DE102019208132A1 - ARRANGEMENT WITH LIGHTING DEVICE AND MEASURING DEVICE, INCLUDING AN ELECTRICAL MEASURING CIRCUIT AND A SELECTION CIRCUIT - Google Patents

Abstract

The present invention relates to an arrangement, includinga) an exposure device, including a plurality of carrier elements, each with a carrier surface, a group of light-emitting semiconductor components being arranged on each carrier surface, andb) a measuring device, including) an electrical measuring circuit for measuring a voltage drop a light-emitting semiconductor component, andii) a selection circuit electrically connected between the electrical measuring circuit and the groups; wherein the selection circuit is electrically connected to at least one light-emitting reference semiconductor component of each group at least one part containing at least two groups of the groups of light-emitting semiconductor components, that by means of the selection circuit and the electrical measuring circuit a voltage drop across at least one of the light-emitting reference semiconductor components per Group of at least part of the groups can be measured. The invention also relates to a printing press with the arrangement according to the invention; a manufacturing process; and various uses of the arrangement according to the invention.

Description

1. a) eine Belichtungseinrichtung, beinhaltend eine Vielzahl von Trägerelementen mit jeweils einer Trägeroberfläche, wobei auf jeder Trägeroberfläche jeweils eine Gruppe von lichtemittierenden Halbleiterbauelementen angeordnet ist, und
2. b) einer Messeinrichtung, beinhaltend
   1. i) eine elektrische Messschaltung zum Messen eines Spannungsabfalls an einem lichtemittierenden Halbleiterbauelement, und
   2. ii) eine elektrisch zwischen der elektrischen Messschaltung und den Gruppen geschaltete Selektionsschaltung;

wobei die Selektionsschaltung so mit mindestens einem lichtemittierenden Referenzhalbleiterbauelement jeder Gruppe mindestens eines mindestens zwei Gruppen der Gruppen von lichtemittierenden Halbleiterbauelementen beinhaltenden Teils elektrisch verschaltet ist, dass mittels der Selektionsschaltung und der elektrischen Messschaltung ein Spannungsabfall an mindestens einem einzelnen der lichtemittierenden Referenzhalbleiterbauelemente pro Gruppe mindestens des Teils der Gruppen gemessen werden kann. Ferner betrifft die Erfindung eine Druckmaschine mit der erfindungsgemäßen Anordnung; ein Herstellungsverfahren; sowie verschiedene Verwendungen der erfindungsgemäßen Anordnung.The present invention relates to an arrangement including

1. a) an exposure device containing a plurality of carrier elements each having a carrier surface, a group of light-emitting semiconductor components being arranged on each carrier surface, and
2. b) a measuring device, including
   1. i) an electrical measuring circuit for measuring a voltage drop across a light-emitting semiconductor component, and
   2. ii) a selection circuit electrically connected between the electrical measuring circuit and the groups;

wherein the selection circuit is electrically connected to at least one light-emitting reference semiconductor component of each group of at least one part containing at least two groups of the groups of light-emitting semiconductor components, that by means of the selection circuit and the electrical measuring circuit, a voltage drop across at least one of the light-emitting reference semiconductor components per group of at least the part Groups can be measured. The invention also relates to a printing press with the arrangement according to the invention; a manufacturing process; and various uses of the arrangement according to the invention.

In the technical field of the invention - the printing industry - the use of light sources for curing printing inks and varnishes has long been known. Furthermore, the use of UV-curable inks and varnishes - that is, inks and varnishes that can be cured by exposure to suitable ultraviolet radiation - is known. Conventionally, mercury vapor lamps are used to harden such paints and varnishes. However, these light sources show considerable disadvantages with regard to their service life, maintenance intensity and also heat generation. This has already been recognized in the prior art. As a result, light-emitting semiconductor components, in particular light-emitting diode modules (LED modules), are used in place of mercury vapor lamps for irradiating UV-curable inks and varnishes. Although the use of light-emitting diodes already opens up many advantages over the well-known mercury vapor lamps, there is room for improvement in the design of light sources with LEDs, in particular but not exclusively with UV LEDs. In the printing industry, for example, high-performance light-emitting diodes are often used which, despite the significantly higher degree of efficiency typical of light-emitting diodes compared to vapor lamps, generate waste heat which has to be dissipated. If this does not succeed sufficiently, the service life and efficiency of the light-emitting diodes are reduced considerably. In addition, overheating of the light-emitting diodes can lead to their destruction. In the case of insufficient cooling of light-emitting diodes, significant advantages of light-emitting diodes over vapor lamps are lost. This must be prevented not only for individual light-emitting diodes, but also as far as possible over all light-emitting diodes of a light source. For this purpose, as far as possible, all light-emitting diodes of a light source, which have a length of the order of meters and can therefore contain numerous light-emitting diodes, must be cooled to the same temperature as possible. This should also apply in the event of disturbances occurring during operation of the light source. Accordingly, it is desirable to be able to recognize global as well as local deviations and disturbances of the cooling in situ during the operation of the light source and to be able to take suitable countermeasures. In addition, it is desirable not only to recognize and diagnose malfunctions that have already occurred, i.e. to identify their type and cause, but also to be able to predict future malfunctions in further operation. In order to be able to at least partially meet all these needs, various measures are proposed within the scope of the invention.

In general, it is an object of the present invention to at least partially overcome a disadvantage arising from the prior art.

Another object of the invention is to provide a structure with a radiator for a printing press which improves the efficiency of the printing press. Furthermore, it is an object of the invention to provide a structure with a radiator for a printing press which improves a service life or an efficiency or both of the radiator. Another object of the invention is to provide a structure with a radiator for a printing press which can maintain a desired output spectrum or a desired intensity distribution on a target surface over the longest possible operating time of the radiator. A further object of the invention is to provide a structure with a radiator for a printing press which enables a reduction in shutdown times for maintenance purposes. Furthermore, it is an object of the invention to provide a structure with a radiator for a printing press which enables maintenance of the radiator to be automated as far as possible. Furthermore, it is an object of the invention to provide a structure with a radiator for a printing press that enables a To automate error detection or a diagnosis of the cause of the error or both and preferably a suggestion or initiation of countermeasures as much as possible. Furthermore, it is an object of the invention to provide a structure with a radiator for a printing press that enables automatic error prediction and preferably automatic suggestion or initiation of countermeasures. According to a further object of the invention, a structure with a radiator for a printing press is provided which allows in situ monitoring of a voltage drop, an operating temperature and / or an optical output power, in each case individual light sources of the radiator. A further object of the invention is to provide one of the aforementioned advantageous structures, this also being kept as simple and / or as space-saving as possible.

Analogously to the above, structural-related objects, a further object of the invention is to provide a method for producing a printed product in which a radiator shows the respective advantage.

A contribution to the at least partial fulfillment of at least one, preferably several, of the above tasks is made by the independent claims. The dependent claims provide preferred embodiments which contribute to at least partially fulfilling at least one of the objects.

1. a) eine Belichtungseinrichtung, beinhaltend eine Vielzahl von Trägerelementen mit jeweils einer Trägeroberfläche, wobei auf jeder Trägeroberfläche jeweils eine Gruppe von lichtemittierenden Halbleiterbauelementen angeordnet ist, und
2. b) einer Messeinrichtung, beinhaltend
   1. i) eine elektrische Messschaltung zum Messen eines Spannungsabfalls an einem lichtemittierenden Halbleiterbauelement, und
   2. ii) eine elektrisch zwischen der elektrischen Messschaltung und den Gruppen geschaltete Selektionsschaltung;

wobei die Selektionsschaltung so mit mindestens einem lichtemittierenden Referenzhalbleiterbauelement jeder Gruppe mindestens eines mindestens zwei Gruppen der Gruppen von lichtemittierenden Halbleiterbauelementen beinhaltenden Teils elektrisch verschaltet ist, dass mittels der Selektionsschaltung und der elektrischen Messschaltung, bevorzugt zeitlich nacheinander, ein Spannungsabfall an mindestens einem einzelnen der lichtemittierenden Referenzhalbleiterbauelemente pro Gruppe mindestens des Teils der Gruppen gemessen werden kann.An embodiment 1 of an arrangement makes a contribution to fulfilling at least one of the objects according to the invention

1. a) an exposure device containing a plurality of carrier elements each having a carrier surface, a group of light-emitting semiconductor components being arranged on each carrier surface, and
2. b) a measuring device, including
   1. i) an electrical measuring circuit for measuring a voltage drop across a light-emitting semiconductor component, and
   2. ii) a selection circuit electrically connected between the electrical measuring circuit and the groups;

wherein the selection circuit is electrically connected to at least one light-emitting reference semiconductor component of each group of at least one part containing at least two groups of the groups of light-emitting semiconductor components, that by means of the selection circuit and the electrical measuring circuit, preferably one after the other, a voltage drop across at least one of the light-emitting reference semiconductor components per Group of at least part of the groups can be measured.

Preferably the part of the groups includes at least 50% of the groups, more preferably at least 60% of the groups, more preferably at least 70% of the groups, even more preferably at least 80% of the groups, most preferably at least 90% of the groups. Furthermore, the selection circuit is preferably electrically connected to at least one light-emitting reference semiconductor component of each group of light-emitting semiconductor components in such a way that, by means of the selection circuit and the electrical measuring circuit, preferably in chronological order, a voltage drop across at least one single light-emitting reference semiconductor component per group can be measured.

The wording "electrically connected" means that the arrangement contains an electrical circuit that allows, that is to say is arranged and designed to electrically connect the mentioned light-emitting reference semiconductor components, preferably one after the other, to the electrical measuring circuit by means of the selection circuit, that the voltage dropping across the respective light-emitting reference semiconductor component (voltage drop) can be measured.

