DE102017214482A1 - Device for cooling electronic components - Google Patents

Abstract

A device for cooling electronic components (8A) is proposed, comprising a first side (A) with a first cooling surface (6) for delivering heat of an electronic component (8A) to a cooling medium, and a second side (B) with a second Cooling surface (7) for emitting heat of an electronic component (8A) to the cooling medium, wherein the two sides (A, B) are arranged opposite, so that the two cooling surfaces (6, 7) with a distance (X) to form a passage for the cooling medium, wherein within the distance (X) and on the two cooling surfaces (6, 7), a flexible cooling structure (22) is arranged.

Description

The invention relates to a device for cooling electronic components, a heat sink module, an electronic module, an inverter and a motor vehicle drive train.

Stackable electronic modules are known which are each arranged on an external cooling plate. There are also superimposed electronics modules known, which are arranged together in a common housing. From such modules, an inverter can be constructed, which can be used for example for the electrical energization of an electric motor of a motor vehicle.

From the EP 2 019 429 A1 a module for power electronics is known, which allows a cooling over two opposite cooling surfaces of the module. The module itself is not stackable.

In the non-pre-published DE 10 2016 223 889.2 The Applicant proposes a stackable electronic module.

The object of the present invention is to improve the state of the art.

This object is achieved by the features specified in the main claims. Preferred embodiments thereof are the dependent claims.

Accordingly, a device for cooling electronic components, a heat sink module, an electronic module, an inverter and a motor vehicle drive train are proposed.

The proposed device for cooling electronic components has a first side with a first cooling surface and a second side with a second cooling surface. Both cooling surfaces serve to deliver heat of one or more electronic components to a cooling medium. In particular, one of the two sides forms an upper side of a first heat sink module for a first electronic component and the other of the two sides forms an underside of a second heat sink module for a second electronic component.

In the proposed device, the two sides of the device are arranged opposite, so that the two cooling surfaces with a distance to form a passage for the cooling medium face each other.

In the proposed device is also within the distance and on the two cooling surfaces, a flexible cooling structure is arranged. The flexible cooling structure is thus arranged within the passage through which cooling medium flows during operation of the device. The passage is in particular a gap between the two opposite cooling surfaces.

The flexible cooling structure is in particular designed to absorb heat from both cooling surfaces and deliver it to the cooling medium within the passage. With the cooling structure, a flow of the cooling medium can be directed as needed, for example, toward one of the cooling surfaces or away from one of the cooling surfaces. In addition, with the cooling structure advantageous turbulence can be introduced into the flow of the cooling medium between the two cooling surfaces, whereby the heat absorption is improved.

The cooling structure is at least flexible in that the two cooling surfaces can compress the cooling structure when joining the two sides of the device. This ensures that the cooling structure applies with a certain biasing force to the two cooling surfaces. It can therefore also be said alternatively that the cooling structure is arranged with a biasing force between the two opposing cooling surfaces. It may alternatively be said that the cooling structure has a lower rigidity than the two cooling surfaces. Both implies a certain flexibility of the cooling structure. This also ensures that a thermally conductive connection of the two cooling surfaces is given in a disadvantageous tolerance chain.

In particular, it is therefore provided that the distance between the two cooling surfaces in the assembled state is smaller than a height of the cooling structure before the cooling surfaces are joined together.

• • eine erste Kühlfläche auf einer ersten Seite des Kühlkörpermoduls, und
• • eine zweite Kühlfläche auf einer zur ersten Seite gegenüberliegenden zweiten Seite des Kühlkörpermoduls, und
• • eine Stelle zum Anordnen zumindest eines Elektronikbauteils zwischen den beiden Kühlflächen des Kühlkörpermoduls, sodass das Elektronikbauteil Wärme an diese beiden Kühlflächen abgeben kann.

Also proposed is a heat sink module for forming the proposed device. The heat sink module has:

• • a first cooling surface on a first side of the heat sink module, and
• A second cooling surface on a second side of the heat sink module opposite the first side, and
• A location for arranging at least one electronic component between the two cooling surfaces of the heat sink module, so that the electronic component can deliver heat to these two cooling surfaces.

At least one of the two cooling surfaces of the heat sink module in this case has said flexible cooling structure arranged thereon.

