DE102020213171A1 - X-ray detector module and method of providing an X-ray detector module - Google Patents

Abstract

The invention relates to an X-ray detector module comprising at least one substrate unit (1) with a planar extension and at least two evaluation units (3), each designed to process electrical signals fed in from a coupled converter unit (5), in a stacked arrangement, wherein
- the at least two evaluation units (3) are arranged spaced apart next to one another along a first direction parallel to the planar extent of the substrate unit (1), and
- Electrically conductive connections (7) from at least one of the two evaluation units (3) to the substrate unit (1) are arranged along the first direction between the two evaluation units (3).

Description

The invention relates to an x-ray detector module, an x-ray detector unit comprising an x-ray detector module, an x-ray detector unit, an associated medical imaging device and a method for providing an x-ray detector module.

X-ray detectors are used in many imaging applications. For example, x-ray detectors are used in computer tomographs in medical imaging in order to generate a tomographic x-ray image of an examination area of a patient.

In x-ray imaging, for example in computed tomography (CT), angiography or radiography, counting, directly converting x-ray detector devices or integrating, indirect-converting x-ray detector devices can be used. The X-rays or the photons can be converted into electrical pulses by a suitable converter material in directly-converting X-ray detector devices. For example, CdTe, CZT, CdZnTeSe, CdTeSe, CdMnTe, InP, TlBr2, HgI2, GaAs or others can be used as converter material. The electrical pulses can be evaluated by electronic circuits of an evaluation unit, for example in the form of an integrated circuit (Application Specific Integrated Circuit, ASIC). In counting X-ray detector devices, the incident X-ray radiation can be measured by counting the electrical pulses which are triggered by the absorption of X-ray photons in the converter material. The magnitude of the electrical pulse is also typically proportional to the energy of the absorbed X-ray photon. As a result, spectral information can be extracted by comparing the height of the electrical pulse with a threshold value. The X-rays or the photons can be converted into light in indirect-converting X-ray detector devices by means of a suitable converter material and into electrical pulses by means of optically coupled photodiodes. Scintillators such as GOS (Gd2O2S), CsJ, YGO or LuTAG are often used as converter material. The generated electrical signals are further processed via an evaluation unit having electronic circuits.

In order to enlarge a detection area, a number of hybrids consisting of an evaluation unit and an associated converter unit are often arranged next to one another, in a line or in a matrix. A CT detector can consist, for example, of a large number of hybrids that are lined up at least along the direction of rotation φ. In addition, a row can also be provided along the axis of rotation in order to be able to image a larger examination area at the same time. For efficient use of the dose, it is advantageous to keep non-active spaces within the detection area as small as possible. It can therefore be advantageous for the formation of large-area X-ray detectors to use structural units which can be lined up as closely as possible. However, this may be countered by the need to provide data lines and control lines from and to the evaluation units.

In order to ensure good handling and, moreover, to be able to provide enough space for plugs and a surface for good thermal coupling on the back of a carrier unit, the carrier unit should not be smaller than a certain minimum size. On the other hand, it is advantageous not to produce converter units and evaluation units as individual parts that are too large. It is therefore customary to install a number of evaluation units and/or converter units on a carrier unit.

So-called “Through Silicon Vias” (TSV, dt.: Silicon Durchkontaktierung), in which through-contacts are provided through the silicon substrate of the evaluation unit, can be used to line up as densely as possible along all four sides. However, this can involve complex and expensive manufacturing.

Particularly in the field of directly converting X-ray detectors, it is known to use so-called wire bonds for contacting the evaluation units. Wire bonding technology is an established and cost-effective way of making contact. Here, the evaluation unit of a hybrid protrudes laterally beyond the converter element on at least one edge. These areas are used to connect contact areas of the evaluation units to contact areas on a carrier unit via bonding wires. The disadvantage is that at least at the edge with the bonding wires, additional space is required for the contact areas on the evaluation unit and the carrier unit and for the course of the bonding wire itself. At least in this area, inactive areas in a detection area must therefore be accepted in the event of a possible juxtaposition.

When two hybrids are arranged in combination with a carrier unit, what is known as a back-to-back arrangement is common. The hybrids are arranged on the carrier unit in such a way that the wire bonds along the respective vonei nander remote, outer edge of the evaluation units are arranged. This allows the two hybrids to be arranged with a small distance between the coupled converter units along a first direction and to be lined up just as closely together in a direction orthogonal thereto. However, particularly large inactive areas and, moreover, particularly non-uniform pixel spacings arise disadvantageously if more than two hybrids are to be arranged on a carrier unit or several carrier units are to be arranged next to one another along the first direction.

The object of the invention is to provide an x-ray detector module that allows for cost-effective production and advantageous stackability.

The object is solved by the features of the independent patent claims. Further advantageous and partly inventive embodiments and developments of the invention are set out in the dependent claims and the following description.

The invention relates to an x-ray detector module comprising at least one substrate unit with a two-dimensional extent and at least two evaluation units, each designed to process electrical signals fed in from a coupled converter unit, in a stacked arrangement, the at least two evaluation units being spaced apart along a first direction parallel to the two-dimensional extent of the substrate unit are arranged next to one another, and electrically conductive connections from at least one of the two evaluation units to the substrate unit are arranged along the first direction between the two evaluation units.

A substrate unit, which can be comprised by the X-ray detector module according to the invention, can also be referred to as a carrier unit. Such a substrate unit has an areal extent, i.e. an areal extent. The surface normal of such a substrate unit can preferably run essentially parallel to the direction of incidence of the X-ray radiation, i.e. to the stacking direction. A substrate unit can, for example, comprise glass, ceramic or also a plastic.

A respective evaluation unit, which can be comprised by the x-ray detector module according to the invention, can in particular also have a planar extension. The surface normal of a respective evaluation unit can preferably run essentially parallel to the direction of incidence of the x-ray radiation. An evaluation unit can be designed as an integrated circuit. An evaluation unit can be designed in particular as an application-specific integrated circuit (ASIC).

An evaluation unit, which can be comprised by the X-ray detector module according to the invention, can in particular each comprise a large number of pixel electronics, wherein a respective pixel electronics of the large number of pixel electronics can be designed for pixel-by-pixel processing of the electrical signals fed from the converter unit into a pixel electronics to form a digital pixel measurement signal. This means that such pixel electronics of the multiplicity of pixel electronics can at least be designed to receive an electrical signal from a converter unit coupled to the evaluation unit via at least one signal input and to further process the electrical signal that is fed in, in particular to digitize it, for example by means of an A/D Converter (analog-to-digital converter). The pixel electronics can also have other switching elements, such as a signal amplifier or a comparator.

A respective evaluation unit can be coupled to the converter unit via electrically conductive connections. For example, each of the plurality of pixel electronics of an evaluation unit can each have a signal input which is designed to feed electrical signals from the converter unit into a pixel electronics if the evaluation unit is coupled to the converter unit via electrically conductive connections for signals. The electrically conductive connections between an evaluation unit, i.e. a respective signal input, and a converter unit can be designed, for example, as soldered connections, e.g. so-called bump bonds, as so-called stud bumps, as conductive adhesive connections or else in some other way. As a rule, there is a distance between the evaluation unit and the converter unit which corresponds to the height of the electrically conductive connection formed between them.

A converter unit coupled to such an evaluation unit can be embodied as a directly-converting converter unit comprising a directly-converting converter material. In other configurations, however, the converter unit can also be in the form of an indirect-converting converter unit. In this case, the converter unit can comprise, for example, a scintillator material and a number of photodiodes coupled thereto.

A converter unit, which is coupled to such an evaluation unit, can in particular be two-dimensional. The converter unit can special have a flat extension. The surface normal of the converter unit can preferably run essentially parallel to the operational direction of incidence of the x-ray radiation. A converter unit can also be coupled to a plurality of evaluation units.

A stacked arrangement comprising an evaluation unit and a substrate unit describes that a substrate unit can be provided in a first stacked position and an evaluation unit can be provided in a second stacked position parallel to the first stacked position, the stacking direction of the stacked arrangement running in particular essentially parallel to the operational direction of incidence of the X-ray radiation and the evaluation unit in the stack arrangement faces the operational direction of incidence of the x-ray radiation. A converter unit coupled to an evaluation unit is preferably arranged closest to an x-ray radiation source in the stack arrangement, so that the x-ray radiation in particular impinges directly on the converter unit.

In such a stack arrangement, a substrate unit is mechanically connected to a stacked evaluation unit. An evaluation unit can be mechanically connected to the substrate unit by means of an adhesive connection, for example. In advantageous variants, a substrate unit and a respective evaluation unit are connected in particular in a thermally conductive manner, so that an exchange of heat between the evaluation unit and the substrate unit is advantageously made possible. This can enable effective heat dissipation from the evaluation unit.

In such a stack arrangement, a substrate unit is also electrically conductively connected to a stacked evaluation unit via the electrically conductive connections. At least some of these electrically conductive connections can be provided for transmitting the processed signals from an evaluation unit to the substrate unit. The substrate unit can be designed to forward the processed electrical signals. Furthermore, signals can also be transmitted to the evaluation units via the electrically conductive connections, e.g. a reference voltage, a clock signal or a configuration signal. The substrate unit can have a connection unit, for example a plug. The signals can be transmitted via the substrate unit to a stacked evaluation unit by means of the connection unit, or the signals can be read out and, for example, forwarded to a computing unit of a medical device. Such a connection unit can be arranged, for example, on a side or surface of the substrate unit that faces away from the incident x-ray radiation. The connection unit can be assigned to a plurality of evaluation units, in particular all evaluation units that are assigned to a common substrate unit.

A respective evaluation unit can have contact areas, also called contact pads. The substrate unit can have corresponding contact areas. An electrically conductive connection from an evaluation unit to the substrate unit can in each case electrically conductively connect a contact area on a stacked evaluation unit to a corresponding contact area on the substrate unit and thus enable signal transmission. Electrically conductive connections can then be formed from the contact areas of the substrate unit to any connection unit for forwarding the signals.

