DE102018222296A1 - Workpiece processing method and processing device - Google Patents
Workpiece processing method and processing device Download PDFInfo
- Publication number
- DE102018222296A1 DE102018222296A1 DE102018222296.7A DE102018222296A DE102018222296A1 DE 102018222296 A1 DE102018222296 A1 DE 102018222296A1 DE 102018222296 A DE102018222296 A DE 102018222296A DE 102018222296 A1 DE102018222296 A1 DE 102018222296A1
- Authority
- DE
- Germany
- Prior art keywords
- workpiece
- plastic
- grinding
- grindstones
- front surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000003672 processing method Methods 0.000 title claims abstract description 5
- 238000012545 processing Methods 0.000 title claims description 21
- 238000000227 grinding Methods 0.000 claims abstract description 130
- 239000006223 plastic coating Substances 0.000 claims abstract description 10
- 239000011248 coating agent Substances 0.000 claims abstract description 4
- 238000000576 coating method Methods 0.000 claims abstract description 4
- 238000012546 transfer Methods 0.000 claims description 41
- 238000004140 cleaning Methods 0.000 claims description 21
- 238000003754 machining Methods 0.000 claims description 20
- 238000000034 method Methods 0.000 claims description 14
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 12
- 230000007306 turnover Effects 0.000 claims description 3
- 239000003795 chemical substances by application Substances 0.000 description 11
- 230000008569 process Effects 0.000 description 7
- 239000000853 adhesive Substances 0.000 description 4
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- 239000003599 detergent Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 235000010855 food raising agent Nutrition 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 2
- BUHVIAUBTBOHAG-FOYDDCNASA-N (2r,3r,4s,5r)-2-[6-[[2-(3,5-dimethoxyphenyl)-2-(2-methylphenyl)ethyl]amino]purin-9-yl]-5-(hydroxymethyl)oxolane-3,4-diol Chemical compound COC1=CC(OC)=CC(C(CNC=2C=3N=CN(C=3N=CN=2)[C@H]2[C@@H]([C@H](O)[C@@H](CO)O2)O)C=2C(=CC=CC=2)C)=C1 BUHVIAUBTBOHAG-FOYDDCNASA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000005422 blasting Methods 0.000 description 1
- 239000012459 cleaning agent Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000002996 emotional effect Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Images
Classifications
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02002—Preparing wafers
- H01L21/02005—Preparing bulk and homogeneous wafers
- H01L21/02008—Multistep processes
- H01L21/0201—Specific process step
- H01L21/02013—Grinding, lapping
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B3/00—Spraying or sprinkling apparatus with moving outlet elements or moving deflecting elements
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B24B49/03—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent according to the final size of the previously ground workpiece
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
- B24B49/04—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent involving measurement of the workpiece at the place of grinding during grinding operation
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B24B55/02—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
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- H01L21/02057—Cleaning during device manufacture
- H01L21/0206—Cleaning during device manufacture during, before or after processing of insulating layers
- H01L21/02065—Cleaning during device manufacture during, before or after processing of insulating layers the processing being a planarization of insulating layers
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- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
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- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
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- H—ELECTRICITY
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
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- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
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- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
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- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
Abstract
Ein Werkstückbearbeitungsverfahren beinhaltet einen Kunststoffbeschichtungsschritt des Beschichtens einer vorderen Oberfläche eines Werkstücks mit einem Kunststoff, einen Kunststoffhärtschritt des Aufbringens eines Ultraviolettstrahls auf den zu härtenden beschichteten Kunststoff, einen Kunststoffschleifschritt des Schleifens des gehärteten Kunststoff mit Schleifsteinen, so dass er eben ausgestaltet wird, und einen Werkstückschleifschritt des Haltens der Seite des Werkstücks mit dem eben ausgestalteten Kunststoff an einem Einspanntisch und des Schleifens der hinteren Oberfläche mit Schleifsteinen. Im Kunststoffschleifschritt wird ein Schleifen durchgeführt, während der an den Schleifsteinen haftende Kunststoff gereinigt wird. Demgemäß ist es möglich, den Kunststoff, mit dem die vordere Oberfläche des Werkstücks beschichtet ist, und die hintere Oberfläche des Werkstücks in der gleichen Vorrichtung zu schleifen.A workpiece processing method includes a plastic coating step of coating a front surface of a workpiece with a plastic, a plastic hardening step of applying an ultraviolet ray to the coated plastic to be cured, a plastic grinding step of grinding the hardened plastic with grindstones so as to be planarized, and a workpiece grinding step of Holding the side of the workpiece with the newly designed plastic on a chuck table and grinding the back surface with grindstones. In the plastic grinding step, grinding is performed while the plastic adhering to the grinding stones is cleaned. Accordingly, it is possible to grind the plastic with which the front surface of the workpiece is coated and the rear surface of the workpiece in the same device.
