DE102020005115A1 - Method for producing a component arrangement and component arrangement - Google Patents

Abstract

The invention relates to a method for producing a component arrangement (3), in which a first component (1) and a second component (2) are fixed to one another in a cohesive manner by producing a soldered connection device (7) between the components (1, 2). According to the invention, the soldered connection device (7) is produced by producing a first soldered connection unit (10) in a first soldering zone (9) of the soldered connection device (7) using a first soldering tool (12, 13) and a second soldered connection unit (11) in a second soldering zone (9) is produced by means of a second soldering tool (12, 13). The invention also relates to a component arrangement (3) which has a first component (1) and a second component (2) which have been fixed to one another in a cohesive manner using a method.

Description

According to patent claim 1, the invention relates to a method for producing a component arrangement. According to patent claim 7, the invention relates to a component arrangement which has been produced by means of the method.

In order to connect components, in particular aluminum components, to one another in a particularly reliable and cohesive manner, soldering is known from the prior art. In connection with aluminum components, soldering often takes place in an oven - i.e. by means of an oven soldering process. However, such a furnace soldering process is fraught with problems, for example, due to the fact that the components to be soldered or joined together have to be brought to the soldering temperature in their entirety, even in areas of the components in which no soldered connection is formed at all. As a result, furnace soldering is particularly expensive and, in particular, energy-intensive. In the furnace soldering process, a large number of components are often soldered simultaneously by bringing this large number of components into a common furnace muffle and exposing them to the soldering temperature there. If the furnace or the soldering furnace has an adverse effect on the components to be soldered in the furnace muffle, for example if the soldering furnace is defective or a furnace atmosphere is contaminated by foreign substances, all components arranged in the furnace muffle are exposed to these disadvantageous or undesirable effects. As a result, it can happen that all of the components or structural elements arranged in the furnace muffle become scrap or require a particularly complex after-treatment.

Components that are usually soldered using such a furnace soldering process are made of an aluminum alloy from group 3000 (see DIN EN 573-3/4). However, these only have low strength characteristics; as a rule, the 0.2% yield point is less than 80 N/mm ² (Newtons per square millimeter). However, there is a need to solder high-strength aluminum components to one another. Precipitation-hardenable magnesium-alloyed aluminum alloys (from group 6000) can be produced with higher strength through suitable heat treatments, but are difficult to solder using the furnace soldering process. Although soldering in a vacuum is possible, it is economically unfavorable for large components and, in particular, large quantities. Furthermore, the use of a flux is conceivable, but this is often harmful to the environment and usually has a highly corrosive effect when the corresponding component is used in service.

In order to bring such an aluminum-magnesium-silicon alloy, i.e. an aluminum-based alloy from group 6000, or other precipitation-hardenable alloys such as copper-alloyed aluminum alloys (group 2000) or zinc-alloyed aluminum alloys (group 7000) to a desired high strength, components are made of to artificially age the aluminum alloys mentioned after the furnace soldering process. Such an artificial aging is usually carried out by exposing the corresponding components to an artificial aging temperature of approximately 150° C. (degrees Celsius) to 250° C. for a period of approximately 30 minutes to several hours. A prerequisite for successful artificial aging is that the components made of the corresponding aluminum alloys are in a supersaturated solid solution state before artificial aging. This in turn presupposes that the corresponding components are quenched or cooled particularly quickly after the soldering process or after a solution annealing process (solution annealing temperature around 500 °C) carried out after the soldering process. However, particularly rapid quenching or particularly rapid cooling is made more difficult if the components have previously been fully heated to the brazing or solution annealing temperature. Under certain circumstances, an achievable quenching rate or cooling rate on the corresponding component is not sufficient to produce a sufficiently high supersaturation state. In addition, a particularly high level of component distortion is to be expected as a result of quenching.

Furthermore, it is known to heat the components to be soldered together only in a locally limited manner in order to carry out the soldering process. As a result, the energy consumption is lower compared to a furnace soldering process. Such locally limited soldering can be achieved, for example, by means of induction soldering and/or laser soldering.