When arranging an identical or comparably constructed second heat sink module on this proposed heat sink module, the flexible cooling structure is then arranged between the two opposite sides (and thus cooling surfaces) of the two heat sink modules. Here, the flexible cooling structure is compressed so far that it rests securely against the two opposite cooling surfaces. The two opposite cooling surfaces of the heat sink modules form the passage for the cooling medium, within which the flexible cooling structure is arranged.

The cooling structure is preferably made of sheet metal. As a result, it can be easily manufactured and sufficient flexibility can be achieved. The cooling structure is preferably formed by a stamped part. This also simplifies the manufacture of the cooling structure. The cooling structure may also have been produced in other ways, for example by 3D printing.

The cooling structure may be attached to at least one of the two cooling surfaces. For this purpose, the cooling structure may in particular be welded, sintered or soldered to the cooling surface. This ensures good heat transfer from the cooling surface to the cooling structure. Alternatively or additionally, the cooling structure may also be screwed or glued or otherwise fastened to the cooling surface.

The cooling structure may in particular consist of several rows of meandering material strips. These rows may in particular be offset from each other. As a result, a particularly large area for heat emission can be generated.

The cooling structure may be formed by an insert, which is inserted between the two cooling surfaces. Before joining the two sides of the device so the cooling structure is first placed on one of the two cooling surfaces and, if necessary, fixed there. Subsequently, the two sides of the device are joined together opposite, so that the cooling structure is clamped between the respective projections. In the proposed heat sink module, the cooling structure is thus merely applied to one of the two cooling surfaces.

In particular, the cooling structure may have one or more so-called turbulators. This is in each case a shape of the cooling structure, for example a recess or indentation, for the targeted generation of turbulence in the flow of the cooling medium. As a result, the heat dissipation is improved by the cooling medium.

Preferably, a first housing part and a second housing part are provided in the device and / or the heat sink module. The first housing part extends in the direction of the first side and projects beyond the first cooling surface in this direction. The second housing part extends in the direction of the second side and projects beyond the second cooling surface in this direction. The two housing parts thus stand out from the respective cooling surfaces. In principle, however, it is also possible to provide a one-part housing which assumes the functions of the two housing parts.

In the device for cooling electronic components, the two housing parts to form the passage for the cooling medium are arranged opposite to each other. The two cooling surfaces thus define, together with the two housing parts, the passage for the cooling medium. For example, the two cooling surfaces form an upper wall and a lower wall of the passage and the two housing parts together form a lateral wall of the passage. The two cooling surfaces look like this.

In the case of the heat sink module, the two cooling surfaces are arranged on two opposite sides of the heat sink module, for example a top side and a bottom side. The two cooling surfaces of the heat sink module, so to speak, look away from each other. In this case, no passage for the cooling medium is formed by the heat sink module alone. Only by arranging an identical or comparable second heat sink module thereon is a passage formed between these two heat sink modules.

The proposed device is realized in this case by arranging the first side of the first heat sink module on the second side of the second heat sink module, the flexible cooling structure lying therebetween. This takes place in such a way that the first cooling surface of the first heat sink module is arranged at a distance from the second cooling surface of the second heat sink module by the said distance, and the said cooling structure is provided within this distance.

The first housing part in particular surrounds the first cooling surface laterally. The second housing part in particular surrounds the second cooling surface laterally. At least partially, the housing parts can directly adjoin the respective cooling surface. At the transition from the housing to the cooling surface, an interference contour can be formed on the housing in order to close a lateral bypass for the cooling medium.

As already explained, the heat sink module is preferably designed with at least one another module, in particular a housing module or a similar or identical heat sink module, to be stacked by arranging this further module on either the first side or the second side of the heat sink module. Thus, the further module can thus be arranged, if necessary, both on the first side, as well as on the second side. Both sides of the heat sink module are therefore equally suitable for arranging the further module thereto.

The electronic component is, in particular, an electronic component which releases heat during operation. This may in particular be a power electronic component, such as in particular a power semiconductor, such as an IGBT (bipolar transistor with insulated gate electrode) or a MOSFET (metal oxide semiconductor field effect transistor). Alternatively or additionally, the electronic component can also be an electrical ohmic resistance and / or an electrical inductance and / or an electrical capacitance. In particular, the electronic component may be a chip or a printed circuit board or the like, with one or more electrical components arranged thereon or therein.

The first and / or second cooling surface may be arranged so that it is perpendicular to the stacking direction (= axial direction of the heat sink module), ie perpendicular to the direction in which the modules are stackable. Thus, the cooling surfaces of stacked, identical heat sink modules are always parallel to each other. Alternatively, however, the first and / or second cooling surface may also be inclined to the stacking direction. This can result in an improved flow of cooling medium.

