DE102021208624A1 - METHOD AND INTEGRATION DEVICE - Google Patents

Abstract

A method for installing an exchangeable component (202) in an optical system (200), with the steps: a) lowering (S1) the component (202) onto a fixed world (212) of the optical system (200), b) connecting (S2) of the component (202) to the fixed world (212), wherein an actual position (208) of the component (202) is shifted in such a way that the actual position (208) is within a tolerance zone (228) of a target Position (226) of the component (202), and wherein decoupling devices (218, 220) for decoupling the component (202) from the solid world (212) are elastically deformed, c) fixing (S3) the component (202) in its Actual position (208), d) lifting (S5) of the component (202) from the solid world (212), wherein the decoupling devices (218, 220) are relaxed, e) lowering (S6) of the component (202) on the fixed world (212), and f) unfixing (S8) the component (202).

Description

The present invention relates to a method and an integration device for installing a replaceable component in an optical system.

Microlithography is used to produce microstructured components such as integrated circuits. The microlithography process is carried out using a lithography system which has an illumination system and a projection system. The image of a mask (reticle) illuminated by the illumination system is projected by the projection system onto a substrate coated with a light-sensitive layer (photoresist) and arranged in the image plane of the projection system, for example a silicon wafer, in order to place the mask structure on the light-sensitive coating of the substrate transferred to.

Driven by the striving for ever smaller structures in the production of integrated circuits, EUV lithography systems (English: extreme ultraviolet, EUV) are currently being developed, which emit light with a wavelength in the range from 0.1 nm to 30 nm, in particular 13.5 nm , use. In such EUV lithography systems, because of the high absorption of light of this wavelength by most materials, reflecting optics, ie mirrors, must be used instead of—as hitherto—refractive optics, ie lenses.

To install or change optics as mentioned above, it is necessary to align them exactly with a fixed world, for example in the form of a so-called support frame, of the lithography system. The required position tolerance of the optics in relation to the solid world is in the order of 0 µm to 100 µm.

Against this background, it is an object of the present invention to provide an improved method for installing a component in an optical system.

Accordingly, a method for installing a replaceable component in an optical system is proposed. The method comprises the steps: a) lowering the component to a fixed world of the optical system, b) binding the component to the fixed world, with an actual position of the component being shifted in such a way that the actual position is within a tolerance field of a target -position of the component, and decoupling devices for decoupling the component from the solid world are elastically deformed, c) fixing the component in its actual position, d) lifting the component from the solid world, wherein the decoupling devices are relaxed, e) lowering the component onto the solid world, and f) unpinning the component.

Because the component is connected to the fixed world and the decoupling devices are used to shift the actual position into the tolerance field, a technically complex positioning tool for positioning the component relative to the fixed world can be dispensed with.

The connection of the component to the solid world can be achieved solely with the help of a weight of the component. In this context, “connecting” can be understood to mean placing or depositing the component on the solid world after the component has been lowered onto the solid world. When the component is connected to the solid world, it positions itself automatically in relation to the solid world due to its weight. Additionally or alternatively, optional clamping devices can be provided for connecting the component to the solid world. The clamping devices are mounted on the fixed world and can connect the component to the fixed world. However, as previously mentioned, the clamps are optional.

The component is an optical element, such as a mirror, or includes an optical element. In particular, the component has a mount, in particular what is known as an interchangeable mirror mount, and an optical element. The optical element can be glued into the socket. The component is, or may be referred to as, an alternating component. The optional clamping devices connect the socket to the fixed world. The decoupling devices decouple the socket from the solid world. The optical system can be a projection system of a lithography system, in particular an EUV lithography system or a DUV lithography system, or part of such a projection system. However, the optical system can also be part of a beam shaping and illumination system. The fixed world can be a support frame or a manipulator frame mounted on motors.