Description
HINTERGRUND DER ERFINDUNGBACKGROUND OF THE INVENTION
Technisches GebietTechnical area
Die vorliegende Erfindung betrifft ein Werkstückbearbeitungsverfahren und eine Bearbeitungsvorrichtung.The present invention relates to a workpiece machining method and a machining apparatus.
Beschreibung der verwandten TechnikDescription of the Related Art
In einem Herstellungsprozess für ein Halbleiterbauelement werden Straßen (Teilungslinien) in einem Gittermuster an einer vorderen Oberfläche eines Werkstücks ausgebildet und ein Bauelement wie ein integrierter Schaltkreis (IC), ein Large Scale Integration Circuit (LSI) oder dergleichen wird in jedem Bereich, der durch die Straßen unterteilt ist, ausgebildet. Das Werkstück wird durch ein Schleifen der hinteren Oberfläche des Werkstücks auf eine vorgegebene Dicke dünn ausgestaltet. Das Werkstück wird danach entlang der Straßen durch eine Schneidvorrichtung oder dergleichen geteilt, um einzelne Halbleiterbauelementchips herzustellen. Wenn das Werkstück geschliffen wird, um dünn ausgestaltet zu werden, wird die vordere Oberfläche des Werkstücks mit einem Kunststoff beschichtet, um die Bauelemente zu schützen. Um eine Dickenpräzision des beschichteten Kunststoffs zu verbessern, wird ein Schritt des ebenen Ausgestaltens durch ein Schleifen des beschichteten Kunststoffs an der vorderen Oberfläche des Wafers durchgeführt (siehe beispielsweise
DARSTELLUNG DER ERFINDUNGPRESENTATION OF THE INVENTION
Allerdings wird, nachdem der obige Schritt durchgeführt worden ist, um den beschichteten Kunststoff an der vorderen Oberfläche des Werkstücks zu schleifen, ein Schritt durchgeführt, in dem die hintere Oberfläche des Werkstücks durch eine andere Schleifvorrichtung geschliffen wird, wodurch der Nachteil verursacht wird, dass die Anzahl der Schleifschritte erhöht wird.However, after the above step has been performed to grind the coated plastic on the front surface of the workpiece, a step is performed in which the rear surface of the workpiece is ground by another grinding device, thereby causing the disadvantage that the Number of grinding steps is increased.
Es ist daher ein Ziel der vorliegenden Erfindung, ein Werkstückbearbeitungsverfahren und eine Bearbeitungsvorrichtung bereitzustellen, die in der Lage sind, das Werkstück ohne ein Erhöhen der Anzahl der Schleifschritte effizient zu bearbeiten.It is therefore an object of the present invention to provide a workpiece machining method and apparatus that are capable of efficiently machining the workpiece without increasing the number of grinding steps.
Gemäß einem Aspekt der vorliegenden Erfindung wird ein Werkstückbearbeitungsverfahren zum Schleifen ein Schleifen eines Kunststoffs, mit dem eine vordere Oberfläche eines Werkstücks beschichtet ist, die ein Bauelement in jedem von mehreren Bereichen, die durch mehrere Teilungslinien, die an der vorderen Oberfläche des Werkstücks in einem Gittermuster ausgebildet sind, aufweist, und zum Schleifen einer hinteren Oberfläche des Werkstücks. Das Werkstückbearbeitungsverfahren beinhaltet einen Kunststoffbeschichtungsschritt des Beschichtens der vorderen Oberfläche des Werkstücks mit dem Kunststoff, einen Kunststoffhärtschritt des Aufbringens eines Ultraviolettstrahls auf den zu härtenden beschichteten Kunststoff, einen Kunststoffschleifschritt des Schleifens des gehärteten Kunststoffs mit Schleifsteinen so dass dieser eben ausgestaltet wird, und einen Werkstückschleifschritt des Haltens der Seite des Werkstücks mit dem eben ausgebildeten Kunststoff an einem Einspanntisch und des Schleifens der hinteren Oberfläche des Werkstücks mit Schleifsteinen. Im Kunststoffschleifschritt wird ein Schleifen durchgeführt, während der an den Schleifsteinen haftende Kunststoff gereinigt wird.According to one aspect of the present invention, a workpiece processing method for grinding is a grinding of a plastic coated on a front surface of a workpiece, which is a component in each of a plurality of regions defined by a plurality of division lines formed on the front surface of the workpiece in a lattice pattern are formed, and for grinding a rear surface of the workpiece. The workpiece processing method includes a plastic coating step of coating the front surface of the workpiece with the plastic, a plastic hardening step of applying an ultraviolet ray to the coated plastic to be cured, a plastic grinding step of grinding the hardened plastic with grindstones to make it planar, and a workpiece grinding step of holding the side of the workpiece with the newly formed plastic on a chuck table and the grinding of the rear surface of the workpiece with grindstones. In the plastic grinding step, grinding is performed while the plastic adhering to the grinding stones is cleaned.
