DE102018203213A1 - Method for producing at least one nanostructure-containing layer on at least one electronic element of a printed circuit board useful for a camera system and injection molding device having a structural plate with at least one nanodegativstructure for producing a nanostructure-containing layer - Google Patents

Abstract

The approach presented here relates to a method for producing at least one antireflective layer (120) comprising a plurality of cone-shaped elevations, in particular having a height of 100-200 nm, on at least one electronic element (125) of a printed circuit board ( 130) for a camera system. The method comprises a step of supplying and a step of injection molding. In the step of feeding, at least one benefit section of the utility (130) is fed into an injection molding apparatus (100) having at least one structural plate (105) having a nanocontrol structure (110) of the nanostructure (115) to be produced, wherein the utility section comprises the at least one electronic element (125). includes. In the step of injection molding, a layer material (135) is sprayed to the electronic element (125), wherein in the injection molding step, the layer material (135) is injected between the electronic element (125) and the nanocondensate structure (110) of the pattern plate (105) the antireflective layer (120) to produce a molded structural surface of the nano negative structure (110).

Description

State of the art

The approach is based on a device or a method according to the preamble of the independent claims.

There are methods in which a plastic material in a heated injection mold is injected directly onto a surface of a circuit substrate to protect an image receptor. As a result, the image sensor is cleaned and then protected.

The DE 10 2013 106 392 B4 describes a method by which a nanostructure for anti-reflective moth eyes is applied directly to a plastic carrier. The method is used to soften large-area plastic display surfaces in vehicles.

Disclosure of the invention

Against this background, with the approach presented here, a method for producing at least one nanostructure-containing layer on at least one electronic element of a printed circuit board benefit for a camera system and an injection molding device with a structural plate having at least one nanodegativstruktur for producing a nanostructure having layer according to the main claims presented. The measures listed in the dependent claims advantageous refinements and improvements of the independent claim device are possible.

The advantages that can be achieved with the presented approach are that a method presented here makes it possible to produce an anti-reflection nanostructure layer on an electronic element or even several nanostructure layers on a plurality of electronic elements in just one step of the injection molding.

The invention relates to a method for producing at least one antireflective layer comprising a plurality of cone-shaped elevations, in particular having a height of 100-200 nm, on at least one electronic element of a printed circuit board useful for a camera system. This can be a nanostructure, as used in the DE 10 2013 106 392 B4 is disclosed. The PCB benefit has at least two printed circuit boards that can be separated in a later process. These printed circuit boards serve as circuit carriers and each have at least one electronic element. The electronic element can be, for example, an image sensor for a camera system. The circuit board benefit described below will only be referred to as "benefit".

The method comprises a step of supplying and a step of injection molding. In the step of supplying, at least one benefit section of the benefit is supplied to an injection molding apparatus having at least one structural plate having a nanocontrast structure of the nanostructure to be produced, wherein the utility section comprises the at least one electronic element. In the step of injection molding, a layer material is injected to the electronic element, wherein in the injection molding step, the layer material is injected between the electronic element and the nanocontrast structure of the structure plate to produce as the antireflective layer a molded structure surface of the nano negative structure.

By means of the method presented here, it is advantageously possible to produce an antireflecting layer having a nanostructure by injection molding to a corresponding nano-negative structure. The antireflective layer can therefore be produced quickly and simply as an imprint of the nano-negative structure. This advantageously makes it possible, using a corresponding structural plate, to rapidly produce such anti-reflective layers in rapid succession, for example simultaneously.

The method may include a step of providing in which UV radiation is provided which is adapted to effect crosslinking of the layer material sprayed in the step of injection molding on or on the at least one electronic element. As the UV radiation is to be understood ultraviolet radiation, which may be provided for example by a UV lamp. By crosslinking, hardening of the layer material can be accelerated. Thus, the benefits with the layer without long waiting times for curing can be processed quickly.

In the step of supplying, the benefit portion of the benefit may be supplied to the injection molding apparatus, wherein the structural plate has at least one further nanocondensed structure of the nanostructure to be produced, wherein the benefit portion comprises at least one further electronic element, wherein in the injection molding step, the layer material between the further electronic element and the another nanocontrast structure is sprayed in order to produce, as a further anti-reflective layer, a further molded-on structure surface of the further nanoconative structure on the further electronic element. A shaping of the further nanocontrast structure can in this case be a shaping of the Nano-negative structure correspond or at least similar, in order to generate the described nanostructure on the other electronic element can. Thus, two layers can advantageously be produced on two electronic elements in the one step of injection molding. Accordingly, three layers can be produced on three electronic elements or four layers on four electronic elements.

