DE102018204867A1 - Inductance with integrated heat dissipation structures - Google Patents

Abstract

Methods and mechanisms to provide inductance with integrated heat sink structures. In one embodiment, the inductor comprises an electrical conductor and a ferromagnetic body with a portion of the conductor extending through the ferromagnetic body. The conductor further includes other portions extending away from the ferromagnetic body, wherein the other portions each further define respective respective rib structures or are coupled thereto. In another embodiment, the inductor has a plurality of separate ferromagnetic bodies, wherein different portions of the conductor extend differently each through a respective one of the ferromagnetic bodies.

Description

BACKGROUND OF THE INVENTION

Technical area

Embodiments of the present invention relate generally to circuit structures, and more particularly, but not exclusively, to heat sink structures of an inductance device.

Technical background

Efficient and efficient heat dissipation in integrated circuit devices during operation is becoming increasingly important as the power consumption of integrated circuit (IC) devices is steadily increasing. For example, this applies particularly to highly integrated IC chips and packetized devices. Ineffective heat dissipation can introduce reliability issues and shorten the life of an IC device.

Many types of heat dissipation solutions have been used to prevent this type of problem. For example, system fans, heat pipes and heat sinks are often provided which are coupled to the device packages to dissipate heat generated by integrated circuits and other electronic devices as quickly as possible. The particular approach used for heat dissipation on a particular device may depend on the type of package in which the device is provided, the way the device is connected to a system board, and / or the system in which the device operates will depend.

As subsequent generations of IC technologies continue to increase in size and provide more functionality, improvements in heat dissipation structures and techniques are expected to be given greater weight.

list of figures

• 1 zeigt perspektivische Ansichten, die Elemente einer Induktivitätsvorrichtung gemäß einer Ausführungsform darstellen.
• 2 ist ein Flussdiagramm, das Elemente eines Verfahrens zum Bereitstellen einer Induktivität gemäß einer Ausführungsform darstellt.
• 3A-3C zeigen perspektivische Ansichten, die jeweils Strukturen während einer entsprechenden Verarbeitungsstufe bei der Herstellung einer Induktivitätsvorrichtung gemäß einer Ausführungsform zeigen.
• Die 4A, 4B zeigen jeweils Induktivitätsvorrichtungen gemäß einer entsprechenden Ausführungsform.
• 5 ist ein Funktionsblockdiagramm, das Elemente einer Computervorrichtung gemäß einer Ausführungsform darstellt.
• 6 ist ein Funktionsblockdiagramm, das Elemente eines Computersystems gemäß einer Ausführungsform darstellt.

The various embodiments of the present invention are illustrated by way of example, but not limitation, in the drawings with the accompanying drawings, in which:

• 1 shows perspective views illustrating elements of an inductance device according to an embodiment.
• 2 FIG. 10 is a flowchart illustrating elements of a method of providing inductance according to an embodiment. FIG.
• 3A Figs. -3C are perspective views each showing structures during a corresponding processing stage in the manufacture of an inductance device according to an embodiment.
• The 4A . 4B each show inductance devices according to a corresponding embodiment.
• 5 FIG. 10 is a functional block diagram illustrating elements of a computing device according to one embodiment. FIG.
• 6 FIG. 10 is a functional block diagram illustrating elements of a computer system according to an embodiment. FIG.

DETAILED DESCRIPTION

Embodiments discussed in the present specification include various methods and / or mechanisms for providing the functionality of an inductance device having integrated heat sink structures. In one embodiment, an inductor comprises an electrical conductor and a body comprising a ferromagnetic material (referred to herein as a "ferromagnetic body") with a portion of the conductor extending through the ferromagnetic body. Other portions of the conductor may extend away from the ferromagnetic body, the other portions each having one or more respective rib structures to facilitate dissipation of heat. This heat can be wholly or partly generated, for example, by the inductance and / or the circuit which is coupled to the inductance. In some embodiments, the inductor has a plurality of separate ferromagnetic bodies, wherein different portions of the conductor extend differently through a respective one of the ferromagnetic bodies.

As used herein, "rib structure" refers to any of the variety of branch portions formed by a conductor - e.g. Where such a branch portion extends generally at a right angle (or an acute angle) away from another portion of the conductor. A curve, curve, connection or other such structure of the conductor may be an interface between a fin structure thereof and other portions of the conductor. A rib structure may extend to form a distal end of a conductor - e.g. Where a physical coupling of the inductor to an external structure is only via a different connection than any one of the fin structure.

The technologies described herein may be in one or more electronic devices be implemented. Non-limiting examples of electronic devices utilizing the technologies described herein include any type of mobile device and / or fixed device, such as cameras, cellular phones, computer terminals, desktop computers, electronic readers, fax machines, kiosks, netbook computers, notebook computers. Computers, Internet devices, payment terminals, personal digital assistants, media players and / or recorders, servers (eg, blade server, server cabinet, combinations thereof, etc.), set-top boxes, smart phones, tablet PCs, ultramobile Personal computers, corded phones, combinations thereof and the like. More generally, the technologies described in the present specification may be used in any of a variety of different electronic devices having inductance, having integrated heat sink structures as described herein.

