DE102020118446A1 - fastener - Google Patents

Abstract

Connecting element (1) comprising a plurality of sections (2) which are arranged in succession along an axis (x) of the connecting element (1), the sections (2) each having a multiplicity of nanowires (3), with adjacent ones of the sections (2) adjoin one another within a respective intermediate layer (4), and wherein the nanowires (3) of the two respective sections (2) adjoining an intermediate layer (4) are held on the corresponding intermediate layer (4).

Description

The invention relates to a connecting element, a method for producing a connecting element, an arrangement comprising a connecting element and two components connected thereto, and a method for connecting two components with a connecting element. The invention particularly relates to the technical field of electronic devices.

In the manufacture of electronic devices, individual components must regularly be connected to one another in an electrically conductive manner. Various methods are known for this. For example, the contacts of the components can be soldered together or connected using silver sintering. However, the resulting temperatures can damage the components. An innovative alternative to such conventional methods is the connection of electronic components using nanowires. This can be formed easily at comparatively low temperatures. In this case, nanowires are provided as a "lawn" on the contact surfaces of the components to be connected. If the contact surfaces are brought together, the nanowires with a very large contact surface are woven or knitted together and thus form a mechanically stable as well as electrically and thermally conductive connection. However, known methods for nanowire connection of components require particularly flat contact surfaces. Unevenness of the contact surfaces can be compensated for by the nanowires. However, nanowires can only be grown reliably up to a length of around 100 µm. If the distance between the contact surfaces varies on a larger scale, a connection with nanowires cannot be reliably formed.

The object of the present invention is, based on the prior art described, to present a method with which two components can be reliably connected to one another, even if the contact surfaces of the components are uneven. In addition, a suitable connecting element, a method for its production and an arrangement with such a connecting element and two components connected to it are to be presented.

These objects are solved with the subject matter of the independent claims. Further advantageous developments are specified in the dependent claims. The features presented in the claims and in the description can be combined with one another in any technologically meaningful way.

According to the invention, a connecting element is presented which comprises a plurality of sections which are arranged one after the other along an axis of the connecting element. The sections each have a multiplicity of nanowires. Adjacent ones of the sections abut one another within a respective intermediate layer. The nanowires of the two respective sections adjacent to an intermediate layer are held to the corresponding intermediate layer.

Two components can be connected to one another with the connecting element, in particular two electronic components. The components preferably each have a contact surface. The contact surfaces of the components can be connected to one another with the connecting element. This creates a mechanically stable and electrically and/or thermally conductive connection between the components. The connecting element described can be used for a wide variety of applications. In this way, two electrical conductors can be connected to one another in an electrically conductive manner as components via the connecting element. Two thermal conductors can also be connected to one another in a thermally conductive manner as components via the connecting element. When manufacturing an electric motor, magnets as components can be connected to a basic component via one or more of the connecting elements. Semiconductor chips can be connected to one another as components via the connecting element. A sensor can be fixed as a component to a base component via the connection element.

The connection can be formed in that the connecting element is produced on the contact surface of a first of the components. A nanowire connection can be formed between the contact surface of the second component and the connecting element. For this purpose, the connecting element has a multiplicity of nanowires, in particular on the side opposite the first component. These can be brought into contact with the contact surface of the second component. The nanowires can connect to the contact surface of the second component in particular by heating and/or pressing on. It is also possible to provide a further multiplicity of nanowires on the contact surface of the second component. In that case, the connection between the nanowires of the connecting element and the second component can be formed. Due to the particularly large contact area between the nanowires, no heating is required in this case in particular. However, the connection can also be reinforced in this case by heating and/or pressing on. Another connection can also be placed on the contact surface of the second component training element are provided. In that case, the connection can be formed between nanowires of the two connection elements. It is also conceivable that the connecting element is initially produced on a separate substrate and then transferred to the contact area of the first component. The connecting element can be connected to the first component in the same way as to the second component. For this purpose, the connecting element preferably also has a multiplicity of nanowires on the side facing the first component.

