DE102021127700A1 - Additive manufacturing process for producing a three-dimensional object and object produced therewith - Google Patents

Abstract

In an additive manufacturing process for producing a three-dimensional object, a structure of the object is provided in layers, then a conductive, elongate section (14) of a conductor track (16) is applied within a layer and embedded in non-conductive material. At its ends, the section (14) of the conductor track (16) is contacted with conductive, fluid, solidifying material (18). Due to the fact that the non-conductive material is discharged at the same time as the section (14) of the conductor track (16) and the section (14) of the conductor track (16) is encased in the layer and that the contact with the conductive, solidifying material ( 18) a conductive transition to the next layer of the three-dimensional object is provided, an additive manufacturing method for producing a three-dimensional object and an object produced thereafter are created, with which an object with integrated electrical components can be produced with great design freedom and high integration density.

Description

field of invention

The invention relates to an additive manufacturing method for producing a three-dimensional object according to the preamble of claim 1 and a three-dimensional object produced accordingly according to the preamble of claim 10.

definitions

In the context of this application, the term “conductive, elongate section” of a conductor track is understood to mean a conductive solid material such as a wire or another suitable conductive material. Such a conductive solid material is available, for example, in the form of so-called bonding wires as a commodity from the semiconductor industry. They preferably contain at least one of the materials gold, silver, copper, platinum, palladium, aluminum and alloys containing one or more of these metals.

In the context of this application, “sheathing” means embedding the conductive, elongated section like a wire as a conductor track in the one layer of non-conductive material that is removed with the conductor track. The conductor track does not have to be exactly in the middle of the layer for sheathing. Sheathing is also present when the conductor track is "covered" from above, as long as a layer of non-conductive material is maintained as the smallest distance between adjacent conductor tracks.

State of the art

From the patent application on which the preamble of the independent claims is based U.S. 2020/0223213 A1 discloses a method of embedding cables in articles made by an additive manufacturing process. First, a channel is formed into which a conductive element such as a wire is inserted. In the next step, the wire is embedded in the channel. Although this has the advantage that conductive elements of popular diameters can be embedded, on the other hand, adjacent conductor tracks are always spaced apart from one another by the walls of the channels.

From the EP 2 860 021 A1 it is also known to produce conductor tracks drop by drop, for example from appropriate soldering materials.

Summary of the Invention

Proceeding from this prior art, the object of the present invention is to create an additive manufacturing method for manufacturing a three-dimensional object and an object manufactured using it, with which an object with integrated electrical components can be manufactured with great freedom of design and high integration density.

This object is achieved by an additive manufacturing method having the features of claim 1 and by an object having the features of claim 10.

The additive manufacturing process is accomplished by providing a layered build-up of the three-dimensional object in layers, wherein at least one conductive, elongate portion of a conductive trace is made of a solid material such as e.g. B. a wire within a layer. In this case, the section of the conductor track is embedded in non-conductive material and is contacted at least at the ends with conductive, fluid, solidified material. The non-conductive material is deposited at the same time as the section of the conductor track, thereby encasing the section of the conductor track in the layer in one operation. Contact with the solidifying material results in a conductive transition from section to section of the conductor track to the next layer of the three-dimensional object.

In this way, real cable properties are advantageously generated over the section of the conductor track in a single construction level. Depending on the material and in particular when sheathing with soft plastics, there is flexibility in the laying level. The encapsulation in one layer results in a thin structure, which at the same time creates the prerequisite for a high integration density, since the direct encapsulation allows the next conductive path to be arranged directly next to, above or below a encapsulated conductor. In order to contact the conductor sections in different layers with one another, it is only necessary for the ends of the sections to be free so that a connection to the next layer is made possible there via a conductive material, such as in particular solder. This permits a high geometric resolution, since the connection between the individual layers only has to be guaranteed at one point.

Since the properties of hybrid components, in particular from the plastic injection molding process, with regard to climatic influences, adhesion and thermal expansion between the coating matrix of the material and the conductive material of the conductor track are known, a functional object with reliable properties can be produced.

The electrical and climatic (aging) properties from soldering technology are also well known for the connection of the ends of the conductor sections such as the wire ends with a drop of solder, especially in comparison to the use of e.g. two components such as silver ink or conductive plastic as a contact or conductor track material in the case of printable ones Solutions.