1 shows a side view 100a , a top view 100b and a perspective view 100c each of an inductance device according to an embodiment having structures for facilitating heat dissipation. The inductance device of 1 FIG. 5 is an example of an embodiment in which a conductor extends through a structure (referred to herein as a "ferromagnetic body") to provide signal inductance properties, and further extends to form fin structures through which heat can be dissipated.

In the illustrated illustrative embodiment, the inductance device of FIG 1 a ferromagnetic body 120 and a conductor extending therethrough - wherein z. B. the conductor conductive sections 110a . 100b each having a respective side of the ferromagnetic body 120 extend away. Another section (not shown) of the conductor may be the sections 110a . 100b Couple together, with the ferromagnetic body 120 extends around this other section. Such a portion of a conductor is referred to herein as a "middle conductor portion".

sections 110a . 110b may each differ from a respective side of the ferromagnetic body 120 extend away, wherein Wärmeableitstrukturen (or "rib structures") different by a respective one of the sections 110a . 110b be formed or extend from such a path. In the illustrated illustrative embodiment, one or more rib structures (such as the illustrative rib structures shown extend 112 ) away from a generally planar structure of the conductive portion 110a , Alternatively or additionally, one or more other rib structures (such as the illustrative rib structures shown extend 114 ) away from a generally planar structure of the conductive portion 110b , Although some embodiments are not limited in this regard, one or more sides of the conductive portions may become 110a . 100b and / or the central conductor portion extend in a plane away from some or all of the rib structures 312 . 314 extend.

The in the views 100a . 100b . 100c inductance shown variously can facilitate coupling to a source circuit and a sink circuit (not shown), which are to transmit a signal via the inductance. For example, the sections 110a . 110b each form a respective terminal (ie, a conductive pin, a pad, a ball, a pad or other such contact structure) or be coupled to such, are to be coupled via the external circuits with the inductor. Some embodiments are not limited in view of a specific configuration and / or functionality of the circuit that supplies a signal to an inductance device like that in FIG 1 should transmit. One or both of these terminals (or other structure of the inductor) may act as a path through which heat is conducted to and / or in the conductor - e.g. B. where such heat at least partially by means of rib structures 312 . 314 is derived.

In one embodiment, the conductor - z. Copper (eg, coated with silver or gold), aluminum, and / or any of a variety of other metals or alloys thereof - stamped, formed, or otherwise formed into the illustrated shape. The ferromagnetic body 120 may include any of a variety of one or more materials - among others, e.g. For example, but not limited to nickel-zinc (NiZn), magnesium-zinc (MgZn), a ferrite, perovskite, zirconate, titanate or cobalt-based magnetic material or the like - which are characterized by low core loss, low hysteresis and / or high flow capacity (eg at frequencies in the range 5 MHz to 50 MHz). The formation of the ferromagnetic body 120 around the conductor may include sintering or otherwise converting the one or more materials - e.g. From a powdered or other granular state to a single rigid body. For the production of the inductance, one or more materials may be used and / or operations adapted, for example, from conventional methods for the production of circuit elements. The specific details of such conventional methods are not further explained in the present specification, so that certain features of various embodiments are not obscured.

In an exemplary embodiment, a total width (x-axis) of the conductor may range from 8 millimeters (mm) to 12 mm - e.g. B. where a total length (y-axis) of the conductor is also in the range of 8 mm to 12 mm. In such an embodiment, the thickness on the z-axis of the central conductor portion (extending through the ferromagnetic body 120 For example, in the range of 0.05 mm to 0.1 mm (for example, in the range of 0.1 mm to 0.2 mm). Some or all rib structures 112 . 114 may have a respective height on the z-axis, which is in the range of 1.0 mm to 2.5 mm - z. B. where such rib structures each have a respective thickness on the y-axis in the range of 0.05 mm to 0.1 mm. Alternatively or additionally, a thickness (z-axis) of the ferromagnetic body 120 on one side of the middle conductor section, for example in the range of 0.5 mm to 1.0 mm - z. B. where a total thickness of the ferromagnetic body 120 in the range of 1.5 mm to 3.0 mm. In such an embodiment, the ferromagnetic body 120 For example, have a width (x-axis) in the range of 6 mm to 12 mm and / or a length (y-axis) in the range of 4 mm to 10 mm. However, these dimensions serve the conductor and the rib structures 312 . 314 for illustrative purposes only and may be different in other embodiments depending on the specific details of the implementation.

In other embodiments, the inductor may have more, fewer, and / or differently configured fin structures. For example, in the illustrative embodiment shown in FIG 1 is shown, the rib structures 312 . 314 all in the same direction from the same side of a generally planar structure, partly from sections 110a . 110b is formed. Furthermore, as shown, the rib structures extend 312 . 314 also at a right angle away from such a side of the planar structure. However, some embodiments may differ therefrom, for example, with respect to the total number of one or more rib structures on a given side of the ferromagnetic body 120 the respective side (s) of the conductor from which some or all of such fin structures extend differently, the respective angles at which some or all of the fin structures extend differently, and / or the like.