The selection circuit is preferably electrically connected to at least one light-emitting reference semiconductor component of each group of light-emitting semiconductor components in such a way that the measurement of the voltage drop during operation of the exposure device (in situ), in particular the group of the respective light-emitting reference semiconductor component, is carried out by means of the selection circuit and the electrical measuring circuit can. Furthermore, the selection circuit is preferably electrically connected to at least one light-emitting reference semiconductor component of each group of light-emitting semiconductor components so that the measurement can be carried out continuously or repeatedly over time by means of the selection circuit and the electrical measuring circuit. The selection circuit is preferably electrically connected to at least one light-emitting reference semiconductor component of each group of light-emitting semiconductor components in such a way that the measurement can be carried out repeatedly in a large number of consecutive cycles by means of the selection circuit and the electrical measuring circuit. The arrangement preferably also includes a control device which is arranged for this purpose and is designed to control the selection circuit for one of the aforementioned measuring.

In an embodiment 2 according to the invention, the arrangement is designed according to its embodiment 1, the arrangement further including a control device which is arranged and designed to control the selection circuit in such a way that the voltage drop occurs in a plurality of successive cycles per cycle on at least one individual of the light-emitting reference semiconductor components per group of at least part of the groups is measured. Each cycle preferably includes a measurement of the voltage drop across at least one of the light-emitting reference semiconductor components per group of at least the part. The voltage drop on the same light-emitting reference semiconductor component or on the same light-emitting reference semiconductor components or on different light-emitting reference semiconductor components can be measured in different cycles per group. The voltage drop is preferably measured in the cycles per group on the same light-emitting reference semiconductor component or on the same light-emitting reference semiconductor components. A cycle is a time interval of a defined duration. The cycles of the plurality of chronologically successive cycles preferably follow one another directly. Furthermore, these cycles are preferably of the same duration. The control device is preferably arranged and designed to control the selection circuit in such a way that the voltage drop is measured in a plurality of successive cycles per cycle on at least one of the light-emitting reference semiconductor components per group. The exposure device is preferably in operation in at least some of the cycles. Accordingly, the control device is preferably arranged and designed such that the above-described measurement can take place in situ during operation of the exposure device.

In an embodiment 3 according to the invention, the arrangement is designed according to its embodiment 2, the control device also being arranged and designed to change one of the voltage drop measured in at least two of the cycles for at least one of the light-emitting reference semiconductor components per group of at least that part of the groups To determine the temperature of the respective light-emitting reference semiconductor component. The determination can take place arithmetically, in particular by means of a mathematical function, or by comparison with reference values. The control device is preferably arranged and designed in such a way that the above-described determination can take place in situ during operation of the exposure device.

In an embodiment 4 according to the invention, the arrangement is designed according to its embodiment 3, the temperature of the respective light-emitting reference semiconductor component being its junction temperature.

In embodiment 5 according to the invention, the arrangement is designed according to one of its embodiments 2 to 4, the control device also being arranged and designed for at least one of the light-emitting reference semiconductor components per group of at least the part of the groups from the voltage drop measured in at least two of the cycles to determine a change in a power of the respective light-emitting reference semiconductor component. The determination can take place arithmetically, in particular by means of a mathematical function, or by comparison with reference values. The control device is preferably arranged and designed in such a way that the above-described determination can take place in situ during operation of the exposure device.

In an embodiment 6 according to the invention, the arrangement is configured according to its embodiment 5, the power being an optical output power of the respective light-emitting reference semiconductor component. The optical output power here is the energy that the respective light-emitting reference semiconductor component emits as electromagnetic radiation per time interval during operation.

1. a. eine an der das jeweilige lichtemittierende Referenzbauelement beinhaltenden Gruppe anliegende Spannung, oder
2. b. eine Stromstärke eines durch die das jeweilige Referenzbauelement beinhaltenden Gruppe fließenden elektrischen Stroms,

jeweils in Abhängigkeit der bestimmten Leistung anzupassen. Hier ist die vorstehende Alternative b. im Rahmen der Erfindung bevorzugt. In diesem Fall führt das Anpassen der Stromstärke vorzugsweise auch zu einer Änderung der Spannung. Bevorzugt ist die Steuervorrichtung dazu angeordnet und ausgebildet, die anliegende Spannung oder die Stromstärke so anzupassen, dass die Leistung sich einem Sollwert annähert.In an embodiment 7 according to the invention, the arrangement is designed according to its embodiment 5 or 6, the control device also being arranged and designed to

1. a. a voltage applied to the group containing the respective light-emitting reference component, or
2. b. a current intensity of an electrical current flowing through the group containing the respective reference component,

to be adjusted depending on the specific performance. Here the above alternative is b. preferred within the scope of the invention. In this case, the adjustment of the current strength preferably also leads to a change in the voltage. The control device is preferably arranged and designed to adapt the applied voltage or the current intensity such that the power approaches a setpoint value.

In an embodiment 8 according to the invention, the arrangement is designed according to one of its embodiments 3 to 7, the control device containing a data memory, the data memory having a means for determining the change in temperature from the voltage drop of an individual one of the light-emitting reference semiconductor components determined in at least two of the cycles Group includes at least part of the groups.

1. a. einen Datensatz, beinhaltend eine Vielzahl von Spannungswerten mit jeweils einem zugeordneten Temperaturwert, oder
2. b. eine mathematische Funktion der Änderung der Temperatur von einer Änderung des Spannungsabfalls eines lichtemittierenden Halbleiterbauelements

beinhaltet.In an embodiment 9 according to the invention, the arrangement is designed according to its embodiment 8, the means

1. a. a data set containing a multiplicity of voltage values, each with an assigned temperature value, or
2. b. a mathematical function of the change in temperature from a change in the voltage drop of a light emitting semiconductor device

includes.

In an embodiment 10 according to the invention, the arrangement is designed according to its embodiment 9, the mathematical function of the change in temperature from the change in the voltage drop of the light-emitting semiconductor component being a linear function.

In an embodiment 11 according to the invention, the arrangement is designed according to one of its embodiments 5 to 10, the control device containing a data memory, the data memory being a means for determining the change in power from the voltage drop determined in at least two of the cycles on a single one of the light-emitting reference semiconductor components per group includes at least part of the group.

1. a] einen Datensatz, beinhaltend eine Vielzahl von Spannungswerten mit jeweils einem zugeordneten Wert der Leistung, oder
2. b] eine mathematische Funktion der Änderung der Leistung von einer Änderung einer Temperatur eines lichtemittierenden Halbleiterbauelements

beinhaltet.In an embodiment 12 according to the invention, the arrangement is designed according to its embodiment 11, the means

1. a] a data set containing a multiplicity of voltage values, each with an assigned value of the power, or
2. b] a mathematical function of the change in power from a change in a temperature of a light-emitting semiconductor component

includes.

In an embodiment 13 according to the invention, the arrangement is designed according to its embodiment 12, the mathematical function of the change in power from the change in temperature of the light-emitting semiconductor component being a linear function.

In an embodiment 14 according to the invention, the arrangement is designed according to one of its embodiments 3 to 13, the control device also being arranged and designed for at least one of the light-emitting reference semiconductor components per group of at least the part of the groups from an absolute temperature value and a specific change in the Temperature to determine an absolute actual temperature of the respective light-emitting reference semiconductor component. Here, the control device is preferably arranged and designed to carry out the aforementioned determination of the actual temperature during operation of the exposure device, in particular of the group of the respective light-emitting reference semiconductor component. Furthermore, the control device is preferably arranged and designed to carry out the aforementioned determination several times, preferably repeatedly, preferably in a plurality of chronologically successive cycles, or continuously, in a temporal course. In a preferred embodiment, the control device is also arranged and designed to derive a diagnosis for the exposure device, in particular a fault diagnosis, preferably in situ during operation of the exposure device, from the above-mentioned light-emitting reference semiconductor components of at least the part of the groups.

Determining the actual temperatures of the groups enables in-situ monitoring of the cooling of the groups. If, for example, a different actual temperature is determined for different groups, the cooling of individual groups can be specifically adapted in order to regulate all groups to the same operating temperature and thus achieve the same optical output power as possible for all groups. This is particularly advantageous when the groups have different emission spectra which add up to form an overall emission spectrum. In this case, if the output power of a part of the groups deviates from its nominal value, the spectral intensity distribution desired for the application will not be achieved. Even if the different groups have the same emission spectra, a deviation in the output power of the groups caused by cooling inhomogeneities can lead to a spatially inhomogeneous distribution of intensity on an irradiated surface. This is also disadvantageous in many applications. For example, drying in a printing machine can take place spatially inhomogeneous, whereby either the irradiation time must be adapted to a longest local drying time, which is the The printing process is prolonged, or there may be insufficient local drying and thus faulty printing. Furthermore, from characteristic differences in the actual temperature between the groups, conclusions can be drawn about the presence of certain disorders. For example, when the arrangement is used in a printing press, the light-emitting semiconductor components can be arranged very close to the object to be exposed. In practice, this means that paint or varnish splashes get onto optical windows or optics. Such splashes of paint or varnish lead to reflections on the group behind and thus to local temperature increases. Such a disturbance can be recognized from the pattern which the determined actual temperatures of the groups result. In this way, suitable countermeasures can be taken or planned for efficient treatment of the disturbance. These countermeasures can at least partially be taken automatically by the control device. The invention thus allows the maintenance of the exposure device to be automated.

In an embodiment 15 according to the invention, the arrangement is designed according to its embodiment 14, the control device also being arranged and designed to switch off the light-emitting semiconductor components of the group containing the light-emitting reference semiconductor component whose absolute actual temperature was determined when the determined absolute actual temperature Temperature of this light-emitting reference semiconductor component exceeds a maximum value. In this way, in particular, overheating of the light-emitting semiconductor components of the affected group due to a defect affecting the entire group can be avoided. Such a defect can for example be a clogging of a cooling channel. As a result of the aforementioned avoidance of overheating, destruction of all light-emitting semiconductor components of the group by the defect can in turn be avoided. If the maximum value is set below a temperature which leads to the destruction of the light-emitting semiconductor components, a service life of the group can be increased in particular, since the operating temperature of light-emitting semiconductor components significantly influences their service life.