Soldering is fundamentally inherent in the fact that the soldering process temperature or soldering temperature must be set and maintained with particular precision. Especially when producing larger soldering zones and/or when soldering components with complex geometries, it is often difficult with induction soldering processes to reliably maintain the often narrow soldering temperature range at every point in the soldering zone, which makes it difficult or time-consuming to produce a high-quality soldering zone.

With laser soldering, the amount of energy introduced can be controlled via the laser power and the advance of the laser soldering tool or regulated via pyrometers. So-called web soldering is also known from vehicle construction, in particular series vehicle construction, with the solder material usually being introduced into the laser focus as wire or strip material and melting there. Parallel to this, using the laser the component surface is also heated to the soldering temperature.

the DE 10 2013 002 628 A1 discloses a method for closing a housing, wherein at least two housing elements can be connected using a joining process, wherein a connecting material between the housing elements for connecting them is prepared, for example melted, and at least one of the housing elements has a local reduction in thermal conductivity, so that a Heat propagation is reduced in the at least one housing element. However, providing such a housing element, which has a locally reduced thermal conductivity, is particularly complex.

the DE 10 2017 205 117 A1 proposes a method for producing a composite component comprising at least two components. At least one of the components is multi-layered and has a functional element. The functional element enables the second component to be fixed in a materially bonded manner at a joint of the first component on the first component, with the functional element comprising at least one joining material forming a layer of the second component. The two components are then aligned with one another and joined to one another in a cohesive manner by thermal joining between the first component and the second component, in that the functional element designed as a joining material is melted. In this case, the thermal joining of the components includes in particular a furnace process, which entails the disadvantages set out above.

The object of the present invention is to provide a particularly efficient soldering method for the material connection of two components and a component arrangement.

According to the invention, this object is achieved by a method having the features specified in patent claim 1 and by a component arrangement having the features specified in patent claim 7 . Advantageous configurations with expedient developments of the invention are specified in the remaining patent claims. Features, advantages and advantageous configurations of the method according to the invention are to be regarded as features, advantages and advantageous configurations of the component arrangement according to the invention and vice versa.

According to the invention, a method for producing a component arrangement is therefore proposed, in which a first component and at least one second component are fixed to one another in a materially bonded manner, in that a soldered connection device is produced between the components. This means that in order to produce the component arrangement, the components of the component arrangement are soldered to one another. The component arrangement can also have further components in addition to the first component and the second component. By way of example, the method by means of which at least two of the components of the component arrangement are soldered to one another in a materially bonded manner is described in connection with the first component and the second component; however, it is to be understood that the method can also be used between other of the components of the component assembly.

In order to provide a particularly efficient soldering method for materially connecting the two components, the invention provides that the soldered connection device is produced by producing a first soldered connection unit in a first soldering zone of the soldered connection device using a first soldering tool. Furthermore, the method provides that at least one second soldered connection unit is produced in a second soldering zone, which is different from the first soldering zone, by means of a second soldering tool, which is different from the first soldering tool. This means that the soldered connection device in the finished component arrangement has the first soldered connection unit and at least the second soldered connection unit, which have been produced using two different soldering tools.

At least one component of the component arrangement consists of an aluminum-based alloy, which means that the corresponding component consists of at least 50 percent by weight of aluminum and has at least one additional alloy element. It is particularly preferred if the aluminum-based alloy is a heat-treatable aluminum alloy, such as a group 2000, group 6000 or group 7000 aluminum alloy. As a result, advantageously high strengths can be produced at least on the corresponding component. High strength is understood here to mean a 0.2% yield point of at least 150 N/mm ² , in particular at least 180 N/mm ² .

The advantage of the soldering process is that, due to the operating principle, a material structure of the components involved in the soldering process is not affected or is only affected to a particularly small extent. In particular, the soldering process--unlike a welding process--does not produce a hole or pore in/on the components to be connected. As a result, particularly tight connections, ie soldered connections, can be produced between the components. This is particularly advantageous when it comes to the component arrangement with is produced by means of the method is a component arrangement through which a fluid can flow, such as a heat exchanger (“radiator”), in particular of a motor vehicle. It is also conceivable to use the method to produce the component arrangement, which then includes a heating and/or cooling body, a battery tray (with or without integrated cooling), a flat reinforcement and/or wall element, an electric motor and/or gear housing (with or without integrated cooling).