2 shows features of a process 200 for providing a circuit inductance according to an embodiment. The procedure 200 may be performed to make or otherwise provide the in the views 100a . 100b . 100c shown inductance.

3A -3C show respective processing stages 300a - 300c for the manufacture, according to one embodiment, of an inductance, for example, those in 1 having shown features. To illustrate certain features of various embodiments, the method 200 here in terms of processing for fabricating structures such as in stages 300a - 300c shown described. However, the validity of this description may be extended to a processing wherein any of a variety of different additional or alternative inductance structures having the features described herein are manufactured.

The procedure 200 can operations 202 include, as in the steps 300a - 300c shown to produce an inductance. In one embodiment, operations include 202 at 210, forming one or more first rib structures (eg, rib structures 312 ) of a first section of the conductor. operations 202 may further include, at 220, forming one or more second fin structures of a second portion of the conductor, wherein a third portion of the conductor lies between the first portion and the second portion.

It will now be referred to 3A ; a conductive body 310 in stage 300a has sections 310a . 310c and another section 310b in between. In the illustrated illustrative embodiment, the sections extend 310a . 310b . 310c in various ways to at least partially form a substantially planar structure. In such an embodiment, the conductor 310 further form heat sink structures that extend away from such a planar structure away. In the sense of an illustration and without limitation, section 310a first ribs 312 form or be coupled to (for example) extend away from a plane - z. B. where some or all sections 310a . 310b . 310c Have page structures that extend in the plane. Alternatively or additionally, section 310c second ribs 314 or coupled thereto, which also extend (for example) away from such a plane. In the exemplary embodiment, the stage 300a is illustrated, ribs extend 312 and ribs 314 different parallel to one another in a direction that is substantially perpendicular to a plane that is different from side structures of the sections 310a . 310b . 310c is formed. However, number, size, direction and / or another embodiment of the ribs 312 and / or the ribs 314 differ in various embodiments thereof.

During or after the processing of the operations 202 For example, the first portion and the second portion may each have or be coupled to a respective terminal through which the inductor is to be coupled to other circuits. For example, as in stage 300b in 3B , a coating 320 be selectively structured to respective surface regions 322 . 324 the sections 310a . 310b to leave exposed - z. B. where the surface regions 322 . 324 (or respective ones on the surface regions 322 . 324 trained contact structures) later serve as terminals for coupling the finally formed inductance device with other circuit structures. The coating 320 may include any of various passivation, insulating, antirust, and / or other materials, such as those derived from and adapted from conventional circuit manufacturing processes.

In one embodiment, operations include 202 further at 230, disposing a first ferromagnetic body about the third portion. For example, as in stage 300c from 3C represented, a ferromagnetic body 330 comprising a ferromagnetic material, injection molded, sintered, bonded and / or otherwise around the central portion 310b between the sections 310a . 310c be formed.

Physical properties of the ferromagnetic material may facilitate that the inductance provides high frequency signaling. For example, as shown by the detailed sectional view in partial image 370 from 3C , the ferromagnetic body 330 Particles, grains and / or other such accumulations of ferromagnetic material, which are different around gap regions in the ferromagnetic body 330 extend. Such aggregates (referred to herein as "ferromagnetic node structures") may be melted or otherwise bonded together - e.g. B. by a sintering process. For example, these nodes may have individual ferromagnetic particles that are different from each other, and / or may have ferromagnetic structures fused together at their respective surfaces. For example, an interface between a ferromagnetic node structure and an adjacent ferromagnetic node structure may be indicated by a local minimum in the cross-sectional area of any ferromagnetic material between the node structures.

In the illustrated illustrative embodiment of partial image 370 includes the ferromagnetic body 330 ferromagnetic node structures 372 , which adjoin one another in a different way and around gaps 374 extend around. gap regions 374 For example, various air and / or bonding material used therein may be used to sinter or another method of bonding the ferromagnetic particles. For example, such binder material may include paraffin, although some embodiments are not limited in this regard. The respective lengths (eg diameter) of the ferromagnetic node structures 372 For example, they can range from 30 nanometers (nm) to 30 micrometers - e.g. Depending on the specific details of the implementation.

The ferromagnetic body 330 may have at least a minimum volume fraction of the gap regions, such as the void regions to be illustrated 374 as shown is attributed. By providing such a minimum volume fraction of the gap regions (and a corresponding maximum volume fraction of the total ferromagnetic material of the layer), some embodiments reduce the risk of the inductor reaching the saturation state during operation. By way of illustration and without limitation, a volume fraction of the ferromagnetic material in the ferromagnetic body 330 equal to or less than 97% - z. B. where the volume fraction of the gap regions 374 in the ferromagnetic body 330 in the range of 3% to 25% (and in some embodiments in the range of 5% to 15%). It is understood that the total volume of the ferromagnetic body 330 does not include the volume of other structures, that of the ferromagnetic body 330 be enclosed - z. B. where such structures section 310b include.