The contact areas of a stacked evaluation unit can be arranged on a top side of the evaluation unit, which faces away from the substrate unit and faces the incident x-ray radiation. The contact areas of the evaluation unit are generally arranged on an edge area of the evaluation unit. The edge area can extend, for example, along an edge of the evaluation unit. The edge, also referred to below as the contacting edge, can then extend in particular along a direction parallel to the areal extent of the evaluation unit. The edge area having the contact areas can be left out of a covering of a coupled converter unit. However, there can also be other configurations, in which case the converter unit projects at least partially beyond the contact area.

The corresponding contact areas on the substrate unit can be arranged in particular on a side of the substrate unit which faces the incident x-ray radiation. The contact areas on the substrate unit can be arranged in particular in a surface area of the substrate unit which, in the stacked arrangement, does not overlap with the surface area of a stacked evaluation unit. In the stacked arrangement, the contact areas of the substrate unit are generally in spatial proximity to the contact areas on the evaluation unit and, when the stacked arrangement is present, can be arranged, for example, mirror-symmetrically to the contact areas of the stacked evaluation unit.

The electrically conductive connections can be formed in a particularly simple variant of such a stack arrangement, for example, as bonding wires, ie the electrically conductive connections can by means of a so-called Wirebonding- (English Wirebonding -) be formed technique. However, there can also be other versions of the electrically conductive connections. The use of bonding wires to produce electrically conductive connections between evaluation units and further units of an X-ray detector is well known in the field of technology and represents a well-established method for producing electrically conductive connections.

The x-ray detector module according to the invention has a stack arrangement as described above, with the second stack layer comprising at least two evaluation units. The second stack layer can also include more than two, for example three or four, evaluation units. The at least two evaluation units of the X-ray detector module according to the invention are arranged next to one another in an evaluation plane parallel to the planar extension of the substrate unit. The surface normals of a plurality of evaluation units stacked with a substrate unit can in particular run essentially parallel to one another.

The at least two evaluation units of the x-ray detector module according to the invention are arranged next to one another, in particular along a first direction, which is parallel to the planar extension of the substrate unit. The first direction can, for example, preferably run parallel to an axis of rotation of a computed tomography device if the x-ray detector module is comprised by a computed tomography device. The at least two evaluation units are in particular arranged at a distance from one another, so that a surface area of the substrate unit between the first and the second evaluation unit of the at least two evaluation units is not covered by the first and the second evaluation unit.

According to the invention, electrically conductive connections from at least one of the two evaluation units to the substrate unit are arranged along the first direction between the two evaluation units. This can include only part of a respective electrically conductive connecting line being arranged between the two evaluation units. Another part of a respective electrically conductive connecting line can also run over or parallel to a flat extension of a respective evaluation unit on a side of the evaluation unit facing away from the substrate unit.

Contact areas of that evaluation unit whose electrically conductive connections are arranged between the at least two evaluation units can then be arranged in particular in the edge area of this evaluation unit which is closest to the second evaluation unit along the first direction. The contacting edge of this evaluation unit consequently faces the second evaluation unit and extends along a second direction that is parallel to the planar extent and orthogonal to the first direction. The corresponding contact areas of the substrate unit, which are provided for contacting the at least one evaluation unit of the evaluation units, can be present in particular in the uncovered surface area of the substrate unit between the at least two evaluation units.

The electrically conductive connections from the second evaluation unit of the at least two evaluation units of the X-ray detector module according to the invention to the substrate unit can be arranged on a side of the second evaluation unit which faces away from the first evaluation unit of the at least two evaluation units along the first direction. This means that a contacting edge of the second evaluation unit can face away from the first evaluation unit and can extend on an opposite side of the second evaluation unit along the first direction. However, in one embodiment of the X-ray detector module according to the invention, they can also be arranged between the first and the second evaluation unit. This means that the contacting edge of the second evaluation unit can face the first evaluation unit. In this embodiment, contact areas can be provided both for the first and for the second evaluation unit in the surface area of the substrate unit between the first and the second evaluation unit.

The extent of a distance between two evaluation units on a substrate unit is generally at least dependent on a positioning accuracy, i.e. a necessary assembly distance when the evaluation units are placed relative to one another on the substrate unit. In particular, the dimensions of a distance along the first direction in an arrangement of the evaluation units according to the invention are also dependent on the space requirement of the electrically conductive connections from the at least one evaluation unit to the substrate unit. The space requirement can depend on the type of design of the electrically conductive connections. The space requirement can depend on whether the electrically conductive connections of only one of the evaluation units or of both evaluation units are arranged between the first and the second evaluation unit.

The electrically conductive connections of an X-ray detector module according to the invention can NEN be formed as bonding wires in a particularly simple and inexpensive variant of the X-ray detector module according to the invention. According to another embodiment variant according to the invention, the electrically conductive connections can also be produced, for example, lithographically or by means of a conductor track printing process. According to a further embodiment variant according to the invention, the electrically conductive connections can also be formed, for example, by means of a preformed contacting element. Formation by means of a lithographic method, by means of a conductor track printing method or by means of a preformed contacting element can allow the distances to be optimized and simplified handling or production.

In addition to an arrangement according to the invention of the at least two evaluation units, further evaluation units can also be arranged in a stacked arrangement with the substrate. For example, a third or fourth evaluation unit can be arranged along the first direction in a stacked arrangement with the substrate unit. For example, electrically conductive connections of at least one of the respective adjacent evaluation units can be arranged between the respective adjacent evaluation units between two evaluation units that are arranged next to one another along the first direction.

An arrangement of electrically conductive connections along a second direction that is parallel to the areal extent of the substrate unit and orthogonal to the first direction can advantageously be dispensed with. Provision can be made for further evaluation units to be arranged in a stacked arrangement with the substrate unit along this second direction, which is parallel to the planar extent of the substrate unit and is orthogonal to the first direction, adjacent to the at least two evaluation units. The second direction can, for example, preferably run parallel to a direction of rotation of a computed tomography device if the x-ray detector module is comprised by a computed tomography device. Along such a second direction, a distance between adjacent evaluation units or converter units coupled thereto can only be determined by a mounting distance. A uniformly small distance along the direction of rotation of a computed tomography device is particularly advantageous. A plurality of x-ray detector modules each having a substrate unit can also be lined up in a row along the second direction, advantageously with a small spacing. A distance between two adjacent evaluation units or converter units coupled thereto on two substrate units arranged next to one another can be minimized to any necessary mounting distance.

An arrangement according to the invention enables a plurality of X-ray detector modules according to the invention to be advantageously lined up in a row, i.e. a plurality of substrate units each having at least two evaluation units, along the first direction. In this way, an overall more uniform distribution of the distances and overall even smaller distances between the evaluation units or the converter units coupled thereto and thus the inactive areas within a detection area along the first direction can be achieved. This applies in particular in comparison to X-ray detector modules with at least two evaluation units along the first direction, in which the electrically conductive connections between the evaluation units and an associated carrier unit are each arranged on the outer edges of the evaluation units facing away from one another and not at least partially on the inside between the evaluation units. Although larger distances may be accepted along the first direction due to an at least partially internal arrangement of the electrically conductive connections of at least one evaluation unit between the evaluation units on a substrate unit, in return, distances can be achieved in an area in which two substrate units are lined up next to one another between adjacent evaluation units or converter units coupled thereto. An arrangement of more than two evaluation units along the first direction in a stack arrangement with a substrate unit is also made possible by the inventive intermediate arrangement of the electrically conductive connections with an improved guarantee of uniform distances along the first direction, without having to provide the electrically conductive connections at low cost must be renounced.

Advantageously, a structure according to the invention with electrically conductive connections, which are arranged between the first and the second evaluation arrangement, also compared, for example, to arrangements from the prior art with TSV connections or so-called interposer layers, that the evaluation units can be used over the entire surface and in particularly good thermal Contact, for example by means of a thermally conductive adhesive, can be applied to the substrate unit. This increases the thermal coupling and thus improves possible heat stabilization. Furthermore, the improved mechanical stabilization can make it possible to use thinner evaluation units, ie evaluation units based on thinner wafers, since the evaluation units cover the entire surface without, for example, intervening, punctiform soldered connections, lying on the substrate unit.

Furthermore, the electrically conductive connection, which is at least partially internal, i.e. arranged between two evaluation units, ensures partial protection of the connections against mechanical damage and thus easier handling of the modules.

According to an advantageous embodiment variant, the electrically conductive connections can be formed using a lithographic process.

By means of a lithographic method, conductor tracks can be applied to an evaluation unit or substrate unit, which connect the contact areas on an evaluation unit to the corresponding contact areas on the substrate unit via a side surface of the evaluation unit. In this case, the electrically conductive connections can each extend from the contact areas on a top side of the evaluation unit partially parallel to the areal extension of the evaluation unit along the first direction on the evaluation unit.

Lithographic processes for providing conductor tracks are known in semiconductor and microsystems technology. Advantageously, lithographic methods allow an extremely precise formation of electrically conductive connections. In addition, electrically conductive connections can also be produced over a relatively large area at the same time. Furthermore, the space required for the formation of the electrically conductive connections can be reduced, for example compared to a wire bonding technique. This can affect both the space required for the electrically conductive connections themselves and the space required during the formation of the electrically conductive connections. A lithographic method for forming the electrically conductive connections can consequently allow smaller distances between two evaluation units arranged next to one another or converter units assigned to them on the substrate unit along the first direction.

In the case of a lithographic method, it can be advantageous if the height of an evaluation unit and thus the height that has to be bridged by means of the lithographically applied conductor tracks between the contact areas of the evaluation unit and the contact areas of the substrate unit is not too great. Due to the possibility of applying an evaluation unit to the entire surface of the substrate unit, it is advantageously possible to ensure sufficient stability despite the evaluation unit being less thick.