Since the conductor section or wire is directly encased in a non-conductive material, similar to printed circuit boards, there is a higher integration density of conductive tracks compared to printed silver ink or conductive plastic, since the encapsulation allows different potentials to be realized directly next to one another. This is also in contrast to FDM-based trace printing, in which a wire is fed in but embedded/insulated between the strands.

The non-conductive material for coating the conductive section is preferably applied in the form of drops which coat the section drop by drop. An even higher integration density of the conductor tracks can advantageously be achieved as a result. Since the wire is encased by "one" row of drops, different potentials can be realized directly next to each other.

The section of the conductor track is preferably removed at the same time as the respective layer of the object is being built up, so that the conductor track can be completely encased in one method step when a layer is being built up. This results in a faster construction with simultaneous electrical integration and insulation of the conductor track.

In a preferred embodiment, the respective layer of the three-dimensional object is oriented relative to a fixed discharge nozzle through which the non-conductive material is discharged, with the wire feed being arranged in a fixed geometric relationship to the discharge nozzle. This advantageously opens up the possibility of arranging the object on a multi-axis construction table in such a way that the construction plane is not identical to the x-y plane of the surrounding coordinate system of the construction space. This allows any mathematical level in the component to be selected, which is built up as a layer. This means that any orientation of wiring levels and component assembly can be achieved in the entire target geometry. A true amorphous three-dimensional integrated device is manufactured.

A further material is preferably discharged as a support or building material through a further discharge nozzle. As a result, the conductive element can advantageously be supplied with encasing, non-conductive material on the one hand, and on the other hand any other materials and/or support materials can be applied simultaneously or with a time delay in order to accelerate the construction progress.

In a preferred embodiment, the diameter of the section of the conductor track is dimensioned so that it is encased in a series of drops, in which the diameter is about 0.2 to 0.5 times a drop diameter. This advantageously allows for reliable encapsulation and electrical insulation.

Sections of different conductor tracks are also preferably arranged in adjacent layers in such a way that they cross one another in a vertical projection and/or are arranged in rows of drops lying next to one another in one layer. This advantageously increases the integration density since, in contrast to other production methods, only the droplet diameter ensures sufficient spacing even of different potentials.

In a preferred exemplary embodiment, solder is used as the conductive, fluid, solidifying material and/or wire is used as a section of the conductor track. Known materials are advantageously used whose interaction with plastic from other areas, such as plastic injection molding, is well known, so that the experience there with regard to dimensioning and design can be used.

In addition, preferably electronic components can be integrated by equipping vacant spaces of the three-dimensional object and electrically connected by making contact with the section of the conductor track. This advantageously makes it possible to integrate any desired electronic components into the three-dimensional object analogous to the encasing conductive element, with SMD components possibly being just a drop of contact in the conductor track level at the end of the wire. Using a drop of solder only for contacting, instead of printing a conductor track with solder, has the advantage that the contacting is known from conventional soldering processes. Problems with interfaces between several drops of solder with regard to conductivity and aging/climate resistance in the plastic do not have an effect and there are also fewer flux residues in the component.

The above-mentioned object is also achieved by the three-dimensional object produced in this way with the features of claim 10, which is produced by an additive manufacturing process. The article has overlying layers and conductive, elongate portions of a conductive trace of a solid material disposed within the three-dimensional article. The sections are embedded by a non-conductive material and are terminally contacted with a conductive material. The sections are encased in non-conductive material which receives and radially surrounds the section of conductive trace. A conductive transition to the next layer of the object is provided at the end of the section of the conductor track. This advantageously results in a high integration density, since the conductor track is arranged in the layer and is already insulated directly when the layer is built up. Due to the sheathing, the next conductor track can already be arranged directly above the previously constructed conductor track in the next layer. At the same time, the transition at the ends of the sections can ensure a high degree of design freedom, since only this transition point from layer to layer is required to produce a three-dimensional object with integrated electrically conductive elements.

Preferably, the article has superimposed layers with rows of abutting beads, the portion of the conductive track being encased by a row of beads of non-conductive material within the layer (12), the beads receiving and radially surrounding the portion of the conductive track. Due to the direct encasing, a high integration density can advantageously be achieved in a very small space in the grid of the droplets.