In an embodiment 16 according to the invention, the arrangement is designed according to its embodiment 15, the maximum value being in a range from 100 to 180 ° C, preferably from 110 to 170 ° C, more preferably from 120 to 160 ° C, even more preferably from 130 to 150 ° C, most preferably from 135 to 145 ° C.

In an embodiment 17 according to the invention, the arrangement is designed according to one of its embodiments 3 to 16, the control device further being arranged and designed to extrapolate the change in temperature for at least one of the light-emitting reference semiconductor components per group of at least part of the groups and based on to make an error diagnosis of the extrapolated change in temperature. This design allows in particular what is known as predictive maintenance to be carried out. Defects or defects that are likely to occur can be determined from the extrapolated change in temperature. These are then specified in the error diagnosis. For example, a blocked cooling channel often leads to an abrupt increase in temperature. This increase in temperature can be measured and the affected group switched off as described above. However, if the temperature rises gradually rather than abruptly in this way, there is often no clogged cooling channel, but a connection such as a soldered joint loosens. This can be recognized at an early stage by extrapolating the change in temperature and suitable maintenance measures can be taken. As a result, maintenance can be made more efficient, for example by being carried out in an already planned shutdown phase. In addition, a suitable maintenance measure can be derived from the error diagnosis, which saves time and effort in manual troubleshooting during a shutdown phase.

In an embodiment 18 according to the invention, the arrangement is designed according to one of its preceding embodiments, the arrangement further including a cooling device which is arranged and designed for active cooling of the carrier elements.

In an embodiment 19 according to the invention, the arrangement is designed according to its embodiment 18, the active cooling including contacting a cooling surface of the carrier elements with a cooling fluid.

In an embodiment 20 according to the invention, the arrangement is designed according to its embodiment 19, the carrier surface and the cooling surface of a carrier element, preferably each carrier element of the plurality of carrier elements, being mutually opposite outer surfaces of this carrier element.

In an embodiment 21 according to the invention, the arrangement is designed according to its embodiment 19 or 20, the cooling surface of a carrier element, preferably each carrier element of the plurality of carrier elements, including a cooling structure.

In an embodiment 22 according to the invention, the arrangement is configured according to its embodiment 21, the cooling structure containing a plurality of cooling fins, preferably being formed therefrom.

In an embodiment 23 according to the invention, the arrangement is designed according to its embodiment 22, the plurality of cooling fins consisting of 3 to 30 cooling fins, preferably 5 to 25 cooling fins, more preferably 10 to 20 cooling fins.

In one embodiment 24 according to the invention, the arrangement is designed according to one of its preceding embodiments, each of the light-emitting semiconductor components of the groups each containing a circuit board and at least one semiconductor chip overlaying the circuit board on the side facing away from the carrier surface on which the respective light-emitting semiconductor component is arranged. Preferably, each of the light-emitting semiconductor components additionally contains at least one optical unit superimposed on the at least one semiconductor chip on a side facing away from the circuit board. In the case of an LED as a light-emitting semiconductor component, the above structure, including the circuit board and the semiconductor chip and, optionally, one or more optics, is also referred to as a package in the technical field. Package and LED are often used synonymously. In the case of the chip-on-board technology, which is also possible within the scope of the invention, several semiconductor chips are arranged on a common circuit board. In this case, the package contains several semiconductor chips. In general, a package can contain further elements such as electrical contacts, protective circuits and elements for heat dissipation.

In an embodiment 25 according to the invention, the arrangement is designed according to one of its previous embodiments, the light-emitting semiconductor components of the groups being connected to the carrier surface on which they are arranged. The light-emitting semiconductor components are preferably one selected from the group consisting of glued to the carrier surface, soldered to the carrier surface, and sintered to the carrier surface, or a combination of at least two thereof. The circuit board of the light-emitting semiconductor component is preferably connected to the carrier surface, preferably in one of the aforementioned ways.

In an embodiment 26 according to the invention, the arrangement is designed according to one of its preceding embodiments, the plurality of carrier elements consisting of 5 to 150, preferably 10 to 150, more preferably 15 to 120, more preferably 15 to 100, most preferably 15 to 75 carrier elements. The number of carrier elements of the plurality of carrier elements is particularly preferably an integral multiple of 2. This in particular facilitates control of a cooling of the exposure device.

In an embodiment 27 according to the invention, the arrangement is designed according to one of its preceding embodiments, the carrier elements of the plurality of carrier elements each having a width in a range from 5 to 100 mm, preferably from 10 to 50 mm, more preferably from 15 to 40 mm more preferably from 20 to 35 mm, most preferably from 20 to 30 mm. The carrier elements are often about an inch, that is to say about 25.4 mm, wide. The width of a carrier element is more than its thickness and less than its length. The width of a carrier element preferably runs in a longitudinal direction of the exposure device, that is to say along a length of the exposure device.

In an embodiment 28 according to the invention, the arrangement is designed according to one of its preceding embodiments, the exposure device being elongated in a longitudinal direction. The longitudinal direction is preferably a direction of a length of the exposure device.

In an embodiment 29 according to the invention, the arrangement is designed according to its embodiment 28, the exposure device having a length in the longitudinal direction in a range from 100 to 3000 mm, more preferably from 200 to 3000 mm, more preferably from 300 to 3000 mm, even more preferably from 400 to 3000 mm, most preferably from 400 to 2000 mm.

In an embodiment 30 according to the invention, the arrangement is designed according to its embodiment 28 or 29, the carrier elements of the plurality of carrier elements being arranged one after the other in the longitudinal direction.

In one embodiment 31 according to the invention, the arrangement is designed according to one of its preceding embodiments, the light-emitting semiconductor components being arranged and designed for exposure to light in a UV wavelength range or an IR wavelength range or both. For this purpose, an emission spectrum of the light-emitting semiconductor components preferably has a local maximum or a global maximum or both in the UV wavelength range or the IR wavelength range. A preferred UV wavelength range is selected from the group consisting of a UV-A wavelength range, a UV-B Wavelength range, and a UV-C wavelength range, or a combination of at least two of them.

In an embodiment 32 according to the invention, the arrangement is designed according to one of its preceding embodiments, the exposure device containing a ballast. A preferred ballast is an electronic ballast. A preferred electronic ballast is an LED driver.

In an embodiment 33 according to the invention, the arrangement is configured according to one of its preceding embodiments, the light-emitting semiconductor components of the groups being light-emitting diodes. A preferred LED is a UV LED or an IR LED.

In an embodiment 34 according to the invention, the arrangement is designed according to one of its preceding embodiments, the exposure device being a UV radiator or an IR radiator or both.

In an embodiment 35 according to the invention, the arrangement is designed according to one of its preceding embodiments, the selection circuit being an electronic selection circuit.

In an embodiment 36 according to the invention, the arrangement is designed according to its embodiment 35, the electronic selection circuit containing a multiplexer or a demultiplexer or both.

In an embodiment 37 according to the invention, the arrangement is designed according to one of its preceding embodiments, the electrical measuring circuit including a measuring resistor whose electrical resistance is at least 10 times, preferably at least 100 times, more preferably at least 1000 times as large as a largest electrical resistance of the light-emitting Reference semiconductor components.

In an embodiment 38 according to the invention, the arrangement is designed according to one of its preceding embodiments, the electrical measuring circuit having a measuring resistor with an electrical resistance of at least 1 kΩ, preferably at least 5 kΩ, more preferably at least 10 kΩ, more preferably at least 50 kΩ, more preferably at least 100 kΩ, more preferably at least 500 kΩ, most preferably at least 1 MΩ.

In one embodiment 39 according to the invention, the arrangement is designed according to one of its previous embodiments, the measuring device between the selection circuit and the electrical measuring circuit including one, preferably exactly one, analog-digital converter.

In one embodiment 40 according to the invention, the arrangement is designed according to one of its preceding embodiments, the arrangement further including an exposure object that is arranged and designed to be irradiated with light emitted by the light-emitting semiconductor components.

In an embodiment 41 according to the invention, the arrangement is designed according to its embodiment 40, the exposure object being designed in a two-dimensional manner. A preferred areal exposure object is designed in the form of a web.

In an embodiment 42 according to the invention, the arrangement is configured according to its embodiment 40 or 41, the exposure object including a substrate and a composition overlying the substrate. The substrate is preferably planar, more preferably web-shaped. The composition is preferably liquid. A preferred substrate is a print carrier, also called a printing material.

In an embodiment 43 according to the invention, the arrangement is designed according to one of its embodiments 40 to 42, the arrangement further including a transport device which is arranged and designed to transport the object to be exposed in a process direction relative to the exposure device.

In one embodiment 44 according to the invention, the arrangement is configured according to its embodiment 43, the arrangement including an overlay device arranged in the process direction upstream of the exposure device, the overlay device being arranged and designed to overlay the substrate with the composition. A preferred overlay device includes a print image memory or a print head or both.

An embodiment 1 of a printing press, including the arrangement according to the invention according to one of its embodiments 1 to 39, makes a contribution to fulfilling at least one of the objects of the invention.

In an embodiment 2 according to the invention, the printing machine is designed according to its embodiment 1, the exposure device being arranged and designed in the printing machine for irradiating a composition printed on a printing medium.

In embodiment 3 according to the invention, the printing machine is designed according to its embodiment 2, the composition being a printing ink or a lacquer or both.

In an embodiment 4 according to the invention, the printing machine is designed according to one of its embodiments 1 to 3, the printing machine being a printing machine without print image storage. A preferred printing machine without print image storage is designed for non-impact printing (NIP). A preferred printing machine without print image storage is an ink jet printer or a laser printer or both.