The decoupling facilities can be associated with the component or with the fixed world. The decoupling devices can each have a decoupling element assigned to the component and a decoupling element assigned to the solid world. For example, the decoupling element assigned to the solid world is an interface of the respective coupling device or can be designated as such. The decoupling elements take effect when the component is lowered onto the solid world into each other. Preferably, three decoupling devices are provided, which are distributed evenly around a circumference of the component. With the aid of the clamping devices or the weight of the component, the component is positioned in step b) relative to the solid world. In the process, the decoupling devices deform elastically beyond an extent that is permissible in an operational situation. Fixing the component in step c) prevents the decoupling devices from deforming back and thus moving the actual position out of the tolerance field.

The component can be continuously fixed during steps c), d) and e). Alternatively, the actual position of the component remains within the tolerance zone due to its weight alone. With the lifting of the component from the solid world, the elastically deformed isolators relax from their deformed state back to an undeformed state. This means that when the component is lowered again onto the solid world in step e), the decoupling devices are voltage-free, so that the actual position remains within the tolerance field and the decoupling devices do not move the actual position out of the tolerance field.

When using the optional clamping devices, the component is positioned exactly to the solid world after closing the clamping devices after step e), the decoupling devices are not deformed beyond a permissible extent and deformations introduced into the optical element are within a permissible range. If necessary, the process of relaxing the decoupling elements can be carried out several times. The decision to do this can be made by measuring the absolute position or by checking the reproducibility of the final positioning of the component. A “tolerance field” is to be understood here as an area around the target position by which the actual position can deviate from the target position.

According to one embodiment, steps a), c), d), e) and f) are performed using an integration device.

During initial assembly, the component can be installed, for example, from a vertical direction. If the component is replaced in the field, it can be installed from a horizontal direction, for example. The integration device is optional. The integration device can also be referred to as an installation device or changing device. In particular, the lowering and lifting of the component are carried out with the aid of a lifting system of the integration device. The lifting system includes several lifting columns. In particular, the integration device is not part of the optical system. If the component is integrated from the horizontal direction, the component can be lowered and raised using a rocker system, for example.

According to a further embodiment, before step a), the integration device is mounted on a housing of the optical system, with the integration device being removed from the housing after step f).

For this purpose, the integration device comprises a fastening section which can be connected to the housing. The fastening section can in particular be screwed to the housing. The attachment portion may be ring-shaped.

According to a further embodiment, steps a), d) and e) are carried out with the aid of a lifting system of the integration device.

As previously mentioned, the lifting system may include multiple lifting columns. The lifting system can be implemented, for example, by three lifting columns, which are evenly distributed around the circumference of the component. The lifting columns are mounted on the mounting portion of the integration device.

According to a further embodiment, steps c) and f) are carried out with the aid of lockable sliding elements of the integration device.

The sliding elements are mounted on the lifting columns and carry the component. The sliding elements allow the component to move in a horizontally arranged plane, which is spanned by a width direction or x-direction and a depth direction or z-direction. This level can also be referred to as the floating level. The sliding elements can be brought from an unblocked state to a blocked state and vice versa. During steps a), b) and f) the sliding elements are in the unblocked state. During steps c), d) and e) the sliding elements are in the blocked state.

According to a further embodiment, in step b) the component is supported by the sliding elements, the sliding elements being moved linearly when the actual position of the component is shifted.

The sliding elements are mounted in a linearly displaceable manner, in particular on the lifting columns. The component is mounted on the sliding elements.

According to a further embodiment, in step b) the decoupling devices shift the actual position of the component in such a way that the actual position is within the tolerance field of the target position of the component.

By closing the clamping devices or solely by the weight of the component in step b), an original incorrect positioning of the component relative to the solid world of, for example, 100 μm to 400 μm translates into a range of 0 μm to 100 μm. This is done with the help of an elastic deformation of the decoupling devices, in particular with the help of an elastic deformation of the joints of the decoupling devices.

According to a further embodiment, a transmission ratio between the fixed world and the component realized by the decoupling devices is used in step b) to shift the actual position of the component.

This allows exact positioning of the component relative to the solid world. As previously mentioned, the geometry of the decoupling devices provides a transmission ratio between the fixed world and the component.

According to a further embodiment, in step b) the component is attached to the solid world with the aid of its weight.