Preferably, the section of conductor track is sized in diameter to be encased in a series of drops. For this purpose, the diameter of the conductor track is about 0.2 to 0.5 times the diameter of a drop. This advantageously ensures that thin conductor tracks can also be produced by an additive manufacturing process in a very small space, so that there is a high integration density even with objects produced in this way.

In a preferred embodiment, sections of different conductor tracks are also arranged in adjacent layers in such a way that they intersect in a vertical projection and/or are arranged in adjacent rows of drops in one layer. The encapsulation in the row of drops advantageously makes it possible for even conductor tracks with different potentials to be isolated from one another by the non-conductive, encapsulated material in such a way that such an arrangement in the smallest of spaces does not cause any problems. The integration density is therefore higher than with printed silver ink or conductive plastic or even when embedded between strands or in guide channels.

In a preferred exemplary embodiment, an arrangement of electronic components in the three-dimensional object is also possible. This is done by equipping vacant spaces of the three-dimensional object, ie spaces that were previously left free as a vacant lot. The electronic component can be inserted there and then electrically connected by making contact with the sections of the conductor track. Under certain circumstances, it is sufficient for just a drop of solder to connect the connection elements to one another. A three-dimensional object fitted with electronic components can be produced in a very small space using additive manufacturing.

Further advantages result from the dependent claims and the following description of a preferred exemplary embodiment.

character list

• 1 eine dreidimensionale Ansicht einer Vorrichtung zur Herstellung eines dreidimensionalen Gegenstandes durch additive Fertigung von schräg oben,
• 2 eine Darstellung gemäß 1 von schräg unten,
• 2a einen vergrößerten Ausschnitt aus 2,
• 3 einen Abschnitt einer Leiterbahn mit zugehöriger Kontaktierung,
• 4a,4b Beispiele für eine dreidimensionale Führung einer Leiterbahn,
• 5 eine schematische Darstellung einer Ankopplung eines elektronischen Bauteils an eine Leiterbahn,
• 6a, 6b verschiedene Anordnungen einer Leiterbahn innerhalb einer Schicht aus nicht leitfähigem Material, vorzugsweise innerhalb eines Tropfens,
• 7a, 7b eine schematische Darstellung von sich kreuzenden Leiterbahnen in einer dreidimensionalen Darstellung sowie in Draufsicht,
• 8 einen dreidimensionale Darstellung eines Gegenstands mit darin erkennbaren Leiterbahnen.

The invention is explained in more detail below using an exemplary embodiment illustrated in the figures. Show it:

• 1 a three-dimensional view of a device for producing a three-dimensional object by additive manufacturing obliquely from above,
• 2 a representation according to 1 from diagonally below
• 2a an enlarged section 2 ,
• 3 a section of a conductor track with associated contacts,
• 4a , 4b Examples of a three-dimensional routing of a conductor track,
• 5 a schematic representation of a coupling of an electronic component to a conductor track,
• 6a , 6b different configurations of a conductor track within a layer of non-conductive material, preferably within a droplet,
• 7a , 7b a schematic representation of intersecting conductor tracks in a three-dimensional representation and in a plan view,
• 8th a three-dimensional representation of an object with traces recognizable in it.

Description of preferred embodiments

Before the invention is described in detail, it should be pointed out that it is not limited to the respective components of the device and the respective method steps, since these components and methods can vary. The terms used herein are only intended to describe particular embodiments and are not used in a limiting manner. Furthermore, when the singular or indefinite articles are used in the description or in the claims, this also applies to the plural of these elements, unless the overall context clearly indicates otherwise.

The 1 , 2 , 2a show a device for the additive manufacturing of a three-dimensional object. In additive manufacturing, the geometry of a three-dimensional object is broken down into layers and the object is built up layer by layer by adding material (additively). In the exemplary embodiment, this is done by supplying drops. In principle, however, at least partial feeding of strands of material is also possible.

The 1 , 2 , 2a show a construction space 42 in such a device, in which a three-dimensional object 10 is produced on a construction board 38 . In principle, it is also possible to provide an approach for a first layer of a three-dimensional object on the six-axis robot shown in the figures or on a differently equipped construction table. Above the object 10, which is movably arranged in this respect, or its building board 38, there are several discharge units, of which at least two must be provided, namely the discharge unit 34 for the non-conductive material and the solder discharge unit 32. The discharge unit 34 guides the three-dimensional object 10 via the fixed discharge nozzle 22 to non-conductive material. At the same time, a conductive, elongated section 14 of a conductor track 16 comprising a conductive solid material, preferably in the form of a wire, can be fed via the wire feed 24 .

