DE102018122571A1 - DEVICE FOR TEMPORARY LIMITATION OF A FLOWABLE MATERIAL ON AN OPTOELECTRONIC LIGHTING DEVICE AND METHOD FOR PRODUCING AN OPTOELECTRONIC LIGHTING DEVICE - Google Patents

Abstract

A device for temporarily delimiting a material that can be applied in a flowable state, wherein the material does not cover a first area of an optoelectronic lighting device and covers a second area of the lighting devices adjoining the first area, comprises a delimiting element with an underside and at least one has lateral surface, wherein, in particular to protect the first area from the flowable material, the device is designed and can be temporarily arranged on the lighting device such that the underside of the delimiting element contacts the lighting device in the first area and the side surface and / or an edge delimits the first area from the second area between the lateral surface and the underside.

Description

The present invention relates to a device for temporarily delimiting a material that can be applied in a flowable state and to a method for producing an optoelectronic lighting device.

In the case of optoelectronic lighting devices, it can be provided that a material provided in the flowable state, in particular in the form of a layer, is applied to at least a specific area of a surface of the optoelectronic lighting device. In this case, the effect can occur, which is also referred to as "bleeding", that the material also reaches areas which are adjacent to the specific area and which should not be covered by the material.

The present invention is therefore based on the object of creating a possibility with which it can be prevented in a simple manner that material provided in the flowable state reaches undesired areas of the optoelectronic lighting device.

The object is achieved by a device having the features of claim 1. Preferred embodiments and developments of the invention are specified in the dependent claims.

A device according to the invention for temporarily delimiting a material that can be applied in a flowable state, wherein the material does not cover a first area of an optoelectronic lighting device, in particular an upper side of a carrier of the lighting device, and covers a second area of the lighting device adjacent to the first area , comprises a delimiting element with an underside and at least one lateral surface, the device being designed and temporarily being able to be arranged on the lighting device in such a way that the underside of the delimiting element contacts the lighting device in the first region and the lateral surface and / or an edge between the lateral Surface and the bottom delimits the first area from the second area.

The delimiting device thus comprises a delimiting element which can be brought with the underside onto the surface of the lighting device, which is in particular the top of the carrier. The underside can lie on the surface, and the limiting device can be dimensioned such that the lateral surface separates the first area from the second area. The flowable material can then be applied to the second area, the restriction device preventing - e.g. through the effect of "bleeding" - the flowable material from the second area to the first area and thus unwanted wetting. After the material has hardened, the limiting device can be removed. The limiting device can thus serve as a kind of dam that protects the first area of the surface of the lighting device from the material. However, the “dam” is only provided temporarily because the limiting device is removed after the material has hardened or only after it has hardened.

The flowable material can be, for example, silicone or epoxy resin.

The edge running between the underside and the lateral surface can have a course which corresponds at least approximately to a boundary line between the first region and the second region. As a result, the first region can be delimited relatively precisely from the second region and in particular a slight wetting of the first region can also be avoided.

The lateral surface can be closed in a circumferential direction, in particular running parallel to the underside. The side surface can therefore form a completely continuous, closed partition.

The underside and / or the edge running between the underside and the lateral surface can be brought into contact with the upper side of the carrier over its entire length. This prevents the material from flowing from the second area to the first area along the entire boundary line between the first area and the second area.

The underside can have at least one coating, in particular in order to avoid or limit the flow of the material. An edge running between the underside and the lateral surface can likewise have at least one coating. Flow of the material from the second area to the first area can thereby be avoided particularly well.

The side surface can have at least one coating and / or a stop device, in particular in order to avoid or limit the flow of the material. The stop device on the side surface can define a maximum fill level for the material.

The stop device can have stop lines or stop elements. The stop device can for example be arranged at a certain distance from the underside on the side surface of the delimiting element. The stop device can be arranged on the side surface in the form of a circumferential circumferential collar which projects away from the side surface. The height level defined by the federal government can determine the maximum filling height for the material.

The limiting element can be formed at least partially from a deformable and / or soft material. The limiting element can thereby be pressed onto the surface of the lighting device in an improved manner. This results in an improved seal between the two areas on the surface of the lighting device or the top of the carrier.

The lateral surface can extend, in particular in a straight line, at an angle of at least approximately 90 degrees to the underside. Alternatively, the side surface, in particular a straight line, can run upwards and outwards from the underside. The edge between the underside and the lateral surface can be rounded. Seen in a plane perpendicular to the underside, the delimiting element can have a rectangular, square or triangular cross section. The shape and the course of the side surface are reflected in the shape and in the course of the side surface of the layer formed from the flowable material.