In an embodiment 5 according to the invention, the printing press is designed according to one of its embodiments 1 to 3, the printing press containing a print image memory. A preferred print image memory is a printing roller or a printing plate.

In an embodiment 6 according to the invention, the printing press is designed according to its embodiment 5, the printing press being arranged and designed for indirect printing by means of the print image memory. A preferred printing machine for indirect printing is an offset printing machine. A preferred offset printing machine is a sheet-fed offset printing machine.

1. a) Bereitstellen
   1. i) einer Belichtungseinrichtung, beinhaltend eine Vielzahl von Trägerelementen mit jeweils einer Trägeroberfläche, wobei auf jeder Trägeroberfläche jeweils eine Gruppe von lichtemittierenden Halbleiterbauelementen angeordnet ist, und
   2. ii) mindestens eines Belichtungsobjekts; und
2. b) Bestrahlen des mindestens einen Belichtungsobjekts mit von der Belichtungseinrichtung emittiertem Licht unter Erhalt des Erzeugnisses;

wobei jede Gruppe eines mindestens zwei Gruppen der Gruppen von lichtemittierenden Halbleiterbauelementen beinhaltenden Teils der Gruppen mindestens ein lichtemittierendes Referenzhalbleiterbauelement beinhaltet; wobei in dem Verfahrensschritt b), bevorzugt zeitlich nacheinander, ein Spannungsabfall an mindestens einem einzelnen der lichtemittierenden Referenzhalbleiterbauelemente pro Gruppe mindestens des Teils der Gruppen gemessen wird. Das vorgenannte Messen erfolgt bevorzugt mindestens teilweise, bevorzugt vollständig, während des Bestrahlens. Hier wird bevorzugt während des Bestrahlens in situ der Spannungsabfall an den lichtemittierenden Referenzhalbleiterbauelemente bestimmt. Bevorzugt erfolgt das vorgenannte Messen in dem Verfahrensschritt b) für die genannten lichtemittierenden Referenzhalbleiterbauelemente mehrfach, bevorzugt wiederholt, vorzugsweise in einer Vielzahl zeitlich aufeinanderfolgender Zyklen, oder kontinuierlich.Embodiment 1 of a method for manufacturing a product, including the method as method steps, makes a contribution to fulfilling at least one of the objects according to the invention

1. a) Provide
   1. i) an exposure device comprising a plurality of carrier elements each having a carrier surface, a group of light-emitting semiconductor components being arranged on each carrier surface, and
   2. ii) at least one exposure object; and
2. b) irradiating the at least one exposure object with light emitted by the exposure device to obtain the product;

wherein each group of a part of the groups containing at least two groups of the groups of light-emitting semiconductor components contains at least one light-emitting reference semiconductor component; wherein in method step b), preferably successively in time, a voltage drop across at least one of the light-emitting reference semiconductor components per group of at least part of the groups is measured. The aforementioned measurement is preferably carried out at least partially, preferably completely, during the irradiation. Here, the voltage drop across the light-emitting reference semiconductor components is preferably determined in situ during the irradiation. The aforementioned measurement in method step b) preferably takes place several times, preferably repeatedly, preferably in a large number of successive cycles, or continuously, for the said light-emitting reference semiconductor components.

In an embodiment 2 according to the invention, the method is designed according to its embodiment 1, wherein in method step b) the voltage drop is measured in a plurality of successive cycles per cycle on at least one of the light-emitting reference semiconductor components per group of at least part of the groups. The voltage drop is preferably measured in a large number of successive cycles per cycle on at least one of the light-emitting reference semiconductor components per group. The irradiation is preferably carried out at least partially in one of the cycles. The described determination takes place preferably during the irradiation.

In an embodiment 3 according to the invention, the method is configured according to its embodiment 2, the method further including determining a change in a temperature of the respective light-emitting reference semiconductor component from that measured in at least two of the cycles for at least one of the light-emitting reference semiconductor components per group of at least the part of the groups Includes voltage drop. The determination can take place arithmetically, in particular by means of a mathematical function, or by comparison with reference values. The determination described above preferably takes place in situ during the irradiation.

In embodiment 4 according to the invention, the method is configured according to its embodiment 3, the temperature of the respective light-emitting reference semiconductor component being its junction temperature.

In embodiment 5 according to the invention, the method is designed according to one of its embodiments 2 to 4, the method further including determining a change in a power of the respective light-emitting reference semiconductor component from the at least two for at least one of the light-emitting reference semiconductor components per group of at least the part of the groups the voltage drop measured in cycles. The determination can be made arithmetically, in particular by means of a mathematical function, or by comparison with Reference values. The determination described above preferably takes place in situ during the irradiation.

In an embodiment 6 according to the invention, the method is configured according to its embodiment 5, the power being an optical output power of the respective light-emitting reference semiconductor component.

1. a. eines Datensatzes, beinhaltend eine Vielzahl von Spannungswerten mit jeweils einem zugeordneten Temperaturwert, oder
2. b. einer mathematischen Funktion der Änderung der Temperatur von einer Änderung des Spannungsabfalls eines lichtemittierenden Halbleiterbauelements

erfolgt.In an embodiment 7 according to the invention, the method is designed according to one of its embodiments 3 to 6, the determination of the change in temperature by means of

1. a. a data set containing a plurality of voltage values, each with an associated temperature value, or
2. b. a mathematical function of the change in temperature from a change in the voltage drop of a light emitting semiconductor component

he follows.

In an embodiment 8 according to the invention, the method is configured according to its embodiment 7, the mathematical function of the change in temperature from the change in the voltage drop of the light-emitting semiconductor component being a linear function.

1. a] eines Datensatzes, beinhaltend eine Vielzahl von Spannungswerten mit jeweils einem zugeordneten Wert der Leistung, oder
2. b] einer mathematischen Funktion der Änderung der Leistung von einer Änderung einer Temperatur eines lichtemittierenden Halbleiterbauelements

erfolgt.In an embodiment 9 according to the invention, the method is designed according to one of its embodiments 5 to 8, wherein the determination of the change in power is by means of

1. a] of a data set, containing a plurality of voltage values, each with an assigned value of the power, or
2. b] a mathematical function of the change in the power from a change in a temperature of a light-emitting semiconductor component

he follows.

In an embodiment 10 according to the invention, the method is configured according to its embodiment 9, the mathematical function of the change in power from the change in temperature of the light-emitting semiconductor component being a linear function.

In an embodiment 11 according to the invention, the method is designed according to one of its embodiments 3 to 10, the method further including determining an absolute actual temperature of at least one of the light-emitting reference semiconductor components per group of at least the part of the groups from an absolute temperature value and a specific change in the Includes temperature of the respective light-emitting reference semiconductor component.

In an embodiment 12 according to the invention, the method is designed according to its embodiment 11, the method further including comparing the determined absolute actual temperatures with a maximum value and switching off the light-emitting semiconductor components of a light-emitting reference semiconductor component whose absolute actual temperature exceeds the maximum value Group includes. The determination described above preferably takes place in situ during the irradiation. Furthermore, the aforementioned determination is preferably carried out several times in a temporal course, preferably repeatedly, preferably in a plurality of successive cycles, or continuously. In a preferred embodiment, a diagnosis for the exposure device, in particular a fault diagnosis, preferably in situ during the irradiation, is derived from the above-mentioned light-emitting reference semiconductor components of at least the part of the groups.

In an inventive embodiment 13, the method is designed according to its embodiment 12, the maximum value being in a range from 100 to 180 ° C, preferably from 110 to 170 ° C, more preferably from 120 to 160 ° C, even more preferably from 130 to 150 ° C, most preferably from 135 to 145 ° C.

In an embodiment 14 according to the invention, the method is configured according to one of its embodiments 3 to 13, the method furthermore extrapolating the change in temperature and creating a fault diagnosis based on the extrapolated for at least one of the light-emitting reference semiconductor components per group of at least the part of the groups Includes change in temperature.

In one embodiment 15 according to the invention, the method is designed according to one of its embodiments 1 to 14, the method further including active cooling of the carrier elements in method step b).

In an embodiment 16 according to the invention, the method is designed according to its embodiment 15, the active cooling including contacting a cooling surface of the carrier elements with a cooling fluid.

In an inventive embodiment 17, the method is designed according to one of its embodiments 1 to 16, wherein a Spectrum of the light has a local maximum or a global maximum or both in a UV wavelength range or an IR wavelength range.

In an embodiment 18 according to the invention, the method is designed according to one of its embodiments 1 to 17, the respective light-emitting reference semiconductor component being connected to an electrical measuring circuit by means of a selection circuit to measure the voltage drop at each of the light-emitting reference semiconductor components.

In an embodiment 19 according to the invention, the method is designed according to its embodiment 18, the selection circuit being an electronic selection circuit.

In an embodiment 20 according to the invention, the method is designed according to its embodiment 19, the electronic selection circuit containing a multiplexer or a demultiplexer or both.

In an embodiment 21 according to the invention, the method is designed according to one of its embodiments 18 to 20, the electrical measuring circuit including a measuring resistor whose electrical resistance is at least 10 times, preferably at least 100 times, more preferably at least 1000 times as large as a largest electrical resistance of the light-emitting reference semiconductor components.

In an embodiment 22 according to the invention, the method is designed according to one of its embodiments 18 to 21, the electrical measuring circuit having a measuring resistor with an electrical resistance of at least 1 kΩ, preferably at least 5 kΩ, more preferably at least 10 kΩ, more preferably at least 50 kΩ, more preferably at least 100 kΩ, more preferably at least 500 kΩ, most preferably at least 1 MΩ.

In an embodiment 23 according to the invention, the method is designed according to one of its embodiments 18 to 22, an electrical signal being digitized by means of one, preferably exactly one, analog-to-digital converter to measure the voltage drop across each of the light-emitting reference semiconductor components.