Furthermore, the method according to the invention makes it possible to produce particularly dimensionally stable component arrangements, with the component arrangement preferably being a particularly large or particularly large-area component arrangement. “Large-area” is to be understood here as meaning that the entire outer surface area of the component arrangement is particularly large in relation to the overall volume of the component arrangement.

Furthermore, the invention relates to a component arrangement which has a first component and at least one second component which have been fixed to one another in a materially bonded manner by means of a method designed in accordance with the above description.

Further advantages, features and details of the invention result from the following description of a preferred exemplary embodiment and from the drawing. The features and combinations of features mentioned above in the description and the features and combinations of features mentioned below in the description of the figures and/or shown alone in the figures can be used not only in the combination specified in each case, but also in other combinations or on their own, without going beyond the scope of the leave invention.

• 1 eine schematische Ansicht eines ersten Bauteils und eines zweiten Bauteils, die stoffschlüssig aneinander fixiert werden, um eine Bauteilanordnung herzustellen;
• 2 eine schematische und gemäß der in 1 eingezeichneten Schnittebene II-II geschnittene Ansicht der Bauteilanordnung mit einem Lötbereich;
• 3 eine schematische und gemäß der in 1 eingezeichneten Schnittebene II-II geschnittene Ansicht der Bauteilanordnung mit einer weiteren Ausführungsform des Lötbereichs; und
• 4 eine schematische Ansicht der Bauteilanordnung mit auf den Lötbereich einwirkenden Lötwerkzeugen.

while showing

• 1 a schematic view of a first component and a second component which are cohesively fixed to one another in order to produce a component arrangement;
• 2 a schematic and according to in 1 drawn section plane II-II sectioned view of the component arrangement with a soldering area;
• 3 a schematic and according to in 1 drawn section plane II-II sectioned view of the component arrangement with a further embodiment of the soldering area; and
• 4 a schematic view of the component arrangement with soldering tools acting on the soldering area.

Elements that are the same or have the same function are provided with the same reference symbols in the figures.

A component arrangement 3 having a first component 1 and a second component 2 and a method for producing that component arrangement 3 are described jointly below.

1 shows a schematic view of the first component 1 and the second component 2, which are fixed to one another in a materially bonded manner in order to produce the component arrangement 3.

At least one of the components 1, 2, preferably the components 1, 2, are made of a metallic material, in particular an aluminum-based alloy. In particular, the material of the respective component 1, 2 consists of a precipitation-hardenable aluminum-based alloy, for example from group 6000. It is also conceivable that the corresponding component 1, 2 is provided as a respective aluminum sheet material. Such an aluminum sheet material can be, for example, a two-layer or multi-layer composite material. For the soldering described below, it is of particular advantage if the sheet material is solder-plated.

Alternatively or additionally, it is possible that the corresponding component 1, 2 and/or at least one further component of the component arrangement 3 consists of an aluminum casting material, an aluminum forging material, an aluminum extruded material or an aluminum material produced additively or generatively. The components 1, 2 can consist of the same aluminum base material or of different aluminum base materials. Furthermore, the components 1, 2 can each consist entirely of the same aluminum base material or of an aluminum composite material or of an aluminum gradient material. At least one of the components 1, 2 is preferably in the solution-annealed state before soldering. In the case of sheet metal, this corresponds to the so-called T4 condition.

In the method for producing the component arrangement 3, in which the components 1, 2 are fixed to one another or connected to one another in a materially bonded manner, a soldering material 4 is also provided, by means of which the components 1, 2 are materially bonded to one another. In this case, the soldering material 4 can, for example, completely or partially cover a first outer surface 5 of the first component 1 . Alternatively or additionally, the soldering material 4 can be arranged or attached—for example partially—to a first outer surface 6 of the second component 2 . The solder material 4, which is designed for example as a solder body is formed, can in this case simply be placed on the corresponding outer surface 5, 6 or connected to it in a non-positive, positive and/or cohesive manner.

The soldering material 4 is connected to a soldering connection device 7 (first shown in 2 ) can be formed or converted by subjecting the soldering material 4 to a soldering temperature, as a result of which the soldering material 4 melts and a material connection is established with the first component 1 and with the second component 2, in particular with the first outer surface 5 of the first component 1 and with the first outer surface 6 of the second component 2 is received. In this way, the components 1, 2 are then cohesively connected to one another via the soldering material 4, which is further developed to form the soldered connection device 7, namely soldered to one another. In other words, the components 1, 2 are fixed to one another in a cohesive manner, in that the soldering material 4 is converted into the soldering connection device 7 by melting it.