With the connecting element described, unevenness in the contact surfaces of the components can be compensated particularly well despite the limited length of the nanowires. For this purpose, the connecting element is divided into sections along its axis. This enables the nanowires to bridge a distance between the contact surfaces that is many times the length of a single nanowire. Since the nanowires are flexible, unevenness in the contact surfaces that are longer than the length of a single nanowire can be compensated for. The connecting element preferably has 2 to 20 sections, in particular 5 to 10. The connecting element can be connected to the two components via the two outer sections. The nanowires of these two sections can enter into a nanowire connection with one of the two components, optionally indirectly via a further connection element or an intermediate element. If more than two sections are provided, in addition to the two outer sections there is also at least one section that does not come into contact with any of the components. Together with the two outer sections, these sections serve as buffers to compensate for unevenness in the contact surfaces. In this way, the nanowires of one section can be compressed, which is why the connecting element is flexible overall. As a result, the connecting element can adapt to the contact surfaces.

The axis of the connecting element is the decisive orientation for the connection between the components. The sections are sequentially arranged along the axis of the connector. This means that when viewed along the axis of the connector, the connector is fully split into the sections. Each part of the fastener belongs to exactly one of the sections. The sections abut each other without a gap. Interfaces between the sections are preferably formed perpendicular to the axis of the connecting element.

Each section has a multitude of nanowires. A nanowire is understood here to mean any material body that has a wire-like shape and a size in the range from a few nanometers to a few micrometers. For example, a nanowire can have a circular, oval, or polygonal base. In particular, a nanowire can have a hexagonal base. All nanowires are preferably formed from the same material. It is particularly preferred that the nanowires are formed entirely from an electrically conductive material.

For an electrically and/or thermally particularly well conductive connection, it is preferred that the nanowires are formed from an electrically and/or thermally conductive material. The use of copper, silver, nickel and gold is particularly preferred here. The contact surfaces are also preferably formed from an electrically and/or thermally conductive material, in particular with copper, silver, nickel or gold. The contact surfaces and the nanowires are particularly preferably formed from the same material. This makes the connection particularly stable.

The nanowires of the individual sections are preferably each oriented along the axis of the connecting element. However, since nanowires are not exactly straight in practice, it is also preferred that the nanowires on average enclose an angle of less than 30° with the axis of the connecting element. In the case of a curved nanowire, its orientation can be determined by approximation. The orientation of the nanowires refers to the state before two devices are connected to each other via the connector. In the case of uneven contact surfaces, the sections of the connecting element can be compressed so that the unevenness is leveled out. This can change the orientation of the nanowires. The extent of the sections along the axis of the connecting element is significantly influenced by the length of the nanowires in any case before a connection is formed between two components via the connecting element. The nanowires preferably have a length in the range from 100 nm [nanometer] to 100 μm [micrometer], in particular in the range from 10 to 80 μm. Furthermore, the nanowires preferably have a diameter in the range from 10 nm to 10 μm, in particular in the range from 30 nm to 2 μm. The term diameter refers to a circular base area, with a base area deviating from this, a comparable definition of a diameter is to be used. It is particularly preferred that all nanowires used have the same length and the same diameter.

Adjacent ones of the sections abut one another within a respective intermediate layer. The interface between two adjacent sections thus runs through the intermediate layer. When viewed along the axis of the connecting element, the interface between the two sections is preferably located centrally within the intermediate layer. Adjacent intermediate layers are spaced from each other. The nanowires are arranged between the intermediate layers. The intermediate layers allow the nanowires of the individual sections to be arranged along the axis. As a result, the connection element can have an extent along the axis of the connection element which is a multiple of the length of a single nanowire. The connecting element can be produced by growing the nanowires in sections onto the intermediate layers. The interlayers stabilize the connector and prevent the nanowires from breaking.

The intermediate layers are preferably arranged perpendicularly to the axis of the connecting element, at least before a connection between two components is formed via the connecting element. The intermediate layers are preferably arranged parallel to one another. In practice, however, this can be difficult to implement. It is therefore also preferred that the intermediate layers each enclose an angle of 70 to 90° with the axis of the connecting element. Within this angular range, the intermediate layers can be at an angle to one another. If an intermediate layer is not flat, a level should be used as an approximation for this intermediate layer.

The nanowires of the two respective sections adjoining an intermediate layer are held on this intermediate layer. Apart from the two outer sections along the axis of the connecting element, all sections participate in two intermediate layers. In these sections, the nanowires are held with one of their ends on the first of these intermediate layers and with their other end on the other intermediate layer. The adjacent intermediate layers are therefore connected to one another via the nanowires. In this case, a distance between the adjacent intermediate layers along the axis of the connecting element preferably corresponds to the length of the nanowires arranged between these intermediate layers. Since in practice the nanowires often do not run exactly along the axis of the connecting element, it is preferred that the spacing of the adjacent intermediate layers along the axis of the connecting element correspond to 90 to 100 percent of the length of the nanowires arranged between these intermediate layers.