In an embodiment 24 according to the invention, the method is configured according to one of its embodiments 1 to 23, the exposure object including a substrate and a composition overlying the substrate.

In one embodiment 25 according to the invention, the method is configured according to its embodiment 24, the method including superimposing the composition on the substrate before method step b), the composition being irradiated with the light in method step b).

In one embodiment 26 according to the invention, the method is configured according to its embodiment 25, the composition being liquid during the superimposition.

In an embodiment 27 according to the invention, the method is designed according to one of its embodiments 1 to 26, method step b) taking place in a printing press.

A preferred substrate is a print carrier. The composition is preferably liquid when superimposed. The overlaying is preferably carried out as printing. In a preferred embodiment, the composition contains at least one colorant during the superimposition, preferably in a proportion in a range from 0.5 to 20% by weight, more preferably from 1 to 15% by weight, more preferably from 2 to 10% by weight. %, most preferably from 3 to 8% by weight, each based on the composition at the time of overlaying. In a further preferred embodiment, the composition contains a vehicle when superimposed, preferably in a proportion in a range from 10 to 95% by weight, more preferably from 20 to 95% by weight, more preferably from 30 to 95% by weight, most preferably from 40 to 90% by weight, each based on the composition at the time of overlaying. In a further preferred embodiment, the composition contains a photoinitiator during the superimposition, preferably in a proportion in a range from 1 to 30% by weight, more preferably from 2 to 25% by weight, more preferably from 3 to 20% by weight, most preferably from 5 to 15% by weight, each based on the composition at the time of overlaying. In a further preferred embodiment, the composition contains at least one monomer during the superimposition, preferably in a proportion in a range from 10 to 95% by weight, more preferably from 20 to 95% by weight, more preferably from 30 to 90% by weight , more preferably from 40 to 85% by weight, more preferably from 50 to 85% by weight, most preferably from 60 to 80% by weight, in each case based on the composition at the time of overlaying. In a further preferred embodiment, the composition contains at least one monomer, at least one oligomer, preferably in a proportion in a range from 1 to 50% by weight, preferably from 1 to 40% by weight, more preferably from 2 to 30, when superimposed % By weight, more preferably from 3 to 25% by weight, most preferably from 5 to 20% by weight, in each case based on the composition at the time of overlaying. In another preferred Embodiment obtaining the article includes curing the composition. The curing preferably involves reducing an amount of a vehicle in the composition. Alternatively or additionally preferably, the curing includes polymerizing a monomer or an oligomer or both in the composition. A particularly preferred composition is a printing ink or a varnish or both.

In a preferred embodiment, the method is a method for producing a printed product. A preferred printed product is one selected from the group consisting of a magazine, a book, a poster, an advertising material, and a label or a combination of at least two thereof. In one embodiment of the method according to the invention, the printing press according to the invention is provided according to one of its embodiments in method step a).

An embodiment 1 of a use 1 of the arrangement according to one of its embodiments for curing a composition makes a contribution to fulfilling at least one of the objects of the invention.

An embodiment 1 of a use 2 of the arrangement according to the invention according to one of its embodiments 1 to 39 in a printing press makes a contribution to fulfilling at least one of the objects of the invention. A preferred printing press is designed like the printing press according to the invention according to one of its embodiments. Furthermore, the luminaire is preferably used in the printing machine for curing a composition. The hardening is preferably carried out according to one embodiment of the method according to the invention.

An embodiment 1 of a use 3 of the arrangement according to one of its embodiments for creating a fault diagnosis or for predicting a malfunction of the exposure device or both makes a contribution to fulfilling at least one of the tasks according to the invention.

Features that are described as preferred in a category according to the invention, for example according to the arrangement according to the invention, are also preferred or corresponding to the respective category in an embodiment of the further categories according to the invention, for example an embodiment of the method according to the invention or use 1 to 3. In particular, the measurement or determination disclosed in connection with the arrangement takes place in a preferred embodiment of the method according to the invention as described for the arrangement.

Exposure device

An exposure device is a device for irradiating an exposure object with electromagnetic radiation, that is to say light. In addition to light sources, which are at least partially light-emitting semiconductor components within the scope of the invention, the exposure device can contain further elements necessary for the intended operation of the exposure device or for the intended use of the light emitted by the exposure device. These elements can include, for example, one or more secondary optics, cooling, electronic elements, and a housing. In the context of the invention, a suitable exposure device is any device that appears suitable to the person skilled in the art for use according to the invention, preferably for use in a printing press. The exposure device of the arrangement according to the invention is preferably a radiator, preferably for use in an industrial process, particularly preferably in an industrial printing process. A preferred emitter is an ultraviolet emitter (UV emitter) or an infrared emitter (IR emitter). UV emitters and IR emitters as well as modules containing one or more such emitters are used in numerous industrial processes. This includes, for example, the drying and hardening of coatings, shaping, embossing, lamination, joining, welding, browning, heating, heating and preheating, as well as germ reduction. A preferred industrial process here is a continuous process. In a preferred embodiment, the above statements on processes or methods also apply to the method according to the invention. The exposure device of the arrangement according to the invention preferably contains a ballast which is arranged and designed to operate the exposure device, in particular in the case of LEDs as light-emitting semiconductor components. A preferred ballast is an electronic ballast. A preferred electronic ballast is an LED driver. Furthermore, the exposure device of the arrangement according to the invention preferably contains means for active cooling, in particular for active heat dissipation from the heat generated by the light-emitting semiconductor components. A preferred means for active cooling is a cooling structure such as cooling fins and / or cooling channels for supplying and removing a cooling fluid, in particular a cooling liquid.

Light-emitting semiconductor components

Any component containing a semiconductor as the emission medium, which appears suitable to the person skilled in the art, comes into consideration as a light-emitting semiconductor component. The light-emitting semiconductor components of the exposure device of the arrangement according to the invention are preferably the elements of the exposure device which are arranged and designed to emit electromagnetic radiation of a defined spectrum, preferably the emission spectrum of the exposure device. Here, the emission medium, that is to say the semiconductor of the light-emitting semiconductor component, is arranged and designed to emit this electromagnetic radiation.

Preferred light-emitting semiconductor components are light-emitting diodes (LED), or laser diodes (also called semiconductor lasers), or mixtures of these, with light-emitting diodes being particularly preferred here.

A particularly preferred LED is an IR LED (infrared LED) or a UV LED (ultraviolet LED) or both. A preferred UV-LED is one selected from the group consisting of a UV-A-LED, a UV-B-LED, and a UV-C-LED, or a combination of at least two thereof. An IR-LED is an LED that is arranged and configured to emit light having a spectrum including a peak wavelength in an IR wavelength range. A UV LED is an LED that is arranged and designed to emit light with a spectrum including a peak wavelength in a UV wavelength range. A preferred UV wavelength range is selected from the group consisting of a UV-A wavelength range, a UV-B wavelength range, and a UV-C wavelength range, or a combination of at least two thereof.

A preferred light-emitting semiconductor component, in addition to a semiconductor chip as an emission medium, preferably also contains at least one optical system, often a primary optical system, which overlays the at least one semiconductor chip in an emission direction. In the case of an LED as a light-emitting semiconductor component, the above structure, including a substrate carrying the semiconductor chip, the semiconductor chip itself and, optionally, one or more optics, is also referred to as a package in the technical field. Package and LED are often used synonymously. In the case of the chip-on-board technology, which is also possible within the scope of the invention, a plurality of semiconductor chips are arranged on a common substrate. In this case, the package contains several semiconductor chips. In general, a package can contain further elements such as electrical contacts, protective circuits and elements for heat dissipation.

Electromagnetic radiation

The term electromagnetic radiation is used synonymously with the term light. In addition to visible light, both include components of the electromagnetic spectrum that are invisible to the human eye. Preferred electromagnetic radiation is in the wavelength range from 10 nm to 1 mm. Further preferred electromagnetic radiation is infrared radiation (IR radiation) or ultraviolet radiation (UV radiation) or a mixture of both. According to the DIN 5031-7 standard, the wavelength range of UV radiation extends from 10 to 380 nm. By definition, UV-A radiation is in the range from 315 to 380 nm, UV-B radiation in the range from 280 to 315 nm, UV-C radiation in the range from 100 to 280 nm, and EUV radiation in the range from 10 to 121 nm. In the context of the invention, UV radiation is selected from the group consisting of UV-A radiation and UV-B Radiation, and UV-C radiation, or a combination of at least two of them are particularly preferred. It must be taken into account here that the above-mentioned standard defines the wavelength ranges of UV radiation, but in the technical field of LEDs also LEDs with maxima of the emitted intensity (in the technical field also called peak wavelength) at wavelengths that are not specified in the standard Wavelength ranges are referred to as UV-LED. For example, LEDs with maxima of the emitted intensity at wavelengths of 385 nm, 395 nm and 405 nm are also referred to as UV-A LEDs. In the context of the invention, such LEDs also belong to the preferred light-emitting semiconductor components. Furthermore, the designation of the technical field is adopted here and such LEDs are also referred to as UV LEDs.

Measuring device

In the context of the invention, any measuring device that appears suitable to a person skilled in the art, in particular for measuring a voltage drop across the light-emitting reference semiconductor components, can be considered as the measuring device. A preferred measuring device is an electrical measuring device. The electrical measuring circuit of the measuring device is preferably a voltage measuring circuit. If reference is made here to a voltage or a voltage drop, an electrical voltage or a drop in an electrical voltage at an element is always meant. A preferred voltage drop or a preferred voltage of an LED as light emitting semiconductor device is a forward voltage of the LED.

Selection circuit

In principle, any selection circuit that appears suitable to a person skilled in the art can be considered as a selection circuit within the scope of the invention. In this case, a selection circuit is an electrical circuit with which precisely one can be selected from a number of electrical input signals and switched through to an output. For this purpose, the selection circuit can contain a multiplexer or a demultiplexer or both.