That is, the weight force leads to a positioning of the component in relation to the solid world. Optionally, the clamping devices can also be used.

According to a further embodiment, step b) comprises closing clamping devices in order to connect the component to the solid world.

As previously mentioned, the clamps are optional. Preferably, three clamping devices are provided, which are evenly distributed around a circumference of the component.

According to a further embodiment, the clamping devices are opened after step c).

This means that after the component has been fixed with the aid of the sliding elements in step c), the clamping devices are opened. Then, in step d), the component is lifted off the solid world.

According to a further embodiment, the clamping devices are closed after step e).

According to a particularly preferred embodiment of the method, in which the optional clamping devices are used, the method comprises the steps: a) lowering the component onto a fixed world of the optical system, b) closing clamping devices to bind the component to the fixed world, wherein an actual position of the component is shifted in such a way that the actual position is within a tolerance field of a target position of the component, and wherein decoupling devices for decoupling the component from the solid world are elastically deformed, c) fixing the component in its actual position position, d) opening the clamping devices, e) lifting the component from the fixed world, relaxing the decoupling devices, f) lowering the component onto the fixed world, g) closing the clamping devices, and h) unfixing the component.

Furthermore, an integration device for installing a replaceable component in an optical system is proposed. The integration device includes a lifting system for lowering the component onto a fixed world of the optical system and lifting the component from the fixed world, and slides for supporting the component on the lifting system.

The method explained above is carried out with the aid of the integration device. As mentioned above, the integration device can also be referred to as an installation device or changing device. In addition to the lifting system, the integration device includes the previously mentioned attachment section on which the lifting system is mounted. The sliding elements are slidably mounted on the lifting system.

According to one embodiment, the lifting system comprises a large number of lifting columns, with each lifting column being assigned at least one sliding element.

However, this is not mandatory. For example, three lifting columns are provided. However, the number of lifting columns is arbitrary.

According to a further embodiment, the sliding elements can be brought from an unblocked state into a blocked state and vice versa.

In the unblocked state, the component can be translated with respect to the solid world. In the blocked state, moving the component relative to the solid world is not possible. The component is then fixed.

"A" is not necessarily to be understood as being limited to exactly one element. Rather, a plurality of elements, such as two, three or more, can also be provided. Any other count word used here should also not be understood to mean that there is a restriction to precisely the stated number of elements. Rather, numerical deviations upwards and downwards are possible, unless otherwise stated.

The embodiments and features described for the method correspondingly apply to the proposed integration device and vice versa.

Further possible implementations of the invention also include combinations of features or embodiments described above or below with regard to the exemplary embodiments that are not explicitly mentioned. The person skilled in the art will also add individual aspects as improvements or additions to the respective basic form of the invention.

• 1A zeigt eine schematische Ansicht einer Ausführungsform einer EUV-Lithographieanlage;
• 1B zeigt eine schematische Ansicht einer Ausführungsform einer DUV-Lithographieanlage;
• 2 zeigt eine schematische Ansicht einer Ausführungsform eines optischen Systems für die Lithographieanlage gemäß 1A oder 1B;
• 3 zeigt eine weitere schematische Ansicht des optischen Systems gemäß 2;
• 4 zeigt eine weitere schematische Ansicht des optischen Systems gemäß 2;
• 5 zeigt eine weitere schematische Ansicht des optischen Systems gemäß 2;
• 6 zeigt eine weitere schematische Ansicht des optischen Systems gemäß 2;
• 7 zeigt eine weitere schematische Ansicht des optischen Systems gemäß 2; und
• 8 zeigt ein schematisches Blockdiagramm einer Ausführungsform eines Verfahrens zum Einbau einer Komponente in das optische System gemäß 2.

Further advantageous refinements and aspects of the invention are the subject matter of the dependent claims and of the exemplary embodiments of the invention described below. The invention is explained in more detail below on the basis of preferred embodiments with reference to the enclosed figures.