In contrast to electrically conductive connections which are produced using a wire bonding method, conductor tracks can be applied directly to an evaluation unit using a lithographic method and, in particular, do not protrude significantly from an evaluation unit in the direction of the incident x-ray radiation. This can contribute to simplified handling. In particular, a conductor track which is applied by means of a lithographic method can have a lower height than a distance between an evaluation unit and a converter unit coupled thereto. This can advantageously make it possible for a converter unit coupled to the evaluation unit to protrude partially or completely beyond the area of the evaluation unit in which the contact areas or the conductor tracks of the electrically conductive connections are formed on an evaluation unit. This means that the areal extension of the converter unit can at least partially overlap with the area of the evaluation unit having the contact areas of the evaluation unit or the conductor tracks. In this way, a distance between two converter units assigned to two adjacent evaluation units can advantageously be reduced, so that inactive regions of the detection area can advantageously be reduced.

In an alternative variant, the electrically conductive connections can be formed by means of a conductor track printing process.

A conductor track printing method can in particular include a method of additive manufacturing of conductor tracks. An additive manufacturing process may include a 3D printing process. For example, a so-called surface direct write method can be used for the selective deposition of conductor tracks. Such a method can include, for example, a droplet-based or an extrusion-based method. A surface direct writing method can advantageously enable printing on a 3D surface.

Extrusion-based technologies use positive pressure to meter desired materials. The dispensing material is in the form of a liquid or a paste and is extruded through a small nozzle. Extrusion-based technologies include, for example, so-called robocasting or fused deposition modeling (also known as fused filament fabrication). Droplet-based technologies eject the desired material onto the target substrate in the form of droplets, as opposed to extrusionba based technologies in which a continuous jet is formed. Droplet-based technologies include, for example, inkjet printing (see, for example, DragonFly 2020 from Nano Dimension or Voltera V-One) or aerosol jet printing (see, for example, Aerosol Jet™ process from Optomec). A variety of conductive inks have been developed for effective dispensing, such as metal-based nanoparticle inks, organometallic inks, conductive polymers, carbon nanotubes, graphene oxide, sol-gel, polyelectrolyte inks, and conductive carbon pastes.

In this case, too, an arrangement can be made possible in which a converter unit coupled to the evaluation unit overlaps partially or completely with the area of the evaluation unit in which the contact areas or the conductor tracks are formed. This means that, just as in the case of lithographically produced electrically conductive connections, a converter unit can also be coupled to the evaluation unit here, the two-dimensional extent of which overlaps at least with the area of the evaluation unit having the contact areas.

The formation of electrical conductor tracks using an additive manufacturing process allows rapid production of microelectronic components. In doing so, complex processes such as lithographic masking steps, which can be time consuming and expensive, can be avoided.

A configuration of an X-ray detector module comprising a stacked arrangement with a substrate unit and with only one evaluation unit can also already be advantageous, with the electrically conductive connections between the evaluation unit and the substrate unit being formed by means of a lithographic method or by means of a printed circuit board method, as described above . Such an advantageous stacked arrangement can correspond to a stacked arrangement described above in connection with an X-ray detector module according to the invention, with only at least one evaluation unit being arranged in a stacked arrangement with a substrate unit. The substrate unit, the evaluation unit and a converter unit that can be coupled to the evaluation unit can in particular correspond to a substrate unit, evaluation unit and converter unit already described above. Such a stack arrangement can be comprised by an X-ray detector. An x-ray detector can in particular also include a number of such stacked arrangements. Such an x-ray detector can be included in a medical imaging device, for example a computed tomography device. Such a stacked arrangement can also include a converter unit with a two-dimensional extension, which is coupled to the evaluation unit. The converter unit coupled to the evaluation unit can partially or completely overlap with the area of the evaluation unit in which the contact areas or the electrically conductive connections are formed. This means that the two-dimensional extent of the converter unit can at least overlap with the area of the evaluation unit having the contact areas. Such a stacked arrangement can be produced by providing a substrate unit and then providing at least one evaluation unit in a stacked arrangement with the substrate unit. Furthermore, electrically conductive connections between the evaluation unit and the substrate unit are produced by means of a lithographic method or by means of a conductor track printing method.

The advantages of forming electrically conductive connections by means of a lithographic method or by means of a conductor track printing method, which were described in connection with an X-ray detector module according to the invention comprising at least two evaluation units, can also be transferred to an X-ray detector module with a stacked arrangement with at least one evaluation unit. The execution of electrically conductive connections by means of a lithographic process or by means of a conductor track printing process can enable improved handling of such a stacked arrangement compared to, for example, electrically conductive connections formed by means of a wire bonding process, without the cost-effective provision of the electrically conductive connections dispense. Such a method can also be used to reduce the space required for the electrically conductive connections or for making the connections. Inactive detection areas of a stacked arrangement can be reduced in particular in the case of an overlapping arrangement of the converter unit with the contact areas of the evaluation unit.

According to an embodiment variant of the x-ray detector module according to the invention with at least two evaluation units, the electrically conductive connections can also be formed by means of a preformed contacting element comprising the electrically conductive connections.

A preformed contacting element can, for example, produce all the required electrical connections between an evaluation unit and the substrate unit at the same time. The contacting element, for example, the electrically conductive connections in an electrically insulating material, such as a Plastic or rubber, have in a suitable arrangement. The preformed contacting element can in particular be matched to the arrangement of the contact areas of the evaluation unit and the substrate unit and the present stacked arrangement. The preformed contacting element can in particular have mating contact areas corresponding to the contact areas on the evaluation unit and to the contact areas on the substrate unit. Such a preformed contacting element can be brought into contact with the evaluation unit and the substrate unit, for example by means of friction/pressure (pressing in) and/or by means of a suitable, supporting adhesive connection or other type of contact mass, e.g. indium or by soldering. In particular, the electrically conductive contact areas on the substrate unit or the evaluation unit and the mating contact areas of the contacting element can be electrically conductively contacted. In connection with press-fitting, a mechanically flexible configuration of the preformed contacting element can be advantageous, for example using a mechanically flexible material such as rubber. A preformed contacting element can, for example, be in the form of a multilayer contacting element or can also be produced by means of an additive manufacturing technique.

Advantageously, preformed contacting elements can be produced in advance in a simple manner, in large quantities and at low cost. Furthermore, the introduction of the elements by means of one of the aforementioned methods can also be implemented in a technically simple and inexpensive manner. In addition, the handling of the x-ray detector modules can advantageously be improved, since the electrically conductive connections are present in a fixed relationship to one another within the contact element and the possibility of the electrically conductive connections being impaired or damaged by external influences is reduced. A space requirement for the electrically conductive connections or for producing the electrically conductive connections can advantageously be reduced, in particular in comparison to a wire bonding method.

A preformed contacting element can be designed as a multi-layer contacting element, with the multi-layer contacting element comprising a plurality of contacting layers comprising the electrically conductive connections and insulating intermediate layers, which are lined up along a second direction parallel to the planar extent and orthogonal to the first direction.

In this case, the layers of the multi-layer contacting element can be stacked along the contacting edge, so that the planes of the layers are parallel to the plane which would otherwise be spanned, for example by bonding wires in a wire bonding method. The planes of the contacting layers comprising the electrically conductive connections are designed in such a way that they connect a respective contact area of an evaluation unit to the corresponding contact area on the substrate unit. The contacting layers are each separated by an insulating intermediate layer with a suitable thickness, so that the electrically conductive connections are separate from one another. The thickness of the individual contacting layers and the insulating intermediate layers is such that the sequence of the contacting layers is matched to the existing contact areas on the evaluation unit and the substrate unit. The conductive connections within a contacting layer can be in the form of conductor tracks on a contacting layer. A respective contacting layer can also be designed to be electrically conductive over the whole or part of the surface.

A preformed contacting element in the form of a multilayer contacting element represents an advantageously simple way of providing such a preformed contacting element. There can also be design variants of a preformed contacting element which is produced, for example, by means of an additive manufacturing process.

A configuration of an x-ray detector module comprising a stacked arrangement with a substrate unit and with only one evaluation unit can also already be advantageous, with the electrically conductive connections between the evaluation unit and the substrate unit being formed by means of a preformed contacting element, as described above. Such an advantageous stacked arrangement can essentially correspond to a stacked arrangement described above in connection with an X-ray detector module according to the invention, with only at least one evaluation unit being arranged in a stacked arrangement with a substrate unit. The substrate unit, the evaluation unit and a converter unit that can be coupled to the evaluation unit can in particular correspond to a substrate unit, evaluation unit and converter unit already described above. Such an evaluation unit can have contact areas on a top side of the evaluation unit, which is arranged in the stack arrangement facing away from the substrate unit. The contact areas can be arranged in particular along an edge area of an evaluation unit and along an edge, ie the contacting edge, of the evaluation unit. The means of the preformed contacting element Provided electrically conductive connections can be formed from the contact areas of the evaluation unit to corresponding contact areas on the substrate unit. The contact areas of the substrate unit can be arranged in particular on a top side of the substrate unit which faces the evaluation unit in the stacked arrangement and in an area of the substrate unit which is not covered by the evaluation unit. Such a stacked arrangement can also include a converter unit with a two-dimensional extension, which is coupled to the evaluation unit. Such a stack arrangement can be comprised by an X-ray detector. An x-ray detector can in particular include a number of such stacked arrangements. Such an x-ray detector can be included in a medical imaging device, for example a computed tomography device. The advantages of forming electrically conductive connections using a preformed contacting element, which were described in connection with an inventive X-ray detector module comprising at least two evaluation units, can also be transferred to an X-ray detector module with a stacked arrangement with at least one evaluation unit. Advantageously, preformed contacting elements can be produced in advance in a simple manner, in large quantities and at low cost. Furthermore, the introduction of the elements by means of one of the aforementioned methods can also be implemented in a technically simple and inexpensive manner. Advantageously, the handling of the x-ray detector modules can be improved and the space required for the electrically conductive connections or for producing the electrically conductive connections can be reduced, in particular in comparison to a wire bonding method. Such a stacked arrangement with a contacting element can be produced by providing a substrate unit and then providing at least one evaluation unit in a stacked arrangement with the substrate unit. Furthermore, electrically conductive connections are produced by bringing a preformed contacting element comprising the electrically conductive connections into contact with at least the first evaluation unit and the substrate unit. Before connecting, the manufacturing step can consequently include the provision of a preformed contacting element. An electrical contact between the preformed contacting element can be produced, for example, mechanically (for example by means of pressure), by means of a conductive adhesive connection or some other contact compound, for example based on indium, or by a soldered connection. In particular, the contact areas of an evaluation unit or the substrate unit can be brought into electrically conductive contact with mating contact areas of the contacting element.