Control device

In principle, any control device that appears suitable to a person skilled in the art can be used as the control device in the context of the invention. A preferred control device is an electronic control circuit. This preferably includes a suitable logic circuit. The control device preferably contains suitable means for electronic signal and / or data processing known to those skilled in the art, for example a microcontroller.

Printing press

Any type of printing machine that is suitable for use with the arrangement according to the invention can be considered as the printing machine according to the invention. A preferred printing press is designed to carry out the method according to the invention according to one of its embodiments. The exposure device is preferably arranged and designed in the printing machine for irradiating a composition printed on a print carrier. The composition is preferably a printing ink or a varnish or both. A preferred printing machine is a printing machine without print image storage. A preferred printing machine without print image storage is designed for non-impact printing (NIP). A preferred printing machine without print image storage is an ink jet printer or a laser printer or both. An alternatively preferred printing press includes a print image memory. A preferred print image memory is a printing roller or a printing plate. Furthermore, a preferred printing machine is arranged and designed for indirect printing by means of the print image memory. A preferred printing machine for indirect printing is an offset printing machine. A preferred offset printing machine is a sheet-fed offset printing machine.

Exposure obj ect

In principle, any object that can be modified by irradiating with light from the exposure device while retaining the product can be considered as the exposure object. In this case, the irradiation itself can trigger the modification or enable it. The modification can be one selected from the group consisting of a physical modification, a chemical modification, and a biological modification, or a combination of at least two thereof. A preferred physical modification includes one selected from the group consisting of deforming, joining, adjusting a surface tension, and evaporation, or a combination of at least two thereof. A preferred deformation is deep drawing or stamping or both. A preferred joining is welding or lamination or both. Preferred chemical modification involves a chemical reaction. A preferred chemical reaction is a polymerization reaction or a crosslinking reaction or both. A preferred biological modification includes reducing a germ count by means of exposure to the electromagnetic radiation. The exposure object preferably contains a, preferably sheet-like, substrate and a composition. In a preferred embodiment, the preferably sheet-like substrate contains the composition. In a further preferred embodiment, the composition overlays the substrate at least partially on a side of the substrate facing the exposure device. The composition preferably includes a liquid, more preferably the composition is a liquid. The liquid preferably contains a solvent or an initiator for a chemical reaction or both. More preferably the liquid is a solvent or an initiator for a chemical reaction, or both. In the case of a solvent, the exposure device, particularly preferably with regard to its output radiation power or with regard to its emission spectrum of the light or both, is preferably designed to at least partially evaporate the solvent by irradiating the exposure object with the light. A preferred solvent is water or an organic solvent or both. In the case of an initiator for a chemical reaction, the luminaire, particularly preferably with regard to its output radiation power or with regard to its emission spectrum of the light or both, is preferably designed to initiate the chemical reaction by irradiating the exposure object with the light. A preferred sheet-like substrate includes a fiber-containing material such as paper, cardboard, cardboard, or fleece such as for example for sanitary articles such as diapers or sanitary towels. The substrate particularly preferably consists of the fiber-containing material. Another preferred sheet-like substrate is a film, preferably a polymer film, or a laminate containing several layers such as polymer layers. A preferred composition is selected from the group consisting of a printing ink, an ink, and a varnish, or a combination of at least two thereof. A preferred ink is a disperse ink. In an embodiment according to the invention, the object to be exposed is a printing material printed with a printing ink. In a further embodiment according to the invention, the object to be exposed is a water-containing object such as, for example, a fleece, which can be dried by being irradiated with the light. In a further embodiment according to the invention, the object to be exposed is a substrate overlaid with a protective lacquer, it being possible for the protective lacquer to be hardened by exposure to light. In a further embodiment according to the invention, the object to be exposed is a blank which can be made at least partially deformable by irradiating with the light, so that the blank can be processed into a shaped body or can be embossed, for example by deep drawing.

Overlay

If it is defined herein that an element, for example a layer or a component, is superimposed on another element, these elements can follow one another directly, i.e. without any further element in between, or indirectly, i.e. with at least one further element in between. Immediately successive elements preferably adjoin one another, that is to say that they are in contact with one another. Furthermore, elements overlying one another are preferably connected to one another. Overlapping elements can be directly or indirectly connected to one another. Two elements are connected if their adhesion to one another exceeds van der Waals forces of attraction. Elements connected to one another are preferably one selected from the group consisting of soldered, welded, sintered, screwed and glued to one another, or a combination of at least two thereof. A formulation in which a layer sequence contains enumerated layers or coatings means that at least the specified layers or coatings are present in the specified order. This formulation does not necessarily mean that these layers or coatings follow one another directly. A formulation in which two layers adjoin one another means that these two layers follow one another directly and therefore without an intermediate layer. If a layer overlaps another layer in a layer sequence, the layer does not necessarily overlap the other layer over the entire surface of one or the other layer, but preferably over a flat area of the two layers. The layers forming the layer sequence are preferably connected to one another over a large area.

Variety

The term “plurality” here always means that the plurality contains at least two of the elements mentioned. The plurality preferably includes at least 3, more preferably at least 4, more preferably at least 5, more preferably at least 10, more preferably at least 15, more preferably at least 20, more preferably at least 30, more preferably at least 40, even more preferably at least 50 of the elements mentioned.

groups

If a part of the groups of the light-emitting semiconductor components is referred to herein, this part preferably contains at least 50% of the groups, more preferably at least 60% of the groups, more preferably at least 70% of the groups, even more preferably at least 80% of the groups, most preferably at least 90 % of groups.

Hardening

The curing of a composition is herein a solidification of the composition, a layer being obtained from the composition which, during curing, is preferably also bonded to the underlying substrate. The layer can be a continuous layer, which is preferred as a composition in the case of a lacquer, or a non-continuous layer, for example in the form of letters formed from a printing ink. Preferred hardening is physical hardening or chemical hardening or both. A preferred physical hardening is drying. Drying preferably involves reducing a proportion of a vehicle in the composition, preferably to 0% by weight, preferably by evaporating the vehicle. A preferred vehicle is an organic vehicle or an inorganic vehicle. Water is preferred as the inorganic vehicle. Another preferred vehicle is a solvent. Chemical hardening involves a chemical reaction. A preferred chemical reaction is a polymerization reaction or a crosslinking reaction or both. If the composition is a powdery composition, the curing includes bonding particles of the powdery composition to obtain a coherent solid, which is preferably also connected to the underlying substrate. In the case of a liquid composition, it changes from the liquid state to the solid state on hardening.

Print carrier

Any object that appears suitable to the person skilled in the art within the scope of the invention can be used as the print carrier, also called printing material. A preferred print carrier is flat. This means that a length and a width of the print carrier are greater than a thickness of the print carrier by a factor of at least 10, more preferably at least 100, even more preferably at least 1000. A preferred planar print carrier is designed in the form of a web. This means that a length of the print carrier is greater than a width of the print carrier by a factor of at least 2, more preferably at least 5, even more preferably at least 10, most preferably at least 100. A preferred print carrier includes, preferably consists of, paper, a film or a laminate. A preferred laminate contains one or more polymer layers, one or more paper layers, one or more metal layers, or a combination of the aforementioned layers in a layer sequence.

Printing ink

Printing inks are mixtures containing colorants that have a suitable viscosity for application as a thin layer. In this case, the thin layer in the cured state preferably has a thickness (dry thickness) in a range from 0.5 to 50 μm, preferably from 1 to 30 μm, more preferably from 1 to 20 μm. A preferred printing ink includes one selected from the group consisting of one or more colorants, a binder, a vehicle, and an additive, or a combination of at least two, preferably all of the foregoing. A preferred binder here is a resin or a polymer or a mixture of both. A preferred vehicle is a solvent. A preferred additive is used to set a desired property of the printing ink, preferably a desired processing property, for example a viscosity of the printing ink. A preferred additive is one selected from the group consisting of a dispersing additive, a defoamer, a wax, a lubricant, and a substrate wetting agent, or a combination of at least two thereof. Further, a preferred printing ink is one selected from the group consisting of a toner, an ink for an ink jet printer, an offset printing ink, an illustration printing ink, a liquid color, and a radiation curing printing ink, or a combination of at least two thereof. A preferred offset printing ink is a web offset printing ink or a sheet offset printing ink or both. A preferred web offset printing ink is a web offset coldset printing ink or a web offset heatset printing ink or both. A preferred liquid color is a water-based liquid color or a solvent-based liquid color or both. A particularly preferred printing ink contains 8 to 15% by weight of at least one colorant, preferably at least one pigment, and a total of 25 to 40% by weight of at least one resin or at least one polymer or a mixture of the two, 30 to 45% by weight .-% at least one high-boiling mineral oil (boiling range 250 to 210 ° C), and a total of 2 to 8 wt .-% at least one additive, each based on the weight of the printing ink.

paint

A lacquer is a liquid or powdery coating material which has a suitable viscosity for application as a thin layer and from which a solid, preferably cohesive, film can be obtained by curing. Paints often contain at least one selected from the group consisting of at least one binder, at least one filler, at least one vehicle, at least one colorant, at least one resin and / or at least one acrylate, and at least one additive, or a combination of at least two thereof, a combination of all of the aforementioned constituents (with resin and / or acrylate) being preferred. A preferred additive here is a biocide. A preferred biocide is a pot preservative. Varnishes are often used to protect the object provided with them, the decoration, a functionalization of a surface of the object, for example a change in electrical properties or resistance to abrasion, or a combination of the aforementioned functions. A lacquer that is preferred in the context of the invention is one selected from the group consisting of a water-based lacquer, a solvent-based lacquer, a UV-based, i.e. UV-curable lacquer, and a dispersion lacquer, or a combination of at least two thereof. A particularly preferred lacquer is designed to protect a printed surface.

