DE102020103628A1 - Device for cooling electronic components - Google Patents

Abstract

The present invention relates to a device (100) for cooling electronic components (105), a first layer (101) and a second layer (102) being arranged parallel or at least substantially parallel to one another, with between the first layer (101) and a profile element (103) is arranged on the second layer (102), the profile element (103) being profiled in such a way that a volume between the first layer (101) and the second layer (102) is divided into first channels (110 ), second channels (120) and third channels (130), with first transitions (115) in the profile element (103) each producing a fluid connection between the individual first channels (110) and adjacent second channels (120) and wherein second transitions (125) in the profile element (103) each produce a fluid connection between the individual second channels (120) and respectively adjacent third channels (130).

Description

The present invention relates to a device for cooling electronic components.

State of the art

In the present context, electrical or electronic components are to be understood as individual electronic elements or electronic components such as microprocessors or power switches such as diodes, transistors, etc. Inverters, microcontrollers, control devices, batteries, etc.

Lossy energy conversion processes take place in such components, in the course of which high power losses occur in the form of heat. For safe operation and also a long service life, it is important to be able to dissipate such power losses effectively and at a low temperature.

For this purpose, cooling devices or heat sinks are known on which electronic components can be arranged and which are mostly flowed through by a cooling medium which absorbs and dissipates waste heat from the components.

Disclosure of the invention

According to the invention, a device for cooling electronic components with the features of claim 1 is proposed. Advantageous refinements are the subject matter of the subclaims and the description below.

The device comprises a first layer and a second layer, which are arranged parallel or at least substantially parallel to one another. These layers can be flat or cylindrical (e.g. cooling jacket of a cylindrical electrical machine). For example, these layers can each be formed from sheet metal. However, these layers can also be plastic layers or plastic plates, which in particular have an electrically insulating effect.

A profile element is arranged between the first layer and the second layer, which can be designed, for example, as a profiled sheet metal or plastic element. In particular, this profile element or this profile body is provided as a profiled separating element which divides a volume between the first and second layer into different sections.

The profile element is profiled in such a way that the volume between the first layer and the second layer is divided into first channels, second channels and third channels that run parallel to one another. These first, second and third channels represent in particular adjacent, juxtaposed sections with parallel main directions of extent.

First transitions in the profile element each produce a fluid connection between the individual first channels and each adjacent second channel. By means of second transitions in the profile element, a fluid connection is established between the individual second channels and respectively adjacent third channels. These first and second transitions are each expediently designed as openings in the profile element, so that in each case a direct fluid connection is established between the respective channels.

The first and second layers expediently form an upper side and a lower side of a fluid-tight closed, in particular cuboid or at least essentially cuboid volume. In particular, the two layers define a flat liquid channel through which a cooling fluid can be passed. By means of the profile element, this liquid channel is expediently divided into individual channels through which a cooling fluid can be passed in an expedient manner.

In particular, the first, second and third channels are each identical in shape or at least substantially identical, but differ in particular in how they are arranged in the device relative to the component to be cooled and also in particular in which channels and in which way are in fluid communication with each other.

The individual first channels are in direct fluid connection in particular with one or two adjacent second channels. Correspondingly, the individual third channels are in direct fluid connection, in particular with one or two adjacent second channels. Each second channel is expediently in direct fluid connection with an adjacent first channel and with an adjacent third channel. The first channels and the third channels are expediently not in direct fluid connection with one another and are separated from one another in particular by the second channels.

This results in the possibility of directing a cooling fluid into the individual first channels (inflow or cold side), which flows through the first passages into the second channels (which the heat from the component to be cooled) and is distributed from there through the second openings in turn into the third channels (drain or hot side), from which the cooling fluid can be derived. Expediently, the first channels can each be connected to a coolant supply and the third channels can each be connected to a coolant discharge. The first channels expediently represent an inflow or a coolant distribution through which cooling fluid can be passed into the cooling device. Fresh, cool cooling fluid can thus expediently be distributed into the second channels from the first channels or inflows. The second channels particularly expediently represent cooling channels in which the actual cooling of the component takes place, ie cooling fluid in these second channels absorbs waste heat given off by the component to be cooled in particular. Heated cooling fluid flows from the second channels or cooling channels into the third channels, which in particular represent an outflow through which heated cooling fluid flows out of the cooling device or is carried away.

In particular, a plurality of first and second transitions can be provided for each second channel, which are distributed over the entire length of the respective second channel at appropriate distances from one another. In this way, fresh fluid can expediently always be supplied over the entire length of the second channels and heated fluid can be removed. In particular, equally conditioned cooling fluid can thus always be passed over downstream areas or sections of the component to be cooled in order to cool the component uniformly over its entire surface and at the same temperature. In particular, it can be avoided that downstream only cooling fluid with a predominantly high temperature can be passed over the component, which can only absorb thermal energy at higher temperatures and can no longer effectively cool the component there.