The two outer sections along the axis of the connecting element each participate in only one intermediate layer. The nanowires of these sections are therefore only held at this one intermediate layer. The connections to the two components can be formed via these nanowires. For this purpose, it is preferred that when viewed along the axis of the connecting element, the two ends of the connecting element are formed by nanowires, ie not by a closed layer.

The connector can be fabricated by growing the nanowires in sections. For this purpose, the nanowires for the first section can be grown, for example, on the contact area of the first component. In all of the following sections, the nanowires can be grown in such a way that the nanowires are held at one of their ends on the respective intermediate layer. Nanowires can be grown by placing a film with pores on a surface to be grown. If the pores are filled, a final layer can be obtained on the surface of the film by continuing the galvanic growth. The nanowires can be connected to one another at their ends by this terminating layer. A film can be placed on the top layer and the nanowires of the following section can be grown on the top layer. The final layer can therefore already represent the intermediate layer. In practice, however, the film often does not lie tightly against the top layer. Gaps between the film and the top layer can fill up with the deposited material during the growth process before the pores fill up and the growth of the nanowires begins to that extent. As a result, further material can be deposited areally on the final layer during the growth of the nanowires of the following section. The final layer together with the material added in this way then forms the respective intermediate layer. To this extent, the intermediate layer can be considered to be divided in two along the axis of the connecting element. However, the parts of the intermediate layer can merge into one another in such a way that they cannot be distinguished from one another, for example in a section analysis. In particular, it is not necessary for an interface between the parts of a respective intermediate layer to be aligned exactly perpendicular to the axis of the connecting element.

In a further preferred embodiment, the connecting element has an extension along the axis of the connecting element between between 20 and 10,000 µm [microns], in particular between 100 and 600 µm.

Nanowires can only be grown reliably with lengths of up to 100 µm [microns]. It is even preferable to use only nanowires with a length of up to 50 μm. The connecting element described can be made significantly longer. In this way, correspondingly larger bumps on contact surfaces can be compensated.

In a further preferred embodiment of the connecting element, the intermediate layers each have an extension along the axis of the connecting element in the range from 0.2 to 40 μm [micrometers], in particular in the range from 1 to 10 μm.

The expansion of the intermediate layers is preferably made up of the expansion of the respective final layer and the material that is added during the growth of the nanowires of the following section. The final layer of an intermediate layer preferably has the same extent along the axis of the connecting element as the layer of material thus added. However, any other distribution is also possible. In particular, the final layer can extend along the axis of the connecting element over 10 to 90% of the intermediate layer. This can vary locally, so that unevenness in the final layer can be leveled out. Preferably, the intermediate layers of all sections have the same extent along the axis of the connecting element.

1. a) Bereitstellen einer Ausgangsschicht,
2. b) Auflegen einer Folie auf die Ausgangsschicht, wobei die Folie eine Vielzahl von Poren aufweist,
3. c) Abscheiden von Material auf die Ausgangsschicht und in die Poren, so dass die Nanodrähte in den Poren aus dem Material gebildet werden,
4. d) außer bei dem letzten Abschnitt Erzeugen einer von der Ausgangsschicht entlang der Achse des Verbindungselements beabstandeten Abschlussschicht an einer Folienoberfläche,

wobei ab dem zweiten Abschnitt in Schritt a) die Abschlussschicht des jeweils vorhergehenden Abschnitts als die Ausgangsschicht verwendet wird.As a further aspect of the invention, a method for producing a connecting element is presented, which comprises a plurality of sections which are arranged in succession along an axis of the connecting element. The sections are created one after the other by the following steps:

1. a) providing an output layer,
2. b) placing a film on the starting layer, the film having a large number of pores,
3. c) depositing material onto the starting layer and into the pores, so that the nanowires in the pores are formed from the material,
4. d) except for the last section, creating a finishing layer on a foil surface spaced apart from the starting layer along the axis of the connecting element,

starting with the second section in step a), the final layer of the respectively preceding section is used as the starting layer.

The advantages and features of the connecting element described can be applied and transferred to the method, and vice versa. The connecting element described is preferably produced with the method described.