The volume fraction of the gap regions 374 can be based at least partially on ferromagnetic node structures 372 be attributed to the node structures of different sizes -. Where the respective sizes (for example, lengths) of the ferromagnetic node structures 372 have a non-Gaussian distribution. As an illustration and without limitation, the ferromagnetic node structures 372 consist of a combination of first ferromagnetic node structures with a first Gaussian size distribution and second ferromagnetic node structures with a second Gaussian size distribution. In such an embodiment, a difference -. An absolute difference - between a first average of the first Gaussian size distribution and a second average of a second Gaussian size distribution at least 10% (in some embodiments at least 20%) of the second average. In different Embodiments may be implemented of any of a variety of other combinations of two or more different sizes of ferromagnetic node structures.

In some embodiments, the method 200 additionally or alternatively include an inductance (such as that by operations 202 educated) with other circuits to couple - among other z. Example, a source circuit that is to provide power to the inductor, and / or a sink circuit that is to receive power from the inductor. For example, the method 200 at 240, to couple the inductor between first circuits and second circuits. It is referred to again 3C ; coupling at 240 may involve a circuit 350 with the conductor 310 over the surface region 322 to couple - z. B. where another circuit 352 further with the conductor 310 over the surface region 324 is coupled. circuit 350 and circuit 352 For example, different respective portions of a single circuit may be intended to send a current through the inductance. Some embodiments are not specific to the circuit's circuit structure 350 and / or the circuit 352 limited.

In the exemplary embodiment shown, surface regions are 322 . 324 on a first page of the ladder 310 Arranged while ripping 312 . 314 in different ways from a second side of the ladder 310 extend away (the second side of the first side opposite). However, some embodiments are not limited in the position of the terminals with respect to the rib structures. In an alternative embodiment, one or both ports may instead be arranged differently on the first side of the conductor - e.g. Where there is a connection in a region between the ferromagnetic body 330 and rib structures 312 (or in a region between the ferromagnetic body 330 and rib structures 314 ) lies.

Alternatively or additionally, the method 200 include operating circuits that have an inductance (such as those generated by operations 202 be formed) - z. B. where such a circuit is connected at 240. For example, the method 200 at 250 current between the first circuit and the second circuit (in one embodiment between the circuit 350 and the circuit 352 ) via the inductance.

4A shows features of an inductance device 400 having integrated heat dissipation according to another embodiment. The inductance 400 can have features like those in one of 1 . 3C shown include -. B. where structures of the inductance device 400 through operations 202 be formed. The inductance device 400 is an example of an embodiment wherein a middle conductor section (eg, section 310b ) disposed in a ferromagnetic body forms one or more curved and / or angular structures. Such a central conductor portion may have a sidewall structure which forms one or more bends or corners - e.g. B. where the middle section has one or more serpentine or otherwise wavy structures.

In the illustrated illustrative embodiment, the inductance 400 a ladder on the sections 410a . 410b and a middle section 410c which is arranged therebetween. The inductance 400 may further comprise a ferromagnetic body 420 have that around the section 410c molded, sintered, glued and / or otherwise formed. The ferromagnetic body 420 is in 4 shown transparently, but only to features of different structures of middle sections 410c to illustrate it. In one embodiment, the middle section forms 410c one or more serpentine structures (such as the illustrative "S" curve as shown) for the inductive interaction between the ferromagnetic body 420 and a signal by means of the middle section 410c should be directed. The sections 410a . 410b For example, respective rib structures 412 . 414 or adjacent to such.

4B shows a section of another inductance device 450 comprising integrated heat sink structures according to another embodiment. The inductance 450 can have features like those in one of 1 . 3C shown include -. B. where structures of the inductance device 450 through operations 202 be formed. The inductance device 450 FIG. 12 is an example of another embodiment wherein a conductor (in addition to forming heat sink structures) forms a plurality of central portions each extending through another respective ferromagnetic body. Such a configuration of a conductor relative to a plurality of ferromagnetic bodies may facilitate a functionality of a parallel arrangement of a plurality of inductors.

In the illustrated illustrative embodiment, the inductance 450 a ladder on the sections 460a . 460b . 460c having. The conductor may further include a middle section 460d between the sections 460a . 460b and another middle section 460e between the sections 460a . 460c exhibit. The middle one sections 460d . 460e can the operation of the inductance device 450 as a parallel combination of two (or more) inductances. For example, the inductance 450 furthermore ferromagnetic bodies 470a . 470b include, which are different around middle sections 460d respectively. 460 molded, sintered, glued and / or otherwise formed. The ferromagnetic body 470a . 470b are in 4 each shown transparent, but only to respective features of the middle sections 460d . 460e to illustrate. Similar section 410c can have one or both middle sections 460d . 460e each form one or more angles or curves (not shown), although some embodiments are not limited in this regard. section 460a For example, rib structures 462 or adjacent to such.