The limiting element can be designed in the form of a frame-like structure which surrounds an inner region. The limiting element can thus form a type of enclosure, the interior of which can be filled with flowable material. Alternatively, the area outside the delimiting element can be coated with the flowable material, the surface area of the lighting device enclosed by the delimiting element being protected from the material. The inner region is preferably dimensioned such that it can accommodate at least one optoelectronic semiconductor component, in particular an LED chip. The limiting device thus allows the formation of a layer of the originally flowable material around the semiconductor component. Depending on the dimensioning of the delimitation device, the layer can be at a distance from the semiconductor component or adjoin it flush.

The lateral surface can be the surface side of the frame-like structure that faces the inner region or that faces away from the inner region. Depending on the application, it can therefore be provided that either the area outside the delimiting element or the area enclosed by the delimiting element is covered with material.

The delimiting element can in particular be designed in the form of a stamp, the underside of which has at least approximately the size and / or shape of the first region. The delimiting element can thus cover the first area on the surface of the lighting device, so that the surroundings of the covered first area can be covered with flowable material without the first area being wetted.

The device can have an upper, preferably rigid, limiting device which can be arranged at a certain distance above the lighting device, in particular the upper side of the carrier. By means of the delimitation device, a layer of the flowable material can be formed in the space between the carrier surface and the delimitation device. In particular, the layer can have a defined height, which corresponds to the distance of the limiting device from the surface of the lighting device or from the top of the carrier.

The limiting element is preferably arranged on the limiting device. In particular, the limiting device can be permanently and / or permanently connected to the limiting element. The limiting device is particularly preferably designed as a limiting plate and the limiting element is arranged on the underside of the limiting plate.

The limiting device, in particular in the form of a limiting plate, can have at least one opening extending from its top to its bottom. The material can be introduced through the opening into the space between the limiting device and the lighting device.

A holding device can be provided for holding the delimiting device at a defined distance above the lighting device or the top of the carrier to form the layer between the delimiting device and the top of the carrier. A punctiform contact between the limiting device and the lighting device or the upper side of the carrier can also be realized by means of the holding device. The distance determines in particular the height of the resulting layer of material, which can thus be manufactured precisely. A certain casting height can therefore be achieved for the originally flowable material. If the layer is formed over the emission surface of an optoelectronic semiconductor component, its height can be determined relatively precisely. In this way, for example, a relatively narrow color location distribution can be ensured in the production of white LEDs.

The holding device can have at least one spacer. The spacer can be arranged on the delimiting device, and an end of the spacer lying away from the delimiting device can be brought into contact with the top of the carrier.

An underside of the limiting device can have a non-stick coating. The limiting device can thus be removed more easily. Other sides of the limiting device can also have a non-stick coating.

An underside of the delimiting device, which faces the surface of the lighting device and in particular the upper side of the carrier, if the delimiting device is arranged at a distance above the lighting device, can have a structuring at least in a region of the underside. This can be used to form a complementary structure on the top of the layer formed from the flowable material.

If the delimiting device is arranged at a distance above the carrier, the area of the underside can preferably lie above a light-emitting area of an optoelectronic semiconductor component, and the structuring can be designed such that in the layer to be formed from the flowable material above the light-emitting area an optical element, such as a lens, can be formed.

An underside of the delimiting device, which faces the lighting device when the delimiting device is arranged at a distance above the lighting device, can have a first area which is at a first distance from the upper side of the carrier, and can have at least a second area which is a second Has distance to the top of the carrier, which differs from the first distance.

A layer can thus be formed from the flowable material and has different heights in different areas. This is advantageous, for example, if different thick encapsulation layers are to be formed over adjacent optoelectronic semiconductor components, such as LEDs. In this way, for example, different degrees of conversion or color locations can be realized with a converter volume encapsulation. E.g. neighboring LEDs can be coated with a potting compound in such a way that "cold" white light is emitted over one LED and "warm" white light is emitted over the other LED.

Sedimentation can take place, especially after the volume has been poured, which can naturally occur or be forced, for example, in a centrifuge. Due to the initially different fill levels over a chip, different thicknesses of a sedimented phosphor layer result. Using a subsequent grinding process in silicone or another, in particular clear, material over the sedimented phosphor, a uniform component thickness can be generated over the substrate.

