DE102018212310A1 - Heterogeneous printed circuit board and method for producing a heterogeneous printed circuit board - Google Patents

Abstract

A circuit board (101) for an electrical and / or electronic switching arrangement is described. The circuit board (101) comprises at least one electrically conductive layer (121) which is designed to provide conductor tracks for connecting different components of a switching arrangement. In addition, the printed circuit board (101) comprises a plate-shaped, dielectric substrate (122) on which the at least one electrically conductive layer (121) is arranged. The dielectric substrate (122) is subdivided into a number of different, plate-shaped, partial regions (201, 202, 203, 204), the different partial regions (201, 202, 203, 204) having at least partially different electrically relevant properties.

Description

The invention relates to a printed circuit board for an electronic and / or electrical circuit, the printed circuit board being able to be efficiently adapted to different requirements for different subcircuits of the electronic and / or electronic circuit. Furthermore, the invention operated a method for producing such a printed circuit board.

Printed circuit boards or printed circuit boards can have a multiplicity (e.g. N = 2, 4, 6, 8, 10 or more) of electrically conductive layers. The conductive layers can be used to provide electronic components and / or to connect electronic components to one another in an electrically conductive manner. The different electrically conductive layers are each separated in pairs by a non-conductive layer (also referred to as substrate in this document). The one or more non-conductive layers of a printed circuit board can also be used to provide electronic components and typically have an influence on properties of the electronic circuit realized with a printed circuit board.

A non-conductive or dielectric layer can e.g. be made of a relatively high-capacity high-frequency material in order to be able to provide relatively compact high-frequency circuits with relatively small structures. Alternatively, a non-conductive layer can be made of a relatively low-capacitance material in order to keep the impedance of electrically conductive connections relatively low. On the other hand, an inexpensive base material can be used for a non-conductive layer if there are no special requirements.

The present document deals with the technical task of providing a printed circuit board or printed circuit board which can be adapted in a flexible and cost-efficient manner to different requirements of an electronic and / or electrical circuit.

The object is achieved by the subject matter of the independent claims. Advantageous embodiments are defined in particular in the dependent claims, described in the following description or shown in the accompanying drawing.

According to one aspect of the invention, a printed circuit board or a printed circuit board for an electrical and / or electronic switching arrangement is described. The switching arrangement can have several different subcircuits with several different requirements, in particular requirements with regard to the capacitance or the dielectric constant of the circuit board and / or requirements with regard to the costs of the circuit board.

The printed circuit board comprises at least one electrically conductive layer (in particular at least one copper layer) which is designed to provide conductor tracks for connecting different components of a switching arrangement. The circuit board can be provided with a largely continuous electrically conductive layer. Segments of the electrically conductive layer can then be removed, e.g. to provide conductor tracks and / or electronic or electrical components.

In addition, the printed circuit board comprises a plate-shaped, dielectric substrate on which the at least one electrically conductive layer is arranged. The dielectric substrate is subdivided into several different, plate-shaped, partial areas, the different partial areas at least partially having different electrically relevant properties. In other words, the surface of the substrate can be divided into different partial areas. Different substrate materials can be used in the different partial areas in order to provide different electrically relevant properties in the different partial areas. In particular, the different subregions of the substrate can have at least partially different dielectric constants. The substrate can thus be subdivided into different partial areas such that the electrically conductive layer in the different partial areas is in contact with at least partially different substrate materials with at least partially different electrically relevant properties.

It is thus possible to provide a printed circuit board with a substrate which has different electrically relevant, in particular different dielectric, properties in different partial areas. The different subcircuits of a switching arrangement can thus be implemented in the different subregions of the substrate in order to be able to meet the different requirements of the subcircuits in an efficient and flexible manner.

For example, the substrate can have a first partial area with a relatively high dielectric constant and a second partial area with a relatively low dielectric constant. A first subcircuit can then be implemented in the first subarea, which requires a substrate with a relatively high electrical capacitance. On the other hand, a second subcircuit can be implemented in the second subarea, which requires a substrate with a relatively low impedance.