5 represents a computing device 500 according to one embodiment. The computing device 500 houses a circuit board 502 , The circuit board 502 may include a number of components, including, but not limited to, a processor 504 and at least one communication chip 506 , The processor 504 is physically and electrically connected to the PCB 502 connected. In some implementations, the at least one communication chip 506 also physically and electrically to the circuit board 502 connected. In other implementations, the communication chip is 506 Part of the processor 504 ,

Depending on their applications, the computing device may 500 have other components that are physically and electrically connected to the circuit board 502 connected or not. These other components may include, but are not limited to, volatile memory (eg, DRAM), nonvolatile memory (eg, ROM), flash memory, graphics processor, digital signal processor, cryptoprocessor, chipset, antenna, a display, a touchscreen display, a touch screen controller, a battery, an audio codec, a video codec, a power amplifier, a global positioning system (GPS) device, a compass, an accelerometer, a gyroscope, a speaker, a camera, and a mass storage device (such as a hard disk drive, a compact disk (CD), a digital versatile disk (DVD), etc.).

The communication chip 506 enables wireless communication for data transfer to and from the computing device 500 , The term "wireless" and terms derived therefrom may be used to describe circuits, devices, systems, methods, techniques, communication channels, etc. that can communicate data through a non-fixed medium by using modulated electromagnetic radiation. The term does not imply that the associated devices do not contain wires, although in some embodiments this might be the case. The communication chip 506 can implement any of a number of wireless standards or protocols, including Wi-Fi (IEEE 802.11 family), WiMAX (IEEE 802.16 family), IEEE 802.20 , Long Term Evolution (LTE), Ev-DO, HSPA +, HSDPA +, HSUPA +, EDGE, GSM, GPRS, CDMA, TDMA, DECT, Bluetooth, derivatives of these, as well as all other protocols for wireless transmission, called 3G, 4G, 5G and beyond. The computing device 500 can have multiple communication chips 506 exhibit. For example, a first communication chip 506 short-range wireless communication such as Wi-Fi and Bluetooth, and a second communication chip 506 can be dedicated to longer range wireless communication such as GPS, EDGE, GPRS, CDMA, WiMAX, LTE, Ev-DO and others.

The processor 504 the computing device 500 has an ic die inside the processor 504 is packed. The term "processor" may refer to any device or portion of a device that processes electronic data from registers and / or memory to convert that electronic data to other electronic data stored in registers and / or memory can be. The communication chip 506 also has an IC die, which is inside the communication chip 506 is packed. In one embodiment, the motherboard 502 an inductor (not shown) as described herein or coupled thereto.

In various embodiments, the computing device 500 a laptop, a netbook, a notebook, an ultrabook, a smartphone, a tablet, a personal digital assistant (PDA), an ultra-mobile PC, a mobile phone, a desktop computer, a server, a printer, a scanner, a monitor, a set-top box, an entertainment control center, a digital camera, a portable music player or a digital video recorder. In further embodiments, the computing device 500 any other electronic device that processes data.

Some embodiments may be provided as a computer program product, or software, that includes a machine-readable medium having stored thereon instructions that may be used to program a computer system (or other electronic devices) to perform a method according to one embodiment. A machine-readable data medium includes any mechanism for storing or transmitting information in a form readable by a machine (eg, a computer). For example, one includes machine-readable (eg, computer-readable) media, a machine (eg, computer-readable) storage medium (eg, read-only memory, "ROM"), random access memory ("RAM"), Magnetic disk storage media, optical storage media, flash memory devices, etc.), a machine (e.g., computer) readable transmission medium (electrical, optical, acoustical, or other form of propagating signals (e.g., infrared, digital Signals etc.)) etc.

6 illustrates a diagrammatic representation of a machine in the exemplary form of a computer system 600 in which a series of instructions may be executed to cause the machine to perform one or more methods as described in the present specification. In alternative embodiments, the machine may be connected to other machines in a local area network (LAN), an intranet, an extranet, or the Internet (eg, networked). The machine may operate as a server or client machine in a client-server network environment or as a peer machine in a peer-to-peer (or distributed) network environment. The machine may be a personal computer (PC), a tablet PC, a set top box (STB), a personal digital assistant (PDA), a mobile phone, a web device, a server, a network router , -Switch or -Bridge, or any machine capable of executing (sequentially or otherwise) a series of instructions defining actions to be taken by the machine in question. Further, even though only a single machine is illustrated, the term "machine" is also to be understood to include any collection of machines (eg, computers) that individually or collectively contain a series (or multiple rows) of instructions to perform one or more of the procedures described herein.

The exemplary computer system 600 has a processor 602 , a main memory 604 memory (e.g., read-only memory ROM), flash memory, dynamic random access memory (DRAM) such as synchronous DRAM (SDRAM) or Rambus DRAM (RDRAM), etc.) 606 (eg flash memory, static random access memory (SRAM), etc.) as well as a secondary memory 618 (eg, a data storage device), which is over a bus 630 communicate with each other.