Such a conductive solid material is known, for example, in the form of bonding wires as a commodity from the semiconductor industry. They preferably contain at least one of the materials gold, silver, copper, platinum, palladium, aluminum and alloys containing one or more of these metals. Usual diameters are in the range from 0.01 mm to approx. 0.5 mm. Which wire is preferably used depends on the properties to be achieved, such as electrical conductivity, elasticity/bending strength, solderability with which type of solder or also the wettability with the enveloping insulating material.

Solder is preferably also supplied dropwise via the solder discharge nozzle 36 via the solder discharge unit 32 if this is required to connect or connect sections 14 of the conductor track 16 across layers or other solder connections, for example to electronic components 28, are desired ( 5 ).

In addition, a further discharge unit 26 can be provided, via which a further building material and/or a support material is supplied to the three-dimensional object 10 built up in the building space 42 .

• Zunächst wird ein schichtweiser Aufbau des dreidimensionalen Gegenstandes 10 in Schichten 12 bereitgestellt. Dabei können die Schichten innerhalb des Gegenstands 10 beliebig gewählt werden, was auch eine erhöhte Gestaltungsfreiheit für die Lage der im Gegenstand herzustellenden Leiterbahnen 16 und/oder die Position von elektronischen Bauteilen 28 innerhalb des dreidimensionalen Gegenstandes 10 gestattet. Mit der Drahtzuführung 24 wird ein leitfähiger, langgestreckter Abschnitt 14 einer Leiterbahn 16 aus einem Festkörper-Material, vorzugsweise ein Draht, innerhalb einer Schicht 12 des schichtweisen Aufbaus ausgebracht. Durch die Anordnung der Drahtzuführung in vorzugsweise geometrisch feststehendem Verhältnis zur Austragsdüse 22 der Austragseinheit 34 für das nicht leitfähige Material kann mit dem Ausbringen des leitfähigen Abschnitts 14 ein Einbetten des Abschnitts in das nicht leitfähige Material erfolgen, wie dies z.B. in 3 dargestellt ist.

with the inside 1 , 2 , 2a With the device shown, an additive manufacturing method for manufacturing a three-dimensional object 10 can be carried out as follows:

• First, a layered structure of the three-dimensional object 10 is provided in layers 12 . The layers within the object 10 can be selected as desired, which also allows increased design freedom for the position of the conductor tracks 16 to be produced in the object and/or the position of electronic components 28 within the three-dimensional object 10. With the wire feeder 24, a conductive, elongated portion 14 of a conductor track 16 made of a solid material, preferably a wire, is deposited within a layer 12 of the layered structure. By arranging the wire feed in a preferably geometrically fixed relationship to the discharge nozzle 22 of the discharge unit 34 for the non-conductive material, the section can be embedded in the non-conductive material when the conductive section 14 is removed, as is the case, for example, in 3 is shown.

In 3 the section of a conductor track 16 is shown, with the conductive, elongated section 14 of the conductor track 16 being visible at one end. The conductive portion 14 is within a layer 12 diagrammatically shown in 2a is shown. The section 14 of the conductor track 16 is embedded in non-conductive material. At least at the ends of the section 14 of the conductor track 16 there is terminal contact with conductive, fluid, solidifying material 18. According to the method, at the end there is a section of the conductive section 14, i.e. preferably the wire, which then comes into contact with the conductive, fluid, solidifying material at this point 18, preferably a solder is connected.

In the embodiment of 3 the conductive portion 14 is preferably within drops 20, or rather a row of drops 20, which row of drops is part of a (construction) layer 12 diagrammatically shown in 2a is shown.

The non-conductive material is preferably discharged from the discharge nozzle 22 at the same time as the section 14 of the conductor track 16 and encases the section 14 of the conductor track 16 in the layer 12, so that an image according to FIG 3 or. 6a results. The thickness of a layer preferably corresponds to a droplet diameter or, given a correspondingly dense packing of the spherical droplets, approximately 50% to 66% of a droplet diameter. Such a drop usually has a size of 0.01 to 0.05 mm ³ . The wire to be sheathed as section 14 must be made correspondingly thin so that the sheathing is guaranteed.