The limiting device can be dimensioned such that it covers at least the second area of the lighting device. The entire second area can thus be provided with a layer which can have a defined height or can have different, defined heights in different areas and / or can have a defined structure in an area of its upper side.

Components used temporarily, such as in particular the limiting element or the limiting device, can have a poorly adhering surface or a surface with a non-stick coating. This can make it easier to demould later.

The invention also relates to a method for producing an optoelectronic lighting device, comprising the steps of: providing a carrier on the top of which at least one optoelectronic semiconductor component, in particular an LED chip, is arranged,
Temporary arrangement on the carrier of a device according to the invention such that, in particular to protect a first region on the top of the carrier from flowable material, the underside of the delimiting element contacts the top of the carrier in the first region and the lateral surface contacts the first region with respect to a second region delimits the carrier surface,
Applying flowable material to the second area, and
Remove the device after the flowable material has hardened.

The device can be fixed on the carrier, in particular clamped, or pressed on.

• 1 bis 3 eine jeweilige Querschnittsansicht einer Variante einer temporären Begrenzungsvorrichtung bzw. einer optoelektronischen Leuchtvorrichtung, wobei das Auftragen von fließfähigem Material illustriert wird,
• 4 bis 6 eine jeweilige Querschnittsansicht einer weiteren Variante einer temporären Begrenzungsvorrichtung bzw. einer optoelektronischen Leuchtvorrichtung, wobei das Auftragen von fließfähigem Material illustriert wird,
• 7 bis 9 eine jeweilige Querschnittsansicht noch einer weiteren Variante einer temporären Begrenzungsvorrichtung bzw. einer optoelektronischen Leuchtvorrichtung, wobei das Auftragen von fließfähigem Material illustriert wird,
• 10 bis 12 eine jeweilige Querschnittsansicht noch einer weiteren Variante einer temporären Begrenzungsvorrichtung bzw. einer optoelektronischen Leuchtvorrichtung, wobei das Auftragen von fließfähigem Material illustriert wird, und wobei zusätzlich unterschiedliche Varianten einer Begrenzungseinrichtung dargestellt sind, und
• 13 bis 15 eine jeweilige Querschnittsansicht noch einer weiteren Variante einer temporären Begrenzungsvorrichtung bzw. einer optoelektronischen Leuchtvorrichtung mit einem Träger, wobei das Auftragen von fließfähigem Material illustriert wird, und wobei zusätzlich noch eine weitere Variante einer Begrenzungseinrichtung zur Bildung einer Materialschicht dargestellt ist.

Exemplary embodiments of the invention are explained in more detail below with reference to the attached drawings. Each shows schematically

• 1 to 3rd 3 shows a respective cross-sectional view of a variant of a temporary delimitation device or an optoelectronic lighting device, the application of flowable material being illustrated,
• 4th to 6 3 shows a respective cross-sectional view of a further variant of a temporary delimitation device or an optoelectronic lighting device, the application of flowable material being illustrated,
• 7 to 9 a respective cross-sectional view of yet another variant of a temporary delimitation device or an optoelectronic lighting device, the application of flowable material being illustrated,
• 10th to 12th a respective cross-sectional view of yet another variant of a temporary delimiting device or an optoelectronic lighting device, the application of flowable material being illustrated, and additionally different variants of a delimiting device being shown, and
• 13 to 15 a respective cross-sectional view of yet another variant of a temporary delimitation device or an optoelectronic lighting device with a carrier, the application of flowable material being illustrated, and in addition a further variant of a delimitation device for forming a material layer is shown.

The in the 1 to 3rd shown device 21 includes a delimiting element 23 with a bottom 25th and at least one side surface 27 . The boundary element 23 has an at least approximately rectangular cross section and is preferably formed from a soft, deformable material. In a circumferential direction perpendicular to the image plane U is the limiting element 23 fully closed. The boundary element 23 thus forms, along its circumferential direction U seen, a frame that can be designed, for example, rectangular or square or also ring-shaped. The side surface 27 is also along the circumferential direction U seen, completely closed. The side surface 27 therefore forms a wall that one of the frame-like delimitation element 23 covered interior 29 surrounds.

The limiting device 21 also has an upper, rigid limiting device 51 on, which is designed in the form of a base plate, on the underside of the limiting element 23 is arranged. The base plate 51 has at least one opening from its top to its bottom through which the inner region 29 is accessible. This allows at least one flowable material 55 , in particular in the form of a layer, on a plate-like carrier 33 an optoelectronic lighting device 31 be applied.