The processor 602 stands for one or more universal processing devices such as a microprocessor, a central processing unit, or the like. More specifically, the processor 602 a Complex Instruction Set Computing (CISC) microprocessor, a Reduced Instruction Set Computing (RISC) microprocessor, a Very Long Instruction Word (VLIE) microprocessor, a processor, a processor implements other instruction sets or processors that implement a combination of instruction sets. The processor 602 may also be one or more specialized processing devices, such as an application specific integrated circuit (ASIC), field programmable gate array (FPGA), digital signal processor (DSP), network processor, or the like. The processor 602 is designed for processing logic 626 to perform the operations described here.

The computer system 600 can also be a network interface 608 exhibit. The computer system 600 can also have a video display unit 610 (eg, a Liquid Crystal Display (LCD), a Light Emitting Diode (LED) display, or a Cathode Ray Tube (CRT)), an alphanumeric input device 612 (eg a keyboard), a cursor control device 614 (eg, a mouse) and a signal generator 616 (eg a speaker). In one embodiment, the computer system 600 an inductor (not shown) as described herein or coupled thereto.

The secondary storage 618 may include a machine-readable storage medium (or more specifically, a computer-readable storage medium) 632 upon which one or more rows of instructions (eg, software 622 ) that embody one or more of the methods described herein. The software 622 can also be completely or at least partially in main memory 604 and / or in the processor 602 lie while away from the computer system 600 is executed, the main memory 604 and the processor 602 also represent machine-readable storage media. The software 622 may also be via the network interface device 608 over a network 620 be transmitted or received.

Although the machine-readable storage medium 632 In an exemplary embodiment, the term "machine-readable storage medium" is to be understood to include a single medium as well as multiple media (eg, a central or distributed database and / or associated caches and servers ) storing the one or more rows of instructions. The term "machine-readable storage medium" is also to be understood to include any medium capable of storing a series of instructions or which are executed by the machine and which cause the machine to execute one of the one or more embodiments. Accordingly, the term "machine-readable storage medium" shall be understood to include, but not be limited to, solid-state storage, optical and magnetic media.

In one implementation, the inductor comprises a first inductor having a first portion forming one or more first fin structures, wherein the first portion has or is coupled to a first terminal via which the inductor is to be coupled to a first circuit. a second portion forming one or more second fin structures, the second portion having or being coupled to a second port through which the inductor is to be coupled to a second circuit; and a third portion disposed between the first portion and the second portion. The inductor further includes a first ferromagnetic body disposed about the third portion.

In one embodiment, a volume fraction of the ferromagnetic material of the first ferromagnetic body is equal to or less than ninety-seven percent (97%). In another embodiment, the one or more first rib structures include a first plurality of rib structures, wherein the one or more second rib structures include a second plurality of rib structures. In another embodiment, the one or more first fin structures extend away from a first side of a bottom portion of the first portion, wherein the first terminal is disposed on a second side of the bottom portion, the second side facing the first side. In another embodiment, the one or more first fin structures extend away from a first side of a bottom portion of the first portion, wherein the first terminal on the first side of the bottom portion is disposed in a region between the first ferromagnetic body and the one or more fin structures , In another embodiment, the third portion forms a first sidewall structure in the first ferromagnetic body, wherein the first sidewall structure forms a curve or corner. In another embodiment, a size distribution for ferrite node structures of the first ferromagnetic body is different than any Gaussian distribution. In another embodiment, the conductor further includes a fourth portion disposed between the first portion and the second portion, the inductor further comprising a second ferromagnetic body disposed around the fourth portion. In another embodiment, the third portion forms a first sidewall structure in the first ferromagnetic body, the fourth portion forming a second sidewall structure in the first ferromagnetic body, the first sidewall structure and the second sidewall structure each forming a respective curvature or corner.

In another implementation, a method of making an inductor includes forming one or more first fin structures of a first portion of the conductor, wherein the first portion has or is coupled to a first terminal, and forming one or more second fin structures of a second portion the conductor, wherein the second portion has or is coupled to a second terminal, wherein a third portion of the conductor between the first portion and the second portion is located. Producing the inductor further comprises arranging a first ferromagnetic body around the third portion.