As is known in fiber embedding, when manufacturing the three-dimensional object 10, the volume of the supplied conductive trace 16 is taken into account by reducing the volume of non-conductive material, such as the bead 20, contained in 6a , 6b can be seen in section is reduced accordingly. For this purpose, the in situ can be adjusted dynamically. In this way, a cutout with an embedded trace is treated like its own (different, different) material, so that the same layer thickness is created as with the material without embedding.

In tests, a wire with a diameter of 0.1 mm was used, which corresponds to about half a layer thickness. Based on previous experience, this is a value that allows good embedding in a layer.

The non-conductive material for coating the conductive section 14 of the conductor track is preferably applied in the form of drops 20 . In principle, it is also possible to bring out strands, provided this allows the desired direct encasing of the conductive section 14 .

For sheathing, it is not necessary for the conductive, elongated section to be located exactly in the middle of the layer 12 as a conductor track 16, as is the case in 6a is shown. Sheathing is also present if the conductor track according to 6b is “covered” from above, as long as a layer of the non-conductive material is maintained as the smallest distance between adjacent conductor tracks. This layer preferably always has the same height, so that a “single-drop row” is always possible as the smallest distance, preferably in the case of drop-by-drop discharge.

4a and 4b show the arrangement of a conductor track 16, the sections 14 are arranged in superimposed layers. According to the method, the conductive section 14 of the conductor track 16 is encased by the non-conductive material, a conductive transition to the next layer 12 being formed at a predetermined point in the layer by contact with the solidifying material 18 . Thus, the conductor track 16 can be encased within the layers and a transition can also be created between layers lying one on top of the other.

Curved conductor tracks 16 can also be configured in the z-direction. If we call the plane of a layer an xy plane, then in the third dimension, i.e. in the z-direction, a connection between superimposed layers 12 in the z-direction can be formed via the conductive, fluid, solidifying material 18, such as in particular solder . Starting from this point, a conductor track 16 can also be formed in the z-direction or at an angle or even with a curvature in the overlying layers with just a drop of solder. This is illustrated below 7a , 7b , 8th and 9 explained in more detail.

The section 14 of the conductor track 16 is applied at the same time as the respective layer 12 of the object 10 is being built up. The respective layer 12 and thus the three-dimensional object 10 move relative to the stationary discharge nozzle 22, i.e. the layer can also be oriented relative to it become. The non-conductive material is discharged through the discharge nozzle 22 , the wire feed 24 being arranged in a fixed geometric relationship to the discharge nozzle 22 . The arrangement of the object 10 or the construction board 38, e.g can be arranged.

Preferably, another material as a support or building material from the other discharge unit 26 are supplied to the three-dimensional object 10 during construction.

The diameter of the section 14 of the conductor track 16 is preferably dimensioned in such a way that it is encased in a series of drops 20 by the diameter having approximately 0.2 to 0.5 times a drop diameter. With a droplet diameter of 0.1 to 0.3 mm, this corresponds to a diameter of the conductor track 16 of approximately 0.02 to 0.15 mm.

By being encapsulated in a series of drops and thus within a layer 12, sections 12 on different conductor tracks 16 in adjacent layers can preferably be arranged such that they cross in a vertical projection. Likewise, conductor tracks 16 can be arranged in a layer 12 in rows of drops lying next to one another. These traces can also carry a different potential as they are electrically encased by the non-conductive material such as polycarbonate, PA, PES or a similar material that meets the electrical requirements in terms of insulation ability and temperature resistance.

Solder and/or a correspondingly thin wire is preferably used as the conductive, fluid, solidifying material 18 and/or as the section 14 of the conductor track 16 .

Electronic components 28 can also be integrated in the three-dimensional object. This is done by initially leaving, for example, rooms within the layered structure free of construction, i.e. remaining free. Electronic components 28 can be fitted into these gaps and these can then be electrically connected to section 14 of conductor track 16 .

Depending on the component, this connection can only be done with a drop of solder, i.e. with the conductive, fluid, solidifying material. Since these processes are well known from other methods, a reliable, permanent and temperature-stable connection can be ensured within the framework of additive manufacturing.