The carrier 33 comprises a substrate 39 and a metallization layer 37 . This can be divided into individual sub-areas that are electrically separated from one another. The layer 37 can therefore not on the entire top 35 of the carrier 33 be arranged, but only on a partial area and therefore, for example, have individual, separate contact areas for electrical contacting.

On the top 35 of the carrier 33 is also at least one optoelectronic semiconductor component 41 arranged, which can be, for example, an LED chip. On the top of the semiconductor device 41 a light-emitting area is formed, which consists of an optional, in particular transparent, material layer 43 is covered. Via at least one bond wire 45 can the semiconductor device 41 with the metallization layer 37 be electrically connected.

With the lighting device 31 it is provided that at least one layer of at least one material processed in the flowable state 55 on top 35 of the carrier 33 is applied. The material should 55 a first area 47 on the top of the beam 35 do not cover and one at the first area 47 adjacent second area 49 on the carrier surface 35 cover. The terms “carrier top” or “carrier surface” are to be understood broadly and in particular should also include surface areas of elements or devices that are on the carrier 33 are arranged. To differentiate the first area 47 from the second area 49 are vertical dashed lines in 1 drawn. The border line G between the two areas 47 , 49 also extends in the plane of the top of the beam 35 .

The material 55 is processed in the flowable state and especially on the top of the carrier 35 upset. It then hardens, for example in a thermal process. To apply the material 55 in flowable condition on top 35 of the carrier 33 comes the limiting device 21 for use. This is temporarily on the top 35 arranged and removed after curing or curing. The side surface can do this 27 for example made from a material with poor adhesion or poor wettability.

With the limiting device 21 is / are the bottom 23 and / or the side surface 25th and / or an optionally rounded edge 61 between the bottom 23 and the side surface 25th designed and dimensioned such that the limiting device 21 if the bottom 23 on the carrier surface 35 the first area 47 towards the second area 49 limited.

In particular, it points between the bottom 25th and the side surface 27 running edge 61 along the circumferential direction U a course that is at least approximately the borderline G between the first area 47 and the second area 49 matches if the bottom 25th on the carrier surface 35 lies on. The edge 61 can be seen along the entire borderline G in contact with the top of the beam 35 bring. The edge 61 and the side surface 27 can thus have a lateral limitation for that by means of an application device 53 on the second area 49 applied material 55 form, like in particular 2nd illustrated. The order facility 53 can act as a kind of donor, the flowable material 55 dispenses through a downward-pointing nozzle so that the flowable material 55 from the top of the surface 35 can be applied (cf. 2nd ).

The limiting device 21 can, comparable to a stamp, temporarily on the carrier surface 35 arranged or with an in 2nd indicated force F on the carrier surface 35 be pressed. The limiting device 21 can therefore also be seen as a kind of stamping tool. The power F can be generated, for example, in that the limiting device 21 on the carrier surface 35 stretched or by means of an appropriate device on the support surface 35 is pressed.

By pressing on the limiting device 21 can be the area between the edge 61 and the surface 35 particularly well sealed and therefore a flow of the material 55 over the border line G and on the first area 47 be prevented. The sealing effect can be further improved by the limiting element 23 is made of a soft, deformable material. Furthermore, a coating on the side surface 27 , the bottom 25th and / or the edge 61 be provided, which causes a better seal.

How 2nd also shows the material 55 sideways next to that of the side surface 27 of the delimitation element 23 formed wall can be filled up to a desired level. This can be done on the side surface 27 a stop device 57 be arranged. This can comprise several stop elements that are at a certain distance from the underside 25th and in the direction of rotation U seen offset from each other from the side surface 27 stand out. Alternatively, the stop device 57 also as a circumferential and from the side surface 27 projecting covenant. Through the stop device 57 can be prevented that by means of the application device 53 material applied the height level of the stop device 57 exceeds (cf. 2nd ). At least in the area of the side surface 27 can thus by means of the stop device 57 a maximum fill level for the flowable material 55 achieved or ensured. The stop device 57 can have a surface made of a weakly adhering material. This can remove the limiting device 21 be relieved.