In one embodiment, a volume fraction of the ferromagnetic material of the first ferromagnetic body is equal to or less than ninety-seven percent (97%). In another embodiment, the one or more first rib structures include a first plurality of rib structures, wherein the one or more second rib structures include a second plurality of rib structures. In another embodiment, the one or more first fin structures extend away from a first side of a bottom portion of the first portion, wherein the first terminal is disposed on a second side of the bottom portion, the second side facing the first side. In another embodiment, the one or more first fin structures extend away from a first side of a bottom portion of the first portion, wherein the first terminal on the first side of the bottom portion is disposed in a region between the first ferromagnetic body and the one or more fin structures , In another embodiment, the third section forms a first one Sidewall structure in the first ferromagnetic body, wherein the first sidewall structure forms a curve or corner. In another embodiment, a size distribution for ferrite node structures of the first ferromagnetic body is different than any Gaussian distribution. In another embodiment, the conductor further includes a fourth portion disposed between the first portion and the second portion, the inductor further comprising a second ferromagnetic body disposed around the fourth portion. In another embodiment, the third portion forms a first sidewall structure in the first ferromagnetic body, the fourth portion forming a second sidewall structure in the first ferromagnetic body, the first sidewall structure and the second sidewall structure each forming a respective curvature or corner. In another embodiment, the method further comprises coupling the inductance to a first circuit via the first terminal and to a second circuit via the second terminal. In another embodiment, the method further comprises transmitting via the inductance a signal between the first circuit and the second circuit.

In another implementation, a system includes an inductor having a first portion forming one or more first fin structures, the first portion having or coupled to a first terminal, a second portion forming one or more second fin structures, wherein the second portion has or is coupled to a second terminal and a third portion disposed between the first portion and the second portion. The inductor further includes a first ferromagnetic body disposed about the third portion. The system further includes a first circuit coupled to the inductor via the first terminal, a second circuit coupled to the inductor via the second terminal, the conductor to communicate a signal between the first circuit and the second circuit, and a display device coupled to one of the first circuit and the second circuit, the display device to display an image based on the signal.

In one embodiment, a volume fraction of the ferromagnetic material of the first ferromagnetic body is equal to or less than ninety-seven percent (97%). In another embodiment, the one or more first rib structures include a first plurality of rib structures, wherein the one or more second rib structures include a second plurality of rib structures. In another embodiment, the one or more first fin structures extend away from a first side of a bottom portion of the first portion, wherein the first terminal is disposed on a second side of the bottom portion, the second side facing the first side. In another embodiment, the one or more first fin structures extend away from a first side of a bottom portion of the first portion, wherein the first terminal on the first side of the bottom portion is disposed in a region between the first ferromagnetic body and the one or more fin structures , In another embodiment, the third portion forms a first sidewall structure in the first ferromagnetic body, wherein the first sidewall structure forms a curve or corner. In another embodiment, a size distribution for ferrite node structures of the first ferromagnetic body is different than any Gaussian distribution. In another embodiment, the conductor further includes a fourth portion disposed between the first portion and the second portion, the inductor further comprising a second ferromagnetic body disposed around the fourth portion. In another embodiment, the third portion forms a first sidewall structure in the first ferromagnetic body, the fourth portion forming a second sidewall structure in the first ferromagnetic body, the first sidewall structure and the second sidewall structure each forming a respective curvature or corner.

The present patent describes methods and architectures for providing heat dissipation in circuit structures. For purposes of explanation, numerous specific details are set forth in the foregoing description to provide a thorough understanding of certain embodiments. However, it will be obvious to one skilled in the art that certain embodiments may be practiced without these specific details. In other instances, structures and devices are shown in block diagram form to facilitate their description.

The reference in the specification to "a single embodiment" or "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment, in at least one embodiment of the invention occurs. The term "in one embodiment" at various places in the description does not necessarily always refer to the same embodiment.

Some portions of the detailed description have been presented herein in terms of algorithms and symbolic representations of operations for data bits in computer memory. These algorithmic descriptions and representations represent the methods used by those skilled in the data processing arts to communicate the substance of their work to other professionals as effectively as possible. An algorithm is understood here and generally to mean a consistent sequence of steps leading to a desired result. The steps are steps that require physical manipulation of physical quantities. Usually, though not necessarily, such amounts take the form of electrical or magnetic signals that can be stored, transferred, combined, compared, or otherwise manipulated. Occasionally, principally for reasons of common usage, it has proven convenient to refer to such signals as bits, data, values, elements, symbols, characters, terms, numbers, numbers, or the like.

It should be kept in mind, however, that all these and similar terms are to be associated with the corresponding physical quantities and that these are only convenient labels applied to those quantities. Unless otherwise specifically stated or apparent from the foregoing discussion, it will be understood that throughout the description, discussions are made using terms such as "processing" or "processing data" or "calculating" or "determining" or "displaying" or the like will relate to the action and processes of a computer system or similar electronic processing device that manipulates and converts data represented as physical (electronic) sets in the registers and memories of the computer system into other data stored in a manner similar to physical quantities in the memories and Registers of the computer system or other such information storage, transmission or display devices are shown.

Certain embodiments also relate to devices for performing the operations in this patent. Such a device may be specially constructed for the required purposes or may comprise a general-purpose computer selectively activated or reconfigured by a computer program stored on the computer. Such a computer program may also be stored on a computer-readable storage medium such as, but not limited to, any type of disk including floppy disks, optical disks, CD-ROMs and magneto-optical disks, read-only memories (ROMs), Random Access Memories (RAMs) such as dynamic random access memory (DRAM), EPROMs, EEPROMs, magnetic or optical memory cards, or any type of media suitable for storing electronic instructions and coupled to a computer system bus.