A corresponding embodiment is in 5 shown. The conductive portion 14 of the trace 16 is encased within the row of drops 20 . The electrical component 28 is inserted/assembled in an unconstructed space, not shown in the drawing. In the embodiment of 5 the electrical component has terminals made of the conductive, solidifying material 18, as a result of which an electrical connection with the conductor track 16 results.

The 7a and 7b show schematically the routing of conductors P1, P2 in a three-dimensional object, with the other parts of the object being removed for better illustration. Starting from the conductive sections 14, the conductor P1 is formed by the conductive, elongate section, which is encased by drops 20 throughout. In the case of conductor P2, on the other hand, the drops 20 in the middle of the figure merge into conductive, fluid, solidifying material 18, such as drops of solder. This means that a connection from layer to layer is formed there over several layers by the conductive, fluid, solidifying material 18 until then in another layer (during the discharge above and/or after the layer discharged in the figure below) again a transition to the drops 20 and the next section of the conductor tracks is created.

As a result, conductor tracks can be placed in an object with the smallest possible distance - equivalent to a high integration density. Conductor tracks of different potentials can also cross in this way.

8th and 9 12 schematically show several layers of a three-dimensional object 10 in two exemplary embodiments. Sections 14 can be seen on the right and left in the top and bottom layers. The conductive, fluid, solidifying material 18 can also be seen approximately in the middle, over which the conductor tracks located in the object and shown in broken lines are routed from the top layer to the bottom layer. In this case, several conductor tracks could also lie directly next to one another, separated only by the drops 20 of the layer embedding them. In the figures, however, in the area of the conductive, fluid, solidifying material 18 there is always a drop 20 spacing from conductor to conductor.

while in 8th the direction of the traces inside the item remains unchanged and they are only offset in height, they will be in 9 additionally pivoted by 90°, with any other pivoting angle being possible. In addition, the conductor tracks in 9 in the lower part on top of each other at different heights. In principle, the conductor tracks could also be arranged directly next to one another.

The three-dimensional object 10 produced in this way using an additive method reveals its production process, at least when the structure is viewed under the microscope. Layers 12 lying one on top of the other can be seen elongated portions 14 of conductive traces 16 are arranged from a solid material such as wire. The conductive section 14 is not only embedded in a non-conductive material, but encased by it, and it can be seen that this is the encapsulation within the layer 12 .

In addition, the conductor track 16 is at least in terminal contact with a conductive material, preferably through the conductive, fluid, solidifying material 18 . A conductive transition to the next layer 12 of the object 10 is provided at least there. In principle, however, such a transition is also possible at a different location of section 14 of conductor track 16 .

Preferably, portion 14 of conductive trace 16 is encased by a series of bead 20 of non-conductive material configured such that a bead 20 receives portion 14 of conductive trace 16 and radially centers away from conductive elongate portion 14 surrounds to the outside.

The layers 12 are produced and formed by rows of drops 20 lying one on top of the other. Superimposed layers 12 of rows of drops 20 can be seen. In the three-dimensional object 10, conductive, elongated sections 14 of the conductor tracks 16 are arranged within the drops and thus also within each layer 12.

Preferably, the non-conductive material is a series of droplets or a strand of material. The diameter of section 14 of conductor track 16, that is to say of the wire, is dimensioned in such a way that it is reliably sheathed in the series of drops 20. In addition, its diameter is about 0.2 to 0.5 times the diameter of a drop.

In the three-dimensional object 10, sections of possibly also different conductor tracks 16 in layers 12 lying on top of one another are arranged, if desired, in such a way that they cross one another in a vertical projection. Similarly, conductor tracks 16 with different potentials can also be arranged in a layer 12 in adjacent rows of drops 20 .

Electronic components 28 can also be integrated in the three-dimensional object 10 , it being evident from the finished object that these have been fitted in unconstructed spaces and have therefore been integrated into the three-dimensional object 10 . The electronic component 28 is electrically connected there via connections made of the conductive, fluid, solidifying material 18 with the conductor track 16 and the section 14 in a contacting manner.