2 shows a schematic and sectional view of the component arrangement 3 with a soldering area 8. The soldering area 8 has a multiplicity of soldering zones 9 which are delimited from one another in the soldering area 8. FIG. This means that the soldering area 8 can be formed at least partially by the multiplicity of soldering zones 9 .

The basic idea behind the method for producing the component arrangement 3 is that the individual soldering zones 9 are heated to the soldering temperature by locally limited energy sources. These energy sources are, for example, a respective soldering tool 12, 13, for example a vertically emitting laser source, a horizontally emitting laser source, a disk laser, a fiber laser, a fiber-coupled laser system, a laser diode, a scanned laser beam system to non-coherent LED-based radiation sources (high-power LEDs, LED arrays or LED floodlights) and/or a scanned electron beam system. The soldering tool 12, 13 can also have a combination of at least two of the aforementioned devices, for example a laser diode bar. In particular when the soldering tool 12, 13 has a laser element, this laser soldering tool can then comprise at least one optical element, for example a lens, a mirror, an optical grating or combinations thereof.

The soldered connection device 7 is thus produced in that a first soldered connection unit 10 is produced in a first of the soldering zones 9 using a first soldering tool 12, 13. Furthermore, at least one second soldered connection unit 11 is produced in a second soldering zone, which is different from the first soldering zone, by means of a second soldering tool 12, 13, which is different from the first soldering tool 12, 13. Since the component arrangement 3 has the plurality of soldering zones 9 in the present example, it is provided that the respective soldering zone 9 is heated to the soldering temperature or process temperature by means of a specially assigned soldering tool 12, 13, so that a respective soldered connection unit is produced for each soldering zone 9, whereby the components 1, 2 are or are cohesively connected to one another in/on the plurality of soldering zones 9. Because a respective soldered connection unit, for example the soldered connection units 10, 11, is produced in the respective soldering zone 9, the soldered connection device 7 is produced between the components 1, 2, with the components 1, 2 being soldered to one another via the soldered connection device 7 and consequently bonded to one another will.

In this context, provision is made in particular for the soldered connection units 10, 11 to be produced at least partially at the same time. In other words, the production of the first soldered connection unit 10 takes place at least partially in a temporally overlapping manner with the production of the second soldered connection unit 11. The production of the first soldered connection unit 10 and the production of the second soldered connection unit 11 particularly preferably begin simultaneously. Furthermore, it can be provided that the production of the first soldered connection unit 10 and the production of the second soldered connection unit 11 end at the same time. This applies in an analogous manner to other soldered connection units, so that in the method it can be provided, for example, that all provided soldered connection units are produced simultaneously.

A respective soldering performance of the soldering tools 12, 13 can be regulated independently of one another, for example in that--in the case of the laser soldering tool--the respective optical element is designed to be controllable or adjustable. For example, the laser beam can be divided between the individual soldering zones 9 using a single laser source. As a further possibility, irradiation patterns, by means of which the soldering zones 9 are irradiated according to a timing for melting the soldering material 4, can be generated by beam oscillation, the beam oscillation being so fast that a quasi-static heat field is formed in the soldering zones 9. Such a beam oscillation can be provided by scanner optics, for example.

Accordingly, in the case of the method, it is generally to be understood that the respective soldering tool 12, 13 assigned to the respective soldering zone 9 is provided by a system consisting of a single energy source, for example a laser source, and one the energy directing device, for example the respective optical element, is provided. In this respect, the first soldering tool 12, 13 differs from the second soldering tool 12, 13 mainly in that the first soldering tool 12, 13 causes an energy input into the first of the soldering zones 9, whereas the second soldering tool 12, 13 causes an energy input into another of the soldering zones 9, for example in the second soldering zone. Furthermore, the respective soldering tool 12, 13 can have an emitter or an emitter group with a correspondingly designed power control, in order to form the plurality of soldering tools 12, 13.

