DE102019100071B4 - High performance capacitor module - Google Patents

Abstract

The invention relates to a high-performance capacitor module with a large number of low-inductance, electrically interconnected individual capacitors and connection terminals for further electronic components, in particular semiconductor switches, the individual capacitors being arranged as a tight packing on a carrier plate and the electrical interconnection being implemented via bus bar plates. According to the invention, a box-shaped, media-tight module housing is formed which has a module cover, the module cover preferably merging into a dome in the area of spatially concentrated connection terminals. Furthermore, with the exception of the dome, a potting or filling compound is introduced into the module housing, a gas space being formed in the volume of the dome, the gas pressure of which is used to monitor the state of the large number of individual capacitors.

Description

The invention is based on a high-performance capacitor module with a large number of low-inductively electrically interconnected individual capacitors and connection terminals for further electronic components, namely semiconductor switches, the individual capacitors being arranged as a tight package on a carrier plate, according to the preamble of claim 1.

From the DE 11 2016 000 235 T2 a power conversion device is known which has a power semiconductor module and a capacitor module and corresponding busbars.

The power semiconductor modules are arranged in such a way that their power connections point in a defined direction. The connections of the capacitor modules are designed in such a way that they are oriented towards the main surfaces of external connections. Corresponding busbars are adapted so that on the one hand the power semiconductor modules and on the other hand the capacitor modules are electrically connected. The actual connection is made by welding connections or by mechanical clamping. The capacitor modules, on the one hand, and the power semiconductor modules, on the other hand, are fixed adjacently on a carrier plate which also accommodates the busbars mentioned. Due to the adjacent arrangement between the capacitor modules and the power semiconductor modules without the interposition of thermal decoupling, there is a risk that heat loss from the power semiconductor modules will lead to permanent damage to the capacitor modules and ultimately to their failure.

For the power electronics module after DE 10 2016 204 460 A1 there are semiconductor components and at least one capacitor module. The capacitor module has at least one intermediate circuit capacitor. There is also a housing which, on the one hand, accommodates the semiconductor switches and, on the other hand, also accommodates the capacitor module in order to provide protection against external environmental conditions. The intermediate circuit capacitor of the capacitor module is designed as a wound capacitor without a housing. Where the intermediate circuit capacitor rests against the inside of the housing, there is a cooling structure, in particular for receiving a cooling liquid in order to dissipate lost heat. For mechanical fixing, it is proposed to press the intermediate circuit capacitor into a bore in the inside of the housing.

In the DE 20 2015 004 662 U1 shows an intermediate circuit capacitor module with low-inductance busbar connections between the individual capacitors and a connection for a semiconductor switch, in particular an IGBT, the individual capacitors being designed as cup capacitors with connection terminals located on one side of the cup.

There is also a carrier plate which holds a group of individual capacitors.

The individual capacitors are tightly packed in any number and in any geometric arrangement on the carrier plate. The busbar connections are designed as a multi-layer busbar plate with an insulating intermediate layer.

The individual capacitors are fixed between the carrier plate and the bus bar plate, the bus bar plate being supported against the carrier plate via bolt-like connecting means.

The individual capacitors are located in the space between the carrier plate and the bus bar plate in such a way that the connection terminals located on the cup side facing the bus bar plate can be connected to a respective conductive layer of the bus bar plate.

With such a solution, short, low-inductance connections between a capacitor module and semiconductor circuits can be implemented. In addition, it prevents the heat generated due to the power loss of the IGBTs from adversely affecting the service life and behavior of neighboring capacitors.

In one embodiment according to DE 20 2015 004 662 U1 For example, the carrier plate that can be used as a heat sink can be designed as a heat sink, this heat sink also being in connection with the semiconductor switch, in particular the respective IGBT. In this embodiment, the carrier plate can therefore represent a common heat sink.

From the DE 295 04 732 U1 that the due is a generic high-performance capacitor module with a large number of electrically interconnected individual capacitors and connection elements known, the individual capacitors being arranged on a carrier plate.