The components are preferably electronic components. The contact surfaces can be designed as electrical contacts. In this case in particular, a large number of individual connections can be formed between the components with the described connecting element, via which the electrical contacts of the components are connected to one another in pairs. In this respect, it is not necessary for the connecting element to be designed to be continuous. The connecting element can also be used to thermally conductively connect an electronic component as the first component to a heat sink as the second component, so that heat can be released from the electrical component to the heat sink via the connecting element. In this case in particular, it is preferred that a single connection is formed between the components via the connecting element. This can be formed over the entire surface. A first mechanical component as the first component can also be mechanically connected with the connecting element to a second mechanical component as the second component. In this case in particular, it is preferred that a single connection is formed between the components via the connecting element. This can be formed over the entire surface. In general, the contact areas can be of any size. In particular, tests from 0.3 µm have yielded satisfactory results. Therefore, it is preferable that the contact areas extend at least 0.3 µm in each direction of their surface.

The sections are basically all generated in the same way through steps a) to d). However, the special features described below arise for the two outer sections of the connection element along the axis of the connection element, i.e. for the section created first (hereinafter “first section”) and for the section created last (“last section”).

In step a) a starting layer is provided. Any layer on which nanowires can be grown can be considered a starting layer. The starting layer is preferably formed from the material of the nanowires. In the first section, the starting layer can be provided in that that a component with a contact area or a separate substrate is provided. In the remaining sections, ie from the second section, the respective starting layer is provided in step a) to the extent that the final layer of the respective preceding section is used as the starting layer. The final layer of a first section is therefore the starting layer of a second section. Together with material that may be added during the growth of the nanowires of the second section, this layer forms the intermediate layer between the first section and the second section.

In step b) the film is placed on the starting layer. In the case of the first section, this can be done by placing the film on the contact surface of the first component or on the separate substrate. The film is preferably formed from a polymer. The pores are preferably oriented along the axis of the connecting element when the film is laid on the base layer. The pores are preferably formed continuously. This means that the pores reach from the side of the film with which the film is placed on the starting layer to an opposite side of the film.

In step c), the nanowires are grown, in particular galvanically. To do this, the material from which the nanowires are to be grown is deposited on the starting layer and in the pores. The material can only be deposited through the pores of the film in such a way that the nanowires grow in the pores. If the film is not close to the starting layer, the material can also separate between the starting layer and the film. In this case, a space between the starting layer and the film is first filled with the material before the material is also deposited in the pores. In this way, the nanowires can grow together on their side facing the starting layer. The material deposited over a large area on the final layer is part of the respective intermediate layer. It is possible that the nanowires only grow together in a few places and not over the entire surface of the starting layer.

If the pores are completely filled with the deposited material, the material on the surface of the film can grow together to form a closed layer. This refers to the surface of the film on the side opposite the base layer. Such a closed layer is referred to herein as the final layer of a section. This is generated in step d). However, no final layer is created for the last section. The growth of a cap layer can be prevented by stopping the galvanic growth before the material starts to coalesce on the surface of the foil. Also included is that a final layer that has grown initially is removed again.

Step d) is carried out for all sections except for the last section. The nanowires of the last section can therefore be brought into contact with a contact surface of a second component in order to form a nanowire connection therewith.

The foils are not part of the fastener. The foils are only needed temporarily during production. Therefore, the foils are preferably removed. In principle, this can be done at any time.

However, the embodiment of the method in which all foils are removed together after the last section has been produced is preferred.

In this embodiment, the nanowires of the previous sections are still protected by the respective foil while the nanowires for the following section are grown. This can prevent the nanowires from being damaged when manufacturing the connector.

• ■ zwei Bauteile mit einer jeweiligen Kontaktfläche, wobei die Kontaktflächen der beiden Bauteile entlang der Achse des Verbindungselements voneinander beabstandet sind,
• ■ ein Verbindungselement, durch welches die Kontaktflächen der beiden Bauteile miteinander verbunden sind, wobei das Verbindungselement eine Mehrzahl von Abschnitten umfasst, die entlang einer Achse des Verbindungselements aufeinander folgend angeordnet sind, wobei die Abschnitte jeweils eine Vielzahl von Nanodrähten aufweisen, wobei benachbarte der Abschnitte innerhalb einer jeweiligen Zwischenschicht aneinandergrenzen, und wobei die Nanodrähte der beiden jeweiligen an eine Zwischenschicht angrenzenden Abschnitte an der entsprechenden Zwischenschicht gehalten sind.