• 1A shows a schematic view of an embodiment of an EUV lithography system;
• 1B shows a schematic view of an embodiment of a DUV lithography system;
• 2 shows a schematic view of an embodiment of an optical system for the lithography system according to FIG 1A or 1B ;
• 3 shows a further schematic view of the optical system according to FIG 2 ;
• 4 shows a further schematic view of the optical system according to FIG 2 ;
• 5 shows a further schematic view of the optical system according to FIG 2 ;
• 6 shows a further schematic view of the optical system according to FIG 2 ;
• 7 shows a further schematic view of the optical system according to FIG 2 ; and
• 8th FIG. 12 shows a schematic block diagram of an embodiment of a method for installing a component in the optical system according to FIG 2 .

Elements that are the same or have the same function have been provided with the same reference symbols in the figures, unless otherwise stated. Furthermore, it should be noted that the representations in the figures are not necessarily to scale.

1A shows a schematic view of an EUV lithography system 100A, which includes a beam shaping and illumination system 102 and a projection system 104 . EUV stands for “extreme ultraviolet” (Engl .: extreme ultraviolet, EUV) and designates a working light wavelength between 0.1 nm and 30 nm, in particular 13.5 nm each provided in a vacuum housing, not shown, each vacuum housing being evacuated by means of an evacuation device, not shown. The vacuum housings are surrounded by a machine room, not shown, in which drive devices are provided for mechanically moving or adjusting optical elements. Furthermore, electrical controls and the like can also be provided in this machine room.

The EUV lithography system 100A has an EUV light source 106A. A plasma source (or a synchrotron), for example, can be provided as the EUV light source 106A, which emits radiation 108A in the EUV range (extreme ultraviolet range), ie for example in the wavelength range from 5 nm to 20 nm. In the beamforming and illumination system 102, the EUV radiation 108A is collimated and the desired operating wavelength is filtered out of the EUV radiation 108A. The EUV radiation 108A generated by the EUV light source 106A has a relatively low transmissivity through air, which is why the beam guidance spaces in the beam shaping and illumination system 102 and in the projection system 104 are evacuated.

This in 1A The beam shaping and illumination system 102 shown has five mirrors 110, 112, 114, 116, 118. After passing through the beam shaping and illumination system 102 , the EUV radiation 108A is directed onto a photomask (reticle) 120 . The photomask 120 is also designed as a reflective optical element and can be used outside of the systems 102, 104 can be arranged. Furthermore, the EUV radiation 108A can be directed onto the photomask 120 by means of a mirror 122 . The photomask 120 has a structure which is imaged on a wafer 124 or the like in reduced form by means of the projection system 104 .

The projection system 104 (also referred to as a projection lens) has six mirrors M1 to M6 for imaging the photomask 120 onto the wafer 124 . In this case, individual mirrors M1 to M6 of the projection system 104 can be arranged symmetrically to an optical axis 126 of the projection system 104 . It should be noted that the number of mirrors M1 to M6 of the EUV lithography tool 100A is not limited to the illustrated number. More or fewer mirrors M1 to M6 can also be provided. Furthermore, the mirrors M1 to M6 are usually curved on their front side for beam shaping.

1B FIG. 12 shows a schematic view of a DUV lithography system 100B, which comprises a beam shaping and illumination system 102 and a projection system 104. FIG. DUV stands for "deep ultraviolet" (Engl .: deep ultraviolet, DUV) and denotes a wavelength of the working light between 30 nm and 250 nm 1A described - be surrounded by a machine room with appropriate drive devices.

The DUV lithography system 100B has a DUV light source 106B. An ArF excimer laser, for example, can be provided as the DUV light source 106B, which emits radiation 108B in the DUV range at, for example, 193 nm.

This in 1B The beam shaping and illumination system 102 shown directs the DUV radiation 108B onto a photomask 120. The photomask 120 is designed as a transmissive optical element and can be arranged outside of the systems 102, 104. The photomask 120 has a structure which is imaged on a wafer 124 or the like in reduced form by means of the projection system 104 .