It is further advantageous if, according to one embodiment, the method comprises a step of further feeding in response to the step of injection molding, wherein in the step of further feeding the utility is moved, whereby at least one additional benefit portion of the benefit is supplied to the injection molding apparatus, wherein the additional benefit section comprises at least one additional electronic element. Accordingly, the method may comprise a step of further injection molding of the layer material to the additional electronic element, wherein in the step of further injection molding the layer material is injected between the additional electronic element and the nanodegativstructure of the structure plate, as an additional anti-reflective layer to an additional molded structural surface of the nanodivisible structure produce.

Such movement or performance of the injection molding apparatus allows for rapid and automated injection molding of anti-reflective coatings onto a plurality of electronic elements. In this case, the additional use section may also comprise a plurality of printed circuit boards, each with an additional electronic element, which are injection-molded simultaneously, for example in the step of further injection molding, to produce a plurality of the additional anti-reflective layers.

In the step of injection molding, as the layer material, a transparent layer material and / or a plastic material can be injected to the electronic element. In the step of injection molding, a low-viscosity layer material can advantageously also be sprayed onto the electronic element as the layer material. A low-viscosity layer material can be inserted particularly advantageously into the cone-shaped nanocontrast structure.

The method may also include a step of arranging, by placing a protective cap on the electronic component prior to the step of injection molding, wherein in the step of injection molding, the layer material is injected to the protective cap of the electronic element, wherein in the step of injection molding, the layer material between the protective cap and spraying the nanocontrast structure of the structural plate to produce, as the anti-reflection layer, a molded structural surface of the nanocontrast structure on or on the protective cap of the electronic element.

Such a protective cap may be configured to prevent penetration of ultraviolet radiation to the electronic element. For example, electronic elements formed as imagers may be sensitive to ultraviolet radiation and should therefore be protected from them.

In the step of injection molding, the layer material can be injected to the electronic element, wherein the layer material has a temperature of 15 to 25 degrees Celsius.

At a low temperature of 15 to 25 degrees, which is to be understood as room temperature, advantageously a high temperature input into the injection molding apparatus, for example into a used injection molding tool, and / or damage to a sensitive electronic element can be prevented. Higher temperatures can damage imagers.

An injection molding apparatus has a structural plate which has at least one nanodegativstruktur for producing a anti-reflective layer comprising a nanostructure of a plurality of peg-shaped elevations, in particular having a height of 100-200 nm on at least one electronic element of a PCB benefit for a camera system.

The injection molding apparatus may comprise at least one component of an injection molding tool, for example a mold insert.

Using such an injection molding apparatus, the previously presented method is feasible. The nano-negative structure of the structural plate may in this case be shaped to produce the antireflective layer, in which the peg-shaped elevations of the nanostructure are arranged in a matrix and / or have an average width of less than 200 nm and / or to produce the antireflective layer, which has a average effective refractive index n of between 1.08 and 1.25. Such a layer is well suited for anti-reflection.

The structural plate of the injection molding apparatus may include at least one identification device disposed adjacent to the nanocontrast structure and configured to create an indicia on or within the layer in forming the antireflective layer adjacent to the nanostructure. Production errors in the production of the layer are thus quickly and easily traceable based on the generated label.

The structural plate may be formed as a plate etched into a mold insert of the injection molding apparatus by means of an etching process and / or may have a plastic material and / or be formed in a transparent manner.

A camera system with an electronic element has an anti-reflective layer, which was produced using a variant of the previously presented method. The electronic element may be an image sensor of the camera system, wherein the image sensor is advantageously both anti-reflective and protected thanks to the layer.

Finally, it is envisioned to use a structural plate to produce an anti-reflective coating on at least one electronic element of circuit board usage for a camera system. Such use advantageously provides a new use of a structural panel.