After the material has hardened 55 can the limiting device 21 be removed again like 3rd shows. It can also harden, for example for shape stabilization, with the limiting device 21 done, whereas the material 55 without limitation device 21 can harden. There is a clear demarcation between the uncovered first area 47 and with material 55 covered second area 49 . A flow, which is also referred to as "bleeding", of the still flowable material 55 in the first area 47 could thus by using the limiting device 21 be avoided. A permanently arranged dam, which could possibly also prevent such bleeding, could be saved.

The related to the 4th to 6 described limiting device 21 differs from the limiting device of the 1 and 2nd a continuous base plate 51 on, and the delimiter 23 has a triangular cross-sectional area. There is also the side surface 27 Outside. With the device 21 according to the 4th to 6 it is therefore provided that the limiting element 23 if it is with its bottom 25th in plant with the top 35 of the carrier 33 brought a first area 47 the top of the beam 35 covered and thus by the adjacent, outer, second area 49 separates.

Due to the triangular cross-sectional shape of the limiting element 23 falls the bottom 25th with the in the direction of rotation U circumferential edge 61 together. This is on the top 35 as described above, with a force F on top 35 pressed. This can achieve an effective seal and "bleed" the flowable material 55 be avoided. A coating can further improve the sealing effect.

In the semiconductor device 41 it can be a light-emitting chip that has a light exit area on its side surface. The chip can in particular be an LED designed as a volume emitter.

The flowable material 55 can in turn by means of an application device 53 to the second area 49 be applied as 2nd shows. Due to the side surface that runs diagonally upwards and outwards 27 there is a corresponding bevel 59 on the semiconductor device 41 facing surface side of the material 55 formed layer (cf. 6 ). Through this bevel 59 points the material 55 a defined shape of the flank opposite the light exit area. This can bring about an improved beam shaping and thus an improved coupling-out efficiency. This is in 6 through the arrows P which illustrates the light path of the from the semiconductor device 41 show emitted light.

The related to the 7 to 9 described limiting device 21 has one on the base plate 51 attached limiting element 23 that, in contrast to the delimiting elements described above, has no frame-like structure, but is at least approximately in the form of an ellipsoidal, ball or egg-shaped structure.

The bottom 25th of the delimitation element 23 can be how 8th shows on top of the material layer 43 apply. The bottom 25th is dimensioned such that it is at least approximately an emission surface of the semiconductor component 41 cover and thus a defined first area 47 on the top 35 of the carrier 33 can protect from material applied in a flowable state. Through over the adjacent second area 49 layers of material formed 55a , 55b the edge of the emission area can thus be limited. This can result in an improved contrast in that of the semiconductor component 41 emitted light can be achieved.

The bottom 25th with the in the direction of rotation U circumferential edge 61 can in turn, as previously described, with a force F on the first area 47 be pressed. This enables an effective seal to be achieved and bleeding of flowable material onto the first area 47 be avoided. A coating can further improve the sealing effect.

As already mentioned, the lighting device 31 according to the 7 to 9 provided that two layers 55a , 55b Made of different materials that are flowable using the device 53 be applied to the second area 49 the top 35 be applied. The side surface 27 of the delimitation element 23 forms one in the circumferential direction U of the delimitation element 23 all-round boundary wall for the material layers 55a , 55b . These can be formed up to this boundary wall. Due to their shape, how 9 shows, a kind of crater laterally above the material layer 43 from the layers of material 55a , 55b be trained, especially with sufficiently high casting heights. The crater can affect the beam quality of the semiconductor device 41 improve emitted light.

The limiting device 21 the 7 and 8th can in turn be viewed as a kind of stamp that is used temporarily to form the layers 55a , 55b and to protect the first area 47 on top of the layer 43 is arranged. The limiting device 21 can also be used for screen-printed layers.

10th to 12th show a temporary limiting device 21 or an optoelectronic lighting device 31 . The device 21 is also for the production of at least one defined layer from the material provided in the flowable state 55 suitable. To do this, the device 21 a limiting device in the form of the limiting plate 51 as well as a holding device 63 for holding the boundary plate 51 at a certain distance A above the top 35 of the carrier 33 when the device 21 as intended on the top 35 lies on. The holding device 63 can be in the form of one or more, for example rod-shaped, spacers which are attached to the boundary plate 51 are arranged and their from the boundary plate 51 distal end at a distance A under the boundary plate 51 lies. The holding device 63 is preferably rigid, so that it is on the top 35 can strike when the device 21 on top 35 is pushed open.