Furthermore, a box-shaped, media-tight module housing is formed which has a module cover. A potting or filling compound is introduced into the module housing, with a gas space being formed in the volume, the gas pressure of which is used to monitor the state of the large number of individual capacitors.

The DE 10 2016 208 381 A1 discloses an intermediate circuit capacitor for a multi-phase system with flat electrodes.

The DE 10 2005 007 607 A1 relates to a capacitor module with a module housing, the module housing being at least partially filled with a medium which absorbs capacitor emissions.

Based on the prior art described, the object of the invention is to create a further developed high-performance capacitor module with a large number of low-inductance, electrically connected individual capacitors and connection terminals for further electronic components, in particular semiconductor switches, which carries the individual capacitors in a mechanically stable manner and is protected against environmental influences in a tight installation space At the same time, the heat generated in a housing arrangement can be dissipated and it is ensured that heat loss from semiconductor components located in structural proximity does not adversely affect the service life and reliability of the capacitors used. Ultimately, the functionality of the capacitors should be monitored in a simple manner in order to avoid damage in the event of malfunctions, in particular through effects on neighboring assemblies, components or other equipment.

The object of the invention is achieved by a high-performance capacitor module according to the combination of features according to claim 1, the subclaims representing expedient refinements and developments.

A high-performance capacitor module with a large number of low-inductance, electrically interconnected individual capacitors is therefore assumed. The individual capacitors can be wound capacitor elements with corresponding connections located in a cup.

Furthermore, the high-performance capacitor module comprises connection terminals for further electrical or electronic components, semiconductor switches, here in particular IGBTs.

The individual capacitors are arranged as a tight packing on a carrier plate. The electrical interconnection of the individual capacitors takes place via bus bar plates that are isolated from one another.

In a preferred embodiment, the individual capacitors are arranged standing next to one another in such a way that the capacitors can be connected in parallel in a simple manner.

In addition, a box-shaped, media-tight module housing is formed which has a module cover.

The module cover merges into a dome.

This dome can preferably be located in the area of spatially concentrated connection terminals. The connection terminals penetrate the dome using an insulation duct.

With the exception of the dome, an electrically insulating potting or filling compound is introduced into the module housing, a gas space being formed in the volume of the dome.

The pressure in the gas space is used to monitor the state of the large number of individual capacitors.

In this regard, a pressure sensor reaching into the gas space, in particular a pressure switch, is arranged.

If the internal pressure inside the dome exceeds a limit value, the module can be switched off automatically using the pressure switch. In addition, the pressure conditions can be continuously monitored using a pressure sensor in order to enable early detection of damage or to determine whether regular maintenance is due.

The pressure sensor or the pressure switch can also be designed in connection with a pressure relief valve or be part of such a pressure relief valve.

There are isolated connection terminal bushings in the dome. The mentioned pressure sensor or the pressure switch can be attached to such a side surface of the dome which, with respect to the electrical connection, is not restrictive with regard to the terminals present there.

The module cover has a plurality of fastening elements, for example designed as fastening bolts, these fastening elements or fastening bolts serving to fix a plate-shaped heat sink.

This cooling plate-like heat sink increases the mechanical strength of the module housing and can be used by using a corresponding lateral protrusion to fasten the high-performance capacitor module, for example in a frame, a switch cabinet or the like.

On the side of the plate-shaped heat sink facing away from the module cover, semiconductor switches are arranged, which can then be connected to the connection terminals in the region of the dome.

The plate-shaped heat sink serves to dissipate heat, on the one hand, from the module housing and, on the other hand, to dissipate heat losses from the other electronic components used, in particular the semiconductor switches.

The sandwich structure between the module cover, plate-shaped heat sink and components generating power loss located on the top of the plate-shaped heat sink also ensures that the heat loss generated by the electronic components in particular does not penetrate the inside of the module housing and possibly damage the capacitors there.

In a further development of the invention, the carrier plate can be part of the module housing. Here the carrier plate can form the base plate of the module housing.

The dome can be designed in one piece with the module cover or it can also be designed as a component that closes the opening in the module cover.