The printed circuit board can comprise a plurality of electrically conductive layers, the layers being electrically insulated from one another in pairs by a plate-shaped substrate. For example, the printed circuit board can have N = 2, 3, 4, 5 or more electrically conductive layers and M = 1, 2, 3, 4 or more substrates. The number N of electrically conductive layers is typically an even number, and the number M of substrates is typically an odd number. Furthermore, the printed circuit board can comprise one or more electrically conductive vias between different electrically conductive layers of the printed circuit board. The provision of several electrically conductive layers enables the provision of complex and compact switching arrangements.

The circuit board can thus comprise a plurality of sheet-like substrates which are layered one above the other. A partial area made of a first substrate material of a first substrate and a partial area made of the first substrate material of a second substrate can overlap at least partially. Furthermore, the first substrate and / or the second substrate can optionally comprise one or more further subregions made of a substrate material that differs from the first substrate material. A multilayer printed circuit board can thus be provided which has the same substrate material in overlapping partial regions of different substrates. In this way, the requirements of complex subcircuits on a circuit board can be met in an efficient manner.

The different sub-areas of a substrate can be efficiently produced, at least in part, using an additive manufacturing process (in particular using a 3D printing process).

According to a further aspect of the invention, an electrical and / or electronic switching arrangement is described which comprises a printed circuit board described in this document. In this case, the substrate of the printed circuit board can comprise a first partial area with a first substrate material that has a first material property and a second partial area with a second substrate material that has a second material property.

In addition, the switching arrangement can comprise a first electrical and / or electronic subcircuit, which is implemented in the first subarea. In this case, the first substrate material can possibly better meet a requirement of the first subcircuit, in particular with regard to the dielectric constant and / or with regard to costs, than the second substrate material. Furthermore, the switching arrangement can comprise a second electronic and / or electrical subcircuit, which is implemented in the second subarea. The second substrate material can possibly better fulfill a requirement of the second subcircuit, in particular with regard to the dielectric constant and / or with regard to costs, than the first substrate material.

The switching arrangement can thus have subcircuits each with different requirements with regard to a substrate material of the printed circuit board. The different subcircuits can then be arranged in the different subregions of the substrate of the printed circuit board in order to optimally meet the respective requirements of the subcircuits. A cost-effective and space-efficient switching arrangement can thus be provided.

According to a further aspect of the invention, a method for producing a printed circuit board is described. The method comprises the application of different substrate materials with at least partially different material properties in different partial areas of a surface in order to produce a flat dielectric substrate for the printed circuit board with several different partial areas from different substrate materials. The different substrate materials can be applied using an additive manufacturing method. The method also includes applying an electrically conductive layer to the substrate.

It should be noted that all aspects of the printed circuit board described in this document and the method described in this document can be combined with one another in a variety of ways. In particular, the features of the claims can be combined with one another in a variety of ways.

• 1a einen beispielhaften Nutzen mit einer Vielzahl von Leiterkarten in einer Draufsicht;
• 1b eine beispielhafte mehrlagige Leiterkarte bzw. ein beispielhafter mehrlagiger Nutzen in einer Seitenansicht;
• 2a eine beispielhafte Leiterplatte mit heterogenen Substraten in einer Seitenansicht;
• 2b ein beispielhaftes Substrat mit mehreren unterschiedlichen Teilbereichen in einer Draufsicht;
• 3 einen beispielhaften Drucker zur Herstellung eines heterogenen Substrats; und
• 4 ein Ablaufdiagramm eines beispielhaften Verfahrens zur Herstellung einer Leiterplatte mit einem heterogenen Substrat.

Furthermore, the invention is described in more detail with reference to exemplary embodiments shown in the accompanying drawing. Show

• 1a an exemplary benefit with a plurality of circuit boards in a plan view;
• 1b an exemplary multi-layer circuit board or an exemplary multi-layer benefit in a side view;
• 2a an exemplary circuit board with heterogeneous substrates in a side view;
• 2 B an exemplary substrate with several different partial areas in a plan view;
• 3 an exemplary printer for making a heterogeneous substrate; and
• 4 a flow diagram of an exemplary method for producing a circuit board with a heterogeneous substrate.