According to an embodiment variant of the x-ray detector module according to the invention with at least two evaluation units, the electrically conductive connections from both evaluation units to the substrate unit are arranged along the first direction between the two evaluation units.

A central arrangement of the electrically conductive connections and thus also of the contact areas on the substrate unit can advantageously simplify forwarding of the signals through conductor tracks in the substrate unit to a common switching unit. Furthermore, it can be achieved that partial areas of the substrate unit, which for example lie below an evaluation unit, do not have to be used for forwarding signals to a switching unit and are therefore free for an improved thermal coupling of the evaluation unit.

Furthermore, the internal arrangement of the contacts and electrically conductive connections of both evaluation units provides improved protection against mechanical influences when handling the x-ray detector modules.

An arrangement of the electrically conductive connections between the at least two evaluation units of the x-ray detector module can be achieved particularly advantageously by providing the electrically conductive connections using a lithographic method, a printed circuit board method or with a preformed contacting element. The fact that there must be sufficient space available for placing the bonding wires can stand in the way of a wire bonding method. However, as soon as a second evaluation unit is placed along the first direction, this can adversely affect desirable short distances between the evaluation units. Advantageously, by providing the electrically conductive connections by means of a lithographic process, a conductor track printing process or with a preformed contacting element, internal contacting between the two evaluation units can be achieved, with at the same time advantageously smaller distances between the evaluation units and thus also between the associated converter units can be guaranteed.

Even with such an internal arrangement of the electrically conductive connections of both evaluation units, a comparatively more uniform distribution of the distances between the evaluation units or the assigned Kon transfer units can be reached along the first direction in total. Advantageously, it can be avoided that the distance for the arrangement of the electrically conductive connections and the distance between two substrate units meet at one point within a detection area. In particular, the distances can be optimized independently of one another. In particular when two substrate units are arranged in a row, a particularly disadvantageous larger distance in a center of the detection area, ie an image center, can be avoided, which under certain circumstances could lead to image artifacts.

According to a variant of this, the electrically conductive connections of the two evaluation units are arranged interlocked, so that in each case an electrically conductive connection of a first of the two evaluation units along a second direction parallel to the planar extent and orthogonal to the first direction is at least partially between two electrically conductive connections the second of the two evaluation units is arranged.

A distance between two evaluation units and thus also between two associated converter units can advantageously be further reduced.

Furthermore, in a design variant of an internal arrangement of the electrically conductive connections, at least some of the electrically conductive connections of the first and the second evaluation unit of the two evaluation units can be electrically conductively connected to one another.

For example, by means of a suitable, for example partially symmetrical, arrangement of the signals to be supplied and removed to and from the evaluation units and the associated contacts on the evaluation units, it can be achieved that interconnectable connections of both evaluation units are opposite one another and are operated with a common electrically conductive connection to the substrate unit be able. For example, a contact area of the first and a contact area of the second evaluation unit are electrically conductively connected to a common contact area on the substrate unit. In addition to interconnected connections, there are usually also non-interconnected connections. Interconnectable connections can include, for example, a ground signal, a reference voltage, a clock signal or a configuration signal. In particular, this configuration is advantageous for connections that are generally implemented redundantly, for example for supply/ground connections. This can also be advantageously possible with differential clock signals.

A space requirement can advantageously be reduced and the complexity can be reduced.

In a design variant of the X-ray detector module according to the invention, evaluation units are also arranged in a stack arrangement with the substrate unit along a second direction parallel to the two-dimensional extent and orthogonal to the first direction. A larger detection area can advantageously be achieved in the direction of the second direction. Particularly small distances between two evaluation units or converter units assigned to them can then be achieved along the second direction, which are only dependent on a positioning accuracy or a mounting distance between two evaluation units on a substrate unit. It is also conceivable for a converter unit to be assigned to a plurality of evaluation units along the second direction, so that inactive surface areas can be avoided. In an arrangement of such an x-ray detector module in a computed tomography device, the second direction can correspond in particular to the direction of rotation. For the highest possible image quality, it is particularly advantageous to avoid inactive areas within a detection area, in particular along the direction of rotation.

The invention also relates to an x-ray detector unit comprising at least two x-ray detector modules according to one of the embodiment variants described above, which are arranged next to one another along the first direction. In particular, the x-ray detector modules include converter units coupled to the evaluation units. Advantageously, the x-ray detector modules designed according to the invention can be used to achieve a particularly uniform distribution of distances and possibly smaller distances overall between adjacent evaluation units or converter units assigned to them along the first direction.

In an advantageous variant, the distance between two converter units, which are assigned to two adjacent evaluation units along the first direction on two different substrate units arranged next to one another, is at most four times, preferably at most twice, the distance between two converter elements, which are two along the first direction are assigned to adjacent evaluation units on the same substrate unit.

All design variants that are described above in connection with the x-ray detector module according to the invention can also be implemented accordingly in the x-ray detector unit. The description made with regard to the x-ray detector module and the advantages described above can accordingly also be transferred to the x-ray detector unit.

The invention also relates to a medical imaging device comprising at least one x-ray detector module according to the invention or an x-ray detector unit according to the invention and an x-ray source arranged opposite thereto.

For recording an x-ray image data record, the object to be imaged can be placed between the x-ray source and the x-ray detector module or the x-ray detector unit and irradiated by the x-ray source.

In particular, the medical imaging device can be embodied as a computed tomography device. The medical imaging device can also be designed as a SPECT or PET system. However, it can also be designed, for example, as a C-arm X-ray device and/or Dyna-CT or else in some other way.

All design variants that are described above in connection with the x-ray detector module according to the invention or the x-ray detector unit can also be implemented accordingly in the medical imaging device. The description made with regard to the x-ray detector module or the x-ray detector unit and the advantages described above can also be transferred accordingly to the medical imaging device according to the invention.

• - Bereitstellen einer Substrateinheit mit einer flächigen Ausdehnung,
• - Bereitstellen zumindest einer ersten Auswerteeinheit in Stapelanordnung mit der Substrateinheit,
• - Bereitstellen einer zweiten Auswerteeinheit in Stapelanordnung mit der Substrateinheit, wobei die erste und die zweite Auswerteeinheit entlang einer ersten Richtung parallel zur flächigen Ausdehnung der Substrateinheit beabstandet nebeneinander angeordnet sind,
• - Herstellen elektrisch leitender Verbindungen zwischen zumindest der ersten Auswerteeinheit und der Substrateinheit, so dass bei Bereitstellung des Röntgendetektormoduls elektrisch leitende Verbindungen von zumindest einer der zwei Auswerteeinheiten zu der Substrateinheit entlang der ersten Richtung zwischen den zwei Auswerteeinheiten angeordnet sind.

The invention also relates to a method for providing an x-ray detector module according to the invention and the embodiment variants described above. The procedure includes the steps

• - providing a substrate unit with a two-dimensional extent,
• - providing at least one first evaluation unit in a stack arrangement with the substrate unit,
• - providing a second evaluation unit in a stacked arrangement with the substrate unit, the first and the second evaluation unit being arranged next to one another at a distance along a first direction parallel to the areal extent of the substrate unit,
• - Establishing electrically conductive connections between at least the first evaluation unit and the substrate unit, so that when the X-ray detector module is provided, electrically conductive connections are arranged from at least one of the two evaluation units to the substrate unit along the first direction between the two evaluation units.

The step of producing electrically conductive connections can be based on a wire bonding method, on a lithographic method, on a conductor track printing method or on contacting by means of a preformed contacting element.

The method can also include the step of producing electrically conductive connections between the second evaluation unit and the substrate unit.

The method can also include the step of applying a converter unit to the first and/or the second evaluation unit. Alternatively, a converter unit can already be mounted on the evaluation unit when the first and/or second evaluation unit is provided.

In addition to the first and the second evaluation unit, the method can also include providing further evaluation units along the first direction in a stacked arrangement with the substrate unit.

An x-ray detector module according to the invention can advantageously be provided. Such an x-ray detector module can advantageously be used in an x-ray detector unit according to the invention.

According to a variant of the method, the step of producing the electrically conductive connections between at least the first evaluation unit and the substrate unit takes place before the step of providing the second evaluation unit.

This variant of the method includes a sequential application of the evaluation units or the electrically conductive connections, with only the electrically conductive connections of the first evaluation unit being arranged between the first and the second evaluation unit. This means that the first evaluation unit is first applied along the first direction, which is then electrically conductively connected to the substrate unit. This is followed by the provision of the second evaluation unit in the stack arrangement along the first direction next to the first evaluation unit, which in turn is then connected to the sub strat unit can be electrically connected.