As a further aspect of the invention, an arrangement is presented which comprises:

• ■ two components with a respective contact surface, the contact surfaces of the two components being spaced apart from one another along the axis of the connecting element,
• ■ a connecting element, through which the contact surfaces of the two components are connected to one another, the connecting element comprising a plurality of sections which are arranged in succession along an axis of the connecting element, the sections each having a multiplicity of nanowires, with adjacent ones of the sections inside of a respective intermediate layer adjoin each other, and wherein the nanowires of the two respective portions adjacent to an intermediate layer are held on the corresponding intermediate layer.

The advantages and features of the described connecting element and the described method can be applied and transferred to the arrangement, and vice versa. The connecting element of the arrangement is preferably designed like the described connecting element. The connecting element of the arrangement is preferably manufactured by the method described.

The contact surfaces of the two components are preferably aligned parallel to one another. Preferably, the contact surfaces of the two components are each aligned perpendicular to the axis of the connecting element. However, due to the flexibility of the nanowires, contact surfaces that are inclined to one another can also be connected to one another. For example, the contact surfaces of the two components can enclose an angle in the range of up to 45° with one another.

1. A) Bereitstellen eines Verbindungselements auf einer Kontaktfläche des ersten Bauteils, wobei das Verbindungselement eine Mehrzahl von Abschnitten umfasst, die entlang einer Achse des Verbindungselements aufeinander folgend angeordnet sind, wobei die Abschnitte nacheinander jeweils durch folgende Schritte erzeugt werden:
   1. a) Bereitstellen einer Ausgangsschicht,
   2. b) Auflegen einer Folie auf die Ausgangsschicht, wobei die Folie eine Vielzahl von Poren aufweist,
   3. c) Abscheiden von Material auf die Ausgangsschicht und in die Poren, so dass die Nanodrähte in den Poren aus dem Material gebildet werden,
   4. d) außer bei dem letzten Abschnitt Erzeugen einer von der Ausgangsschicht entlang der Achse des Verbindungselements beabstandeten Abschlussschicht an einer Folienoberfläche,
   wobei ab dem zweiten Abschnitt in Schritt a) die Abschlussschicht des jeweils vorhergehenden Abschnitts als die Ausgangsschicht verwendet wird, und
2. B) Zusammenführen einer Kontaktfläche des zweiten Bauteils mit dem in Schritt A) bereitgestellten Verbindungselement, so dass die Nanodrähte des zuletzt erzeugten Abschnitts des Verbindungselements mit der Kontaktfläche des zweiten Bauteils, mit Nanodrähten auf der Kontaktfläche des zweiten Bauteils und/oder mit einem weiteren Verbindungselement auf der Kontaktfläche des zweiten Bauteils in Kontakt gelangen.

As a further aspect of the invention, a method for connecting a first component to a second component is presented. The procedure includes:

1. A) Providing a connecting element on a contact surface of the first component, the connecting element comprising a plurality of sections which are arranged one after the other along an axis of the connecting element, the sections being produced one after the other by the following steps:
   1. a) providing an output layer,
   2. b) placing a film on the starting layer, the film having a large number of pores,
   3. c) depositing material onto the starting layer and into the pores, so that the nanowires in the pores are formed from the material,
   4. d) except for the last section, creating a finishing layer on a foil surface spaced apart from the starting layer along the axis of the connecting element,
   starting with the second section in step a), the final layer of the respectively preceding section is used as the starting layer, and
2. B) merging a contact surface of the second component with the connecting element provided in step A), so that the nanowires of the last produced section of the connecting element with the contact surface of the second component, with nanowires on the contact surface of the second component and/or with a further connecting element come into contact with the contact surface of the second component.

The advantages and features of the described connecting element, the described method for producing a connecting element and the described arrangement can be applied and transferred to the method for connecting a first component to a second component, and vice versa. The connecting element used to connect the two components is preferably designed like the described connecting element. The connecting element used to connect the two components is preferably produced in step A) using the described method for producing a connecting element. The arrangement described is preferably obtained with the method for connecting a first component to a second component.

In step A), the connecting element is provided on the contact surface of the first component. This can be done by producing the connecting element on the contact surface of the first component. Alternatively, it is conceivable that the connecting element is produced on a separate substrate and then transferred to the contact surface of the first component. The foils are preferably removed before the connecting element is transferred to the contact surface of the first component. If the connecting element is produced on a separate substrate, the substrate can be used as the starting layer of the first section and to this extent can be provided in step a) of the first section.