With the help of one or more soldering tools 12, 13, a section of the component arrangement 3 or of the first component 1 and/or of the second component 2 to be soldered is heated and/or kept warm. In this case, the respective soldering zone has an edge length of, for example, 30 millimeters by 10 millimeters. However, alternative dimensions and/or geometries are conceivable.

In the method for soldering the components 1, 2, provision is made in particular for the respective soldering tool 12, 13 not to be moved along the zones or soldering zones 9 to be joined—in contrast to a path method. Furthermore, it is provided that the components 1, 2 to be joined do not move under the respective soldering tool 12, 13. In other words, the method provides that when the soldered connection units 10, 11 are produced, a relative position between the components 1, 2 to be connected and the soldering tools 12, 13 remains unchanged. In other words, neither the components 1, 2 nor the soldering tools 12, 13 are moved relative to one another when the soldered connection units 10, 11 are being produced, in particular while the soldered connection units 10, 11 are being produced. This is advantageous insofar as there are no tolerances for movement mechanisms, by means of which the soldering tools 12, 13 and/or the components 1, 2 would be guided during the web process, as a result of which the soldered connection device 7 can be produced particularly precisely and dimensionally accurate.

Instead of moving the components 1, 2 and/or the soldering tools 12, 13 relative to one another, it is preferable to position the locally limited soldering tools 12, 13 or energy sources in such a way that the area to be soldered of the components 1, 2, the is the name of the soldering material 4 in the soldering zones 9, which can/can be heated completely to the soldering temperature or process temperature in a particularly efficient manner. Furthermore, by means of the soldering tools 12, 13 it is possible in a particularly efficient manner to keep the soldering material 4 in the soldering zones 9 at this soldering temperature or process temperature, which can also be referred to as the soldering process temperature. For example, it is provided that several soldering tools 12, 13 are positioned adjacent to one another, so that the soldered connection device 7 is formed as a continuous, for example linear, soldered seam, in that the soldering material 4 in the soldering zones 9 is melted locally by the soldering tools 12, 13. Although the components 1, 2 and the soldering tools 12, 13 are fixed in place relative to one another, it is not to be understood here that a scanner optics is rigid. Because in the case of a scanning heating or heating of the soldering material 4 in the soldering zones 9, it is provided that the corresponding electron or laser beam mainly affects the soldering zone 9 to be heated and at most occasionally jumps into another soldering zone 9 directly adjacent to the corresponding soldering zone 9 . However, the moving scanning device or scanner optics remains stationary above the components 1, 2.

In the present example and due to the arrangement of the components 1, 2 and/or the soldering tools 12 described herein, a heating period or duration during which the soldering material 4 is heated or heated in the corresponding soldering zone 9 by means of the corresponding soldering tool 12, 13 , 13 less than 120 seconds, in particular less than 60 seconds, particularly preferably less than 20 seconds. After this heating period, the soldering process temperature is reached, after which the soldering material 4 is then kept at the soldering process temperature by the soldering tools 12, 13. This means that the soldering material 4 is kept at a constant temperature level, namely at the soldering process temperature, by means of the soldering tools 12, 13 after heating or heating to the process temperature.

The soldering process temperature or soldering temperature is in particular a temperature range which—for example for brazing an aluminum alloy from group 6000—is approximately 590° C. to 600° C. With reference to this example, this means for the heating of the soldering material 4 in the corresponding soldering zone 9 that the respective or corresponding soldering tool 12, 13 initially provides a particularly high soldering power in order to solder the soldering material 4 in the corresponding soldering zone 9 (e.g from room temperature) to 590°C to 600°C. After this soldering process temperature has been reached, the soldering performance of the corresponding soldering tool 12, 13 is reduced since the soldering material 4 no longer needs to be heated. After completion of the soldering process, that is, when the soldering material 4 is to cool down and consequently finally solidify, the soldering performance of the corresponding soldering tool 12, 13 is fully adjusted.