The sequential arrangement and connection of the evaluation units along the first direction makes it possible to use a wire bonding method while maintaining the smallest possible distances between the evaluation units and the converter units coupled thereto. In a wire bonding method, in which the electrically conductive connections are arranged at an edge region of the first evaluation unit on one side along the first direction, more space is required for placing the connections, i.e. for forming the connections, than the connections themselves, if they are trained is needed. By arranging the second evaluation unit along the first direction after the first is already electrically conductively connected, a distance can advantageously be minimized.

According to an alternative embodiment, the step of producing the electrically conductive connections between at least the first evaluation unit and the substrate unit takes place after the step of providing the second evaluation unit.

In this variant of the method, the at least two evaluation units are first placed next to one another along the first direction in a stacked arrangement with respect to the substrate unit before an electrically conductive connection is made, ie before the electrically conductive connections are established between an evaluation unit and the substrate unit. In a subsequent step, the electrically conductive connections are established by at least one evaluation unit. In a further step or at the same time, the electrically conductive connections can be established between the second evaluation unit and the substrate unit.

This variant of the method can be implemented particularly advantageously in combination with a lithographic method, a conductor track printing method or a preformed contact element, since small distances between the evaluation units or the converter elements coupled thereto along the first direction can advantageously be implemented here, even with subsequent contacting.

According to a method variant thereof, in the step of producing the electrically conductive connections, electrically conductive connections are produced simultaneously between the first evaluation unit and the substrate unit and the second evaluation unit and the substrate unit. A process can advantageously be accelerated.

According to a variant of the method, the step of producing the electrically conductive connections is based on a lithographic method.

Lithographic processes for providing conductor tracks are known in semiconductor and microsystems technology. A lithographic method can include, for example, the application of a lithographic resist layer to the at least one evaluation unit or to both evaluation units and the substrate. A lithographic method can also include exposing the lithographic resist layer with a suitable exposure mask, which is matched to the electrically conductive connections to be formed between a respective evaluation unit and the substrate unit. A lithographic process may further include developing the lithographic resist layer to provide a pre-pattern, i.e. the lithographic mask, for forming the electrically conductive connections. The exposed (when using a positive resist) or alternatively the unexposed (when using a negative resist) areas of the lithographic resist layer are dissolved. A lithographic method may further include depositing a conductive metal into the pre-structure, for example by means of a physical vapor deposition method, so that electrically conductive connections are formed. A lithographic method can include dissolving the preliminary structure, for example by means of a wet-chemical method.

In a lithographic method, in advantageous embodiment variants, the electrically conductive connections are produced in particular before the associated converter units are coupled to an evaluation unit, which is to be electrically conductively connected to the substrate by means of the electrical lines.

For example, all electrically conductive connections of an evaluation unit are made at the same time. The electrically conductive connections of a plurality of evaluation units, which are arranged along the first direction, can also be established at the same time.

According to a variant of the method, the production step is based on a conductor track printing method.

For example, the manufacturing step may include a so-called surface direct write method. For example, the conductor track printing method can be based on an ink jet printing method or on an aerosol jet printing method. It can also be another additive manufacturing process Conductor tracks are used, by means of which a vertical difference in height between contact areas on the evaluation unit and the substrate unit can be bridged.

According to one embodiment, the manufacturing step includes connecting a preformed contacting element to at least the first evaluation unit and the substrate unit. Before connecting, the manufacturing step can consequently include the provision of a preformed contacting element. An electrical contact can be produced between the preformed contacting element, for example, mechanically (e.g. by means of pressure), by means of a conductive adhesive connection or other contact mass, e.g. based on indium, or by a soldered connection. In the case of a soldered connection, a reflow soldering process can also bring about a robust and/or optimized alignment of the contacting element and its position relative to the contact areas.

Furthermore, in combination with these methods, compared to a wire bonding method, it is particularly advantageous to produce the electrically conductive connections, with the electrically conductive connections of both evaluation units being arranged between the first and the second evaluation unit.

The method can also include arranging further evaluation units in a stack arrangement with the substrate unit along a second direction that is parallel to the two-dimensional extent and orthogonal to the first direction.

The evaluation units, which are arranged along the second direction, can be arranged before the electrically conductive connections are established. They can also be arranged after the electrically conductive connections have been established. Electrically conductive connections can be established simultaneously for a plurality of evaluation units which are arranged along the second direction.

Within the scope of the invention, features that are described in relation to different embodiments of the invention and/or different claim categories (method, use, device, system, arrangement, etc.) can also be combined to form further embodiments of the invention. For example, a claim relating to a device can also be developed with features that are described or claimed in connection with a method, and vice versa. Functional features of a method can be implemented, for example, by correspondingly designed physical components. In addition to the embodiments of the invention that are expressly described in this application, a wide variety of other embodiments of the invention are conceivable, which a person skilled in the art can arrive at without departing from the scope of the invention, which is defined by the claims.

The use of the indefinite article "a" or "an" does not rule out the possibility that the characteristic in question can also be present more than once. The use of the term "have" does not exclude that the terms linked by the term "have" can be identical. For example, the medical imaging device includes the medical imaging device. The use of the term "unit" does not exclude that the item to which the term "unit" refers may have multiple components that are spatially separated from each other.

In the context of the present application, the expression “based on” can be understood in particular in the sense of the expression “using”. In particular, a wording according to which a first feature is generated based on a second feature (alternatively: ascertained, determined, etc.) does not preclude the first feature being generated (alternatively: ascertained, determined etc.) based on a third feature can.

• 1 eine beispielhafte Ausbildung eines Röntgendetektormoduls aus dem Stand der Technik,
• 2 eine schematische Darstellung einer Ausbildung eines erfindungsgemäßen Röntgendetektormoduls,
• 3 eine schematische Darstellung eines Ausschnitts einer Röntgendetektoreinheit mit zumindest zwei erfindungsgemäßen Röntgendetektormodulen,
• 4 eine schematische Darstellung einer Stapelanordnung umfassend ein Substrat und eine Auswerteeinheit mit mittels eines lithographischen Verfahrens hergestellten elektrisch leitenden Verbindungen,
• 5 eine schematische Darstellung einer Stapelanordnung umfassend ein Substrat und eine Auswerteeinheit mit einem vorgefertigten Kontaktierungselement,
• 6. eine schematische Schnittansicht durch einen vorgefertigtes Kontaktierungselements in einer ersten Ausführungsvariante zur Anordnung auf einer Auswerteinheit,
• 7 eine schematische Schnittansicht durch einen vorgefertigtes Kontaktierungselements in einer zweiten Ausführungsvariante zur Anordnung auf einer Auswerteinheit,
• 8 eine alternative Schnittansicht durch ein vorgefertigtes Kontaktierungselements gemäß der zweiten Ausführungsvariante,
• 9 bis 11 schematische Aufsichtsdarstellungen erfindungsgemäßer Röntgendetektormodule zur Veranschaulichung der Anordnung der elektrisch leitenden Verbindungen gemäß verschiedener Ausführungsvarianten,
• 12 bis 13 schematische Schnittdarstellungen erfindungsgemäßer Röntgendetektormodule in weiteren Ausführungsvarianten,
• 14 bis 16 schematische Verfahrensabläufe zur Bereitstellung eines Röntgendetektormoduls in unterschiedlichen Ausführungsvarianten, und
• 17 eine schematische Darstellung eines medizinischen Bildgebungsgeräts.

The invention is explained below using exemplary embodiments with reference to the attached figures. The representation in the figures is schematic, greatly simplified and not necessarily true to scale. The same reference symbols are used for the same features in different figures. Show it:

• 1 an exemplary embodiment of an x-ray detector module from the prior art,
• 2 a schematic representation of an embodiment of an X-ray detector module according to the invention,
• 3 a schematic representation of a section of an x-ray detector unit with at least two x-ray detector modules according to the invention,
• 4 a schematic representation of a stack arrangement comprising a substrate and an evaluation unit with electrically conductive connections produced by means of a lithographic method,
• 5 a schematic representation of a stack arrangement comprising a substrate and an evaluation unit with a prefabricated contacting element,
• 6 . a schematic sectional view through a prefabricated contacting element in a first embodiment for arrangement on an evaluation unit,
• 7 a schematic sectional view through a prefabricated contacting element in a second embodiment for arrangement on an evaluation unit,
• 8th an alternative sectional view through a prefabricated contacting element according to the second embodiment,
• 9 until 11 schematic top views of X-ray detector modules according to the invention to illustrate the arrangement of the electrically conductive connections according to different embodiment variants,
• 12 until 13 schematic sectional views of X-ray detector modules according to the invention in further variants,
• 14 until 16 schematic process sequences for providing an X-ray detector module in different design variants, and
• 17 a schematic representation of a medical imaging device.

1 12 shows an exemplary sectional view of a module from the prior art. The module shown here comprises a substrate 11 and, in a stack arrangement thereto, at least two evaluation units 13 along a first direction, here along a z-axis, which are each coupled to a converter element 15 . An evaluation unit with a converter unit is also referred to below as a hybrid. A distance p0 is intended to designate an average pixel distance within a hybrid.

A respective hybrid is connected to the substrate 11 along an edge of a respective evaluation unit 11 via electrically conductive connections 17 . The electrically conductive connections 17 are designed as wire bond connections.

The hybrids are arranged on the substrate 11 in such a way that the electrically conductive connections 17 are arranged along the outer edge of the evaluation units 13 facing away from one another along the first direction. This allows the hybrids to be arranged with a small distance C between the coupled converter units 15, which essentially corresponds to a mounting distance, and thus possibly also a small pixel distance p1 between the pixels on two hybrids arranged next to one another on a substrate 11.

However, a disadvantage of such a design of a module, particularly when several substrates 11, i.e. several modules, are lined up in a row along the first direction is that the space requirement A of the electrically conductive connections 17 and the associated contact areas is now on the respective outer areas of the substrates 11 Evaluation unit 13 and substrate 11 and a mounting distance B meet and thus in this area there is a particularly large inactive area 2A+B in the detection area and a large distance p2 between two pixels on two substrates arranged next to one another.