The two cooling surfaces of the heat sink module can be arranged so that they are parallel to each other. Alternatively, they can also be inclined to each other. The two cooling surfaces may also each have a convex or concave shape. As a result, more space can be created for the electronic component at a suitable location.

The heat sink module may have a first passage for the cooling medium, which leads from one of the two cooling surfaces to the other of the two cooling surfaces of the heat sink module. As a result, it is easy to guide cooling medium to the two cooling surfaces of this heat sink module.

Preferably, the heat sink module also has a second passage for the cooling medium, which leads from one of the two cooling surfaces to the other of the two cooling surfaces. The first and second passages are arranged at opposite ends of the cooling surfaces. Thus, the cooling medium can be led from one of the two passages and flow over the respective cooling surface and be discharged from the other of the two passages. In other words, the passages thus serve to pass the cooling medium through the heat sink module and past the two cooling surfaces.

In particular, the first passage and (if present) the second passage may be arranged on the heat sink module such that when stacking two and more identical heat sink modules, first passages of these heat sink modules are arranged in a row and, on the other hand, if present, the second passages these heat sink modules are arranged in a row. Thereby, the one passages may collectively form a manifold (distribution channel) for leading cooling medium to the cooling surfaces of the stacked heat sink modules. The other passages may then collectively form a collector (collector channel) to remove cooling medium from the cooling surfaces of the stacked heat sink modules.

• • die beiden Kühlflächen des Kühlkörpermoduls und
• • der erste Durchgang, und falls vorhanden, der zweite Durchgang des Kühlkörpermoduls

angeordnet sind.The said housing parts in particular form a housing of the associated heat sink module. Thus, therefore, a separate housing is provided for each heat sink module. This housing may in each case be designed in particular frame-shaped or as a frame within which

• • the two cooling surfaces of the heat sink module and
• • the first pass, and if present, the second pass of the heat sink module

are arranged.

By means of the housing, a dense wall can be formed laterally of the cooling surfaces in order to guide cooling medium over the cooling surfaces. Above the respective cooling surface, the housing is then open. Thus, when two identical heat sink modules are stacked, the two associated housings can abut each other and form a lateral seal for a cooling medium in the passages and on the cooling surfaces of the two heat sink modules. The first side of the one heat sink module lies in the stack directly opposite the second side of the further heat sink module stacked thereon. Through the passages of the heat sink modules, the cooling medium can then be easily guided to the cooling surfaces of the heat sink modules in the stack and also led away.

Accordingly, the housing parts form, for each heat sink module, a termination for the cooling medium laterally to the respective cooling surface. Towards the side the cooling surfaces is thus formed tightly made of the housing parts housing, so that the cooling medium there can not uncontrollably or unintentionally escape into an environment. However, it is optionally possible to provide targeted supply and discharge lines of cooling medium at the side of the housing in order to supply or discharge cooling medium to the heat sink module, that is to its cooling surfaces.

So that further modules can be stacked on the heat sink module, its housing (or its housing parts) is designed accordingly. In particular, the housing has in the direction of the first and the second side of the respective heat sink module via corresponding interfaces, such as in particular mutually corresponding sealing surfaces, grooves, springs (for a tongue and groove connection) or beads. This makes it possible for an identical or similar heat sink module to be stacked on the heat sink module. However, it is also possible to place compatible housing modules or various other modules on the heat sink module. Housing modules have even no electronic components and serve, for example, only to extend the module stack or for targeted flow control of the cooling medium or for supply or removal of cooling medium or for suspension / storage of the stack.

These measures provide a flexible heat sink module which can be expanded by any number of further modules, in particular identical or similar heat sink modules. At the same time no separate housing is needed for a module stack created with it. In other words, the proposed measures result in a stackability of the heat sink module in the axial direction (in the direction of the first and second sides of the heat sink module) and lateral sealing for the cooling medium (laterally to the cooling surface, laterally to the heat sink module).

The upper and the lower end of a module stack can in particular form housing modules whose upper side or lower side are substantially closed. Such a housing module may form a termination plate which is placed on an axial end of the stack like a normal module.