The projection system 104 has a plurality of lenses 128 and/or mirrors 130 for imaging the photomask 120 onto the wafer 124 . In this case, individual lenses 128 and/or mirrors 130 of the projection system 104 can be arranged symmetrically to an optical axis 126 of the projection system 104 . It should be noted that the number of lenses 128 and mirrors 130 of the DUV lithography tool 100B is not limited to the number illustrated. More or fewer lenses 128 and/or mirrors 130 can also be provided. Furthermore, the mirrors 130 are typically curved on their front side for beam shaping.

An air gap between the last lens 128 and the wafer 124 can be replaced by a liquid medium 132 having a refractive index>1. The liquid medium 132 can be, for example, ultrapure water. Such a structure is also referred to as immersion lithography and has an increased photolithographic resolution. The medium 132 can also be referred to as an immersion liquid.

2 12 shows a schematic view of an embodiment of an optical system 200. The optical system 200 can be a projection system 104 of an EUV lithography system 100A, as explained above, or part of a projection system 104 of this type. However, the optical system 200 can also be part of a beam shaping and illumination system 102 as explained above. The optical system 200 can also be part of a DUV lithography system 100B.

The optical system 200 comprises a coordinate system with a width direction or x-direction x, a vertical direction or y-direction y and a depth direction or z-direction z. The directions x, y, z are oriented perpendicular to one another.

The optical system 200 includes an interchangeable component or replaceable component 202. The component 202 in turn includes an optical element 204 and a socket 206 in which the optical element 204 is accommodated. The socket 206 is in particular a mirror exchange socket or can be referred to as such. The optical element 204 can be one of the mirrors 110, 112, 114, 116, 118, 120, 130, M1, M2, M3, M4, M5, M6 or one of the lenses 128. The optical element 204 can be circular in top view. However, the optical element 204 can also be oval in plan view. The socket 206 is preferably ring-shaped. The socket 206 can also be circular in plan. A weight force G is assigned to component 202 .

An actual position 208 is assigned to the component 202 or the optical element 204 . In the present case, the actual position 208 is to be understood as the position of the component 202 or of the optical element 204 in a space defined by the directions x, y, z. The component 202 can be accommodated in a housing 210 of the optical system 200 . A fixed world 212 is housed within the housing 210. The fixed world 212 may be a support frame or manipulator frame.

Optional clamping devices 214, 216 are assigned to the fixed world 212, with the aid of which the component 202 can be coupled to the fixed world 212. For this purpose, the clamping devices 214, 216 can engage in the socket 206 in a form-fitting manner. A form-fitting connection is created by the meshing or engaging behind of at least two connection partners, in this case the clamping devices 214, 216 and the socket 206. The 2 however, FIG. 2 shows component 202 in a state where component 202 is not yet coupled to fixed world 212. FIG. That is, the clamping devices 214, 216 are not yet in engagement with the socket 206.

The clamping devices 214, 216 are mounted on the fixed world 212 and can of one in the 2 shown open state can be brought into a closed state. Preferably, three clamping devices 214, 216 are provided, which are distributed evenly around a circumference of the socket 206. That is, the three clamps 214, 216 are placed at an angle of 120° apart from each other.

The component 202 is decoupled from the fixed world 212 by means of decoupling means 218,220. Each decoupling device 218 , 220 includes a first decoupling element 222 associated with the fixed world 212 and a second decoupling element 224 associated with the socket 206 . The second coupling element 224 can also be referred to as an interface. The first decoupling elements 222 can engage in the second decoupling elements 224 . the 2 shows the decoupling devices 218, 220, however, in a state in which the decoupling elements 222, 224 are disengaged.

There are preferably three decoupling devices 218, 220 provided, which are distributed evenly around the circumference of the socket 206. That is, the three decoupling devices 218, 220 are placed at an angle of 120° apart from each other. Each decoupling device 218, 220 is assigned a clamping device 214, 216. The decoupling devices 218, 220 can include flexure joints or be designed as flexure joints.