In step B), the connecting element is connected to the contact surface of the second component. This can be done by placing the second component on the connecting element with the contact surface in front. In step B), the second component is preferably pressed onto the connecting element with a pressure in the range from 1 to 200 MPa. The contact surface of the second component is preferably heated to at least 90.degree. C., in particular to at least 150.degree. C., in step B). The contact surface of the second component is preferably heated to a maximum of 300° C. in step B), in particular to a maximum of 240° C. The contact surface of the second component is particularly preferably heated to a temperature in the range from 90° C. to 300° C., in particular in the range from 150° C. to 240° C., in step B). These temperatures are significantly lower than the temperatures encountered in known joining methods such as soldering.

Other parts of the second component, the connecting element and/or the first component can also be heated together with the contact surface of the second component. For practical reasons, the two components with the connecting element are preferably heated together. What was said for the contact surface of the second component applies to the temperature to be used.

For the formation of the connection, it may be sufficient for the minimum temperature described to be reached once, at least briefly. It is not necessary to maintain the temperature. However, it is preferred that the temperature to which heating is carried out in accordance with step B) is maintained for at least five seconds, preferably at least 30 seconds. This ensures that the connection is formed as desired. Maintaining the temperature for a longer period of time is basically not harmful.

A multiplicity of nanowires is preferably also provided on the contact surface of the second component. In this case, the nanowires of the section of the connecting element produced last come into contact with the nanowires on the contact surface of the second component. In this case in particular, heating and/or pressing on is not required, but is nevertheless preferred. The statements made above regarding temperature and pressure apply.

It is also possible to provide a further connecting element on the contact surface of the second component. In step B), the components are then brought together in such a way that the two connecting elements connect to one another. In this case, the nanowires of the section of the connecting element produced last from step A) come into contact with nanowires of the further connecting element. The further connecting element is preferably provided analogously to step A) on the second component, ie produced on it or transferred onto it. The connection between the connecting elements preferably takes place between the nanowires of the sections of the two connecting elements that were produced last. Due to the design with two connecting elements between the components, particularly large unevenness can be compensated. This is more difficult with a single correspondingly large connecting element, because in practice the length of the nanowires is limited and only a limited number of sections can be lined up to form a connecting element.

In a further preferred embodiment of the method, in step B), an adhesive is provided on the contact surface of the first component and/or on the contact surface of the second component. The adhesive can mechanically stabilize the connection between the components. In addition, the adhesive can stabilize the nanowires of the connecting element. The adhesive can be applied to a contact surface alone or in addition to nanowires or to a connecting element. All of the following combinations are conceivable: The connecting element can be located with or without adhesive on the contact surface of the first component. In this case, the contact surface of the second component can be free, have nanowires without adhesive, have a connecting element without adhesive, have the adhesive alone, have the adhesive in addition to a further connecting element or have the adhesive in addition to nanowires. All combinations in which at least one of the contact surfaces has the adhesive fall under the present embodiment.

The connecting element described can also be used to indirectly connect two components to one another. An intermediate element can thus be provided which has a connecting element designed as described on at least one surface. The intermediate element is preferably a foil. The intermediate element is preferably designed to be electrically conductive, so that an electrically conductive connection can be formed. Alternatively, it is preferred that the intermediate element is designed to be electrically insulating. The intermediate element preferably has a connecting element designed as described on two opposite sides. The intermediate element can be placed between two components to be connected. The components are connected to the intermediate element and to this extent to one another, in particular via the respective connecting element. All of the following combinations are conceivable: The contact surface of the first component and the contact surface of the second component can each be free, have an adhesive, have nanowires, have a connecting element, have an adhesive in addition to nanowires or have an adhesive in addition to a connecting element. If a connecting element is only provided on the side of the intermediate element facing the first component and the contact surface of the second component is free, the intermediate element can be connected directly to the second component, for example by an adhesive effect. If the intermediate element has a connecting element on two opposite sides, the connecting elements can be made of the same material on both sides. However, it is also preferred that the connecting elements are formed from different materials on the two sides. A nanowire connection is particularly stable when it is formed between a contact surface and nanowires made from the same material and/or between nanowires made from the same material. An intermediate element with connecting elements made of different materials allows contact surfaces to be more different Materials are particularly well connected.

• 1 a bis 1f: mehrere Stufen eines erfindungsgemäßen Verfahrens zur Herstellung eines Verbindungselements,
• 2: eine seitliche Schnittdarstellung einer Anordnung umfassend das Verbindungselement aus 1f sowie zwei darüber miteinander verbundene Bauteile.