• • dem Gehäuse angrenzend zu einer der Kühlflächen, oder
• • an einer der Kühlflächen, oder
• • der Kühlstruktur

angeordnet sein. Dadurch kann die Strömungsrichtung innerhalb des Kühlkörpermoduls bedarfsweise gelenkt werden, beispielsweise hin zu einer der Kühlflächen oder hinweg von einer der Kühlflächen. Außerdem kann dadurch ein Bypass für das Kühlmedium geschlossen oder dessen Auswirkung vermindert werden. Außerdem können dadurch vorteilhafte Turbulenzen in die Strömung des Kühlmediums eingebracht werden, wodurch dessen Wärmeaufnahme verbessert wird.The heat sink module preferably has at least one flow guidance means for guiding a cooling medium within the heat sink module. The flow-guiding agent can in this case

• • the housing adjacent to one of the cooling surfaces, or
• • on one of the cooling surfaces, or
• • the cooling structure

be arranged. As a result, the flow direction within the heat sink module can be directed as required, for example, toward one of the cooling surfaces or away from one of the cooling surfaces. In addition, it can be closed by a bypass for the cooling medium or its effect can be reduced. In addition, advantageous turbulence can be introduced into the flow of the cooling medium, whereby its heat absorption is improved.

Also, the flow guiding means may either form an independent component which is suitably attached to the corresponding part of the heat sink module, for example on the housing. Or the flow guide means may form an integral part of the corresponding part of the heat sink module, so be formed integrally therewith. In the latter case, the flow guide means may in particular form a flow guide contour, which is formed on the corresponding part of the heat sink module. Such a flow guidance contour can also be referred to as an interference contour.

For example, the flow guiding means may form a special formation, such as a nose or rib, which protrudes to direct the cooling medium flowing past it in a particular direction.

Preferably, the first housing part of the heat sink module on the first cooling surface and it forms the first side of the heat sink module. The second housing part of the heat sink module then has the second cooling surface and forms the second side of the heat sink module. The first housing part and / or the second housing part of the heat sink module then preferably have a surface for arranging the electronic component thereon. For example, the electronic component may be soldered or sintered or adhesively bonded or screwed onto this surface, or cast on it with casting compound or otherwise attached thereto. The two housing parts may be identical or mirror images of each other.

Preferably, one of the two housing parts of the heat sink module has at least one groove, and the other of the two housing parts of the heat sink module has at least one spring corresponding thereto. Tongue and groove are intermeshing when the two parts are joined to the heat sink module. As a result, sealing of the electronic component arranged between the two parts can be improved.

In particular, the groove and the associated spring surround the location for arranging the at least one electronic component. Alternatively or additionally, the groove and the associated spring surround the first passage and / or the second passage of the heat sink module. In particular, a sealant, such as a sealant or an O-ring or a cord seal is inserted into the groove.

Preferably, the housing of the heat sink module has laterally to the cooling surfaces via at least one opening for electrical contacting of the respective electronic component from outside the housing. As a result, the electrical contacting of the electronic component can be done easily. Preferably, the electronic component is completely contactable via this at least one opening. There is then no need for contacts elsewhere in the electronic component. Alternatively or additionally, however, the electrical contacting of the electronic component can take place completely or partially through an electrical interface in the housing to form a further module stacked on the heat sink module.

Preferably, the electronic component is cast by means of casting compound with the heat sink module. In particular, the electronic component with the casting compound is sealed tightly against the cooling medium. Thus, simply a tightness of the electronic component relative to the cooling medium can be effected. The casting compound is preferably a duroplastic, in particular a resin. The casting compound can be cast by injection molding or low pressure casting, for example, or by other suitable means with the heat sink module. Thus, the electronic component is also vibration resistant and electrically isolated connected to the heat sink module. The casting compound can then itself form part of the heat sink module.

The electronic component can be arranged in a depression of the heat sink module. The electronic component may then be placed in the recess on the heat sink module and secured thereto. The electronic component can also be arranged in an opening running parallel to the cooling surfaces in the heat sink module. In particular, it can then be inserted into the heat sink module and its housing. Thus, it can be easily contacted by a side surface of the housing. Here, the opening may extend from a side surface of the housing to the cooling surfaces.

The opening for insertion or placement of the electronic component may also extend from one side surface of the housing through the heat sink to an opposite other side surface of the housing. The electronic component is then in particular pushed through the housing or arranged therein so that it can be electrically contacted by both side surfaces of the housing. Such an opening can be easily made, for example by milling or drilling.