In X-ray detectors, it is advantageous for efficient dose utilization that the non-active spaces between the pixels are as small as possible in comparison to the active area of the individual pixels. In addition, a uniform pixel arrangement, i.e. pixel spacing that is as uniform as possible, is also advantageous for a four-sided line-up. However, this can only be inadequately fulfilled by an arrangement described above.

An alternative arrangement, in which the substrate of a module has only one evaluation unit 13 along the first direction, leads to a smaller inactive area of width A+B (instead of the above 2A+B) when modules are arranged in a row. The disadvantage, however, is that this doubles the number of substrates 11 and thus also the number of plug-in connections required for conducting electrical signals from or to the substrate 11 . Furthermore, less space is available for such a plug connection and significantly less space for a thermal connection of the evaluation units 13.

2 shows a schematic sectional view of an embodiment of an X-ray detector module according to the invention.

The X-ray detector module comprises at least one substrate unit 1 with a planar extension and at least two evaluation units 3, each designed to process electrical signals fed in from a coupled converter unit 5, in a stacked arrangement.

The at least two evaluation units 3 are arranged spaced apart next to one another along a first direction parallel to the planar extent of the substrate unit 1 . Furthermore, electrically conductive connections 7 from at least one of the two evaluation units 3 to the substrate unit 1 are arranged along the first direction between the two evaluation units 3 . The electrically conductive connections 7 are separated from contact areas (in 2 not shown) on a top of the ejector teeinheit 3 formed to contact areas on the substrate unit 1 (in 2 Not shown). In this case, the contact areas of the substrate unit 1 are arranged between the at least two evaluation units 3 . The contact areas are arranged along the contacting edge of the evaluation unit 3 and essentially symmetrically to the contact areas of the evaluation unit 3 .

The X-ray detector module shown also includes a connection unit 21, for example a plug, which is arranged on a side or surface of the substrate unit 1 facing away from the evaluation units 3. Such a connection unit 21 can be used to transmit signals to evaluation units 1 of an x-ray detector module or to read the signals from evaluation units 3 of the x-ray detector module and forward them to a computing unit 45 of a medical device 32 , for example.

In the variant shown, the electrically conductive connections 7 are indicated as electrically conductive connections which are produced by means of a wire bonding method. In alternative embodiments according to the invention, the electrically conductive connections 7 can also be formed by means of a lithographic process or by means of a conductor track printing process. In a further variant according to the invention, the electrically conductive connections 7 can be formed by means of a preformed contacting element 9 including the electrically conductive connections 7 .

In the embodiment variant shown, the electrically conductive connections 7 of the second evaluation unit 3 to the substrate unit 1 are arranged on a side of the second evaluation unit 3 which faces away from the first evaluation unit 3 along the first direction. This means that in the embodiment variant shown, only the electrically conductive connections 7 of one of the at least two evaluation units 3 are arranged between the two evaluation units 3 . In alternative configurations, the electrically conductive connections of the second evaluation unit 3 can also be arranged between the evaluation units 3 .

In the embodiment shown, a distance between the two evaluation units 3 is correspondingly dependent on the space required for the electrically conductive connections 7 from the first evaluation unit 3 to the substrate unit 1 and possibly an additional mounting distance. The achievable distance A between the two converter units 5 coupled to the evaluation units 3 and thus also a pixel distance p4 between two pixels of hybrids arranged next to one another is generally greater than a distance C or a pixel distance p1 in the variant shown 1 . However, such an inventive x-ray detector module allows x-ray detector modules to be lined up better along the first direction with more uniform pixel spacing. In addition, easier handling can be achieved, for example, by arranging electrically conductive connections at least partially on the inside.

Furthermore, an X-ray detector module according to the invention can also have a third evaluation unit 3 in a stack arrangement with the substrate unit 1, which is arranged along the first direction next to the first and second evaluation unit 3, with electrically conductive connections 7 between the second and the third evaluation unit 3 of at least one of the adjacent evaluation units 3 are formed. In a further development of the in 2 shown variant with a third evaluation unit 3 would be at least the electrically conductive connections 7 of a central, second evaluation unit 3 between the second and the third evaluation unit 3 arranged. Such a design can advantageously ensure uniform distances between two converter units 5, which are assigned to two adjacent evaluation units 3 along the first direction on the same substrate unit 1. This can, however, with a back-to-back arrangement according to the 1 cannot be reached. An X-ray detector module according to the invention also allows evaluation units 3 to be lined up in a row along the first direction, without having to forego the cost-effective provision of the electrically conductive connections.

3 shows a schematic sectional view of a section of an x-ray detector unit according to the invention with at least two x-ray detector modules which are arranged next to one another along the first direction to illustrate the more uniform distances that can be achieved.

The distance between two converter units 5, which are assigned to two adjacent evaluation units 3 along the first direction on two different substrate units 1 arranged next to one another, comprises a distance A+B (with a mounting distance B between two substrate units 1 and the distance A, which provides the space required for reflecting the electrically conductive connections 7 from the evaluation unit 3 to the substrate unit 1). In contrast, in areas in which two substrates 11 in an embodiment according to 1 collide, a significantly larger distance 2A+B before.

Although there may be a larger distance A (compared to a distance C in 1 ) between two converter units 5, which are assigned to two adjacent evaluation units 3 along the first direction on the same substrate unit 1, however, by means of the X-ray modules according to the invention, a much more uniform distribution of the size of the distances between two converter units 1 adjacent along the first direction can be achieved than in a variant according to 1 . In total, even smaller distances between the evaluation units or the converter units coupled thereto along the first direction can be achieved when they are arranged in a row with an x-ray detector module according to the invention.

In particularly advantageous variants, the distance between two converter units 5, which are assigned to two adjacent evaluation units 3 along the first direction on two different substrate units 1 arranged next to one another, is at most twice the distance between two converter elements 5, which are assigned to two adjacent evaluation units along the first direction 3 are associated on the same substrate unit 1.

Furthermore, distances can also be optimized by the production of electrically conductive connections 7 based on a lithographic process, a conductor track printing process or also by means of a preformed contacting element 9 .

4 shows a schematic representation of a stacked arrangement comprising a substrate unit 1 and an evaluation unit 3. The stacked arrangement also comprises a converter unit 3 coupled to the evaluation unit 3.

The module has electrically conductive connections 7 from the evaluation unit 3 to the substrate unit 1, which are produced using a lithographic process. Lithographic processes for providing conductor tracks are known in semiconductor and microsystems technology. Conductor tracks can be applied to the evaluation unit 3 or substrate unit 1 by means of a lithographic process, which connect the contact areas on an evaluation unit 3 to the corresponding contact areas on the substrate unit 1 . The electrically conductive connections 7 can be routed from contact areas of the evaluation unit 3 via a side surface of the evaluation unit 3 to contact areas of the substrate unit 1 . As an alternative to forming the electrically conductive connections 7 by means of a lithographic process, the electrically conductive connections can also be formed by means of a conductor track printing process.

In contrast to electrically conductive connections 7, which are produced using a wire bonding method, conductor tracks can be applied directly to an evaluation unit 3 using a method described above and, in particular, do not protrude from an evaluation unit 3 in the direction of the incident x-ray radiation. This can advantageously make it possible for a converter unit 5 coupled to the evaluation unit 3 to protrude partially or completely beyond the area of the evaluation unit 3 in which the electrically conductive connections are formed on the evaluation unit 3 . This is indicated by the dashed line in 4 implied. This means that the two-dimensional extent of the converter unit 5 can be arranged at least overlapping with the area of the evaluation unit 3 having the electrically conductive connections. In this way, inactive areas of a detection area can advantageously be reduced.

An x-ray detector module includes at least two evaluation units 3 arranged next to one another along the first direction (here z-direction) according to an embodiment of the invention as in connection with FIG 2 and if the electrically conductive connections are formed by means of a lithographic process or by means of a conductor track printing process, a distance between two converter units assigned to two adjacent evaluation units 3 can advantageously be optimized so that inactive areas of the detection surface between two evaluation units 3 or converter units 5 assigned to them can be advantageously reduced. In particular in combination with a converter unit 5 projecting beyond the electrically conductive connections 7, distances formed between two adjacent evaluation units 3 assigned converter units 5 can be particularly advantageously reduced. This also applies advantageously to an X-ray detector unit comprising at least two substrate units 1 according to an embodiment in 3 . The distances between adjacent evaluation units 3 along the first direction or converter units 5 assigned to them can advantageously be further optimized by means of electrically conductive connections produced lithographically or by means of a conductor track printing process between a respective evaluation unit 3 and the associated substrate unit 1 .

5 shows a schematic representation of a stack arrangement comprising a substrate unit 1 and an evaluation unit 3 in a further embodiment. The stacking arrangement includes also a converter unit 3 coupled to the evaluation unit 3.

The module shown here has electrically conductive connections between the evaluation unit 3 and the substrate unit 1, which are formed by means of a preformed contacting element 9 including the electrically conductive connections 7. The preformed contacting element is preformed in such a way that it is adapted to an existing stacked arrangement of the evaluation unit 3 with the substrate unit 1 . The contacting element 9 is designed to bridge a height difference between a top side of the evaluation unit 3 facing the incident X-rays (here y-direction) and a top side of the substrate unit 1 facing the incident X-rays.

The contacting element 9 can extend over the entire length of a contacting edge of the evaluation unit 3 . A preformed contacting element 9 can produce all the required electrical connections 7 between an evaluation unit 3 and the substrate unit 1 at the same time. The contacting element 9 can have the electrically conductive connections 7 in an electrically insulating material, for example a plastic or rubber, in a suitable arrangement. The preformed contacting element 9 can in particular be matched to the arrangement of contact areas on the evaluation unit 3 and the substrate unit 1 and electrically conductively connect corresponding contact areas by means of the electrically conductive connections included. The preformed contacting element 9 can in particular have mating contact areas corresponding to the contact areas on the evaluation unit 3 and to the contact areas on the substrate unit 1 .