The profile element is advantageously profiled in such a way that the first channels and the third channels each have no or at least hardly any contact with the second layer and that the second channels each have no or at least hardly any contact with the first layer. Cooling fluid in the first channels and in the third channels is therefore expediently largely isolated from the second layer. In the second channels, the cooling fluid is expediently in direct contact with the second layer and, in particular, is passed directly over this second layer. In particular, the cooling device is arranged with this second layer on the component to be cooled, so that the cooling fluid in the second channels is conducted over the component and can absorb waste heat. The cooling device can thus expediently be arranged on a component to be cooled in such a way that the second channels are arranged on a side of the device facing the component to be cooled and that the first channels and the third channels are each arranged on a side of the device facing away from the component to be cooled are arranged. This construction can be achieved particularly easily by a profile element with a zigzag cross-section.

Cooling fluid can thus expediently be guided in the first channels isolated from the second layer and thus isolated from the component to be cooled, so that the coolant temperature in the first channels does not or at least hardly increases. If the cooling fluid passes from the first into the second channels, the cooling fluid has a low temperature and can effectively absorb waste heat from the component in the second channels. In the third channels, the heated cooling fluid is again isolated from the component and can be removed from the cooling device without heat being able to pass back to the component. Furthermore, it is particularly expedient for the first channels to each have no contact with the third channels. The first channels and the third channels are therefore particularly expediently isolated from one another. Cool cooling fluid in the first channels is thus in particular not heated by warm cooling fluid in the third channels.

Each first channel is preferably adjacent to two second channels. Furthermore, every third channel is preferably adjacent to two second channels. Every second channel is preferably adjacent to a first and to a third channel. Cooling fluid can thus be supplied from each first channel into the respective two adjacent second channels. Correspondingly, in every third channel, heated cooling fluid can be discharged from the respective two adjacent second channels. For every second channel, in particular, an adjacent first channel is provided as an inflow for fresh, cool cooling fluid and, furthermore, an adjacent third channel is provided as an outflow for heated cooling fluid. The first and third channels are further expediently isolated from one another by the second channels, so that cool fluid in the first channels is not heated by heated fluid in the third channels. An advantageous arrangement of the i-th type channels next to one another is accordingly: i = 1, 2, 3, 2, 1, 2, 3, 2, 1, etc.

A plurality of corresponding first or second transitions is advantageously provided in each first, second and third channel. In particular, the respective transitions per channel are provided at regular intervals, viewed in the main direction of extent of the channels. Thus, in particular, cool cooling fluid is fed into or out of the second channels at regular intervals. heated cooling fluid discharged from the second channels.

The respective first transitions to the respective two adjacent second channels are advantageously provided offset from one another in the individual first channels. Correspondingly, the respective second transitions to the respective two adjacent second channels are provided in each case offset to one another in the individual third channels. In particular, the respective transitions per first or second channel, viewed in the main direction of extent of the channels, are each arranged at different positions. Thus, in particular, an effective distribution of cooling fluid from the first channels into the second channels is made possible and, furthermore, in particular an effective outflow of cooling fluid from the second channels into the third channels.

The second channels are preferably each subdivided into individual sub-channels along their main direction of extent. Each second channel thus has, in particular, a multiplicity of sub-channels located one behind the other when viewed in the main direction of extent of the channel. In particular, the individual sub-channels of every second channel are separated from one another by a barrier, partition or the like. In particular, each sub-channel can be supplied with cool cooling fluid from one of the first channels and, accordingly, warm cooling fluid can be discharged from each sub-channel into one of the third channels. In particular, cool coolant can thus always be supplied over the entire length of the second channels in their main direction of extent, so that areas or sections of the component located downstream are also effectively cooled.

Each sub-channel is preferably in fluid connection with one of the first channels through one of the first transitions and in fluid connection with one of the third channels through one of the second transitions. The individual second channels are thus each subdivided into a plurality of short partial or cooling channels, which are in direct fluid connection with the respective adjacent first channel as an inflow and the respective adjacent third channel as an outflow.