As stated at the beginning, the present document deals with the provision of a printed circuit board which can be adapted in an efficient and flexible manner to the requirements of an electronic and / or electrical switching arrangement. In this context shows 1a a benefit 100 (ie a complete circuit board), which in the example shown has several (possibly identical) circuit boards or circuit boards 101 having. The use 100 is manufactured in a single manufacturing process, and it is thus possible to use multiple circuit boards 101 to manufacture in a single manufacturing process.

1b shows the layer structure of an exemplary four-layer panel 100 , To produce a benefit 100 can be a laminate or substrate 122 from both sides with a conductive layer or layer 121 (especially a layer of copper) are coated. In the course of an etching process, conductor tracks can then be placed in the layers 121 getting produced. Alternatively or additionally, one or more conductor tracks with a conductive paste can be applied to a substrate in a printing process 122 to be printed. It can therefore be a two-layer circuit board with electrical lines or conductor tracks on both sides of a substrate 122 getting produced. In other words, two-layer printed circuit boards with layers 121 be produced that have a specific design or layout.

Two of these two-layer printed circuit boards can then be connected to another substrate 123 (in particular via a so-called "Pre Preg") can be connected to each other to create a four-layered benefit 100 manufacture. The further substrate 123 can be analogous to a substrate 122 be constructed. Layering K two-layer printed circuit boards can thus be of benefit 100 and circuit boards 101 with a total of N = 2K layers 121 can be produced (for example K = 2, 3, 4, 5 or more).

Typically, the substrate 122 . 123 of benefit 100 or a circuit board 101 homogeneous properties along the entire area of benefit 100 or the circuit board 101 on. If a substrate 122 . 123 For example, if at least in a partial area of the total area is to be used for a high-frequency circuit, then typically for the total area of the substrate 122 . 123 a (relatively expensive) radio frequency material used. The remaining area of the total area outside the partial area for the high-frequency circuit can then be used, for example, for the installation of components which have no special requirements with regard to the capacitance of the substrate 122 . 123 exhibit. On the other hand, the installation of components that require a low-capacitance substrate material is typically not possible, so that these components are in a separate substrate 122 . 123 must be arranged. Consequently, the use of substrates 122 . 123 with homogeneous properties lead to increased costs and / or an increased space requirement.

2a shows a section through a circuit board 101 with a total of six electrically conductive layers 121 and five substrates 122 . 123 , Here is the top substrate 122 the circuit board 101 exemplary in four different sub-areas 201 . 202 . 203 . 204 divided. In the first and fourth sections 201 . 204 becomes a first substrate material in the second partial area 202 becomes a second substrate material and in the third section 203 a third substrate material is used. The different substrate materials can at least partially have different properties, for example in relation to the dielectric constant, the volume resistance, the dielectric strength, the surface resistance, the tracking resistance, the thermal resistance, the thermal conductivity, etc.

In the first section 201 For example, a first electronic and / or electrical subcircuit for which the first material properties of the first substrate material are advantageous can be implemented in the second subarea 202 a second electronic and / or electrical subcircuit can be implemented for which the second material properties of the second substrate material are advantageous, etc. Different subregions can thus be used 201 . 202 . 203 . 204 can be provided for different requirements of electrical and / or electronic subcircuits of a switching arrangement.

2 B shows a plan view of the surface of a substrate 122 . 123 a circuit board 101 , In particular is off 2 B evident that in different sections or sub-areas 201 . 202 . 203 of a substrate 122 . 123 different substrate materials can be used. Also show 2a and 2 B exemplary vias 210 between different electrically conductive layers 121 a circuit board 101 ,

In order even with an increasing complexity of printed circuit boards 101 The one or more substrates can thus enable cost-effective and space-efficient switching arrangements 122 . 123 a circuit board 101 in different areas 201 . 202 . 203 . 204 be divided. To this end can be used in an efficient and precise manner, eg additive manufacturing processes (eg a 3D (three-dimensional) printing process) to form a substrate 122 . 123 and / or a printed circuit board 101 with different areas 201 . 202 . 203 . 204 to manufacture. It can be done in any area 201 . 202 . 203 . 204 a different substrate material can be used.