Reference List

10

three-dimensional object

12

layer

14

Section

16

trace

18

conductive solidifying material

20

drops

22

fixed discharge nozzle

24

wire feeder

26

further discharge unit

28

electronic component

30

Six-axis robot

32

solder discharge unit

34

discharge unit

36

solder discharge nozzle

38

build plate

42

installation space

P1, P2

Director

QUOTES INCLUDED IN DESCRIPTION

This list of documents cited by the applicant was generated automatically and is included solely for the better information of the reader. The list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions.

Patent Literature Cited

• US 2020/0223213 A1 [0004]
• EP 2860021 A1 [0005]

Claims (14)

Additive manufacturing method for producing a three-dimensional object (10) with the steps - providing a structure of the three-dimensional object (10) in layers (12), - applying at least one conductive, elongated section (14) of a conductor track (16) made of a solid material within a layer (12), - embedding the section (14) of the conductor track (16) in non-conductive material, - contacting the section (14) of the conductor track (16) at least at the ends with conductive, fluid, solidifying material (18), characterized in that the non-conductive material is deposited simultaneously with the portion (14) of the conductive path (16) thereby substantially encasing the portion (14) of the conductive path (16) in the layer (12) and that by contacting with the conductive, solidifying material (18) is provided a conductive transition to the next layer (12) of the three-dimensional object (10). procedure after claim 1 , characterized in that the non-conductive material for coating the conductive section (14) of the conductor track (16) is discharged in the form of drops (24) which dropwise coat the section. procedure after claim 1 or 2 , characterized in that the removal of the section (14) of the conductor track (16) and its sheathing is carried out simultaneously with the construction of the respective layer (12) of the object (10). Method according to one of the preceding claims, characterized in that the respective layer (12) of the three-dimensional object (10) is oriented relative to the fixed discharge nozzle (22) through which the non-conductive material is discharged, the wire feed (24) in one fixed geometric relationship to the discharge nozzle (22) is arranged. Method according to one of the preceding claims, characterized in that a further material is discharged as a support and/or building material through a further discharge nozzle (26). Method according to one of the preceding claims, characterized in that the diameter of the section (14) of the conductor track (16) is dimensioned in such a way that it is encased in a series of drops (20) by being approximately 0.2 to 0. Has 5 times a drop diameter. Method according to one of the preceding claims, characterized in that sections (12) of different conductor tracks (16) - are arranged in adjacent layers (12) in such a way that they cross in a vertical projection, and/or - in one layer (12) arranged in adjacent rows of drops. Method according to one of the preceding claims, characterized in that solder is used as the conductive, fluid, solidifying material (18) and/or wire is used as the section (14) of the conductor track (16). Method according to one of the preceding claims, characterized in that an electronic component (28) is integrated into the three-dimensional object by equipping vacant spaces of the three-dimensional object (10) and is electrically connected by contacting with the section (14) of the conductor track (16). becomes. Three-dimensional object (10), produced by an additive manufacturing process, with superimposed layers (12), with at least one conductive, elongated section (14) arranged in the three-dimensional object (10) of at least one conductor track (16) made of a solid material, which is is embedded in a non-conductive material and is contact-connected at the ends with a conductive material, characterized in that the section (14) of the conductor track (16) is encased by the non-conductive material within a layer (12) which is designed in such a way that accommodates the section (14) of the conductor track (16) and surrounds it radially, and that a conductive transition to the next layer (12) of the three-dimensional object (10) is provided at least at the end of the section (14) of the conductor track (16). item after claim 10 , characterized in that the superimposed layers (12) have rows of drops (20) lying one on top of the other, the section (14) of the conductor track (16) being encased by a row of drops of the non-conductive material within the layer (12), the Drops (20) absorb the section (14) of the conductor track (16) and surround it radially. item after claim 10 or 11 , characterized in that the diameter of the section (14) of the conductor track (16) is dimensioned such that it is encased in a series of drops (20), the diameter of the section (14) of the conductor track (16) being approximately 0 .2 to 0.5 times the diameter of a drop. item after one of Claims 10 until 12 ,, characterized in that sections (12) of different conductor tracks (16) arranged in adjacent layers (12) intersect in a vertical projection of the object and/or are arranged in adjacent rows of drops in one layer (12). item after one of Claims 10 until 13 , characterized in that an electronic component (28) is integrated into the object by equipping vacant spaces of the three-dimensional object (10) and is electrically connected to the section (14) of the conductor track (16).

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