The heat sink module may have a breakdown from said opening for insertion of the electronic component into the interior of the housing. Thus, a direct contact between the electronic component in the heat sink module and the heat sink module flowing through the cooling medium can be produced. This can improve the cooling of the electronic component.

It is noted that the heat sink module and in particular its housing may consist wholly or partly of a highly thermally conductive metal, such as iron or aluminum or copper or silver (this includes Fe or Al or Cu or Ag alloys). As a result, heat can be dissipated well from the electronic component.

The heat sink module can also consist at least partially of a plastic or of a ceramic. In particular, the heat sink module may consist of several materials, such as at least one metal part and at least one plastic part.

It is preferably provided that the heat sink module has one or more electronic components for forming an inverter. By means of an inverter, a direct current can be converted into an alternating current and / or vice versa.

The proposed electronic module therefore has at least one proposed heat sink module. This heat sink module then has at least one electrical half-bridge with a first and a second power semiconductor as electronic components.

In particular, the electronic module has a high-side power semiconductor and a low-side power semiconductor, in particular one IGBT or MOSFET each. For example, an electrical full bridge can then be formed from a plurality of identical or comparable electronic modules. For example, with three such electronic modules, which are then preferably stacked directly on one another, a B6 inverter can be formed.

The proposed inverter for electrical energization of an electric motor therefore has several such proposed electronic modules stacked. For example, the electronic modules can be stacked directly on top of each other. As explained, for example, a B6 inverter may be formed by a stack of three such electronic modules. Such an inverter can be constructed inexpensively by the simple mass manufacturability of such electronic modules. The use of additional cooling structures can be omitted. In addition, such an inverter is simple Scalable, because any number of modules can be stacked on top of each other.

The also proposed motor vehicle drive train has an electric motor as a traction drive. The electric motor thus serves for vehicle propulsion or vehicle deceleration. During the vehicle deceleration, the electric motor and the inverter preferably operate as generators and charge the battery. The powertrain may therefore serve for a purely electric powered electric vehicle, or it may be used with an internal combustion engine for a hybrid vehicle. The motor vehicle drive train is characterized by the proposed inverter for electrical energization of the electric motor. Thus, as explained, the inverter has a stack of several of the proposed electronic modules. Under such an electric current supply is both a supply of electric currents to understand the electric motor, as well as a discharge of electrical currents from the electric motor.

• 1 eine dreidimensionale Schnittdarstellung durch eine Vorrichtung und ein Kühlkörpermodul zur Kühlung von Elektronikbauteilen,
• 2 eine dreidimensionale Ansicht eines Kühlkörpermoduls,
• 3 eine Schnittdarstellung durch einen Stapel Kühlkörpermodule,
• 4 eine dreidimensionale Schnittdarstellung durch einen Stapel Kühlkörpermodule,
• 5 eine dreidimensionale Ansicht eines Kühlkörpermoduls,
• 6 einen Kraftfahrzeugantriebsstrang.

In the following the invention will be explained in more detail with reference to figures, from which further preferred embodiments and features of the invention can be removed. In each case show in a schematic representation:

• 1 a three-dimensional sectional view through a device and a heat sink module for cooling electronic components,
• 2 a three-dimensional view of a heat sink module,
• 3 a sectional view through a stack of heat sink modules,
• 4 a three-dimensional sectional view through a stack of heat sink modules,
• 5 a three-dimensional view of a heat sink module,
• 6 a motor vehicle powertrain.

In the figures, identical or at least functionally identical elements are provided with the same reference numerals.

The device 1' for cooling electronic components according to 1 has a first page A with a first cooling surface 6 for the release of heat of an electronic component 8A to a cooling medium. The device 1' also has a second page B with a second cooling surface 7 for the release of heat of an (other) electronic component 8A to the cooling medium.

The cooling surfaces 6 . 7 are flowed around by the cooling medium. As a result, they can give off heat or absorb heat. Depending on the design, the cooling surface 6 . 7 thus serve to dissipate heat to the cooling medium or for heat absorption from the cooling medium. In the latter case, the cooling surface is used 6 . 7 So for cooling the cooling medium.

The electronic component 8A In particular, it may comprise one or more power semiconductors, such as an IGBT or MOSFET. The electronic component 8A In particular, it may comprise a printed circuit board (PCB) or a ceramic substrate on which one or more power semiconductors are arranged. The electronic component 8A may form an electrical half-bridge with at least two power semiconductors.