The first transitions and the second transitions are preferably each produced by deformations of the material of the profile element. Furthermore, the second channels are preferably each subdivided into the sub-channels by these deformations. In particular, the material of the profile elements is deformed at corresponding points in such a way that openings between the respective channels are created as respective breakthroughs. Furthermore, the material is deformed at these points, in particular into the respective second channels, so that there it forms partitions or barriers in particular to delimit the individual sub-channels. For example, the material is punched out or cut out in a predetermined shape at these points and correspondingly folded, in particular in such a way that corresponding excess punched-out material is folded into the second channels and forms partitions or barriers there. The profile element can thus be produced in a low-cost and cost-effective manner, for example from a flat sheet metal or plastic element, which is punched and folded accordingly in order to produce the corresponding profile with corresponding openings.

The profile element is preferably produced by punching and folding a flat layer, for example a flat metal layer, preferably a sheet metal, or a flat plastic element. In particular, openings for the later transitions can be produced by punching. By subsequently folding the flat layer, in particular, it is correspondingly profiled and brought into the predetermined shape of the profile element

The profile element is preferably folded in a wave shape, in particular in the form of a triangular wave (zigzag). In particular, the individual channels thus have a triangular or at least substantially triangular cross-section. The cross-sections of the second channels are in particular oriented opposite or mirror-inverted to the cross-sections of the first and third channels.

For the first transitions and the second transitions, material of the profile element is preferably deformed between folding edges. The material between the folds represents, in particular, partition walls of individual channels. The material is expediently punched out accordingly before folding and is correspondingly deformed or folded in the course of the folding process. As explained above, the material deformed for the transitions can expediently represent partition walls of the sub-channels of the second channels.

According to an advantageous embodiment, a first profile element and a second profile element are arranged between the first layer and the second layer, so that the volume between the first layer and the second layer through the first profile element in a first part with corresponding first, second and third channels and is divided by the second profile element into a second part with corresponding first, second and third channels. In particular, these two profile elements are identical or structurally identical. A further third layer can be provided between the two profile elements, which in particular is parallel or at least substantially is arranged parallel to the first layer and the second layer. In particular, the number of channels is doubled by this second profile element. It is therefore particularly expedient to provide twice the number of second channels, in particular to cool two components. In particular, the two profile elements are profiled and arranged in such a way that the second channels of the two parts are each in contact with the first or the second layer. In particular, the first and third channels of the two parts each have no or at least hardly any contact with the first and second layers. Cooling fluid passed through the respective second channels is thus in contact with one of the two layers. Cooling fluid can expediently be guided in the respective second channels along each of the two layers. A first component to be cooled can expediently be arranged on the first layer and a second component to be cooled on the second layer.

The first profile element and the second profile element are advantageously arranged with respect to one another in such a way that the first part and the second part are symmetrical to one another with respect to a plane which is parallel to the first layer and parallel to the second layer. As explained above, a third layer can be provided between the two profile elements, which is arranged in particular in this mirror plane. However, the profile elements can also be arranged one above the other without such a third layer. In this case, the first and the third channels of the first part and of the second part are in particular each connected to form common channels. The second channels of the first part and the second part are expediently isolated from one another by the profile elements.

In a particularly preferred manner, the cooling device is suitable for electrical or electronic components in the (motor) vehicle sector, in particular for control devices, output stages, semiconductor circuits, battery modules, etc. Operation of the vehicle or individual vehicle functions can be achieved. Furthermore, wear can be kept to a minimum and the service life can be increased, as a result of which costly repairs and visits to the workshop can be avoided.

Further advantages and embodiments of the invention emerge from the description and the accompanying drawing.

The invention is shown schematically in the drawing using exemplary embodiments and is described below with reference to the drawing.

Figure list

• 1 shows schematically a preferred embodiment of a device according to the invention for cooling electronic components in a perspective view (a), in a cross-sectional view (b) and in a longitudinal sectional view (c).
• 2 shows schematically a plastic layer from which a profile element for a preferred embodiment of a device according to the invention can be produced.
• 3 shows schematically a preferred embodiment of a device according to the invention for cooling electronic components in a cross-sectional view.

Embodiment (s) of the invention

In the figures, the same reference symbols denote the same or structurally identical elements.

In 1 a preferred embodiment of a device according to the invention for cooling electronic components is shown schematically and with 100 designated. In it shows 1a the cooler 100 in a perspective view, 1b in a cross-sectional view and 1c in a longitudinal sectional view along the in 1b shown section line AA.

The cooler 100 is on an electronic component to be cooled 105 arranged, for example on a heat sink or a circuit carrier or a component, for example in a control unit of a (motor) vehicle.

The cooler 100 has a first layer 101 and a second layer arranged parallel to this 102 on, with the layers 101 , 102 each can be electrically insulating plastic layers. If an insulating effect is not necessary, it can also be a sheet of metal.

Between the first layer 101 and the second layer 102 is a profile element 103 arranged, which is designed as a stamped and folded sheet metal or plastic layer.