The invention is explained in more detail below with reference to the figures. The figures show a particularly preferred embodiment to which the invention is not limited. The figures and the proportions shown therein are only schematic. Show it:

• 1 a until 1f : several stages of a method according to the invention for the production of a connecting element,
• 2 : a lateral sectional view of an arrangement comprising the connecting element 1f and two components connected to each other.

1a until 1f show different stages of a method for manufacturing a (in 1f shown) connecting element 1. 1a shows a first component 6 with a contact surface 7. The connecting element 1 is produced on the contact surface 7 of the first component 6. FIG. The connecting element 1 can thus be used to connect the contact surface 7 of the first component 6 in a mechanically stable and electrically and/or thermally conductive manner to a contact surface 7 of an in 2 to connect the second component 13 shown. The connecting element 1 is constructed along an axis x. The axis x is perpendicular to the contact surface 7 of the first component 6. The contact surface 7 of the first component 6 serves as the starting layer 8. The starting layer 8 is provided in that the first component 6 with the contact surface 7 is provided.

As in 1b shown, a film 9 is placed on the contact surface 7 and to that extent on the starting layer 8 . A first section 2 of the connecting element 1 is produced with the film 9 . The film 9 has a large number of pores 10 . Nanowires 3 can be grown on the starting layer 8 in the pores 10 by galvanic growth. Is in 1b indicated by the fact that the pores 10 are shown in the lower area with a solid line. The nanowires 3 have already grown in this area. Above it is indicated by dots that the pores 10 are still free. It is also indicated that the nanowires 3 have grown together in the lower area because the foil 9 does not lie tightly on the starting layer 8 .

In 1c it is shown that the pores 10 are completely filled and the nanowires 3 of the first section 2 have grown completely. After the pores 10 have been completely filled with the material of the nanowires 3 , the galvanic growth process results in a final layer 12 being formed from the material of the nanowires 3 on a foil surface 11 . The first section 2 is thus completely produced. Section 2 includes the nanowires 3 and the capping layer 12. The foil 9 is not part of section 2 and is removed at the end of the process.

In 1d it is shown that a further section 2 is created. In the 1c The final layer 12 shown of the first section 2 serves as the starting layer 8 for this further section 2. In this respect, the respective starting layer 8 is provided for this second section 2. A foil 9 is then placed on this new starting layer 8 and the nanowires 3 are grown analogously to the previous section 2 . In this case, too, further material is deposited on the starting layer 8 . A final layer 12 is then formed on top of the film 9 . In this way, a plurality of sections 2 arranged successively along the axis x of the connecting element 1 can be obtained.

1e Figure 12 shows three fully formed sections 2. The top section 2 has no top layer 12. This can be achieved by stopping the galvanic growth in time. As a result, the ends of the nanowires 3 of the uppermost section 2 are free and can (as in 2 shown) are brought into contact with the contact surface 7 of the second component 13 .

Before that, however, the foils 9 are removed. The result is the connecting element 1, which together with the first component 6 in 1f is shown. From this it can be seen that adjacent sections 2 adjoin one another within a respective intermediate layer 4 . The intermediate layers 4 are each composed of a final layer 12 and the material deposited over the surface.

In this respect, the intermediate layers 4 are each formed in two parts along the axis x of the connecting element 1 . The boundary between two adjacent sections 2 lies within the respective intermediate layer 4. The nanowires 3 are held on the intermediate layers 4 belonging to the respective sections 2. FIG.

2 shows an arrangement 5 comprising the first component 6 and the connecting element 1 1f . A contact surface 7 of a second component 13 is connected to the contact surface 7 of the first component 6 via the connecting element 1 . It can be seen that the contact surfaces 7 of the two components 6 , 13 are aligned parallel to one another and in each case transversely to the axis x of the connecting element 1 . The two contact surfaces 7 are along the Axis x of the connecting element 1 spaced apart. The two components 6, 13 may have been connected to one another by bringing the contact surface 7 of the second component 13 together with the connecting element 1, so that the nanowires 3 of the uppermost section 2 of the connecting element 1 are in contact with the contact surface 7 of the second component 13 have reached. Alternatively, nanowires (not shown) could also have been provided on the contact surface 7 of the second component 13 . In that case, the nanowires 3 of the top section 2 could have come into contact with these nanowires and/or with the contact surface 7 of the second component 13 . Another connecting element (not shown) could also have been provided on the contact surface of the second component 13 . In that case, the nanowires 3 of the uppermost section 2 could have come into contact with nanowires of the further connecting element.

is drawn in 2 in addition, an extension D of the connecting element 1 along the x-axis of the connecting element 1. This is between 20 and 1000 μm. In addition, an extension d of the intermediate layers 4 along the x-axis of the connecting element 1 is shown, as an example for only one of the two intermediate layers 4. The extension d for both intermediate layers 4 is in the range from 0.2 to 40 μm.

