing process after a curvature measurement process, - the at least one processing control device (3) is set up to control the processing device (1) depending on the actual curvature to adjust a predetermined target curvature, wherein - the laser diode measuring beam device (11) is set up to move along the at least one measuring beam (14) in the curvature measurement process to output the predetermined respective beam path for projecting the predetermined measurement pattern surface (29) onto the curvature surface, - the at least one detector device (13) is set up to detect at least one reflection point (16) of the predetermined measurement pattern surface (29) on the curvature surface, and - from to determine the actual curvature of the curvature surface using the reflection point coordinates (17) of the at least one reflection point (16) on the curvature surface. Processing device (1) according to one of the preceding claims, wherein the at least one measurement control device (12) is set up to determine the actual position of the processing object (7) at least once after completion of the fixing process and to display the actual position of the processing object (7). to transmit the at least one processing control device (3), and wherein the at least one processing control device (3) is set up to, if the actual position of the processing object (7) deviates from the processing position (34) above a threshold value, the processing device (1) to release the contact element (8). Processing device (1) according to one of the preceding claims, wherein the at least one laser diode measuring beam device (11) is set up to output the at least one measuring beam (14) as a collimated beam. Processing device (1) according to one of the preceding claims, wherein the at least one laser diode measuring beam device (11) has at least one expansion element (30) in the respective beam path of the at least one measuring beam (14), which is set up to receive the at least one measuring beam (14). to widen a predetermined optical beam diameter (31) in order to produce the at least one reflection point (16) of the measurement pattern surface (29) with a predetermined reflection surface on the at least one surface (9). Processing device (1) according to one of the preceding claims, wherein the at least one laser diode measuring beam device (11) is set up to output several of the measuring beams (14) simultaneously along predetermined respective beam paths in the at least one measuring process. Processing device (1) according to one of the preceding claims, wherein the processing device (1) is set up to output several of the measuring beams (14) sequentially along predetermined respective beam paths in the at least one measuring process. Processing device (1) according to one of the preceding claims, wherein the at least one laser diode measuring beam device (11) is set up to output the at least one measuring beam (14) guided onto the contact element (8) with a different wavelength than the at least one onto the processing device (1). 1) guided measuring beam (14). Processing device (1) according to one of the preceding claims, wherein the at least one laser diode measuring beam device (11) is set up to project a different measuring pattern surface (29) with the at least one measuring beam (14) guided onto the contact element (8) than with the at least a measuring beam (14) guided onto the processing object (7). Processing device (1) according to one of the preceding claims, wherein the processing object (7) is a human or animal eye. Processing device (1) according to one of the preceding claims, wherein the laser diode measuring beam device (11) comprises at least one surface emitter unit (25). Processing device (1). Claim 13 , wherein the laser diode measuring beam device (11) comprises at least one surface emitter array (24). Processing device (1) according to one of the preceding claims, wherein the laser diode measuring beam device (11) is set up to emit the measuring beams (14) in an infrared spectrum and/or a near-infrared spectrum. Method for operating a processing device (1) for processing an item processing object (7) with at least one processing control device (3), a processing laser beam source (2) which is set up to output a processing laser beam (4), a beam deflection device (5) and a focusing device (6), wherein - through the processing device (1), in an approach process, a contact element (8) is guided into a predetermined docking position (33) with respect to the processing object (7) and/or the processing object (7) is guided into a predetermined processing position (34), and the processing object (7) in the predetermined processing position (34) of the processing object (7) is fixed in relation to a predetermined reference system (R1) for laser processing in a fixation method by means of the contact element (8), - by a measuring device (10) with at least one measuring control device (12). Processing device (1) at least one measuring process is carried out in the approach process, wherein the measuring device (10) consists of reflection point coordinates (17) of at least one reflection point (16) on a surface (9) of the processing object (7) in relation to the predetermined reference system (R1 ) according to a position determination method, the actual position of the processing object (7) is determined in relation to the predetermined reference system (R1), and the actual position of the processing object (7) in relation to the predetermined reference system (R1) is sent to the processing control device (3) the processing device (1), and/or by the measuring device (10) from reflection point coordinates (17) of at least one reflection point (16) on a surface (9) of the contact element (8) in relation to the predetermined reference system (R1) according to one Position determination method, the actual position of the contact element (8) is determined in relation to the predetermined reference system (R1), and the actual position of the contact element (8) in relation to the predetermined reference system (R1) is sent to the processing control device (3) of the processing device ( 1) is output, and wherein - by at least one laser diode measuring beam device (11) of the measuring device (10) in the at least one measuring process at least one measuring beam (14) along a predetermined respective beam path for projecting a predetermined measuring pattern surface (29) onto at least one of the two surfaces (9) is output, - by at least one detector device (13) of the measuring device (10) in which at least one measuring process, at least one reflection point (16) of the predetermined measuring pattern surface (29) on the respective surface (9) is detected, and - by the at least one detector device (13) determines the reflection point coordinates (17) of the at least one reflection point (16) with respect to the predetermined reference system (R1) according to a coordinate determination method, characterized in that - the processing device (1) is set up as a transit time measurement lidar, wherein The at least one measuring beam (14) is output in a pulsed manner by the at least one laser diode measuring beam device (11), the reflection point coordinates (17) of the respective at least one reflection point (16) being detected by the at least one detector device (13) using a transit time measurement, which is a Measurement of a transit time of the respective reflected measuring beam (15) from a time of emission of the measuring beam (14) by the laser diode measuring beam device (11) to a time of reception of the reflected measuring beam (15) by the detector device (13), and/or - the processing device (1) is set up as a modulated continuous wave lidar, the at least one measuring beam (14) being output in a time-modulated manner by the at least one laser diode measuring beam device (11), and the reflection point coordinates (17) of the respective at least one reflection point (16) by the at least one Detector device (13) can be determined using a modulation deviation between a current modulation of the measuring beam (14) and a detected modulation of the reflected measuring beam (15), and / or - the processing device (1) is set up as an intensity lidar, wherein by the at least one laser diode measuring beam device (11) the at least one measuring beam (14) will be output with a predetermined output intensity, and a reception intensity of the respective reflected measuring beam (15) is detected by the at least one detector device (13), the reflection point coordinates (17) of the respective at least one reflection point ( 16) can be determined by the at least one detector device (13) depending on an intensity difference between the output intensity and the reception intensity. Computer program, comprising commands that cause the processing device (1) according to one of the Claims 1 until 15 a procedure Claim 16 executes. Computer-readable medium on which a computer program can be written Claim 17 is stored.

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