Such a preformed contacting element 9 can be brought into contact with the evaluation unit 3 and the substrate unit 1, for example by means of friction/pressure (pressing in) and/or by means of a suitable, supporting adhesive connection or a different type of contact mass, e.g. indium, or by means of a soldered connection, such that the electrically conductive connections contact corresponding contact areas of the evaluation unit 3 and the substrate unit 1 in an electrically conductive manner. In connection with the pressing in, a mechanically flexible design of the preformed contacting element 9 can be advantageous, e.g. using a mechanically flexible material such as rubber as the insulating material.

Such a contacting element 9 can be preformed in such a way that it is adapted to the evaluation unit 3 or the substrate unit 1 . For example, the contacting element 9 can have an L-shaped configuration, as in 5 shown, wherein one leg is in contact with the evaluation unit 3 , in particular lying on the evaluation unit 3 , and the second leg is in contact with the substrate unit 1 . The first leg can extend parallel to the areal extent of the evaluation unit 1 . The second leg can extend along a side face of the evaluation unit 3 . The second leg then has in particular a length which corresponds to the thickness of an evaluation unit 1 or to the height difference between a top side of the evaluation unit 3 facing the incident X-ray radiation and a top side of the substrate unit 1 facing the incident X-ray radiation.

A preformed contacting element 9 can be designed in particular as a multi-layer contacting element 9, with the multi-layer contacting element 9 comprising a plurality of contacting layers comprising the electrically conductive connections 7 and insulating intermediate layers, which are parallel to the planar extent of the evaluation unit 3 or substrate unit 1 and to the first direction orthogonal, second direction are lined up. The first direction extends along the contacting edge, along which the contact areas of the evaluation unit 2 are arranged, which are intended to be contacted by means of the electrically conductive connections 7 . The layers of the multi-layer contacting element 9 can therefore be stacked along the contacting edge, so that the planes of the layers are parallel to the plane which would otherwise be spanned by bonding wires in a wire bonding method, for example. The planes of the contacting layers including the electrically conductive connections 7 are designed in such a way that they connect a respective contact area of an evaluation unit 3 to the corresponding contact area on the substrate unit 1 . The contacting layers can each be separated by an insulating intermediate layer with a suitable thickness, so that the electrically conductive connections are separate from one another. The thickness of the individual contacting layers and the insulating intermediate layers is such that the sequence of the contacting layers is matched to the existing contact areas on the evaluation unit and the substrate unit. The conductive connections within a contacting layer can be in the form of conductor tracks, as in 5 indicated to be trained. A contacting layer can also be designed to be electrically conductive over the whole or part of the surface.

In other design variants, a preformed contacting element can also be produced, for example, by means of an additive manufacturing process.

the 6 and 7 show schematic sectional views of a contacting element 9 and a section of an evaluation unit 3 in an unconnected state to illustrate exemplary embodiment variants of a preformed contacting element 9.

Indicated on the evaluation unit 3 are contact areas 6 which are arranged in an edge area of the evaluation unit 3 along the contacting edge.

In 6 the contacting element has the electrically conductive connections 7 in the form of inserted conductor tracks, as already described in 5 hinted at.

The conductor tracks can be applied to the contacting layers of a multilayer contacting element, for example by means of a printing process or by means of a lithographic process, for example by means of conventional production methods in the production of printed circuit boards. Insulating intermediate layers can be arranged between the contacting layers comprising the conductor tracks. The contacting element 9 can also have mating contact regions 8 which are connected to the conductor tracks and which are arranged overlapping (indicated by the dashed arrow) and brought into electrically conductive contact with one another for contacting the contact element 9 with the evaluation unit 3 . A contacting of contact areas on a substrate unit 1 can take place in the same way.

In 7 the contacting element has the electrically conductive connections 7 within a contacting layer in the form of contacting layers which are designed to be electrically conductive over the whole or part of the area. The contacting layers, which form the electrically conductive connections 7, are separated from one another along the contacting edge by insulating intermediate layers of a suitable thickness.

To illustrate a contacting element 9 designed in this way, 8th a further sectional view of an L-shaped contacting element is shown, which shows one of the contacting layers formed in a full-surface formation.

In order to form a contact, the contacting layers can be arranged so that they overlap with contact areas 6 on the evaluation unit and can be brought into electrically conductive contact with one another. A contacting of contact areas on a substrate unit 1 can take place in the same way.

A design of the electrically conductive connections of an X-ray detector module according to the invention with at least two evaluation units or an X-ray detector unit according to the invention comprising at least two X-ray detector modules by means of a preformed contacting element as described here in connection with a single evaluation unit can advantageously contribute to optimizing the distances along the first direction. Furthermore, a preformed contacting element can be used to simplify handling of the x-ray detector modules as a result of improved protection against mechanical damage.

9 until 11 show schematic plan views of X-ray detector modules according to the invention having at least two evaluation units 3 to illustrate the arrangement of the electrically conductive connections according to various further embodiment variants.

9 shows a variant, wherein electrically conductive connections 7 from the two evaluation units 3 to the substrate unit 1 are arranged along the first direction between the two evaluation units 3. A central arrangement of the electrically conductive connections 7 and thus also the contact areas on the substrate unit 1 between two evaluation units 3 can advantageously simplify forwarding of the signals through conductor tracks in the substrate unit 1 to a common switching unit 21 . Furthermore, it can be achieved that partial areas of the substrate unit 1, which for example are below an evaluation unit 3, do not have to be used for forwarding signals to a switching unit 21 and are therefore free for an improved thermal coupling of the evaluation unit 3. For example, thermally conductive inserts, for example comprising an improved thermally conductive material such as a metal, can be provided in these areas, which can contribute to improved heat exchange. It is conceivable that these insertions can also be used at the same time as connections, ie supply lines (“Vias”), for a supply voltage or reference voltage for an evaluation unit 3 .

Furthermore, the internal arrangement of the contacts and electrically conductive Connections 7 of both evaluation units 3 provide improved protection against mechanical influences when handling the X-ray detector modules.

10 shows a variant, in which electrically conductive connections 7 from the two evaluation units 3 to the substrate unit 1 are arranged along the first direction between the two evaluation units 3 and the electrically conductive connections from the two evaluation units 3 are arranged interlocked, so that an electrically conductive connection 7 of a first of the two evaluation units 3 is arranged at least partially between two electrically conductive connections 7 of the second of the two evaluation units 3 along a second direction parallel to the two-dimensional extent and orthogonal to the first direction.

11 shows a variant, wherein electrically conductive connections 7 from both evaluation units 3 to the substrate unit 1 are arranged along the first direction between the two evaluation units 3 and at least some of the electrically conductive connections 7 of the first and the second evaluation unit 3 of the two evaluation units 3 are electrically connected to each other is conductively connected.

An arrangement of the electrically conductive connections 7 between the at least two evaluation units 3 of the x-ray detector module can be made possible particularly advantageously by providing the electrically conductive connections 7 using a lithographic method, a conductor track printing method or with a preformed contacting element. Advantageously, by providing the electrically conductive connections by means of a lithographic process, a line printing process or with a preformed contacting element, internal contacting between the two evaluation units can be achieved, while at the same time advantageously smaller distances between the evaluation units and thus also between the associated converter units are ensured be able. Furthermore, a toothed arrangement of the electrically conductive connections can also be made possible in a particularly advantageous manner. Electrically conductive connections are advantageously possible, with at least some of the electrically conductive connections 7 of the first and the second evaluation unit 3 of the two evaluation units 3 being electrically conductively connected to one another.

12 FIG. 12 illustrates a variant of an X-ray detector module with internal electrically conductive connections 7, which have been produced by means of a lithographic method or by means of a printed circuit board method, in a sectional view. A particularly small distance F between two converter units 5, or a particularly small pixel distance p7, can be achieved if the converter units 5 coupled to the evaluation units 3 also partially or completely cover the area in which the contact areas or the conductor tracks 7 are formed are, are arranged protruding. This is possible in these variants because, in contrast to electrically conductive connections 7, which are produced using a wire bonding process, the conductor tracks can be applied directly to an evaluation unit 3 and, in particular, do not protrude from an evaluation unit 3 in the direction of the incident X-ray radiation, which would oppose an overlapping arrangement.

13 FIG. 12 illustrates a further variant of an x-ray detector module with internal electrically conductive connections 7 in a sectional view, the electrically conductive connections being formed by means of a preformed contacting element 9 comprising the electrically conductive connections 7.

The preformed contacting element 9 is arranged between the at least two evaluation units. The contacting element 9 can, as in connection with the 5 until 8th described be trained. In this case, the preformed contacting element 9 is also designed in this variant in such a way that it simultaneously provides the electrically conductive connections 7 from the two adjacent evaluation units 3 to the substrate unit 1 . With the introduction of a contacting element designed in this way, all the required connections between the two evaluation units and the substrate are established at the same time. Instead of an L-shaped training, as in connection with 5 described, the preformed contacting element has a T-shaped configuration in this case, with one leg of the preformed contacting element 9 resting on both sides of the evaluation units 3 and the third leg being in contact with the substrate unit 1 . Using such a T-shaped contacting element, both evaluation units 3 can be electrically conductively connected to the substrate unit 1 using a contacting element 9 . In this way, particularly small distances G between the coupled converter units or pixel distances p8 can be achieved. In addition, such an arrangement of the electrically conductive connections 7 according to the 10 and 11 can be provided in a simple manner in connection with a preformed contacting element 9 .

the 14 until 16 each show a schematic process flow for provision an X-ray detector module according to different embodiment variants.