The components 1, 2 are particularly preferably quenched after the soldered connection device 7 has been produced, that is to say after the soldering material 4 has solidified again, that is to say cooled particularly quickly. Since the introduction of heat when producing the soldered connection device 7 is particularly low in the component arrangement 3 due to the only local heating of the corresponding soldering zone 9, the component arrangement 3 or the components 1, 2 can be quenched particularly quickly; that is, a cooling or cooling rate is particularly high. In other words, only a particularly low cooling power is required to quench the component arrangement 3 . Due to the overall very short process time of the heating-up phase and holding phase at the soldering temperature, an oversaturated mixed-crystal structure of the components 1, 2 can at least largely remain if the corresponding component 1, 2 was solution-annealed—in particular before the soldering connection device 7 was produced. A particularly strong mixed-crystal oversaturation is desirable for the components 1, 2 and the component arrangement 3, since a high proportion of mixed crystals in the aluminum material of the components 1, 2 creates particularly favorable conditions for successful precipitation hardening. This allows high-strength aluminum components to be produced.

3 shows in schematic and according to in 1 drawn section plane II-II sectioned view of the component arrangement 3 with a further embodiment of the soldering area 8. It can be seen that the individual soldering zones 9, in contrast to the 2 Soldering region 8 shown are spaced apart. In the method or in the component arrangement 3, it is also provided that the individual soldering zones 9 can have different geometries and/or different sizes from one another.

4 shows a schematic view of the component arrangement 3 with soldering tools 12, 13 acting on the soldering area 8 4 it can be seen that the method can provide for the component arrangement 3 to be produced by the components 1, 2 being soldered to one another on both sides. In other words, the method provides for the soldering tools 12, 13 to couple the soldering power into the soldering material 4 on two opposite second outer surfaces 14, 15 of the first component 1 and the second component 2, respectively. The respective second outer surface 14, 15 is opposite the respective first outer surface 5, 6 at a distance over a component thickness.

In the present example, the soldering tool 12 acts through the first component 1 on the soldering material 4 in order to at least partially produce the soldered connection device 7 . Accordingly, the soldering tool 13 acts through the second component 2 on the soldering material 4 in order to at least partially produce the soldered connection device 7 . By the soldering tools 12, 13 acting through the respective component 1, 2 on the soldering material 4, consequently coupling a respective soldering power into the soldering material 4 and finally melting the soldering material 4, so that when the soldering material 4 solidifies again, the soldering connection device 7 between the components 1 , 2 is formed, the components 1, 2 are cohesively connected to the component arrangement 3 by means of the soldering tools 12, 13. In this case, the soldering tools 12, 13 can be operated in parallel or offset in time, in particular with an overlap in time. Provision is made for only one soldering tool 12 or 13 to be formed in each case to form the respective soldered connection device 7 .

Overall, the invention shows how the component arrangement 3 can be produced particularly efficiently using the method for producing the component arrangement 3, with the finished component arrangement 3 being particularly dimensionally accurate and the soldered connection device 7 between the components 1, 2 having a particularly secure and particularly tight material connection between the components 1, 2 forms. Since the respective energy source or the respective soldering tool 12, 13 can be controlled independently of a corresponding other soldering tool 12, 13 or independently of a correspondingly different energy source, it is possible in particular to identify differences in local component geometries and thus local differences in a respective thermal conductivity or to be taken into account in a respective heat dissipation capacity. This can be done, for example, by an adjusted amount of energy and/or by an adjusted energy exposure area and/or by an adjusted energy exposure duration of the respective energy sources or soldering tools 12, 13 to the conditions specified by the components 1, 2.

In particular, the simultaneous or at least temporally largely simultaneous implementation of the soldering process, ie the production of the soldered connection device 7 in the soldering zones 9, enables a particularly short overall cycle time of the soldering process and is therefore particularly economical. Furthermore, due to the particularly low energy input into the components 1, 2, only a particularly low cooling capacity is required, which is again particularly advantageous from an economic point of view. Furthermore, during the quenching of the component 1, 2, which is only locally limited to the soldering process temperature, compared to quenching a component 1, 2 that is completely heated to the soldering process temperature produces significantly less distortion in the component volume. Accordingly, dimensional accuracy of the component arrangement 3 is particularly advantageous as a result of the method.