The two sides A . B the device 1' are arranged opposite each other, so that the two cooling surfaces 6 . 7 with a distance X are arranged opposite to each other. This will make a passage with the height X formed for the cooling medium. Within the distance X is a flexible cooling structure 22 arranged. The flexible cooling structure 22 is in particular on at least one of the two opposite cooling surfaces 6 . 7 the device 1' attached, in particular soldered, welded or sintered. The cooling structure 22 can also be an insert that is between the two cooling surfaces 6 . 7 the device 1' is inserted.

The cooling structure 22 consists in particular of a flexible material, such as in particular a metal sheet. By way of example, the cooling structure exists 22 from several staggered rows of meandering metal strips (see also, for example 2 ).

The cooling structure 22 is at least as flexible running, so they when joining the pages A . B gives way when the two cooling surfaces 6 . 7 the device 1' approach each other and with the cooling structure 22 come to the plant.

The device 1' becomes in the embodiment after 1 through a first and a second heat sink module 1 formed, which abut each other. Each of the heat sink modules 1 has a first cooling surface 6 on a first page A (Top) of the heat sink module 1 on, and a second cooling surface 7 on one to the first page A opposite second side B (Bottom) of the heat sink module 1 on.

The heat sink modules 1 also have one job each 8th for arranging the electronic component 8A between the two cooling surfaces 6 . 7 of the associated heat sink module 1 , By arranging the electronic component 8A to the associated heat sink module 1 An electronic module can be formed. The spot 8th is chosen so that the electronic component 8A to both cooling surfaces 6 . 7 of the associated heat sink module 1 Can give off heat.

The spot 8th is exemplified by a side of the heat sink module 1 accessible opening or depression formed. In this opening or recess, the electronic component 8A be inserted or inserted. In particular, the electronic component 8A attached to it. This can be done, for example, to the heat sink module 1 soldered or welded. It may alternatively or additionally also with the heat sink module 1 Casting by casting.

For the first page A is ever heat sink module 1 a first housing part 11A a housing 11 of the heat sink module 1 intended. This first housing part 11A extends towards the first page A and towers in this direction, the first cooling surface 6 ,

Similarly, for the second page B a second housing part 11B of the housing 11 of the heat sink module 1 intended. This extends in the direction of the second side B and towers in this direction, the second cooling surface 7 , The through the housing parts 11A . 11B formed housing 11 the heat sink modules 1 are arranged together. They are therefore directly adjacent to each other. In particular, they have abutting sealing surfaces in order to prevent an unwanted escape of cooling medium at the connection point.

Because of the housing parts 11A . 11B the cooling surfaces 6 . 7 project beyond the respective directions, the distance forms X between the cooling surfaces 6 . 7 out.

The housing parts 11A . 11B enclose the respective cooling surfaces 6 . 7 laterally. So they form a lateral boundary of the two cooling surfaces 6 . 7 , They thus prevent accidental leakage of cooling medium laterally to the cooling surfaces 6 . 7 , Towards the first and second pages A . B is that through the housing parts 11A . 11B each case formed 11 however open. Thus, cooling medium in the direction of the first and second side A . B from the individual housings 11 escape. Accordingly, the cooling medium in the heat sink module stack between the individual heat sink modules 1 flow through or circulate.

The housing 11 is exemplified frame-shaped. Inside the frame are the cooling surfaces 6 . 7 arranged, as well as the intermediate point 8th for arranging the electronic module 8A , The housing 11 is thus formed substantially rectangular. However, other shapes are possible, such as a round or oval shape.

In the present case, passage openings are provided in the region of the outer corners of the rectangular shape. Through each of these, a screw or a bolt can be made to the stacked modules 1 to brace each other (see also for example 2 . 4 . 5 ). However, there are alternative ways to use the modules 1 firmly together.

The heat sink modules 1 with the associated housings 11 are each adapted to be stacked with another module (see for example 3 ). These are the two sides A . B the heat sink modules 1 equally designed for placing thereon another module. In particular, the two sides A . B a heat sink module 1 , in particular in the area of the housing 11 formed complementary to each other. For example, corresponding grooves or springs on the sides A . B be educated.

In particular, the pages form A . B of the heat sink module 1 (of the housing 11 ) Sealing surfaces. The two cooling surfaces 6 . 7 are exemplary parallel to these sealing surfaces and thus also parallel to each other. Thus lie the cooling surfaces 6 . 7 in a stack of identical heat sink modules 1 always parallel to each other.