The algorithms and displays presented in the present specification do not inherently refer to any particular computer or other device. Various universal systems may be used with programs in accordance with the teachings of this specification, but it may prove advantageous to construct a more specialized apparatus to perform the required method steps. The structure required for a variety of these systems will be apparent from the description herein. In addition, certain embodiments are not described in terms of a particular programming language. It will be understood that a variety of programming languages may be used to implement the teachings of such embodiments as described herein.

In addition to the descriptions herein, various modifications may be made to the disclosed embodiments and implementations without departing from the scope thereof. The illustrations and examples in the present specification should therefore be understood in an illustrative, but not restrictive sense. The scope of the invention is to be construed solely with the following claims.

Claims (20)

Inductance comprising: a ladder, comprising: a first portion forming one or more first fin structures, the first portion having or coupled to a first terminal via which the inductor is to be coupled to a first circuit; a second portion forming one or more second fin structures, the second portion having or being coupled to a second port through which the inductor is to be coupled to a second circuit; and a third portion disposed between the first portion and the second portion; and a first ferromagnetic body disposed around the third portion. Inductance after Claim 1 wherein a volume fraction of the ferromagnetic material of the first ferromagnetic body is equal to or less than ninety-seven percent (97%). Inductance after Claim 1 wherein the one or more first rib structures include a first plurality of rib structures, and wherein the one or more second rib structures include a second plurality of rib structures. Inductance after Claim 1 wherein the one or more first rib structures extend away from a first side of a bottom portion of the first portion, the first terminal on a second side of the bottom portion is arranged, wherein the second side of the first side is opposite. Inductance after Claim 1 wherein the one or more first fin structures extend away from a first side of a bottom portion of the first portion, wherein the first terminal on the first side of the bottom portion is disposed in a region between the first ferromagnetic body and the one or more fin structures. Inductance after Claim 1 wherein the third portion forms a first sidewall structure in the first ferromagnetic body, wherein the first sidewall structure forms a curve or corner. Inductance after Claim 1 wherein a size distribution for ferrite node structures of the first ferromagnetic body is different than any Gaussian distribution. Inductance after Claim 1 wherein the conductor further comprises a fourth portion disposed between the first portion and the second portion, the inductance further comprising a second ferromagnetic body disposed around the fourth portion. Inductance after Claim 8 wherein the third portion forms a first sidewall structure in the first ferromagnetic body, the fourth portion forming a second sidewall structure in the first ferromagnetic body, the first sidewall structure and the second sidewall structure each forming a respective curvature or corner. Method, comprising: Producing an inductance, including: Forming a leader, including: Forming one or more first fin structures of a first portion of the conductor, the first portion having or coupled to a first terminal; Forming one or more second fin structures of a second portion of the conductor, the second portion having or being coupled to a second terminal, wherein a third portion of the conductor lies between the first portion and the second portion; and Arranging a first ferromagnetic body around the third portion. Method according to Claim 10 wherein a volume fraction of the ferromagnetic material of the first ferromagnetic body is equal to or less than ninety-seven percent (97%). Method according to Claim 10 wherein the one or more first fin structures extend away from a first side of a bottom portion of the first portion, wherein the first terminal on the first side of the bottom portion is disposed in a region between the first ferromagnetic body and the one or more fin structures. Method according to Claim 10 wherein the third portion forms a first sidewall structure in the first ferromagnetic body, wherein the first sidewall structure forms a curve or corner. Method according to Claim 10 wherein the conductor further comprises a fourth portion disposed between the first portion and the second portion, the inductance further comprising a second ferromagnetic body disposed around the fourth portion. Method according to Claim 10 , further comprising coupling the inductance to a first circuit via the first terminal and to a second circuit via the second terminal. Method according to Claim 15 further comprising, via the inductance, transmitting a signal between the first circuit and the second circuit. System comprising: an inductance, comprising: a ladder comprising: a first portion forming one or more first rib structures, the first portion having or coupled to a first port; a second portion forming one or more second rib structures, the second portion having or being coupled to a second port; and a third portion disposed between the first portion and the second portion; and a first ferromagnetic body disposed around the third portion; a first circuit coupled to the inductor via the first terminal; a second circuit coupled to the inductor via the second terminal, the conductor to communicate a signal between the first circuit and the second circuit; and a display device coupled to one of the first circuit and the second circuit, the display device to display an image based on the signal. System after Claim 17 wherein a volume fraction of the ferromagnetic material of the first ferromagnetic body is equal to or less than ninety-seven percent (97%). System after Claim 17 wherein the third portion forms a first sidewall structure in the first ferromagnetic body, wherein the first sidewall structure forms a curve or corner. System after Claim 17 wherein the conductor further comprises a fourth portion disposed between the first portion and the second portion, the inductance further comprising a second ferromagnetic body disposed around the fourth portion.

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