• 1 eine seitliche Darstellung eines Querschnitts einer Spritzgießvorrichtung mit einer Strukturplatte mit zumindest einer Nanonegativstruktur zum Herstellen einer eine Nanostruktur aufweisenden entspiegelnden Schicht auf zumindest einem Elektronikelement eines Leiterplatten-Nutzens für ein Kamerasystem gemäß einem Ausführungsbeispiel;
• 2 eine seitliche Darstellung eines Querschnitts einer Strukturplatte mit einer Nanonegativstruktur gemäß einem Ausführungsbeispiel;
• 3 eine schematische Aufsicht auf eine Strukturplatte mit einer Nanonegativstruktur gemäß einem Ausführungsbeispiel;
• 4 eine seitliche Darstellung eines Querschnitts einer Spritzgießvorrichtung mit einer Strukturplatte gemäß einem Ausführungsbeispiel;
• 5 eine schematische Aufsicht auf eine Spritzgießvorrichtung gemäß einem Ausführungsbeispiel;
• 6 eine schematische Aufsicht auf eine Spritzgießvorrichtung gemäß einem Ausführungsbeispiel; und
• 7 ein Ablaufdiagramm eines Verfahrens zum Herstellen zumindest einer eine Nanostruktur aufweisenden entspiegelnden Schicht auf zumindest einem Elektronikelement eines Leiterplatten-Nutzens für ein Kamerasystem gemäß einem Ausführungsbeispiel.

Embodiments of the approach presented here are shown in the drawings and explained in more detail in the following description. It shows:

• 1 a side view of a cross section of an injection molding apparatus having a structural plate with at least one nano negative structure for producing a nano-structure anti-reflective coating on at least one electronic element of a printed circuit board benefits for a camera system according to an embodiment;
• 2 a side view of a cross section of a structural plate with a nano negative structure according to an embodiment;
• 3 a schematic plan view of a structural plate with a nano negative structure according to an embodiment;
• 4 a side view of a cross section of an injection molding with a structural plate according to an embodiment;
• 5 a schematic plan view of an injection molding apparatus according to an embodiment;
• 6 a schematic plan view of an injection molding apparatus according to an embodiment; and
• 7 a flowchart of a method for producing at least one nanostructure anti-reflective coating on at least one electronic element of a printed circuit board benefits for a camera system according to an embodiment.

In the following description of favorable embodiments of the present approach, the same or similar reference numerals are used for the elements shown in the various figures and similar acting, with a repeated description of these elements is omitted.

If an exemplary embodiment comprises a "and / or" link between a first feature and a second feature, then this is to be read so that the embodiment according to one embodiment, both the first feature and the second feature and according to another embodiment either only first feature or only the second feature.

1 shows a side view of a cross section of an injection molding apparatus 100 with a structure plate 105 with at least one nano negative structure 110 for making a nanostructure 115 having an anti-reflective coating 120 on at least one electronic element 125 a PCB benefit 130 for a camera system according to an embodiment.

The structural plate 105 is in this embodiment in or on the injection molding apparatus 100 recorded and according to this embodiment, at least two of the nano negative structures 110 on. Each of the nano negative structures 110 is shaped to be one of a nanostructure 115 from a plurality of peg-shaped elevations, in particular with a height of 100-200 nm having anti-reflective layers 120 on each of an electronic element 125 manufacture.

At least one useful portion of the printed circuit board benefit shown here 130 , in the following also only "use" 130 is called according to this embodiment for producing the anti-reflective layer 120 the injection molding apparatus 100 arranged arranged. The benefit section has at least one, according to this embodiment at least two or four, of the electronic elements 125 on. Each of the electronic elements 125 is on or on a circuit board, also called circuit board, the benefits 130 and in each case adjacent to one of the nano-negative structures 110 the structural plate 105 arranged.

A layer material 135 is already according to this embodiment of the electronic elements 125 been sprayed, wherein the layer material 135 each between the electronic elements 125 and the adjacent nanonegative structures 110 the structural plate 105 has been sprayed to as the anti-reflective layers 120 in each case a molded structural surface of the nanodegativstrukturen 110 to create.

The injection molding device 100 has according to this embodiment, a UV device with at least one UV lamp 140 , According to this embodiment, a plurality of UV lamps 140 , which is adapted to provide UV radiation adapted to crosslink the sprayed sheet material 135 on or at the at least one electronic element 125 to effect.