It is alternatively possible, the cooling surface 6 . 7 To perform angled to the sealing surfaces. It is alternatively possible, the cooling surface 6 . 7 to perform angled to each other. It is also possible that one or both of the cooling surfaces 6 . 7 are convex or concave.

For a better understanding of the directions are exemplary in 1 the directions "below and above the heat sink module 1" (= axial directions) and the direction "laterally" shown by arrows. Here, U = means below the heat sink module 1 (towards side B ) and O = above the heat sink module 1 (towards side A ) and S = laterally. In the other figures, this applies accordingly.

2 shows a heat sink module 1 , that according to the heatsink modules 1 out 1 is executed. Out 2 is particularly well the arrangement and design of the flexible cooling structure 22 visible, noticeable. There are also electrical connections 14 at the side of the heat sink module 1 for electrical contacting of the electronic module 8A visible, noticeable.

3 shows a section through a stack of three heat sink modules 1 , These are essentially analogous to the heat sink modules 1 out 1 and 2 executed.

In the stack are here first pages A each on second pages B the heat sink modules 1 stacked. As a result, the first cooling surfaces are in the stack 6 one of the heat sink modules 1 the second cooling surfaces 7 of the heatsink module stacked thereon 1 opposite and form a passage for cooling medium. In the distance X between the opposite cooling surfaces 6 . 7 two heat sink modules 1 , ie within the passage for the cooling medium, is the cooling structure 22 arranged.

For a free exchange of cooling medium between the first and second cooling surface 6 . 7 (and thereby between the heat sink modules 1 in the stack), have the heat sink modules 1 within the respective housing 11 a first pass 12 for the cooling medium of one of the two cooling surfaces 6 . 7 of the heat sink module 1 to the other of the two cooling surfaces 6 . 7 of the heat sink module 1 on.

In addition, the heat sink modules have 1 a second passage 13 for the cooling medium of one of the two cooling surfaces 6 . 7 of the heat sink module 1 to the other of the two cooling surfaces 6 . 7 of the heat sink module 1 inside the case 11 on. The two passes 12 . 13 are here at opposite ends of the cooling surfaces 6 . 7 arranged. This allows cooling medium through the first passage 12 to the two cooling surfaces 6 . 7 get past them and through the second passage 13 be discharged again.

The heat sink modules 1 are arranged in the stack so that the first and second passes 12 . 13 are arranged one behind the other, ie in series with each other (see, for example 2 ). This forms the first passages 12 together a distribution channel. The second passes 13 together form a collector channel.

Above is the stack through a housing module 2 completed in the form of a dense cover plate. Below is the stack through another housing module 3 completed. This housing module 3 has at least one inlet 4 and a process 5 for a cooling medium, for supplying and discharging cooling medium to the individual heat sink modules 1 ,

An alternative stack of heat sink modules 1 has more or less such heat sink modules 1 on. In addition, in the stack no or other housing modules 2 . 3 be provided.

The one through the passages 12 formed distribution channel is at the inlet 4 connected. As a result, cooling medium can be supplied to the distribution channel. The through the passages 13 formed collector channel is at the outlet 5 connected. As a result, cooling medium can be removed from the collector channel. Thus, simply a cooling circuit for the heat sink modules 1 be generated in the stack.

4 shows a three-dimensional partial view of a section through a stack of three heat sink modules 1 , analogous to 3 is trained. The individual heat sink modules 1 So correspond to the one out 3 , The explanations for this apply accordingly also for the embodiment according to 4 ,

According to 4 are the individual heatsink modules 1 so stacked together that at least the passages 12 arranged in a row (comparable to the stacks in 2 and 3 ). The passages 12 thereby form a common distribution channel.

According to 4 it is now provided that in the distribution channel a flow guiding means 17 is arranged. This serves to a certain proportion of the flow of the cooling medium in the distribution channel to the opposite cooling surfaces 6 . 7 to direct. The flow guide means 17 has correspondingly shaped noses or ribs 17A , A corresponding flow guiding means may optionally be in the through the passages 13 be formed collector channel formed. This then serves to that of the cooling surfaces 6 . 7 in the collector channel flowing cooling medium in the right direction to steer.