In order to create optimal conditions for a subsequent artificial aging process of the soldered component arrangement 3, at least one of the components 1, 2, in particular the entire component arrangement 3, has an oversaturated mixed crystal state, which is achieved by the components 1, 2 already being Solder connection device 7, that is, before the soldering process, is/are in a solution-annealed state. This solution-annealed state, which is characterized by the oversaturated mixed-crystal state, is not or not significantly lost due to the heat input through the soldering, since the energy exposure time of the entire process, namely the short heating phase up to the soldering temperature and the short holding phase at the soldering temperature, is very short overall . In addition, the quenching rate or cooling rate or cooling rate of the component arrangement 3 is high enough to maintain or at least largely maintain the supersaturated mixed crystal structure. A liquid or gaseous medium can be used for the quenching, with the component arrangement 3 flowing with and around this liquid or gaseous medium. Alternatively, a so-called self-quenching can be used in that, after the soldering tool 12, 13 has been deactivated, the heat coupled into the material of the components 1, 2 by means of it “flows” out of the corresponding soldering zone 9 and into the surrounding material of the corresponding component 1, 2. This is because the material surrounding the soldering zone 9 or adjoining it has not been heated, or has been heated to a much lesser extent, by the soldering process or by the production of the soldered connection device 7 . This self-deterrent effect is particularly pronounced in the present case, since the heating-up and/or holding time of the process temperature in the soldering zones 9 is particularly short. Furthermore, the self-deterrent effect is favored by the already high thermal conductivity of aluminum.

The component arrangement 3, which has been produced by means of the method, is in particular a component of a motor vehicle, for example a passenger car. The component arrangement 3 can thus be a heat exchanger (“radiator”) for the motor vehicle or passenger car. Furthermore, it is conceivable that the component arrangement 3 is a battery or accumulator housing with or without integrated cooling, an electric motor housing with or without integrated cooling, etc.

reference list

1

component

2

component

2

component arrangement

4

solder material

5

outer surface

6

outer surface

7

solder connection device

8th

soldering area

9

solder zone

10

solder connection unit

11

solder connection unit

12

soldering tool

13

soldering tool

14

outer surface

15

outer surface

QUOTES INCLUDED IN DESCRIPTION

This list of documents cited by the applicant was generated automatically and is included solely for the better information of the reader. The list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions.

Patent Literature Cited

• DE 102013002628 A1 [0008]
• DE 102017205117 A1 [0009]

Claims (10)

A method for producing a component arrangement (3), in which a first component (1) and a second component (2) are fixed to one another in a cohesive manner by producing a soldered connection device (7) between the components (1, 2), characterized in that the Soldered connection device (7) is produced in that a first soldered connection unit (10) is produced in a first soldering zone (9) of the soldered connection device (7) using a first soldering tool (12, 13) and a second soldered connection unit (11) is produced in a second soldering zone (9 ) is generated by means of a second soldering tool (12, 13). procedure after claim 1 , characterized in that the soldered connection units (10, 11) are produced at least partially simultaneously. procedure after claim 1 or 2 , characterized in that a respective soldering power of the soldering tools (12, 13) is regulated independently of one another. Method according to one of the preceding claims, characterized in that one or more of the following devices is used as the respective soldering tool (12, 13) for producing the soldered connection units (10, 11): - vertically emitting laser source, - horizontally emitting laser source, - disk laser, - fiber laser, - fiber-coupled laser system, - laser diode or laser diode bar, - scanned laser beam system, - non-coherent radiation sources based on LEDs, - scanned electron beam system. Method according to one of the preceding claims, characterized in that when the soldered connection units (10, 11) are produced, a relative position between the components (1, 2) to be connected and the soldering tools (12, 13) remains unchanged. Method according to one of the preceding claims, characterized in that the components (1, 2) are quenched after the soldered connection device (7) has been produced. Component arrangement (3) which has a first component (1) and a second component (2) which have been cohesively fixed to one another by means of a method designed according to one of the preceding claims. Component arrangement (3) according to one of the preceding claims , characterized in that the component arrangement (3) is a radiator for a motor vehicle and in which at least one of the components (1, 2) consists of an aluminum-based alloy Component arrangement (3) after claim 8 , characterized in that the component arrangement (3) is a battery housing with or without integrated cooling and in which at least one of the components (1, 2) consists of an aluminum-based alloy Component arrangement (3) after claim 8 or 9 , characterized in that the component arrangement (3) is an electric motor housing and in which at least one of the components (1, 2) consists of an aluminum-based alloy.

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