Colorants

Both solid and liquid colorants known to the person skilled in the art and suitable for the present invention come into consideration. Colorant is after DIN 55943: 2001-10 the collective name for all coloring substances, especially for dyes and pigments. A preferred colorant is a pigment. A preferred pigment is an organic pigment. In connection with the Pigments notable for the invention are in particular those in the DIN 55943: 2001-10 and those in "Industrial Organic Pigments, Third Edition." ( Willy Herbst, Klaus Hunger Copyright © 2004 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim ISBN: 3-527-30576-9 ) mentioned pigments. A pigment is a colorant that is preferably insoluble in the application medium. A dye is a colorant that is preferably soluble in the application medium.

Procedural steps

In a method described here, the method steps of a sequence of steps take place in the specified order of their order symbols. The steps of a sequence of steps can follow one another directly or indirectly. Furthermore, successive method steps can take place one after the other, with a temporal overlap, and also simultaneously.

Support element

Any component that appears suitable to the person skilled in the art for use in an exposure device of the arrangement according to the invention can be used as the carrier element. A preferred carrier element is plate-shaped, that is to say as a carrier plate. A particularly preferred carrier element is a cooling plate. A sheet-like element is referred to herein as a plate, the thickness of which at each point is at least a factor of 2, more preferably at least 5, less than its length and width. The carrier element consists preferably of at least 80% by weight, more preferably at least 90% by weight, even more preferably at least 95% by weight, of a material with a thermal conductivity of at least 50 W / (m · K), more preferably at least 100 W / (m · K), more preferably at least 200 W / (mK), most preferably at least 230 W / (m · K). The carrier element preferably contains at least 80% by weight, more preferably at least 90% by weight, even more preferably at least 95% by weight, of a metal. A preferred metal is copper or aluminum or an alloy containing one or both of the aforementioned metals. In a preferred embodiment, the aforementioned material forms a base body of the carrier element, which can also have one or more coatings. A preferred coating consists of one selected from the group consisting of nickel, palladium, and gold, or of an alloy containing at least one of the aforementioned metals. If the carrier element contains several coatings, these overlap the base body from the base body to the outside, preferably in the aforementioned order. Here, the layer sequences base body, nickel coating, gold coating and also base body, nickel coating, palladium coating, gold coating are particularly preferred. The carrier element particularly preferably has the aforementioned coatings at least on the side of its carrier surface. The elements referred to herein as carrier elements are preferably not a substrate or a circuit board of an LED or an LED module. Rather, the carrier element is preferably a component, on the carrier surface of which a multiplicity of LEDs or an LED module can be arranged. The carrier surface of a carrier element is preferably designed largely flat. Furthermore, the carrier elements of the plurality of carrier elements of the exposure device are preferably separate from one another, that is to say not formed integrally with one another. Rather, each of the carrier elements is preferably connected, preferably detachably, to a base element of the exposure device. A releasable connection exists between 2 elements when one of the two elements is directly or indirectly fixed, preferably rigidly, connected to the other of the two elements and this connection without one of the two elements and, in the case of the indirect connection, preferably without an intermediate element to damage or destroy can be solved. Here, the carrier elements are preferably arranged one after the other along a direction of a length of the base element. Alternatively, the carrier elements can be arranged in the form of an array, that is to say a two-dimensional grid. A group of light-emitting semiconductor components is arranged on each of the carrier elements. In this case, each group can consist of the same light-emitting semiconductor components or a mixture of different light-emitting semiconductor components, in particular with regard to an emission spectrum of the light-emitting semiconductor components. Furthermore, the groups can be the same or differ in their composition. In any case, the groups are identified in that the light-emitting semiconductor components of each group are arranged on a carrier surface of precisely one carrier element.

Cooling structure

Any structure that appears suitable to a person skilled in the art for increasing the heat dissipation of a carrier element from its cooling surface to an environment, in particular to a cooling fluid, can be used as the cooling structure. A preferred cooling structure includes one selected from the group consisting of fins, cooling fins, pores, and channels, or a combination of at least two thereof. Cooling fins are particularly preferred here. Cooling fins are also known as cooling fins. Cooling fins are flat elements. These sheet-like elements are preferably each on one edge with a carrier element to which the respective cooling structure belongs. The sheet-like elements are preferably arranged plane-parallel to one another. Furthermore, the sheet-like elements preferably have rectangular side surfaces.

Cooling fluid

Any fluid that appears suitable to the person skilled in the art within the scope of the invention, in particular for cooling the exposure device of the arrangement according to the invention, can be considered as the cooling fluid. A fluid is herein a flowable medium. This includes in particular gases and liquids. A cooling liquid is preferred as the cooling fluid herein. A preferred cooling liquid includes water or glycol or a mixture of both. The cooling liquid preferably consists of water or a water-glycol mixture.

MEASUREMENT METHODS

The following measurement method was used in the context of the invention. Unless otherwise stated, the measurements were carried out at an ambient temperature of 23 ° C., an ambient air pressure of 100 kPa (0.986 atm) and a relative humidity of 50%.

Detection of colorants

Evidence of organic colorants can be provided according to the information in "Industrial Organic Pigments, Third Edition." Willy Herbst, Klaus Hunger Copyright © 2004 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim ISBN: 3-527-30576-9 ) are carried out.

• 1 eine schematische Darstellung einer erfindungsgemäßen Anordnung;
• 2 eine schematische Darstellung einer weiteren erfindungsgemäßen Anordnung;
• 3 eine schematische Darstellung einer weiteren erfindungsgemäßen Anordnung;
• 4 eine Perspektivdarstellung einer Belichtungseinrichtung einer erfindungsgemäßen Anordnung;
• 5 eine perspektivische Teildarstellung der Belichtungseinrichtung der 4;
• 6 eine weitere perspektivische Teildarstellung der Belichtungseinrichtung der 4;
• 7 eine schematische Darstellung einer weiteren erfindungsgemäßen Anordnung;
• 8 ein Ablaufdiagramm eines erfindungsgemäßen Verfahrens;
• 9 ein Diagramm zur Abhängigkeit der optischen Ausgangsleistung von der Sperrschichttemperatur; und
• 10 ein Diagramm zur Abhängigkeit der Sperrschichttemperatur von der Vorwärtsspannung.

The invention is illustrated in more detail below by means of examples and drawings, the examples and drawings not signifying any restriction of the invention. Unless otherwise stated in the description or the respective figure, the following are shown schematically and not to scale:

• 1 a schematic representation of an arrangement according to the invention;
• 2 a schematic representation of a further arrangement according to the invention;
• 3 a schematic representation of a further arrangement according to the invention;
• 4th a perspective view of an exposure device of an arrangement according to the invention;
• 5 a perspective partial illustration of the exposure device of 4th ;
• 6th a further perspective partial illustration of the exposure device of 4th ;
• 7th a schematic representation of a further arrangement according to the invention;
• 8th a flow chart of a method according to the invention;
• 9 a diagram of the dependence of the optical output power on the junction temperature; and
• 10 a diagram showing the dependence of the junction temperature on the forward voltage.

1 shows a schematic representation of an arrangement according to the invention 100 . The order 100 includes an exposure device 101 which is a UV lamp. Details of the UV radiator are in the 4th to 6th shown. The UV radiator contains 28 support elements 102 , of those in the 1 only 3 are shown. Each of the support elements 102 has a support surface 103 on which a group 104 of light-emitting semiconductor components 105 is arranged. In the case of the light-emitting semiconductor components 105 it is about UV-LEDs. The groups' UV LEDs 104 are all the same. Furthermore, the UV LEDs are in the groups 104 arranged equally. Each of the groups 104 contains exactly one light-emitting reference semiconductor component 109 , i.e. a UV LED that serves as a reference. This reference is in each group 104 in the same place. The arrangement also includes 100 a measuring device 106 which in turn have an electrical measurement circuit 108 for measuring a voltage drop across a light-emitting semiconductor component 105 and one electrical between the electrical measurement circuit 108 and the groups 104 switched selection circuit 107 . The selection circuit 107 includes a multiplexer. The electrical measuring circuit 108 is a voltage measuring circuit with a high-ohm measuring resistor, the ohmic resistance of which can be assumed to be approximately infinite compared to the ohmic resistance of each of the UV LEDs. The selection circuit 107 is so with the light-emitting reference semiconductor components 109 electrically connected that by means of the selection circuit 107 and the electrical measuring circuit 108 a forward voltage of each individual light-emitting reference semiconductor component one after the other 109 can be measured. The arrangement also includes a control device 110 which is arranged and designed to control the multiplexer in such a way that the aforementioned forward voltages are measured once per cycle in a large number of consecutive cycles. As a result, the voltage drop across the individual light-emitting reference semiconductor components 109 be measured periodically. This can take place, in particular, in situ during operation of the UV radiator. The control device 110 contains a data memory and a microcontroller. A linear function is stored in the data memory, which describes the dependency of a junction temperature of a UV LED on its forward voltage. 10 shows how this linear function was determined. The control device 110 can now by means of the linear function in situ during operation of the UV emitter from the measured forward voltages of the individual light-emitting reference semiconductor components 109 determine their junction temperature. This means that the junction temperature of each group can be set when the UV lamp is in operation 104 be monitored. Furthermore, the control device is in the data memory 110 Another linear function is stored, which describes the dependence of the optical output power of a UV-LED on its junction temperature. The control device can use this linear function 110 the optical output powers of the light-emitting reference semiconductor components from the specific junction temperatures in situ during operation of the UV emitter 109 determine.

2 shows a schematic representation of a further arrangement according to the invention 100 . This is like the arrangement of the 1 educated. In contrast to the 1 are the light-emitting reference semiconductor components 109 but not in every group here 104 in the same place.

