DE102020108051A8 - Magnetische Speichervorrichtungen und Verfahren zu ihrer Herstellung - Google Patents
Magnetische Speichervorrichtungen und Verfahren zu ihrer Herstellung Download PDFInfo
- Publication number
- DE102020108051A8 DE102020108051A8 DE102020108051.4A DE102020108051A DE102020108051A8 DE 102020108051 A8 DE102020108051 A8 DE 102020108051A8 DE 102020108051 A DE102020108051 A DE 102020108051A DE 102020108051 A8 DE102020108051 A8 DE 102020108051A8
- Authority
- DE
- Germany
- Prior art keywords
- making
- methods
- storage devices
- magnetic storage
- magnetic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B61/00—Magnetic memory devices, e.g. magnetoresistive RAM [MRAM] devices
- H10B61/20—Magnetic memory devices, e.g. magnetoresistive RAM [MRAM] devices comprising components having three or more electrodes, e.g. transistors
- H10B61/22—Magnetic memory devices, e.g. magnetoresistive RAM [MRAM] devices comprising components having three or more electrodes, e.g. transistors of the field-effect transistor [FET] type
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N50/00—Galvanomagnetic devices
- H10N50/01—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N50/00—Galvanomagnetic devices
- H10N50/10—Magnetoresistive devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N50/00—Galvanomagnetic devices
- H10N50/80—Constructional details
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N50/00—Galvanomagnetic devices
- H10N50/80—Constructional details
- H10N50/85—Magnetic active materials
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mram Or Spin Memory Techniques (AREA)
- Hall/Mr Elements (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US16/367,136 | 2019-03-27 | ||
US16/367,136 US11737368B2 (en) | 2019-03-27 | 2019-03-27 | Magnetic memory devices and methods of fabrication |
Publications (2)
Publication Number | Publication Date |
---|---|
DE102020108051A1 DE102020108051A1 (de) | 2020-10-01 |
DE102020108051A8 true DE102020108051A8 (de) | 2020-12-31 |
Family
ID=72604969
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE102020108051.4A Pending DE102020108051A1 (de) | 2019-03-27 | 2020-03-24 | Magnetische Speichervorrichtungen und Verfahren zu ihrer Herstellung |
Country Status (2)
Country | Link |
---|---|
US (1) | US11737368B2 (de) |
DE (1) | DE102020108051A1 (de) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11502188B2 (en) | 2018-06-14 | 2022-11-15 | Intel Corporation | Apparatus and method for boosting signal in magnetoelectric spin orbit logic |
US11476412B2 (en) | 2018-06-19 | 2022-10-18 | Intel Corporation | Perpendicular exchange bias with antiferromagnet for spin orbit coupling based memory |
US11616192B2 (en) | 2018-06-29 | 2023-03-28 | Intel Corporation | Magnetic memory devices with a transition metal dopant at an interface of free magnetic layers and methods of fabrication |
US11737368B2 (en) * | 2019-03-27 | 2023-08-22 | Intel Corporation | Magnetic memory devices and methods of fabrication |
US11063088B2 (en) * | 2019-12-06 | 2021-07-13 | Intel Corporation | Magnetic memory devices and methods of fabrication |
KR20210075467A (ko) * | 2019-12-13 | 2021-06-23 | 에스케이하이닉스 주식회사 | 전자 장치 |
US11302372B2 (en) * | 2020-02-07 | 2022-04-12 | International Business Machines Corporation | MTJ stack containing a top magnetic pinned layer having strong perpendicular magnetic anisotropy |
JP2022049406A (ja) * | 2020-09-16 | 2022-03-29 | キオクシア株式会社 | 磁気記憶装置 |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4843930B2 (ja) * | 2004-10-27 | 2011-12-21 | 富士電機株式会社 | 半導体装置およびその製造方法 |
US7973349B2 (en) | 2005-09-20 | 2011-07-05 | Grandis Inc. | Magnetic device having multilayered free ferromagnetic layer |
KR101849677B1 (ko) * | 2011-05-19 | 2018-04-19 | 삼성전자주식회사 | 자기 터널 접합 소자 |
US8786039B2 (en) * | 2012-12-20 | 2014-07-22 | Samsung Electronics Co., Ltd. | Method and system for providing magnetic junctions having engineered perpendicular magnetic anisotropy |
WO2017052631A1 (en) * | 2015-09-25 | 2017-03-30 | Intel Corporation | Psttm device with multi-layered filter stack |
CN109155360A (zh) * | 2016-02-05 | 2019-01-04 | 汉阳大学校产学协力团 | 存储器件 |
US20170309813A1 (en) * | 2016-04-26 | 2017-10-26 | Globalfoundries Singapore Pte. Ltd. | Integrated circuits with magnetic tunnel junctions and methods for producing the same |
JP7098606B2 (ja) * | 2016-09-08 | 2022-07-11 | モジュメタル インコーポレイテッド | ワークピース上に積層コーティングを提供するためのプロセス、およびそれから製造される物品 |
US11192102B2 (en) | 2017-02-28 | 2021-12-07 | Lmsera Inc. | Microfluidic device |
EP3460811B1 (de) | 2017-09-20 | 2020-06-17 | IMEC vzw | Magnetische schichtstruktur für magnettunnelbauelement |
FR3077917B1 (fr) * | 2018-02-15 | 2022-02-04 | Commissariat Energie Atomique | Empilement magnetique, jonction tunnel, point memoire et capteur comportant un tel empilement |
US10468456B2 (en) | 2018-02-17 | 2019-11-05 | Globalfoundries Inc. | Integrated circuits including magnetic random access memory structures having reduced switching energy barriers for differential bit operation and methods for fabricating the same |
US10516096B2 (en) * | 2018-03-28 | 2019-12-24 | Globalfoundries Singapore Pte. Ltd. | Magnetic random access memory structures, integrated circuits, and methods for fabricating the same |
US11346899B2 (en) | 2018-07-06 | 2022-05-31 | Infineon Technologies Ag | Magnetoresistive sensor with reduced stress sensitivity |
US11476408B2 (en) * | 2018-09-27 | 2022-10-18 | Intel Corporation | Spin orbit torque (SOT) memory devices with enhanced magnetic anisotropy and methods of fabrication |
US20200313074A1 (en) * | 2019-03-27 | 2020-10-01 | Intel Corporation | Magnetic memory devices and methods of fabrication |
US11737368B2 (en) * | 2019-03-27 | 2023-08-22 | Intel Corporation | Magnetic memory devices and methods of fabrication |
US10943950B2 (en) * | 2019-03-27 | 2021-03-09 | Intel Corporation | Magnetic memory devices with enhanced tunnel magnetoresistance ratio (TMR) and methods of fabrication |
US11557629B2 (en) * | 2019-03-27 | 2023-01-17 | Intel Corporation | Spin orbit memory devices with reduced magnetic moment and methods of fabrication |
-
2019
- 2019-03-27 US US16/367,136 patent/US11737368B2/en active Active
-
2020
- 2020-03-24 DE DE102020108051.4A patent/DE102020108051A1/de active Pending
Also Published As
Publication number | Publication date |
---|---|
US20200313084A1 (en) | 2020-10-01 |
US11737368B2 (en) | 2023-08-22 |
DE102020108051A1 (de) | 2020-10-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
R079 | Amendment of ipc main class |
Free format text: PREVIOUS MAIN CLASS: H01L0043080000 Ipc: H10N0050100000 |