The layer material 135 is transparent according to this embodiment and / or formed as a plastic material. According to this embodiment, the layer material 135 with a room temperature of 15 to 25 degrees Celsius to the electronic elements 125 been sprayed.

• 1 zeigt eine Prinzipskizze eines UV-Spritzgießwerkzeugs in Form der Spritzgießvorrichtung 100 mit einer Schutzschicht auf dem Nutzen 130.

The following are details of the injection molding apparatus 100 again described in more detail:

• 1 shows a schematic diagram of a UV injection molding tool in the form of injection molding 100 with a protective coating on the benefit 130 ,

The injection molding apparatus shown here 100 includes except the structural plate 105 According to this embodiment, a tool frame 145 , in a lower mold insert 150 is included on which the benefit 130 is arranged. In addition, the injection molding device comprises 100 according to this embodiment, an upper mold insert 155 , The lower mold insert 150 and the upper mold insert 155 are through a dividing plane 160 separated.

For the production of the anti-reflective coating 120 becomes the injection molding device 100 needed, which according to this embodiment, an injection molding machine and a multi-cavity injection molding tool with PCB benefit implementation 162 and a UV lamp 140 , For example, comprises a UV area lamp. The implementation 162 is in the lower mold insert 150 integrated, which increases according to this embodiment to the tool frame 145 is installed. The upper mold insert 155 consists of a steel frame according to this embodiment 165 , the recesses for cavities 170 has and according to this embodiment, the transparent plastic plate with microstructures, so the structural plate 105 , as well as the UV lamp 140 picks up and fixes. The structural plate 105 According to one embodiment, it consists of at least one cycloolefin copolymer, COC for short, and / or a cycloolefin polymer, COP for short, and has a masking during the etching process only at the cavity surfaces of the cavities 170 the nano negative structure 110 which may also be referred to as a moth-eye microstructure. Thus, the structural plate 105 in the form of a stable plastic plate for several cavities 170 in the upper mold insert 155 fixed and is easily replaceable if necessary.

The low-viscosity and / or transparent layer material according to this exemplary embodiment 135 in the form of a UV plastic was over a sprue distributor 175 That's also on a benefits board advantage 130 runs at room temperature in the cavities 170 the injection mold of the injection molding 100 filled. See also the 5 to 6 ,

Once all the cavities, previously called cavities 170 designated, were filled with the UV plastic, the UV lamp 140 or the UV lamps 140 turned on and the transparent layer 120 chemically crosslinked. After curing of the plastic becomes the benefit 130 of fixing pins 180 that in recesses 185 are fitted, lifted and according to this embodiment by four cavities 170 continue to set. Thus wander a hardened sprue of the sprue 175 and the over-molded circuit carriers of the benefit 130 for a next shot from the dividing plane 160 , At the in 5 or 6 16-mer benefits shown 130 this process is repeated four times. After curing the layers 120 , which can also be referred to as optical layers, with the respectively also anti-reflective negative impression of the etched microstructures in the form of the nanostructures 115 is the PCB benefit 130 Removable from the tool and without cooling time directly forwarded to the separation.

2 shows a side view of a cross section of a structural plate 105 with a nano negative structure 110 according to an embodiment. These may be the ones based on 1 described structural plate 105 with only one example of a nano negative structure 110 act.

The nano negative structure 110 according to this embodiment has a plurality of recesses 200 formed to produce the antireflective layer in which the peg-shaped elevations of the nanostructure are arranged in a matrix and / or the elevations have an average width of less than 200 nm and / or to produce the antireflective layer, which has a mean effective refractive index n of between 1.08 and 1.25.

The structural plate 105 According to this embodiment, it is formed as a plate etched into the mold insert of the injection molding apparatus by means of an etching process and / or has a plastic material and / or is formed in a transparent manner.

According to this embodiment, the structural plate 105 at least one adjacent to the nano negative structure 110 arranged marking device 205 shaped to provide an indicia on or in the layer in forming the anti-reflective layer adjacent to the nanostructure. According to this embodiment, the labeling device 205 to form a number or cavity number on or in the layer.

3 shows a schematic plan view of a structural plate 105 with a nano negative structure 110 according to an embodiment.