3 shows a schematic representation of a further arrangement according to the invention 100 . This is like the arrangement of the 1 educated. In contrast to the 1 are included in each of the groups 104 here, however, a mixture of different UV LEDs. So every group exists 104 from a mixture of UV-A LEDs and UV-C LEDs. Furthermore, each group includes 104 3 light-emitting reference semiconductor components 109 . This enables a more detailed monitoring of the UV LEDs, in particular monitoring of both the UV-A LEDs and the UV-C LEDs.

4th shows a perspective view of an exposure device 101 an arrangement according to the invention 100 . The exposure device 101 is a UV emitter with UV LEDs as light-emitting semiconductor components. One group at a time 104 the UV LEDs is on a support surface 103 one of 28 support elements 102 arranged. The support elements 102 are in a longitudinal direction 405 arranged one after the other and with a basic element 401 that is a housing 401 of the UV radiator forms connected. The UV lamp also includes a connection 402 for a cooling fluid inlet and a connection 403 for a cooling fluid return of a cooling circuit. The connections 402 and 403 are by means of a connecting element 404 with cooling channels (cooling fluid inlet 502 and cooling fluid return 503 in 5 ) connected in the basic element.

5 shows a perspective partial illustration of the exposure device 101 the 4th . Here only parts of the UV lamp are shown in section. You can see the basic element 401 with a cooling fluid inlet 502 and a cooling fluid return 503 . Furthermore are above the support elements 102 (not shown) secondary optics 501 arranged, each including a plurality of plano-convex converging lenses.

6th shows a further perspective partial illustration of the exposure device 101 the 4th . Here are the secondary optics 501 not shown, which reveals the elements below. Of the 28 support elements 102 only a single one is shown here. It is a cooling plate that is attached to the base element by means of screws 401 connected is. On a flat support surface 103 is a group 104 arranged by UV LEDs. Each UV LED has a circuit board that attaches to the carrier surface 103 is soldered. The carrier element has on its rear side 102 a cooling surface with a cooling structure made of cooling fins. By means of the cooling fluid inlet 502 and the cooling fluid return 503 (please refer 5 ) the cooling structure can be washed up with a cooling liquid and so the carrier element 102 be cooled.

7th shows a schematic representation of a further arrangement according to the invention. This includes the arrangement 100 the 1 which here is part of a printing press 701 is. At the printing press 701 it is a sheet-fed offset printing machine. The arrangement also includes a substrate 702 , which by means of a roller conveyor (not shown) relative to the exposure device in a process direction 703 can be transported. The substrate 702 is a print medium that is produced by means of the printing machine 701 can be printed with a printing ink, which can then be cured by exposure to UV light from the UV lamp. The substrate 702 and the printing ink together form an exposure object of the arrangement.

8th shows a flow chart of a method according to the invention 800 to produce a printed product. The procedure 800 includes a process step a) 801 in which the in 4th exposure device shown 101 and a printing medium are provided. Furthermore, the printing medium is printed with a printing ink to obtain an exposure object. In a process step b) 802 is the printed ink with from the exposure device 101 emitted UV light irradiated to preserve the printed product. During the irradiation, the reference semiconductor components emitting light on the individual 109 the exposure device 101 falling forward voltages measured one after the other. This measurement is repeated in successive cycles, that is periodically, so that a change in the forward voltages is monitored in situ in method step b). From two forward voltages measured in consecutive cycles of the same light-emitting reference semiconductor component 109 also in situ a change in a junction temperature and a change in an optical output power of the respective light-emitting reference semiconductor component 109 certainly.

9 shows a diagram for the dependence of the optical output power 902 on the junction temperature 903 . You can see the measured optical output power 904 of a UV LED in% over time in h 901 . A regression line was created from these measurement data 905 determined. This regression line 905 is the graph of the linear function of the optical output power 902 from the time 901 . There is also another straight line 906 showing the dependence of the junction temperature 903 from the time 901 describes. Because junction temperature 903 and optical output power 902 both by a linear function of time 901 can be described, a dependency of the optical output power 902 on the junction temperature 903 can also be described by a linear function. This linear function becomes like to 1 described for the determination of the junction temperatures of the light-emitting reference semiconductor components 109 used.

10 shows a diagram of the dependency of the junction temperature 1001 in ° C of the forward voltage 1002 in V. Measurement points are shown 1003 , to which a regression line 1004 was laid. This regression line 1004 descriptive linear function is used in the arrangement of the 1 used to determine junction temperatures from the forward voltages.

List of reference symbols

100

arrangement according to the invention

101

Exposure device

102

Support element

103

Support surface

104

Group of light emitting semiconductor components

105

light-emitting semiconductor component

106

Measuring device

107

Selection circuit

108

electrical measuring circuit

109

light-emitting reference semiconductor component

110

Control device

401

Basic element / housing

402

Connection for cooling fluid inlet

403

Connection for cooling fluid return

404

Connecting element

405

longitudinal direction

501

Secondary optics

502

Cooling fluid inlet

503

Cooling fluid return

701

Printing press

702

Substrate

703

Process direction

800

method according to the invention

801

Process step a)

802

Process step b)

901

Time in h

902

optical output power in%

903

Junction temperature in ° C

904

measured optical output power over time

905

Regression line for the optical output power

906

Junction temperature over time

1001

Junction temperature in ° C

1002

Forward voltage in V

1003

Measuring points

1004

Regression line for the forward voltage versus the junction temperature

QUOTES INCLUDED IN THE DESCRIPTION

This list of the documents listed by the applicant was generated automatically and is included solely for the better information of the reader. The list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions.

Non-patent literature cited

• DIN 55943: 2001-10 [0112]
• Willy Herbst, Klaus Hunger Copyright © 2004 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim ISBN: 3-527-30576-9 [0112, 0118]

Claims (15)

An arrangement (100), including a) an exposure device (101) containing a plurality of carrier elements (102) each with a carrier surface (103), a group (104) of light-emitting semiconductor components (105) being arranged on each carrier surface (103), and b) a measuring device (106) including i) an electrical measuring circuit (108) for measuring a voltage drop across a light-emitting semiconductor component (105), and ii) a selection circuit (107) electrically connected between the electrical measuring circuit (108) and the groups (104); wherein the selection circuit (107) is electrically connected to at least one light-emitting reference semiconductor component (109) of each group (104) at least one part containing at least two groups (104) of the groups (104) of light-emitting semiconductor components (105), that by means of the selection circuit ( 107) and the electrical measuring circuit (108) can measure a voltage drop across at least one of the light-emitting reference semiconductor components (109) per group (104) of at least part of the groups (104). The arrangement (100) according to Claim 1 , wherein the arrangement (100) further includes a control device (110) which is arranged and designed to control the selection circuit (107) in such a way that the voltage drop in a plurality of successive cycles per cycle on at least one of the light-emitting reference semiconductor components ( 109) per group (104) at least that part of the groups (104) is measured. The arrangement (100) according to Claim 2 , wherein the control device (110) is further arranged and designed to change a temperature for at least one of the light-emitting reference semiconductor components (109) per group (104) of at least that part of the groups (104) from the voltage drop measured in at least two of the cycles of the respective light-emitting reference semiconductor component (109), or a change in a power of the respective light-emitting reference semiconductor component (109), or both. The arrangement (100) according to Claim 3 , wherein the control device (110) is further arranged and designed to provide an absolute actual value for at least one of the light-emitting reference semiconductor components (109) per group (104) of at least the part of the groups (104) from an absolute temperature value and a specific change in temperature -Temperature of the respective light-emitting reference semiconductor component (109) to be determined. The arrangement (100) according to Claim 4 , wherein the control device (110) is further arranged and designed to switch off the light-emitting semiconductor components (105) of the group (104) containing the light-emitting reference semiconductor component (109), the absolute actual temperature of which has been determined, when the determined absolute actual temperature this light-emitting reference semiconductor component (109) exceeds a maximum value. The arrangement (100) according to one of the Claims 3 to 5 , wherein the control device (110) is further arranged and designed to extrapolate the change in temperature for at least one single one of the light-emitting reference semiconductor components (109) per group (104) of at least the part of the groups (104) and based on the extrapolated change in the Temperature to create a fault diagnosis. The arrangement (100) according to any one of the preceding claims, wherein the arrangement (100) further includes an exposure object that is arranged and designed to be irradiated with light emitted by the light-emitting semiconductor components (105). The arrangement (100) according to Claim 7 wherein the exposure object includes a substrate (702) and a composition overlying the substrate. The arrangement (100) according to Claim 7 or 8th , wherein the arrangement further includes a transport device which is arranged and designed to transport the exposure object in a process direction (703) relative to the exposure device (101). The arrangement (100) according to 9, wherein the arrangement (100) includes an overlay device arranged in the process direction (703) in front of the exposure device (101), the overlay device being arranged and designed to overlay the substrate (702) with the composition. A printing machine (701) containing the arrangement (100) according to one of the Claims 1 to 6th . A method (800) for producing a product, the method (800) comprising as method steps a) providing i) an exposure device (101), comprising a plurality of carrier elements (102) each with a carrier surface (103), a group (104) of light-emitting semiconductor components (105) being arranged on each carrier surface (103), and ii) at least one exposure object; and b) irradiating the at least one exposure object with light emitted by the exposure device (101) to obtain the product; wherein each group (104) of a part of the groups (104) containing at least two groups (104) of the groups (104) of light-emitting semiconductor components (105) contains at least one light-emitting reference semiconductor component (109); wherein in method step b) (802) a voltage drop across at least one of the light-emitting reference semiconductor components (109) per group (104) of at least part of the groups (104) is measured. A use of the arrangement (100) according to one of the Claims 1 to 10 to harden a composition. A use of the arrangement (100) according to one of the Claims 1 to 6th in a printing machine (701). A use of the arrangement (100) according to one of the Claims 1 to 10 to generate a fault diagnosis or to predict a malfunction of the exposure device (101) or both.

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