At the bottom of the boundary plate 51 is also a limiting element 23 arranged as previously described. For the use of the device for producing the at least one layer 55 with a certain height, however, the limiting element can only be seen as an optional device.

The boundary plate 51 has openings 73 on that from their top 65 to their bottom 67 go through and in particular to introduce the material to form the material layer 55 between the boundary plate 51 and the carrier top 35 are provided.

As in 11 shown, the device 21 in plant with the top 35 of the carrier 33 to be brought. 11 shows two different configurations of the boundary plate 51 . In the upper part of the 11 (see. 11a) is the boundary plate 51 with a flat top 65 and with a flat bottom 67 educated. This means that material made available in the flowable state can be applied via the application device 53 and through one of the openings 73 is applied one layer 55 are formed that have a defined height H to the top of the beam 35 or a defined height h1 with respect to the top of the semiconductor devices 41 has, which can be about LED chips.

By using the boundary plate 51 to make the layer 55 according to 11a is the height h1 over the semiconductor devices 51 defined, cf. 12a . The material layer thickness above the emitting component can thus be set precisely. This allows deviations in the color location distribution to be reduced.

In the lower part of 11 (see. 11b) is the boundary plate 51 also with a flat top 65 educated. However, the bottom shows 67 a structuring 69 on that to form a complementary structure 71 on the top 75 the layer 55 is provided as 12b shows. In particular, above the light-emitting area of the semiconductor components 41 an optical element 77 , in particular a lens.

As in 10th is further illustrated by way of example, the bottom 67 the limiting device 51 also from an area with a structure 69 and consist of a flat area.

With regard to the 13 to 15 described example comes a device 21 used where the bottom 67 the boundary plate 51 is graduated. The bottom 67 therefore has at least a first area 79 that a first distance h1 to the top of a semiconductor device 41 and a second area 81 that is a second distance h2 to the top of the adjacent, second semiconductor component 41 if the device 21 on the carrier surface 35 is arranged. As the 14 and 15 can illustrate a material layer 55 are formed at which the layer heights h1 , h2 over the neighboring semiconductor devices 41 are different. This enables different color location distributions in the semiconductor components 41 realize. This can be used, for example, to implement several color coordinate coordinates in one "package".

Reference list

21

Limiting device

23

Delimiting element

25th

bottom

27

side surface

29

Indoor area

31

Lighting device

33

carrier

35

Top

37

Metallization layer

39

Substrate

41

Semiconductor device

43

Material layer

45

Bond wire

47

first area

49

second area

51

Plate, limiting device

53

Order setup

55

Material, layer

55a

Material layer

55b

Material layer

57

Stop device

59

bevel

61

Edge

63

Holding device

65

Top

67

bottom

69

structuring

71

structure

73

opening

75

Top

77

optical element

79

first area

81

second area

U

Perimeter

P

arrow

F

force

G

Boundary line

A

distance

H

height

h1

Height, first distance

h2

second distance

Claims (22)