Bevorzugt wird im Kunststoffschleifschritt Schleifwasser aus einer Schleifdüse zu den Schleifsteinen gestrahlt und der Kunststoff wird mit den Schleifsteinen geschliffen, während der an den Schleifsteinen haftende Kunststoff gereinigt wird.Preferably, in the plastic grinding step, grinding water is blasted from a grinding nozzle to the grindstones and the plastic is ground with the grindstones while the plastic adhering to the grindstones is cleaned.
Bevorzugt wird, nachdem der Kunststoffschleifschritt durchgeführt worden ist, eine Transfereinheit benutzt, die das Werkstück in den/aus dem Einspanntisch lädt/entlädt und bewirkt, dass die vordere Oberfläche und die hintere Oberfläche des aus dem Einspanntisch entladenen Werkstücks umgedreht werden, um die vordere Oberfläche und die hintere Oberfläche des Werkstücks umzudrehen, und gleiche Schleifsteine werden im Kunststoffschleifschritt und im Werkstückschleifschritt benutzt.Preferably, after the plastic grinding step has been performed, a transfer unit is used which loads / unloads the workpiece into / from the chuck table and causes the front surface and the back surface of the workpiece unloaded from the chuck table to be reversed about the front surface and turn over the rear surface of the workpiece, and like grindstones are used in the plastic grinding step and the workpiece grinding step.
Gemäß einem anderen Aspekt der vorliegenden Erfindung wird eine Bearbeitungsvorrichtung bereitgestellt, die beim Bearbeiten des Werkstücks benutzt wird, das ein Bauelement in jedem von mehreren Bereichen aufweist, die durch mehrere Teilungslinien unterteilt sind, die an einer vorderen Oberfläche des Werkstücks in einem Gittermuster ausgebildet sind. Die Bearbeitungsvorrichtung beinhaltet einen Einspanntisch, der das Werkstück hält, eine Schleifeinheit, die Schleifsteine beinhaltet, die eine hintere Oberfläche des Werkstücks, dessen vordere Oberfläche mit einem Kunststoff beschichtet ist, und den Kunststoff, mit dem die vordere Oberfläche beschichtet ist, schleifen, und eine Transfereinheit, die das Werkstück in den/aus dem Einspanntisch lädt/entlädt, und bewirkt, dass die vordere Oberfläche und die hintere Oberfläche des aus dem Einspanntisch entladenen Werkstücks umgedreht werden.According to another aspect of the present invention, there is provided a machining apparatus used in machining the workpiece having a device in each of a plurality of regions divided by a plurality of division lines formed on a front surface of the workpiece in a lattice pattern. The processing apparatus includes a chuck table that holds the workpiece, a grinding unit that includes grindstones that grind a rear surface of the workpiece whose front surface is coated with a plastic and the plastic with which the front surface is coated, and a grinder Transfer unit that loads / unloads the workpiece into / from the chuck table and causes the front surface and the rear surface of the workpiece unloaded from the chuck table to be reversed.
Bevorzugt wird eine Kunststoffdicke des Kunststoffs nach einem Schleifen mit den Schleifsteinen gemessen und die hintere Oberfläche des Werkstücks wird mit einer vorgegebenen Dicke dünn ausgestaltet.Preferably, a plastic thickness of the plastic after grinding with the grindstones is measured, and the back surface of the workpiece is made thin with a predetermined thickness.
Bevorzugt beinhaltet die Bearbeitungsvorrichtung ferner eine Reinigungsdüse, die Reinigungswasser zu den Schleifsteinen strahlt, und der Kunststoff wird mit den Schleifsteinen geschliffen, während der an den Schleifsteinen haftende Kunststoff gereinigt wird. Preferably, the processing apparatus further includes a cleaning nozzle that irradiates cleaning water to the grindstones, and the plastic is ground with the grindstones while the plastic adhering to the grindstones is cleaned.