The electrically insulating potting or filling compound used is preferably designed to be hardening. In this regard, one or more potting openings, which can be closed, can be arranged in the module cover.

The module housing is preferably made of a metallic material, in particular aluminum or steel, and has electrical insulation on the inside.

The bus bar plates consist of a solderable material, in particular copper. In the area of the soldering islands, incisions or cutouts are formed for thermal decoupling of the respective soldering island from the rest of the busbar plate. This makes it possible to carry out the large number of necessary soldered connections with low thermal energy, so that an undesired introduction of heat into the capacitor elements can already be avoided during the production of the electrical connections.

The presented high-performance capacitor module is intended for use in medium or high-voltage converters with power semiconductors, in particular IGBT assemblies, without the use being restricted to the aforementioned technical aspect.

The invention will be explained in more detail below with the aid of an exemplary embodiment and with the aid of figures.

• 1 eine perspektivische Darstellung einer kastenförmigen Modulumhausung noch ohne Moduldeckel, jedoch bereits mit Busbarplatte, Teilen der Anschlussterminals sowie Lötinseln, die über Einschnitte zur übrigen Busbarplatte thermisch entkoppelt sind, und
• 2 eine perspektivische Darstellung des Hochleistungskondensatormoduls mit geschlossener, das heißt mediendichter Modulumhausung, auf dem Moduldeckel befindlichen Bolzen zur Aufnahme einer nicht gezeigten Kühlplatte sowie einem oberhalb des Moduldeckels befindlichen, mit diesem verbundenen Dom, welcher einen Gasraum bildet nebst Druckschalter zur Überwachung des Gasdruckes sowie zum elektrischen Abtrennen im Falle auftretender Störungen.

Here show:

• 1 a perspective view of a box-shaped module housing still without a module cover, but already with a bus bar plate, parts of the connection terminals and soldering islands that are thermally decoupled from the rest of the bus bar plate via incisions, and
• 2 a perspective view of the high-performance capacitor module with a closed, i.e. media-tight module housing, bolts located on the module cover to accommodate a cooling plate (not shown) and a dome connected to the module cover above the module cover, which forms a gas space along with a pressure switch for monitoring the gas pressure and for electrical disconnection in the event of malfunctions.

In the figures, a z. B. box-shaped module housing, which consists of four side walls 1 as well as a floor 2 and a lid 3 (please refer 2 ) consists.

A large number of capacitor windings or individual capacitors are located in the interior volume enclosed by the module housing.

The individual capacitors are, for example, housed next to one another, relative to their longitudinal axis, in the module housing. A bent winding connection 4th leads, as in the 1 recognizable, each on a soldering island, which is thermally removed from the bus bar plate through side incisions 5 is decoupled.

A second, electrically insulating bus bar plate is connected to the second capacitor winding connection. The terminals 10 are alternately with the bus bar plates 5 connected. The number of terminals 10 and their cross-section can be adapted to the electrical requirements.

On the inside wall side, the module housing also has an insulating plate 6th on.

openings 7th are used to fill in a potting compound after the module cover 3 with the up to then still open box consisting of the parts 1 and 2 was welded.

The corresponding openings in the module cover 3 are for example with screws 8th tightly closable.

On the module cover 3 is a variety of stud bolts 9 attached, which serve to accommodate a cooling plate, not shown.

The module cover 3 has preferably in the area of the spatially concentrated connection terminals 10 a Cathedral 11 or go to such a cathedral 11 over.

The cathedral 11 has connection terminal bushings 12 for the terminals 10 on.

At one of the 2 recognizable exemplary face 13 of the cathedral 11 is one in the from the cathedral 11 pressure sensor or pressure switch reaching into the enclosed gas space 14th arranged.

A filling of the box-shaped volume via the openings 7th or after removing the screw connection 8th only takes place up to the underside of the module cover 3 or to the cathedral 11 reaching.