The individual substrates 122 . 123 a printed circuit board 101 can thus be built up heterogeneously to sub-areas on the circuit board 101 to be equipped with optimized properties. So, if necessary, on a single substrate 122 . 123 a high-frequency circuit (in a sub-area 201 with a high-capacity RF material), a microprocessor circuit (in a sub-area 202 with a low-capacitance material) and / or a power supply (in a partial area 203 with an inexpensive basic material). The respective sub-areas 201 . 202 . 203 of a substrate 122 . 123 can thus be produced with the optimal materials for the different circuit types of a switching arrangement. In particular, this can result in the fact that a relatively cost-intensive high-frequency material does not have to be used for a circuit without special requirements, just because it is in another sub-area 201 of the same substrate 122 . 123 a high-frequency circuit is arranged.

3 shows a block diagram of an exemplary printer 300 that can be used to create a heterogeneous substrate 122 . 123 for a circuit board 101 to print or manufacture. The printer 300 includes a printhead 320 with moving means 306 (eg along a rail) at different points above a printing surface or storage surface 304 can be positioned. The printhead 320 can by a control unit 307 of the printer 300 can be controlled.

The control unit 307 can be a model, for example a 2D or a 3D model, of a substrate to be printed 122 . 123 determine. The model can show which material in which section 201 . 202 . 203 . 204 of the substrate 122 . 123 should be used. In addition, the model can shape the individual sections 201 . 202 . 203 . 204 of the substrate 122 . 123 describe. Furthermore, the control unit 307 the printhead 320 and the means of movement 306 depending on the model to drive to a substrate 122 . 123 on the shelf 104 to print, which has an arrangement of materials corresponding to the model. For this purpose, the movement means 306 be set up the printhead 320 parallel over the shelf 304 to move (e.g. in the X and Y directions). Furthermore, the movement means 306 be set up the distance between printhead 320 and storage space 304 to change (ie the printhead 320 to move in the Z direction).

The counter space 304 can in a tempering room 303 (eg in an oven). The control unit 307 can be set up a tempering process of the printed substrate 122 . 123 in the cooking space 303 to control, for example, the different, applied materials of the substrate 122 cure.

The printhead 320 can allow one or more cartridges 302 with one or more different printing masses 308 (ie substrate materials). The print mass 308 a cartridge 302 can by means of an actuator 310 the printhead 320 through a nozzle 301 from the cartridge 302 extruded and / or pressed out. For example, using a 3D printing process, a heterogeneous substrate can be produced efficiently and precisely 122 with different areas 201 . 202 . 203 . 204 are produced, the different sub-areas 201 . 202 . 203 . 204 have different electrically relevant properties, in particular different dielectric constants.

Furthermore, the printer 100 be set up conductor tracks of one or more electrically conductive layers 121 on a substrate 122 to print. To do this, the printhead 320 at least one cartridge 302 with an electrically conductive printing compound or paste 308 include. It can be a model of an electrically conductive layer 121 are provided in which the course of the one or more conductor tracks of the electrically conductive layer 121 is described. The control unit 307 can then be controlled depending on the model, around the one or more conductor tracks on a (possibly previously printed) substrate 122 to print.

4 shows a flowchart of an exemplary method 400 for the production of a printed circuit board 101 , The circuit board 101 can be used to implement a circuit arrangement, the circuit arrangement having different subcircuits with different dielectric requirements for a substrate 122 . 123 the circuit board 101 may include. The procedure 400 includes applying 401 of different substrate materials with at least partially different material properties in different partial areas of a surface.