These may be the ones based on 2 described structural plate 105 act in which the wells 200 for the preparation of the matrix-shaped elevations of the anti-reflective layer are arranged in a matrix.

4 shows a side view of a cross section of an injection molding apparatus 100 with a structure plate 105 according to an embodiment. This may be the in 1 described injection molding apparatus 100 with the structure plate 105 act as they do in one of 1 to 3 is described. At the benefit 130 it may be the in 1 described benefit 130 act, with the difference that the electronic elements 125 according to this embodiment, in each case a protective cap 400 each having between the electronic elements 125 and the molded anti-reflective layers are arranged.

4 In other words, shows a schematic diagram of a UV injection mold with protective cap 400 and protective layer.

According to this embodiment, the electronic elements 125 formed as imager by UV light from the UV lamp 140 can be damaged. For this reason, to protect the image sensor in each case according to this embodiment, a thin and / or transparent cap 400 UV light-absorbing polycarbonate, PC for short, and / or polymethyl methacrylate, PMMA for short, positioned and enclosed by the crosslinking plastic of the layer material. According to this embodiment, the protective caps 400 before the injection of the coating material on the electronic elements 125 been arranged. According to an alternative embodiment, this UV protective layer is in the form of the protective caps 400 but also been taken into account when building the camera chips.

An object of the injection molding device presented here 100 The aim is to manufacture plastic, non-reflective optical layers on several circuit carriers with sensitive image pickups and other electronic components simultaneously in one process step without introducing temperature. This task fulfills the injection molding device presented here 100 , whereby advantageously in a very short cycle time, a cost-effective and environmentally friendly camera system can be produced. An encapsulation of the camera module generated by means of the layer serves on the one hand as an antireflective element for the image recorder and on the other hand as media-tight protection also for an associated electronics.

The injection molding device 100 thus enables a UV injection molding process in which, in a process step without temperature input, non-reflective plastic optical layers are produced simultaneously on a plurality of circuit carriers with sensitive image sensors. This reduces the cycle times per component and thus the system costs.

The sensitive electronic elements 125 on the circuit carrier in this case are not claimed by a surface treatment or a high mold temperature when using a according to this embodiment, low viscosity UV plastic with high adhesion and circulated only with very low inflation pressure at room temperature to a protective layer. At the same time, a negative of an anti-reflective microstructure is formed by a mold insert which is plasma etched in accordance with this exemplary embodiment in the form of the structural plate 105 shaped. The mold insert according to this exemplary embodiment is a transparent plastic plate which has partially received a special microstructure in an etching process under vacuum. The molded negative of this structure is also anti-reflective and is determined by the method used in the injection molding apparatus 100 as the layer with the nanostructure transferred to the optical layer of the circuit substrate.

The circuit carriers are used as compact and stable PCB benefits 130 from according to this embodiment 16 Delivered modules and have according to this embodiment, no connection cable. This makes it possible that a plurality of circuit carriers and thus also a plurality of cavities for the optical layers in combination with a flat UV lamp 140 can be integrated in an injection mold.

About the sprue distributor 175 the UV plastic has been evenly distributed at room temperature to all cavities. Immediately after the complete filling of all cavities, the UV lamp is turned on 140 switched on and chemically crosslinked the optical layer. After curing the optical layers, the PCB benefit 130 from the mold of the injection molding apparatus 100 removed and directly processed without cooling time. With the By means of the marking device molded cavity number on the transparent layer in a non-optical region, each component can be assigned to a corresponding position in the injection molding tool. In the case of quality problems, the corresponding cavity can thus advantageously be identified directly and optionally cleaned or post-processed. Thanks to the good flowability of the transparent UV plastic, in addition to surfaces with a low roughness, free-form surfaces or partial areas with the anti-reflective microstructures can be formed very well and thin gaps under electronic components can be optimally filled.

5 shows a schematic plan view of an injection molding apparatus 100 according to an embodiment. This may be the in 4 described injection molding apparatus 100 act, for reasons of clarity, the upper mold insert is not shown.

In other words, shows 5 a schematic diagram of a multi-cavity injection mold for a benefit 130 , According to this embodiment example, the benefit 130 16 circuit support 500 on, which were previously referred to as printed circuit boards. The use 130 is perpendicular to an injection direction according to this embodiment 505 through the injection mold of the injection molding apparatus 100 led, always four cavities 170 be filled per injection molding cycle.