Bevorzugt werden die vordere Oberfläche und die hintere Oberfläche des Werkstücks durch die Transfereinheit umgedreht und ein Schleifen des Kunststoffs und ein Schleifen der hinteren Oberfläche des Werkstücks werden durch Benutzen der gleichen Schleifsteine durchgeführt.Preferably, the front surface and the back surface of the workpiece are reversed by the transfer unit, and grinding of the plastic and grinding of the back surface of the workpiece are performed by using the same grindstones.
Gemäß der vorliegenden Erfindung ist es möglich, den Kunststoff, mit dem die vordere Seite des Werkstücks beschichtet ist, und die Rückseite des Werkstücks in der gleichen Vorrichtung zu schleifen. Somit wird gemäß der vorliegenden Erfindung die Anzahl an Schleifschritten nicht erhöht, und daher kann ein Bearbeiten des Werkstücks effektiv durchgeführt werden.According to the present invention, it is possible to grind the plastic with which the front side of the workpiece is coated and the back side of the workpiece in the same device. Thus, according to the present invention, the number of grinding steps is not increased, and therefore machining of the workpiece can be performed effectively.
Im Kunststoffschleifschritt wird das Reinigungswasser von der Reinigungsdüse zu den Schleifsteinen gestrahlt und der Kunststoff wird geschliffen, während der an den Schleifsteinen haftende Kunststoff gereinigt wird; kein Kunststoff verbleibt an den Schleifsteinen, nachdem der Kunststoffschleifschritt beendet ist. Demgemäß ist es möglich, das Werkstück vorteilhaft eben auszugestalten, selbst wenn der Werkstückschleifschritt durch ein Benutzen der gleichen Schleifsteine durchgeführt wird.In the plastic grinding step, the cleaning water is blasted from the cleaning nozzle to the grindstones, and the plastic is ground while the plastic adhering to the grindstones is cleaned; no plastic remains on the grindstones after the plastic grinding step is completed. Accordingly, it is possible to advantageously make the work flat even if the work grinding step is performed by using the same grinding stones.
Nachdem der Kunststoffschleifschritt durchgeführt worden ist, ist es möglich, die vordere Oberfläche und die hintere Oberfläche des Werkstücks durch die Transfereinheit, die das Werkstück in den/aus dem Einspanntisch lädt/entlädt, und bewirkt, dass die vordere Oberfläche und die hintere Oberfläche des aus dem Einspanntisch entladenen Werkstücks umgedreht werden, umzudrehen. Demgemäß ist es möglich, im Kunststoffschleifschritt und im Werkstückschleifschritt die gleichen Schleifsteine zu benutzen, und dadurch eine Bearbeitungseffizienz zu verbessern.After the plastic grinding step has been performed, it is possible for the front surface and the back surface of the workpiece to be discharged through the transfer unit that loads / unloads the workpiece into / out of the chuck table and causes the front surface and the rear surface of the workpiece to be discharged the workpiece unloaded from the chuck table are turned over to turn over. Accordingly, it is possible to use the same grindstones in the plastic grinding step and the workpiece grinding step, thereby improving a processing efficiency.
Die obigen und weitere Ziele, Merkmale und Vorteile der vorliegenden Erfindung und die Art, diese zu realisieren, werden ersichtlicher und die Erfindung selbst wird am besten durch ein Studium der folgenden Beschreibung und der angehängten Ansprüche unter Bezugnahme auf die angehängten Zeichnungen, die eine bevorzugte Ausführungsform der Erfindung zeigen, verstanden.The above and other objects, features and advantages of the present invention and the manner of realizing the same will become more apparent and the invention itself best be understood by a reading of the following description and the appended claims with reference to the attached drawings, which is a preferred embodiment of the invention, understood.