This forms in the cathedral 11 a gas room. The gas pressure in the gas space is determined using the pressure switch or pressure sensor 14th monitored, so that in the event of a fault, appropriate measures, in particular switching off the module, are possible. In order to avoid explosive destruction in the event of a very rapid increase in the gas pressure in the volume of the dome, there is the possibility of in the area of the dome 11 an overpressure protection in the sense of a valve 15th to arrange.

Alternatively, you can use the openings for the pressure switch 14th and / or the valve 15th are filled and the openings 7th or the screw connections 8th can be omitted.

From the representation after the 2 it can be seen that the cathedral 11 in terms of height above the surface of the module cover 3 protrudes. The existing difference in height can be achieved by the cooling plate (not shown), which also stabilizes the overall arrangement and is fastened with the aid of the bolts 9 be balanced or used.

The cooling plate, not shown, also serves to accommodate electronic components, in particular IGBTs, which in turn are connected to the terminals in accordance with the necessary interconnection 10 are connectable.

The floor 2 the module housing can also form the carrier plate for the large number of individual capacitors.

The box-shaped module housing with dome virtually forms a pressure vessel, whereby the pressure of the gas volume in the area of the dome, which changes in the event of a malfunction, is monitored.

The flat, box-shaped design of the module housing with dome creates enough space for the close proximity, which is preferred for reasons of interconnection, with regard to the necessary power electronics. The polarities of the connection terminals, including their position, are arranged with the aim of establishing a low-inductance connection to neighboring power components and can be varied according to the particular application.

Claims (11)

High-performance capacitor module with a large number of low-inductively electrically interconnected individual capacitors and connection terminals (10) for further electronic components, namely semiconductor switches, the individual capacitors being arranged as a tight packing on a carrier plate, and a box-shaped, media-tight module housing (1; 2; 3) being designed, which has a module cover (3), furthermore a casting or filling compound is introduced into the module housing (1; 2; 3), with a gas space being formed, the gas pressure of which is used to monitor the state of the plurality of individual capacitors, characterized in that the electrical interconnection is carried out via bus bar plates (5), the module cover (3), preferably in the area of spatially concentrated connection terminals (10), merges into a potting or filling compound-free dome (11), the module cover (3) has a large number of fastening elements (9) ), wherein the fastening elements (9) serve to accommodate a plate-shaped heat sink, on which the side of the plate-shaped heat sink facing away from the module cover (3), the semiconductor switches are arranged, which can be connected to the connection terminals (10), the connection terminals (10) using insulated connection terminal bushings ( 12) penetrate the dome (11). High performance capacitor module according to Claim 1 , characterized in that a pressure sensor, in particular a pressure switch (14), reaching into the gas space is arranged on the dome (11). High performance capacitor module according to Claim 1 , characterized in that the plate-shaped heat sink serves to dissipate heat from the module housing (1; 2; 3) and to dissipate heat loss from the semiconductor switches. High-performance capacitor module according to one of the Claims 1 or 3 , characterized in that the module is attached to a carrier device via the plate-shaped heat sink. High-performance capacitor module according to one of the preceding claims, characterized in that the carrier plate is part of the module housing. High performance capacitor module according to Claim 5 , characterized in that the carrier plate is the base plate (2) of the module housing. High-performance capacitor module according to one of the preceding claims, characterized in that the dome (11) is constructed in one piece with the module cover (3) or the dome (11) is constructed as a component closing the opening in the module cover (3). High-performance capacitor module according to one of the Claims 1 to 7th , characterized in that the module cover (3) forms a sandwich arrangement with the plate-shaped heat sink. High-performance capacitor module according to one of the preceding claims, characterized in that the casting or filling compound is hardening and electrically insulating. High-performance capacitor module according to one of the preceding claims, characterized in that the module housing consists of a metallic material, in particular aluminum or steel, and has electrical insulation (6) on the inside. High-performance capacitor module according to one of the preceding claims, characterized in that the electrically conductive busbar plates (5) are made of a solderable material and incisions or recesses are formed in the area of soldering islands for thermal decoupling of the respective soldering island from the rest of the busbar.

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