The profile element 103 is so profiled and between the layers 101 , 102 arranged that a volume between the layers 101 , 102 into first channels that run parallel to one another 110 , second channels 120 and third channels 130 is divided.

The profile element is folded in the shape of a triangular wave (zigzag) and has an at least substantially triangular cross-section. Correspondingly, the first, second and third channels 110 , 120 , 130 a substantially triangular cross-section.

Every first channel 110 is each to two second channels 120 adjacent. Every third channel is the same 130 to two second channels 120 adjacent. Every second channel is therefore a first channel 110 and to a third channel 130 adjacent.

As in 1a and 1b can be seen show the first and third channels 110 , 130 no or at least hardly any contact with the second (lower) layer 102 on. The second channels point accordingly 120 in each case no or at least hardly any contact with the first (upper) layer 101 on.

The first and third channels 110 , 130 are thus through the second channels 120 compared to the second layer 102 isolated. Furthermore, the first are channels 110 from the third channels 130 through the second layer 102 isolated.

In the profile element 103 openings or transitions are also provided through which fluid connections are created between individual channels. Through the first transitions 115 in the profile element 103 are fluid connections between the individual first channels 110 and respective adjacent second channels 120 produced. Through second transitions 125 in the profile element 103 are each fluid connections between the individual second channels 120 and respective adjacent third channels 130 produced.

As in particular in 1 c can be seen, every first channel is available 110 through corresponding first transitions 115 with the two adjacent second channels 120 in fluid communication. Every third channel stands accordingly 130 by corresponding second transitions 125 with the two adjacent second channels 120 in fluid communication.

The first and second passages 115 , 125 are made in such a way that the material of the profile element 103 is deformed or folded. As in 1c can be seen, is the material of the profile element 103 each in the second channels 120 folded in, so that the deformed or folded material in each of the second channels separates walls 122 which are the second channels 120 each in a large number of sub-channels 121 subdivide each in the main direction of extent of the second channels 120 lying one behind the other. Each sub-channel 121 thus stands in each case through a first transition 115 in fluid communication with an adjacent first channel 110 and in each case by a second transition 125 in fluid communication with an adjacent third channel 130 .

As also in 1 c can be seen are in the first individual channels 110 the respective first transitions 115 to the respective two adjacent second channels 120 each arranged offset to one another. Correspondingly are also in the individual third channels 130 the respective second transitions 125 to the respective two adjacent second channels 120 arranged offset to one another.

As indicated by the individual arrows in 1a and 1c indicated, a cooling fluid can through the individual channels 110 , 120 , 130 the cooling device 110 be directed. Fresh, cool cooling fluid flows through the first channels 110 into the device 100 guided. From the first channels 110 Fresh cooling fluid comes out through the first passages 115 each in the second channels 120 or in the individual sub-channels 121 . Because the cooling fluid is in the second channels 120 or the sub-channels 121 in direct contact with the second layer 102 where the electronic component to be cooled is located 105 is arranged, the cooling fluid can absorb the waste heat generated by the component here.

Heated cooling fluid then passes out of the sub-channels 121 through the second transitions 125 into the third channels 130 , from which the heated cooling fluid from the device 100 can be discharged. The first channels 110 The second channels thus serve as an inflow or coolant distribution 120 as the actual cooling channels and the third channels 130 as a drain.

The first channels 110 or the cooling fluid contained therein is not in direct contact with the second layer 102 so that the cooling fluid is not warmed up by the heat of the component before it enters the second channels 120 got. Since the first channels 110 further through the second channels 120 from the third channels 130 are isolated, this will be in the first channels 110 located cooling fluid also not through the warm fluid in the third channels 130 warmed up.

Due to the large number of short sub-channels 121 can along the entire length in the main direction of extent of the second channels 120 Always fresh, cool cooling fluid over the component to be cooled 105 be guided. This means that the entire component can be cooled evenly and effectively 105 be made possible, also from downstream areas of the component 105 .

2 shows schematically a flat plate 200 , from which a profile element is formed by punching and folding 103 for a preferred embodiment of a device according to the invention 100 can be produced.

The solid lines 210 each show punched lines or punched edges on which the plate 200 is cut or punched. The dashed lines 220 represent folding cates or bending edges at which these punched areas are folded in order to form the first and second transitions.

The dashed lines labeled 230 represent folding edges or bending edges along which the plastic layer 200 is to be folded to the triangular wave-shaped profile of the profile element 103 to create.

In 3 a further preferred embodiment of a cooling device according to the invention is shown in a schematic cross-sectional view and denoted by 100 '.