14 shows an exemplary method for providing an x-ray detector module comprising at least the steps of providing S1 a substrate unit 1, providing S2 at least one first evaluation unit 5 in a stacked arrangement with the substrate unit 1, providing S3 a second evaluation unit 3 in a stacked arrangement with the substrate unit 1, with the first and the second evaluation unit 3 are arranged at a distance next to one another along a first direction parallel to the planar extent of the substrate unit 1, and establishing S4 electrically conductive connections 7 between at least the first evaluation unit 3 and the substrate unit 1, so that when the x-ray detector module is provided, electrically conductive connections 7 of at least one of the two evaluation units 3 are arranged to the substrate unit 1 along the first direction between the two evaluation units 3.

In this exemplary variant shown, the step of establishing S4 the electrically conductive connections 7 between at least the first evaluation unit 3 and the substrate unit 1 takes place before the step of providing S3 the second evaluation unit 3.

The method also includes the step of establishing S5 the electrically conductive connections between the second evaluation unit 3 and the substrate unit 1. In the variant shown, the electrically conductive connections S5 are established between the second evaluation unit 3 and the substrate unit 1 separately from the manufacturing step S4 electrically conductive connections 7 between at least the first evaluation unit 3 and the substrate unit 1.

The method can include the evaluation units 3 already being coupled to a converter unit 5 when S2, S3 are provided. However, there may also be variants of the method, coupling to a converter unit 7 occurring only after one or both evaluation units 3 have been provided in a stacked arrangement with the substrate unit 1 or even after the electrically conductive connections 7 have been established.

In the 14 The method variant shown describes a step-by-step, ie sequential, construction of the x-ray detector module along the first direction, with an electrically conductive connection of a first evaluation unit first taking place before a second evaluation unit is provided along the first direction. This training variant advantageously allows, as in 14 indicated by way of example, a production S4 of electrically conductive connections 7 by means of a wire bonding method while achieving the smallest possible distances between two evaluation units 3 or converter units 5 coupled thereto.

However, it is also possible in this variant of the method to produce S4 electrically conductive connections 7 based on a lithographic method, on a printed circuit board method or also by means of a preformed contacting element 9 . This means that the production step S4 can include connecting a preformed contacting element 9 to at least the first evaluation unit 3 and the substrate unit 1 . The production step S4 can include producing electrically conductive connections 7 by means of a lithographic method or by means of a conductor track printing method.

The method can also include that, in addition to a first and a second evaluation unit 3, a third evaluation unit 3 is also provided along the first direction in a stacked arrangement with the substrate unit 1.

the 15 and 16 show further method variants of a method for providing an X-ray detector module, wherein the step of producing S4 the electrically conductive connections 7 between at least the first evaluation unit 3 and the substrate unit 1 takes place after the step of providing S3 the second evaluation unit 3.

In particular, the 15 and 16 Variants of the method, in which the electrically conductive connections of both evaluation units are established between the two evaluation units 3. However, there can also be variants in which only the electrically conductive connections of an evaluation unit 7 between the evaluation units 3 are established. The electrically conductive connections 7 of the second evaluation unit 3 to the substrate unit 1 can also be produced on a side of the second evaluation unit 3 which faces away from the first evaluation unit 3 along the first direction.

In particular, in the 15 and 16 in the step of producing S4 the electrically conductive connections 7, electrically conductive connections are produced simultaneously between the first evaluation unit 3 and the substrate unit 1 and the second evaluation unit 3 and the substrate unit 1.

The step of establishing S4 the electrically conductive connections 7 between the evaluation units 3 and the substrate unit 1 takes place in 15 especially based on a lithograph phical process or on a conductor track printing process.

The step of establishing S4 the electrically conductive connections 7 between the evaluation units 3 and the substrate unit 1 includes in 16 , a preformed contacting element 9 having the electrically conductive connections 7 with the evaluation units 3 and the substrate unit 1 to connect.

An electrical contact can be produced between the preformed contacting element 9, for example, mechanically (e.g. by means of pressure), by means of a conductive adhesive connection or other contact material, e.g. based on indium, or by a soldered connection.

17 shows an exemplary embodiment of a medical imaging device 32 with a detection unit 36 comprising at least one X-ray detector module according to the invention or at least one X-ray detector unit according to the invention and an X-ray source 37 opposite the detection unit 36. The X-ray source 37 is designed to expose the detection unit 36 to X-rays. The medical imaging device 32 shown is embodied in particular as a computed tomography device. The computed tomography device includes a gantry 33 with a rotor 35. The rotor 35 includes the X-ray source 37 and the detection unit 36. The rotor 35 can be rotated about the axis of rotation 43. The examination subject 39 , here a patient, is mounted on the patient couch 41 and can be moved along the axis of rotation 43 through the gantry 33 . In general, the object 39 may include an animal patient and/or a human patient, for example. The computing unit 45 is provided for controlling the medical imaging device and/or for generating an x-ray image data set based on signals detected by the detection unit.

In the case of a computed tomography device, a (raw) x-ray image data record of the object is usually recorded from a large number of angular directions by means of the detection unit, which is based on processed electrical pixel measurement signals from the pixel electronics 5 of the evaluation units. A final x-ray image data set can then be reconstructed based on the (raw) x-ray image data set using a mathematical method, for example comprising a filtered back-projection or an iterative reconstruction method.

The computing unit 45 can include a control unit for controlling the medical imaging device 32 and a generation unit for generating an x-ray image data record based on pixel measurement signals.

Furthermore, an input device 47 and an output device 49 are connected to the computing unit 45 . The input device and the output device can, for example, enable interaction by a user or the display of a generated x-ray image data set.

Claims (17)

X-ray detector module comprising at least one substrate unit (1) with a planar extension and at least two evaluation units (3), each designed to process electrical signals fed in from a coupled converter unit (5), in a stack arrangement, wherein - the at least two evaluation units (3) are arranged spaced apart next to one another along a first direction parallel to the planar extent of the substrate unit (1), and - Electrically conductive connections (7) from at least one of the two evaluation units (3) to the substrate unit (1) are arranged along the first direction between the two evaluation units (3). X-ray detector module according to one of the preceding claims, in which the electrically conductive connections (7) are formed by means of a lithographic method or by means of a conductor track printing method. X-ray detector module according to one of Claims 1 or 2 , wherein the electrically conductive connections (7) are formed by means of a preformed contacting element (9) comprising the electrically conductive connections (7). X-ray detector module claim 3 , wherein the preformed contacting element (9) is designed as a multi-layer contacting element (9), wherein the multi-layer contacting element (9) comprises a plurality of contacting layers comprising the electrically conductive connections (7) and insulating intermediate layers, which are arranged along a plane parallel to the planar extension and to the first direction orthogonal, second direction are lined up. X-ray detector module according to one of the preceding claims, wherein electrically conductive connections (7) from both evaluation units (3) to the substrate unit (1) are arranged along the first direction between the two evaluation units (3). X-ray detector module claim 5 , wherein the electrically conductive connections of the two evaluation units (3) are arranged interlocked, so that in each case an electrically conductive connection (7) of a first of the two evaluation units (3) along a second direction parallel to the planar extent and orthogonal to the first direction is arranged at least partially between two electrically conductive connections (7) of the second of the two evaluation units (3). X-ray detector module claim 5 , wherein at least some of the electrically conductive connections (7) of the first and the second evaluation unit (3) of the two evaluation units (3) are electrically conductively connected to one another. X-ray detector module according to one of the preceding claims, wherein evaluation units (3) are also arranged in a stack arrangement with the substrate unit (1) along a second direction parallel to the planar extent and orthogonal to the first direction. X-ray detector unit further comprising at least two X-ray detector modules according to one of the preceding claims, which are arranged next to one another along the first direction. X-ray detector unit claim 9 , wherein the distance between two converter units (5), which are assigned to two adjacent evaluation units (3) along the first direction on two different substrate units (1) arranged next to one another, is at most four times, preferably at most twice, as large as the distance between two converter elements ( 5) which are assigned to two adjacent evaluation units (3) along the first direction on the same substrate unit (1). Medical imaging device (32) comprising an X-ray detector module according to one of Claims 1 until 8th or an X-ray detector unit claim 9 or 10 and an x-ray source (37) positioned opposite thereto. Method for providing an X-ray detector module according to one of Claims 1 until 8th comprising at least the steps - providing (S1) a substrate unit (1) with a planar extension, - providing (S2) at least one first evaluation unit (5) in a stacked arrangement with the substrate unit (1), - providing (S3) a second evaluation unit in a stacked arrangement with the substrate unit (1), wherein the first and the second evaluation unit (3) are arranged spaced apart next to one another along a first direction parallel to the areal extent of the substrate unit (1), - producing (S4) electrically conductive connections (7) between at least the first evaluation unit (3) and the substrate unit (1), so that when the X-ray detector module is provided, electrically conductive connections (7) from at least one of the two evaluation units (3) to the substrate unit (1) are arranged along the first direction between the two evaluation units (3). are. procedure after claim 12 , wherein the step of producing (S4) the electrically conductive connections (7) between at least the first evaluation unit (3) and the substrate unit (1) takes place before the step of providing (S3) the second evaluation unit (3). procedure after claim 12 , wherein the step of producing (S4) the electrically conductive connections (7) between at least the first evaluation unit (3) and the substrate unit (1) takes place after the step of providing (S3) the second evaluation unit (3). Procedure according to one of Claims 12 until 14 , wherein in the step of producing (S4) the electrically conductive connections (7), electrically conductive connections are produced simultaneously between the first evaluation unit (3) and the substrate unit (1) and the second evaluation unit (3) and the substrate unit (1). Procedure according to one of Claims 12 until 15 , wherein the step of producing (S4) is based on a lithographic method or on a printed conductor printing method. Procedure according to one of Claims 12 until 15 , wherein the step of producing (S4) comprises connecting a preformed contacting element (9) comprising the electrically conductive connections (7) to at least the first evaluation unit (3) and the substrate unit (1).

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