In the structures or adjacent to the structures in the layer is always a cavity number 510 Engraved in a non-visually relevant area. By the cavity numbers 510 Each component can be assigned to a specific position in the injection molding tool during subsequent quality control. Every gating point 515 at the optical layer has a different position to the cavity number 510 ,

6 shows a schematic plan view of an injection molding apparatus 100 according to an embodiment. This may be the in 5 described injection molding apparatus 100 Act, with the difference that the injection mold is designed to provide two of the benefits 130 take. According to this embodiment, by means of the injection molding apparatus 100 at the same time eight of the anti-reflective layers to the electronic elements 125 anspritzbar.

7 shows a flowchart of a method 700 for producing at least one anti-reflective coating having a nanostructure on at least one electronic element of a printed circuit board useful for a camera system according to an exemplary embodiment.

This can be a procedure 700 act, which can be controlled by the injection molding apparatus described with reference to one of the preceding figures and / or executable using the injection molding apparatus.

The procedure 700 can also be referred to as an injection molding process for temperature-neutral production of anti-reflective optical layers on a circuit board benefits with multiple circuit carriers.

By means of the method, the anti-reflective layer can be produced on the electronic element, wherein the layer has the nanostructure of a plurality of peg-shaped elevations, which in particular have a height of 100-200 nm.

The method has one step 705 of feeding and one step 710 of injection molding. Optionally, the method includes 700 according to this embodiment also a step 715 of providing a step 720 further feeding, one step 725 further injection molding and a step 730 of arranging.

In step 705 at least one useful portion of the benefit is supplied to an injection molding apparatus having at least one structural plate having a nanocontrol structure of the nanostructure to be produced, wherein the use portion comprises the at least one electronic element. In step 710 Injection molding, a layer material is injected to the electronic element, wherein in step 710 of the injection molding, the layer material is injected between the electronic element and the nanocontrast structure of the structure plate to produce, as the antireflective layer, a molded structure surface of the nano negative structure.

According to one embodiment, in step 705 supplying the useful portion of the benefit to the injection molding apparatus, wherein the structural plate has at least one further nanocontrast structure of the nanostructure to be produced, wherein the use portion comprises at least one further electronic element, wherein in step 710 injection molding, the layer material is injected between the further electronic element and the further nanodegativstructure, in order to produce, as another anti-reflective layer, a further molded-on structure surface of the further nanocontrast structure on the further electronic element.

In step 715 the provision of a UV radiation is provided, which is adapted to crosslinking of the in step 710 the injection molding sprayed layer material on or on the at least one electronic element to effect.

In step 720 further feeding will be in response to the step 710 injection molding and / or the step 715 of providing the benefit, thereby providing at least one additional benefit portion of the benefit to the injection molding apparatus, the additional benefit portion comprising at least one additional electronic element. In step 725 the further injection molding, the layer material is injected to the additional electronic element, wherein in step 725 further injection molding, the coating material is injected between the additional electronic element and the nanocontrast structure of the structure plate to produce as an additional anti-reflective layer an additional molded structure surface of the nanocontrast structure.

In step 730 arranging is done before the step 710 injection molding and / or before the step 705 of supplying a protective cap on the electronic element arranged, wherein in step 710 of the injection molding, the layer material is injected onto the protective cap of the electronic element, wherein in step 710 of injection molding, the coating material is injected between the protective cap and the nano negative structure of the structural plate to produce as the antireflecting layer a molded structural surface of the nano negative structure on or on the protective cap of the electronic element.

The method steps presented here can be repeated and executed in a sequence other than that described.

An approach presented here is directly on the produced component, in particular on the produced layer, by observing a surface with a special microstructure and / or in 2 can be detected. At positions of the gate points, by the analysis of the UV plastic as well as by component cuts, the manufacturing process is immediately recognizable by a person skilled in the art.

The procedure presented here 700 can be used for a multitude of applications in which circuit carriers with sensitive optical electronic components are to be packed in a media-tight manner at room temperature with an anti-reflective optical surface.

QUOTES INCLUDE IN THE DESCRIPTION

This list of the documents listed by the applicant has been generated automatically and is included solely for the better information of the reader. The list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions.