Figurenlistelist of figures
-
1 ist eine Perspektivansicht, die eine Ausgestaltung einer Bearbeitungsvorrichtung darstellt;1 Fig. 10 is a perspective view illustrating an embodiment of a processing apparatus; -
2 ist eine teilweise Querschnittseitenansicht, die eine Ausgestaltung sowohl eines Schleifmittels als auch einer Reinigungsdüse darstellt; und2 Fig. 10 is a partial cross-sectional side view illustrating an embodiment of both an abrasive and a cleaning nozzle; and -
3 ist eine Perspektivansicht, die einen Kunststoffbeschichtungsschritt darstellt;3 Fig. 10 is a perspective view illustrating a plastic coating step; -
4 ist eine Perspektivansicht, die einen Kunststoffhärtschritt darstellt;4 Fig. 10 is a perspective view illustrating a plastic hardening step; -
5 ist eine teilweise Querschnittseitenansicht, die einen Kunststoffschleifschritt darstellt;5 Fig. 16 is a partial cross-sectional side view illustrating a plastic grinding step; -
6 ist eine schematische Ansicht zum Erläutern eines Bearbeitungspunktes und eines Nicht-Bearbeitungspunktes von Schleifsteinen im Kunststoffschleifschritt; und6 Fig. 12 is a schematic view for explaining a machining point and a non-machining point of grindstones in the plastic grinding step; and -
7 ist eine teilweise Querschnittseitenansicht, die einen Werkstückschleifschritt darstellt.7 Fig. 16 is a partial cross-sectional side view illustrating a workpiece grinding step.
AUSFÜHRLICHE BESCHREIBUNG DER BEVORZUGTEN AUSFÜHRUNGSFORMDETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT
Bearbeitungsvorrichtungprocessing device
Eine in
Die Bearbeitungsvorrichtung
Die Bearbeitungsvorrichtung
Eine obere Oberfläche des Einspanntischs
Das Kunststoffbeschichtungsmittel
Das Kunststoffhärtmittel
Die in der vorliegenden Ausführungsform dargestellte Transfereinheit
Die erste Transfereinheit
Die zweite Transfereinheit
Die vordere-Oberfläche/hintere-Oberfläche-UmdrehTransfereinheit
Eine Säule
Die Schleifeinheit
An einer unteren Seite der Schleifeinheit
Die Bearbeitungsvorrichtung
Da die Schleifvorrichtung
Wenn der Kunststoff, mit dem die vordere Oberfläche
WerkstückbearbeitungsverfahrenWorkpiece machining process
Als nächstes erfolgt eine Beschreibung, die ein Werkstückbearbeitungsverfahren des Durchführens eines Schleifens des Kunststoffs, mit dem die vordere Oberfläche
KunststoffbeschichtungsschrittPlastic coating step
Die erste Transfereinheit
Die Kunststoffdüse
KunststoffhärtschrittKunststoffhärtschritt
Der in
KunststoffschleifschrittPlastic grinding step
Nachdem der Kunststoffhärtschritt durchgeführt worden ist, wird der Drehtisch
Im Kunststoffschleifschritt wird ein Schleifen des Kunststoffs
Wenn die sich drehenden Schleifsteine
Nach dem Schleifen des Kunststoffs
WerkstückschleifschrittWorkpiece grinding step
Die in
Die zweite Transfereinheit
Im Werkstückschleifschritt werden die gleichen Schleifsteine
Somit beinhaltet das Werkstückbearbeitungsverfahren gemäß der vorliegenden Erfindung einen Kunststoffbeschichtungsschritt des Beschichtens der vorderen Oberfläche
Im Kunststoffschleifschritt wird das Schleifwasser
Die vorliegende Erfindung ist nicht auf Details der oben beschriebenen bevorzugten Ausführungsform beschränkt. Der Umfang der Erfindung wird durch die angehängten Patentansprüche definiert und alle Änderungen und Modifikationen, die in das Äquivalent des Schutzbereichs der Ansprüche fallen, sind daher von der Erfindung umfasst.The present invention is not limited to the details of the preferred embodiment described above. The scope of the invention is defined by the appended claims, and all changes and modifications that fall within the equivalent of the scope of the claims are therefore included in the invention.
ZITATE ENTHALTEN IN DER BESCHREIBUNG QUOTES INCLUDE IN THE DESCRIPTION
Diese Liste der vom Anmelder aufgeführten Dokumente wurde automatisiert erzeugt und ist ausschließlich zur besseren Information des Lesers aufgenommen. Die Liste ist nicht Bestandteil der deutschen Patent- bzw. Gebrauchsmusteranmeldung. Das DPMA übernimmt keinerlei Haftung für etwaige Fehler oder Auslassungen.This list of the documents listed by the applicant has been generated automatically and is included solely for the better information of the reader. The list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions.
Zitierte PatentliteraturCited patent literature
- JP 2009043931 [0002]JP 2009043931 [0002]
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R012 | Request for examination validly filed | ||
R016 | Response to examination communication |