Reference List

1

fastener

2

section

3

nanowire

4

intermediate layer

5

arrangement

6

first component

7

contact surface

8th

base layer

9

foil

10

pore

11

foil surface

12

final layer

13

second component

x

Axis of the fastener

D

expansion

i.e

expansion

Claims (10)

Connecting element (1) comprising a plurality of sections (2) which are arranged in succession along an axis (x) of the connecting element (1), the sections (2) each having a multiplicity of nanowires (3), with adjacent sections (2) adjoin one another within a respective intermediate layer (4), and wherein the nanowires (3) of the two respective sections (2) adjoining an intermediate layer (4) are held on the corresponding intermediate layer (4). Connecting element (1) after claim 1 , wherein the intermediate layers (4) are each formed in two parts along the axis (x) of the connecting element (1). Connecting element (1) according to one of the preceding claims, wherein the connecting element (1) along the axis (x) of the connecting element (1) has an extent (D) of between 20 and 1000 µm. Connecting element (1) according to one of the preceding claims, in which the intermediate layers (4) each have an extent (d) along the axis (x) of the connecting element (1) in the range from 0.2 to 40 µm. A method for producing a connecting element (1) comprising a plurality of sections (2) which are arranged in succession along an axis (x) of the connecting element (1), the sections (2) being produced in succession in each case by the following steps: a) providing an initial layer (8), b) placing a film (9) on the starting layer (8), the film (9) having a large number of pores (10), c) depositing material onto the starting layer (8) and into the pores (10), so that the nanowires in the pores (10) are formed from the material, d) except for the last section (2), producing a final layer (12) at a distance from the starting layer (8) along the axis (x) of the connecting element (1) on a film surface (11), with from the second section (2) in Step a) the final layer (12) of the respective preceding section (2) is used as the starting layer (8). procedure after claim 5 , wherein all foils (9) are removed together after the last section (2) has been produced. Arrangement (5), comprising ■ two components (6, 13) with a respective contact surface (7), wherein the contact surfaces (7) of the two Components (6, 13) are spaced apart from one another along the axis (x) of the connecting element (1), ■ a connecting element (1) through which the contact surfaces (7) of the two components (6, 13) are connected to one another, the connecting element (1) comprises a plurality of sections (2) which are arranged in succession along an axis (x) of the connecting element (1), the sections (2) each having a multiplicity of nanowires (3), adjacent sections ( 2) adjoin one another within a respective intermediate layer (4), and wherein the nanowires (3) of the two respective sections (2) adjoining an intermediate layer (4) are held on the corresponding intermediate layer (4). Arrangement (5) after claim 7 , wherein the connecting element (1) according to one of Claims 1 until 4 is trained. Method for connecting a first component (6) to a second component (13), comprising: A) providing a connecting element (1) on a contact surface (7) of the first component (6), the connecting element (1) comprising a plurality of sections (2) which follow one another along an axis (x) of the connecting element (1). are arranged, wherein the sections (2) are successively generated by the following steps: a) providing an initial layer (8), b) placing a film (9) on the starting layer (8), the film (9) having a large number of pores (10), c) depositing material onto the starting layer (8) and into the pores (10), so that the nanowires in the pores (10) are formed from the material, d) except for the last section (2), producing a final layer (12) at a distance from the starting layer (8) along the axis (x) of the connecting element (1) on a film surface (11), with from the second section (2) in Step a) the final layer (12) of the respective preceding section (2) is used as the starting layer (8), and B) Bringing together a contact surface (7) of the second component (13) with the connecting element (1) provided in step A), so that the nanowires (3) of the last produced section (2) of the connecting element (1) are connected to the contact surface (7 ) of the second component (13), with nanowires on the contact surface (7) of the second component (13) and/or with a further connecting element on the contact surface of the second component (13). procedure after claim 9 , Wherein the connecting element (1) in step A) with a method according to one of Claims 5 or 6 is produced.

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