Cited patent literature

• DE 102013106392 B4 [0003, 0006]

Claims (12)

Method (700) for producing at least one anti-reflection layer (120) having a nanostructure (115) consisting of a plurality of cone-shaped elevations, in particular with a height of 100-200 nm, on at least one electronic element (125) of a printed circuit board (130) a camera system, the method (700) comprising the steps of: Feeding (705) at least one utility section of the utility (130) into an injection molding apparatus (100) having at least one structural panel (105) having a nanocontrast structure of the nanostructure (115) to be fabricated, the utility compartment comprising the at least one electronic element (125); and Injection molding (710) a layered material (135) onto the electronic element (125), wherein in step (710) of the injection molding the layered material (135) is injected between the electronic element (125) and the nano negative structure (110) of the structural plate (105) as the antireflective layer (120), to produce a molded structural surface of the nano negative structure (110). Method (700) according to Claim 1 , comprising a step (715) of providing, in which UV radiation is provided, which is arranged to crosslink the layer material (135) sprayed in the step (710) of the injection molding on or on the at least one electronic element (125). to effect. Method (700) according to one of the preceding claims, wherein in the step (705) of feeding, the use section of the utility (130) is fed into the injection molding apparatus (100), in which the structural panel (105) comprises at least one further nano negative structure (110) wherein the benefit portion comprises at least one further electronic element (125), wherein in step (710) of the injection molding, the layer material (135) between the further electronic element (125) and the further nano negative structure (110) is injected to as a further anti-reflection layer (120), to produce a further molded-on structure surface of the further nanodegativstructure (110) on the further electronic element (125). The method (700) according to one of the preceding claims, comprising a step (720) of further feeding in response to the step (710) of injection molding, wherein in step (720) of further feeding the utility (130) is moved, whereby at least one additional feed Benefit portion of the benefit (130) of the injection molding apparatus (100) is supplied, wherein the additional benefit portion comprises at least one additional electronic element (125) and a step (725) of further injection molding of the layer material (135) to the additional electronic element (125) In the step (725) of the further injection molding, the layer material (135) is injection-molded between the additional electronic element (125) and the nano negative structure (110) of the structural plate (105) in order, as an additional antireflective layer (120), to form an additional molded structural surface of the nano negative structure ( 110). Method (700) according to one of the preceding claims, wherein in the step (710) of the injection molding as the layer material (135) a transparent layer material (135) and / or a plastic material is injected to the electronic element (125). The method (700) according to one of the preceding claims, comprising a step (730) of arranging, by placing a protective cap (400) on the electronic element (125) prior to the step (710) of injection molding, wherein in step (710) of Injection molding, the layer material (135) is sprayed onto the protective cap (400) of the electronic element (125), wherein in step (710) of the injection molding the layer material (135) between the protective cap (400) and the nano negative structure (110) of the structural plate (105). is sprayed to produce, as the anti-reflection layer (120), a molded structural surface of the nano negative structure (110) on or on the protective cap (400) of the electronic element (125). Method (700) according to one of the preceding claims, wherein in the step (710) of the injection molding, the layer material (135) is sprayed onto the electronic element (125), wherein the layer material (135) has a temperature of 15 to 25 degrees Celsius. Injection molding apparatus (100) having a structure plate (105) which has at least one nano-negative structure (110) for producing a non-reflective layer (120) having a nano-structure (115) of a plurality of cone-shaped elevations, in particular with a height of 100-200 nm an electronic element (125) of a circuit board benefit (130) for a camera system. Injection molding apparatus (100) according to Claim 8 in that the structural plate (105) has at least one identification device (205) arranged adjacent to the nanocontrast structure (110) and shaped to provide an indicia on or in the manufacture of the antireflective layer (120) adjacent to the nanostructure (115) to produce the layer (120). Injection molding apparatus (100) according to one of Claims 8 to 9 in which the structural plate (105) is formed as a by means of an etching process in a mold insert (165) of the injection molding apparatus (100) etched plate and / or has a plastic material and / or is formed transparent. A camera system comprising an electronic element (125) having an anti-reflective coating (120) formed using the method (700) of any one of Claims 1 to 7 was produced. Using a pattern plate (105) to form an anti-reflective layer (120) on at least one electronic element (125) of a circuit board benefit (130) for a camera system.

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