By applying 401 of different substrate materials can be a sheet-like, dielectric substrate 122 for the circuit board 101 be provided, the several different sub-areas 201 . 202 . 203 . 204 from different substrate materials. The different substrate materials can be used in a particularly efficient and precise manner using an additive manufacturing method (eg using a 3D printer) 300 ) are applied. The procedure also includes 400 the applying 402 an electrically conductive layer (in particular a copper layer) 121 on the substrate 122 , So can a circuit board 101 with a heterogeneous substrate 122 to be provided.

The measures described in this document can result in cost-effective and space-efficient circuit boards 101 be provided for complex switching arrangements. In particular, the measures described allow different requirements of different subcircuits of a switching arrangement to be met in an efficient and flexible manner.

The present invention is not restricted to the exemplary embodiments shown. In particular, it should be noted that the description and the figures are only intended to illustrate the principle of the proposed printed circuit board and the proposed method.

Claims (9)

Printed circuit board (101) for an electrical and / or electronic switching arrangement; the circuit board (101) comprising - at least one electrically conductive layer (121) which is designed to provide conductor tracks for connecting different components of a switching arrangement; and - A plate-shaped, dielectric substrate (122) on which the at least one electrically conductive layer (121) is arranged; wherein the dielectric substrate (122) is subdivided into several different, plate-shaped, partial regions (201, 202, 203, 204); the different sub-areas (201, 202, 203, 204) at least partially have different electrically relevant properties. Printed circuit board (101) according to Claim 1 , wherein the different subareas 201, 202, 203, 204) have at least partially different dielectric constants. Printed circuit board (101) according to one of the preceding claims, wherein - The substrate (122) has a first partial region (201) with a relatively high dielectric constant; and - The substrate (122) has a second partial area (202) with a relatively low dielectric constant. Printed circuit board (101) according to one of the preceding claims, wherein the printed circuit board (101) comprises - a plurality of electrically conductive layers (121) which are electrically insulated from one another in pairs by a plate-shaped substrate (122) in each case; and - One or more electrically conductive vias (210) between different electrically conductive layers (121) of the printed circuit board (101). Printed circuit board (101) according to one of the preceding claims, wherein - The printed circuit board (101) comprises a plurality of sheet-like substrates (122) layered one above the other; - A partial area (201) made of a first substrate material of a first substrate (122) overlaps at least partially with a partial area (201) made of the first substrate material of a second substrate (122); and - Both the first substrate (122) and the second substrate (122) comprise one or more further partial areas (202, 203, 204) made of a substrate material that differs from the first substrate material. Printed circuit board (101) according to one of the preceding claims, wherein the different partial areas (201, 202, 203, 204) of the substrate (122) were at least partially manufactured by means of an additive manufacturing method. Printed circuit board (101) according to one of the preceding claims, wherein the substrate (122) is divided into different partial areas (201, 202, 203, 204) such that the electrically conductive layer (121) in the different partial areas (201, 202, 203 , 204) is in contact with at least partially different substrate materials. Electrical and / or electronic switching arrangement, which comprises - A printed circuit board (101) according to one of the preceding claims, wherein the substrate (122) of the printed circuit board (101) has a first partial region (201) with a first substrate material with a first material property and with a second partial region (202) with a second substrate material has a second material property; - a first subcircuit implemented in the first subarea (201); wherein the first substrate material better fulfills a requirement, in particular with regard to a dielectric constant and / or with regard to costs, of the first subcircuit than the second substrate material; and - a second subcircuit implemented in the second subarea (202); wherein the second substrate material better fulfills a requirement, in particular with regard to a dielectric constant and / or with regard to costs, of the second subcircuit than the first substrate material. Method (400) for producing a printed circuit board (101); the method (400) comprising - applying (401) different substrate materials with at least partially different material properties in different partial areas of a surface in order to form a flat dielectric substrate (122) for the printed circuit board (101) with several different partial areas (201, 202 , 203, 204) from different substrate materials; the different substrate materials being applied in particular by means of an additive manufacturing method; and - applying (402) an electrically conductive layer (121) to the substrate (122).

Images