The decoupling devices 218, 220 ensure that only a small part of the voltages introduced by component tolerances in the course of changing the component 202 breaks through to the optical element 204. This decoupling meets the requirement for a maximum permissible deformation of the optical element 204 only in a limited area. Specifically, the decoupling devices 218, 220 may only be deflected by a maximum of 100 μm as a result of incorrect positioning. From the geometry of the decoupling devices 218, 220, this deflection is translated into an incorrect position of the component 202 of less than 100 μm.

Fixed world 212 has associated with it a target or target position 226 . The component 202 is properly positioned relative to the solid world 212 when the actual position 208 matches the desired position 226 . The actual position 208 can deviate from the target position 226 within a tolerance zone 228 . The tolerance field 228 has a width of 0 μm to 100 μm along the x-direction x and along the z-direction z. As long as the actual position 208 is within the tolerance field 228, a permissible deformation of the optical element 204 is not exceeded. This means that when the component 202 is changed, the objective is that the actual position 208 is within the tolerance zone 228 .

In order to be able to change the component 202 in such a way that the component 202 is aligned relative to the solid world 212 in such a way that the actual position 208 lies within the tolerance field 228, an integration device 300 is provided. The integration device 300 is not part of the optical system 200. The integration device 300 can be mounted on the optical system 200, in particular on the housing 210 of the optical system 200, in order to change the component 202. The integration device 300 can also be referred to as an installation device, assembly device, changing device or replacement device. The integration device 300 can also be referred to as an integration tool.

The integration device 300 includes a mounting portion 302 mounted on the housing 210 . The attachment portion 302 may be ring-shaped. Lifting columns 304 , 306 are provided on the fastening section 302 . The lifting columns 304, 306 form a lifting system 308 of the integration device 300. The lifting system 308 can be moved along the y-direction y in order to deposit the component 202 on the solid world 212. For example, the lift system 308 includes three lift columns 304, 306 placed 120° apart from each other. The lifting system 308 requires a softness along the x-direction x and the z-direction z, which can be deliberately locked and opened. An exemplary implementation is described in more detail below.

A sliding element 310 is assigned to each lifting column 304 , 306 . The slides 310 are between the lifting columns 304, 306 and the component 202 placed. That is, the sliding elements 310 support the component 202. The sliding elements 310 allow a translatory movement of the component 202 along the x-direction x and along the z-direction z as well as a rotational movement about the y-direction y. The sliding elements 310 can also be locked or blocked so that the actual position 208 of the component 202 is frozen.

In order to install the component 202 , it is first received in the integration device 300 . To this end, the component 202 is placed on the sliding elements 310 . The integration device 300 is then connected to the housing 210 .

3 shows the initial installation of the component 202. For this purpose, the component is lowered onto the solid world 212 with the aid of the integration device 300 in such a way that the decoupling elements 222, 224 of the decoupling devices 218, 220 engage in one another. The clamping devices 214, 216 are open. Before being lowered onto the solid world 212, the component 202 is roughly aligned in such a way that the actual position 208 deviates from the target position 226 by a maximum of 100 μm to 400 μm.

4 Figure 12 shows the handover of component 202 to fixed world 212. Decoupling elements 222, 224 are engaged. Due to their geometry, the decoupling devices 218, 220 ensure a transmission ratio between the fixed world 212 and the component 202. By actuating the clamping devices 214, 216, the original incorrect positioning of the component 202 relative to the fixed world 212 of 100 μm to 400 μm is translated into one Range from 0 µm to 100 µm. This is done with the help of an elastic deformation of the decoupling devices 218, 220, in particular with the help of an elastic deformation of the joints of the decoupling devices 218, 220.

However, the deflection of the decoupling devices 218, 220 required for the alignment of the component 202 is not permissible during the operation of the optical system 200. The deformations introduced into the optical element 204 and the stresses in the decoupling devices 218, 220 themselves would be too high, in particular taking into account additional shock loads in the case of operating loads due to the shipping of the optical system 200. In the course of assembling the component 202, the magnitude of the shocks introduced is very small and the deformations of the optical element 204 are also in the elastic range. As a result, the decoupling devices 218, 220 can be loaded to a significantly greater extent than specified from the operating load case.