Device for temporarily delimiting a material (55) that can be applied in a flowable state, the material not covering a first area (47) of an optoelectronic lighting device (31) and a second area (49) adjoining the first area (47) ) of the lighting device (31), the device (21) having a delimiting element (23) with an underside (25) and at least one lateral surface (27), in particular to protect the first region (47) from the flowable material (55), the device (21) is designed and can be temporarily arranged on the lighting device (31) such that the underside (25) of the limiting element (23) contacts the lighting device (31) in the first region (47) and the lateral surface (27) and / or an edge (61) between the lateral surface (27) and the underside (25) delimits the first region (47) from the second region (49). Device after Claim 1 , characterized in that the edge (61) extending between the underside (25) and the lateral surface (27) has a course which is at least approximately a boundary line (G) between the first region (47) and the second region (49) corresponds. Device after Claim 1 or 2nd , characterized in that the lateral surface (27) is closed in a circumferential direction (U), in particular running parallel to the underside, and / or in that the underside (25) and / or the lateral surface (27) and / or the, optionally rounded, edge (61) between the underside (25) and the lateral surface (27) is dimensioned such that the limiting device (21), when the underside (25) rests on the lighting device, opposes the first region (47) delimits the second area (49). Device according to one of the preceding claims, characterized in that the underside (25) and / or the edge (61) running between the underside (25) and the lateral surface (27) over its entire length in contact with the lighting device (21) , in particular the top of the carrier (35), can be brought. Device according to one of the preceding claims, characterized in that the underside (25) and / or the edge (61) extending between the underside (25) and the lateral surface (27) and / or the lateral surface (27) has a coating and / or has at least one stop device (57), in particular stop lines or stop elements, in particular for avoiding or limiting a flow of the material (55). Device according to one of the preceding claims, characterized in that the limiting element (23) is at least partially formed from a deformable and / or elastic and / or poorly wettable material. Device according to one of the preceding claims, characterized in that the lateral surface (27), in particular rectilinear, extends at an angle of at least approximately 90 degrees to the underside (25) or the lateral surface (27), in particular rectilinear or curved, preferably concave or convex, from the bottom (25) upwards and outwards. Device according to one of the preceding claims, characterized in that the edge (61) between the underside (25) and the lateral surface (27) is rounded. Device according to one of the preceding claims, characterized in that, seen in a plane perpendicular to the underside (25), the delimiting element (23) has a rectangular, square, triangular, n-angular or circular cross section. Device according to one of the preceding claims, characterized in that the limiting element (23) is designed in the form of a frame-like structure which surrounds an inner region (29), wherein, preferably, the inner region (29) is dimensioned such that at least one optoelectronic one Semiconductor component (41), in particular an LED chip, can be arranged. Device after Claim 10 , characterized in that the lateral surface (27) is the surface side of the frame-like structure facing the inner region (29) or facing away from the inner region (29). Device according to one of the Claims 1 to 9 , characterized in that the delimiting element (23) is in the form of a stamp, the underside (25) of which is at least approximately the size and / or shape of the first region (47). Device according to one of the preceding claims, characterized in that it has an upper, preferably rigid, limiting device (51), in particular a limiting plate, which can be arranged at a certain distance (A) above the lighting device (31), in particular to form a layer of the flowable material (55) in the space between a support surface (35) and the boundary plate (51), wherein, preferably, the limiting element (23) is arranged on the limiting device (51). Device after Claim 13 , characterized in that the limiting device (51) has at least one opening (73) which is continuous from its upper side (65) to its underside (67), in particular for introducing the material (55). Device according to one of the Claims 13 or 14 , characterized in that a holding device (63) is provided for holding the limiting device (51) at a certain distance (A) above the lighting device (31). Device after Claim 15 , characterized in that the holding device (63) has at least one, in particular rigid, spacer, wherein, preferably, the spacer is arranged on the delimiting device (51) and an end of the spacer lying away from the delimiting device (51) is in contact with the Lighting device (31) can be brought. Device according to one of the Claims 13 to 16 , characterized in that an underside (67) of the delimiting device (51) which faces the lighting device (31) when the delimiting device (51) is arranged above the lighting device (31) has at least one area of the underside (67) Structuring (69), in particular for forming a structure (71) complementary to structuring (69) on the top (75) of the layer made of the flowable material (55). Device according to one of the Claims 13 to 17th , characterized in that, if the limiting device (51) is arranged above the lighting device (31), the area of the underside (67) lies above a light-emitting area of an optoelectronic semiconductor component (41) and the structuring (69) is designed such that an optical element (77) is formed in the layer above the light-emitting region. Device according to one of the Claims 13 to 18th , characterized in that an underside (67) of the limiting device (51), which faces the lighting device (31) when the limiting device (51) is arranged above the lighting device (31), has a first area which is a first distance ( h1) to the top of the lighting device (51), and has at least one second area which has a second distance (h2) from the lighting device (51) which differs from the first distance (h1). Device according to one of the preceding claims, characterized in that the limiting device (51) is dimensioned such that it at least substantially covers at least the second region (49) of the lighting device (31). Method for producing an optoelectronic lighting device (31) with the steps: Providing a carrier (33) on the upper side (35) of which at least one optoelectronic semiconductor component (41), in particular an LED chip, is arranged, Temporary arrangement on the carrier (33) of a device according to one of the preceding claims such that, in particular to protect a first region (47) on the upper side (35) of the carrier (33) against flowable material (55), the underside ( 67) of the delimiting element (23) contacts the top of the carrier (35) in the first region (47) and the lateral surface (27) and / or the edge (61) of the delimiting element (23) contacts the first region (47) with respect to a second region ( 49) delimited on the carrier surface (35), Applying flowable material (55) to the second area (49), and Remove the device (21) after the flowable material (55) has hardened. Procedure according to Claim 21 , characterized in that the device (21) is fixed on the carrier (33), in particular clamped or pressed on.

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