According to the in relation to 1 explained cooling device 100 , also shows the in 3 shown cooling device 100 ' between two layers 101 and 102 a first profile element 103 on and also a second profile element 103 ' , the two profile elements 103 and 103 ' are designed in particular structurally identical.

The volume between the two layers 101 , 102 is through the first profile element 103 in a first part 301 with first, second and third channels 110 , 120 , 130 divided and by the second profile element 103 ' in a second part 302 with corresponding first, second and third channels 110 ' , 120 ' , 130 ' .

The profile elements 103 , 103 ' are arranged to one another in such a way that the first part 301 and the second part 302 symmetrical with respect to a plane 302 are which are parallel to the first layer 101 and parallel to the second layer 102 is.

In the plane 303 another layer can be provided, which the two parts 301 and 302 separates from each other. However, it is also not possible for such a separating layer to be provided, so that the first channels 110 , 110 ' of the first part 301 as well as the third channels 130 , 130 ' of the second part 302 each form common channels.

The first channels 110 , 110 ' as well as the third channels 130 , 130 ' or the cooling fluid contained therein are in each case not in contact with the first layer 101 and the second layer 102 and are through the second channels 120 , 120 ' from the locations 101 , 102 isolated. Cooling fluid in the second channels 120 , 120 ' however, stands directly with the first layer 101 or the second layer 102 in contact.

Thus, the device 100 ' for the simultaneous cooling of two electronic components 105 , 105 ' used, being at each of the layers 101 , 102 a component 105 or. 105 ' can be arranged.

Claims (13)

Device (100, 100 ') for cooling electronic components (105, 105'), wherein a first layer (101) and a second layer (102) are arranged parallel or at least substantially parallel to one another, wherein a profile element (103) is arranged between the first layer (101) and the second layer (102), wherein the profile element (103) is profiled in such a way that a volume between the first layer (101) and the second layer (102) is divided into first channels (110), second channels (120) and third channels (130) running parallel to one another is, wherein a fluid connection is established between the individual first channels (110) and respectively adjacent second channels (120) through first transitions (115) in the profile element (103) and one in each case through second transitions (125) in the profile element (103) Fluid connection between the individual second channels (120) and respectively adjacent third channels (130) is established. Device according to Claim 1 wherein the profile element is profiled in such a way that the first channels (110) and the third channels (130) have no contact with the second layer (102) and that the second channels (120) have no contact with the first layer (101) . Device according to Claim 1 or 2 , wherein each first channel (110) is adjacent to two second channels (120), each third channel (130) is adjacent to two second channels (120) and each second channel (120) is each to a first channel ( 110) and is adjacent to a third channel (130). Device according to one of the preceding claims, wherein a plurality of corresponding first or second transitions (115, 125) is provided in each first, second and third channel (110, 120, 130). Device according to Claim 3 and 4th , wherein in the individual first channels (110) the respective first transitions (115) to the respective two adjacent second channels (120) are provided offset from one another and wherein in the individual third channels (130) the respective second transitions (125) close the respective two adjacent second channels (120) are provided offset from one another. Device according to one of the preceding claims, wherein the second channels (120) along their Main direction of extent are each divided into individual sub-channels (121). Device according to Claim 6 wherein each sub-channel (121) is in fluid connection with one of the first passages (110) through one of the first passages (115) and is in fluid connection with one of the third passages (130) through one of the second passages (125). Device according to Claim 6 or 7th , wherein the first transitions (115) and the second transitions (125) are each produced by deformations of the material of the profile element (103) and these deformations (122) each subdivide the second channels into the sub-channels (121). Device according to one of the preceding claims, wherein the profile element (103) is produced by punching (210) and folding (220, 230) a flat sheet (200). Device according to one of the preceding claims, wherein the profile element (103) is folded in a wave shape, in particular in the form of a triangular wave. Device according to Claim 10 wherein for the first transitions (115) and the second transitions (125) each material of the profile element (103, 200) is deformed between folding edges (220, 230). Device according to one of the preceding claims, wherein a first profile element (103) and a second profile element (103 ') are arranged between the first layer (101) and the second layer (102), so that the volume between the first layer (101) and the second layer (102) through the first profile element (103) into a first part (301) with corresponding first, second and third channels (110, 120, 130) and through the second profile element (103 ') into a second part ( 302) is divided with respective first, second and third channels (110, 120, 130). Device according to Claim 12 , wherein the first profile element (103) and the second profile element (103 ') are arranged to one another in such a way that the first part (301) and the second part (302) are symmetrical to one another with respect to a plane (303) which is parallel to the first Layer (301) and parallel to the second layer (302).

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