This transmission ratio of the decoupling devices 218, 220 can be used to position the component 202. After committing component 202 to fixed world 212, clamps 214, 216 may be closed. The sliding elements 310 of the integration device 300 enable a linear movement of the component 202 along the x-direction x and the z-direction z. The movement of the component 202 can be due to the weight G of the component 202 itself or by closing the optional clamping devices 214, 216 and is in the 4 indicated by arrows. The sliding elements 310 thus form a floating plane of the integration device 300, which supports the movement of the component 202 in the x-direction x and in the z-direction z. With the help of the positioning properties of the decoupling devices 218, 220, the target position 226 can be reached. That means the actual position 208 is within the tolerance field 228.

Component 202 is now properly aligned with solid world 212 . That is, the actual position 208 is within the tolerance field 228. However, the decoupling devices 218, 220 are deflected too much, as a result of which the deformation of the optical element 204 is not within the specified specification. In particular, the decoupling devices 218, 220 are braced beyond the range permitted in the operating load case. However, the deformation of the decoupling devices 218, 220 is elastic and therefore reversible.

5 shows the freezing of the position of the component 202. For this purpose, the sliding elements 310 are locked or blocked. This locking is in the 5 illustrated with crosses. As soon as the sliding elements 310 are blocked, movement of the component 202 along the x-direction x and the z-direction z is no longer possible. The actual position 208 is still within the tolerance field 228.

After the sliding elements 310 have been blocked, the optionally previously closed clamping devices 214, 216 are opened again, if necessary, and the component 202 is lifted off the solid world 212 with the aid of the integration device 300, so that the decoupling devices 218, 220, which exceed the permissible extent have been elastically deformed can relax. This relaxation of the decoupling devices 218, 220 is in the 5 indicated by arrows.

6 shows a final placement of the component 202. With the help of the integration device 300 and the sliding elements 310, which are still blocked, the component 202 is placed on the solid world 212 discontinued. The decoupling devices 218, 220 are relaxed and the decoupling elements 222, 224 engage one another. The actual position 208 is within the tolerance zone 228. After discontinuing the component 202, as in the 6 shown, the clamping devices 214, 216 closed again. The actual position 208 remains within the tolerance field 228. As a result, there is no renewed deformation of the decoupling devices 218, 220. Component 202 is now installed by default.

7 shows the dismantling of the integration device 300. For this purpose, the sliding elements 310 are displaced in such a way that it is possible to move the lifting columns 304, 306 past the component 202 upwards. The lifting columns 304, 306 are moved upwards along the y-direction y. The integration device is then disassembled from the housing 210 . The component 202 is now integrated into the optical system 200, the actual position 208 is within the tolerance field 228 and the deformation of the decoupling devices 218, 220 is within the specification established for the operating case.

8th 10 summarizes a schematic block diagram of an embodiment of the previously explained method for installing the component 202 in the optical system 200. In the method, the component 202 is lowered onto the solid world 212 in a step S1. The lowering takes place with the aid of the integration device 300. Then, in an optional step S2, the clamping devices 214, 216 are closed in order to connect the component 202 to the fixed world 212. In step S2, the actual position 208 of the component 202 is shifted with the aid of the decoupling devices 218, 220 such that the actual position 208 is within the tolerance zone 228 of the target position 226 of the component 202. Furthermore, in step S2, the decoupling devices 218, 220 for decoupling the component 202 from the solid world 212 are elastically deformed beyond an extent that is permissible during operation.

In a step S3, the component 202 is fixed in its new actual position 208 with the aid of the blocked sliding elements 310 of the integration device 300. In a step S4, the clamping devices 214, 216 are opened again. With the aid of the integration device 300, the component 202 is again lifted off the solid world 212 in a step S5, the decoupling devices 218, 220 being relaxed during or during the lifting. After the decoupling devices 218, 220 have been relaxed, the component 202 is again lowered onto the solid world 212 in a step S6. In a step S7, the optional clamping devices 214, 216 are closed again. The fixing of the component 202 is canceled again in a final step S8. The integration device 300 is then dismantled.

Although the present invention has been described using exemplary embodiments, it can be modified in many ways.

Reference List

100A

EUV lithography system

100B

DUV lithography system

102

Beam shaping and lighting system

104

projection system

106A

EUV light source

106B

DUV light source

108A

EUV radiation

108B

DUV radiation

110

mirror

112

mirror

114

mirror

116

mirror

118

mirror

120

photomask

122

mirror

124

wafers

126

optical axis

128

lens

130

mirror

132

medium

200

optical system

202

component

204

optical element

206

version

208

actual position

210

housing

212

solid world

214

clamping device

216

clamping device

218

decoupling device

220

decoupling device

222

decoupling element

224

decoupling element

226

target position

228

tolerance field

300

integration device

302

attachment section

304

lifting column

306

lifting column

308

lifting system

310

sliding element

G

weight force

M1

mirror

M2

mirror

M3

mirror

M4

mirror

M5

mirror

M6

mirror

S1

step

S2

step

S3

step

S4

step

S5

step

S6

step

S7

step

S8

step

x

x direction

y

y direction

e.g

z direction

Claims (15)

Method for installing a replaceable component (202) in an optical system (200), with the steps: a) Lowering (S1) the component (202) onto a fixed world (212) of the optical system (200), b) Binding (S2) of the component (202) to the solid world (212), with an actual position (208) of the component (202) being displaced in such a way that the actual position (208) is within a tolerance field (228) a desired position (226) of the component (202), and wherein decoupling devices (218, 220) for decoupling the component (202) from the solid world (212) are elastically deformed, c) Fixing (S3) the component (202) in its actual position (208), d) lifting (S5) the component (202) from the solid world (212), the decoupling devices (218, 220) being relaxed, e) lowering (S6) the component (202) onto the solid world (212), and f) removing (S8) the fixation of the component (202). procedure after claim 1 , wherein steps a), c), d), e) and f) are carried out with the aid of an integration device (300). procedure after claim 2 , wherein before step a) the integration device (300) is mounted on a housing (210) of the optical system (200), and wherein after step f) the integration device (300) is dismantled from the housing (210). procedure after claim 2 or 3 , wherein steps a), d) and e) are carried out with the aid of a lifting system (308) of the integration device (300). Procedure according to one of claims 2 - 4 , Steps c) and f) being carried out with the aid of blockable sliding elements (310) of the integration device (300). procedure after claim 5 , wherein in step b) the component (202) is supported by the sliding elements (310), and wherein the sliding elements (310) are moved linearly when the actual position (208) of the component (202) is shifted. Procedure according to one of Claims 1 - 6 , wherein in step b) the decoupling devices (218, 220) move the actual position (208) of the component (202) in such a way that the actual position (208) is within the tolerance field (228) of the target position (226) of component (202). Procedure according to one of Claims 1 - 7 , wherein in step b) to shift the actual position (208) of the component (202) of the decoupling devices (218, 220) realized transmission ratio between the fixed world (212) and the component (202) is used. Procedure according to one of Claims 1 - 8th , wherein in step b) the component (202) is connected to the solid world (212) with the aid of its weight (G). Procedure according to one of Claims 1 - 9 wherein step b) comprises closing clamps (214, 216) to tether the component (202) to the solid world (212). procedure after claim 10 , wherein after step c) an opening (S4) of the clamping devices (214, 216) is carried out. procedure after claim 11 , wherein after step e) a closing (S7) of the clamping devices (214, 216) is carried out. Having an integration device (300) for installing a replaceable component (202) in an optical system (200). a lifting system (308) for lowering the component (202) onto a fixed world (212) of the optical system (200) and lifting the component (202) from the fixed world (212), and Sliding elements (310) for storing the component (202) on the lifting system (308). integration device Claim 13 , wherein the lifting system (308) comprises a plurality of lifting columns (304, 306), and wherein each lifting column (304, 306) is assigned at least one sliding element (310). integration device Claim 13 or 14 , wherein the sliding elements (310) can be brought from an unblocked state into a blocked state and vice versa.

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