In the present case is the flow guiding means 17 exemplified as an independent component (for example, an insert), which extends over several of the heat sink modules 1 extends in the stack. This is attached to the stack in a suitable manner. Alternatively, the heat sink modules 1 in each case via a corresponding flow guiding means 17 feature. This can be a corresponding nose or rib 17A on the housing 11 in the area of the respective passage 12 . 13 be arranged. This can be an independent component or a part of the housing 11 ,

Analogously designed flow guidance means 17 . 17A can basically in all heat sink modules shown in the figures 1 or heatsink module stacks are used.

In 4 For example, various portions of the flow of the cooling medium are shown as arrows. It can be seen that the further flow guidance means 17 a certain proportion towards the cooling surfaces 6 . 7 directs. The thickness of the arrows represents the volume flow rate of the flow that flows in the respective direction.

As in 4 is clearly visible, the housing can 11 the heat sink modules 1 be formed at least in two parts. On the first housing part 11A is the first page A and the first cooling surface 6 educated. And on the second housing part 11B is the second page B and the second cooling surface 7 educated. In the area of the parting plane between the two housing parts 11A . 11B can be complementary grooves 15 and feathers 16 be provided.

5 shows a three-dimensional view of a two-part heat sink module 1 , The two parts 11A and 11B are separated from each other for better intuition. This provides a view of complementary grooves provided therefor 15 and feathers 16 free. These each surround the passages 12 and 13 , As a result, they can be sealed well. Analogously, the in 1 to 4 shown heat sink modules 1 be educated.

In addition, the parts have 11A and 11B each have a recess for receiving the electronic component 8A , Each of the parts 11A and 11B therefore has a job 8th for arranging the electronic component 8A , These recesses form in the assembled state of the heat sink module 1 an opening extending from a side surface of the heat sink module 1 extends to the opposite other side surface.

Otherwise, the embodiment of the heat sink module corresponds 1 in 5 of those 2 . 3 or 4 , The explanations for this apply accordingly also for the embodiment according to 5 ,

From each of the heat sink modules shown in the figures 1 can by arranging an electronic component 8A to the appropriate place 8th an electronic module 1 be generated.

6 shows a motor vehicle drive train, comprising an electric motor 18 as a traction drive and an inverter 19 for electrical energization of the electric motor 18 , In the electric motor 18 in particular, it may be an induction machine, such as a synchronous or asynchronous machine. The electric machine 18 is via phase lines with alternating current from the inverter 19 provided. The inverter 19 draws the necessary electrical energy via DC lines from an electrical energy storage 20 , such as from an accumulator or capacitor. The electrical energy storage 20 thus supplies a direct current. This one is from the inverter 19 in alternating current for the electric motor 18 changed. The electric machine 18 then drives, for example, vehicle wheels 21 at.

The inverter 19 is present from a stack of electronic modules 1 built up. These are heat sink modules 1 used with appropriate electronic components. The inverter 19 for example, a stack of heatsink modules 1 according to one of 1 . 2 . 3 . 4 . 5 have or be constructed with it. The axial ends of the stack can, as in 3 visible, from housing modules 2 . 3 be formed.

LIST OF REFERENCE NUMBERS

1

Heat sink module

1'

Device for cooling electronic components

2

housing module

3

housing module

4

Intake

5

procedure

6

cooling surface

7

cooling surface

8th

Job

8A

electronic component

11

Housing, frame

11A

Part of the housing / frame 11

11B

Part of the housing / frame 11

12

passage

13

passage

14

electrical connection

15

groove

16

feather

17

Flow guide means

17A

Nose, rib

18

E-machine

19

inverter

20

energy storage

21

vehicle

22

cooling structure

A

Side, top

B

Side, bottom

H

height

O

Direction above a heat sink module 1, axial direction

U

Direction below a heat sink module 1, axial direction

S

lateral direction

X

distance

QUOTES INCLUDE IN THE DESCRIPTION

This list of the documents listed by the applicant has been generated automatically and is included solely for the better information of the reader. The list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions.

Cited patent literature

• EP 2019429 A1 [0003]
• DE 102016223889 [0004]

Claims (11)

Device (1 ') for cooling electronic components (8A), comprising a first side (A) having a first cooling surface (6) for delivering heat of an electronic component (8A) to a cooling medium, and a second side (B) having a second cooling surface (7) for emitting heat of an electronic component (8A) to the cooling medium, wherein the two sides (A, B) are arranged opposite one another so that the two cooling surfaces (6, 7) face one another at a distance (X) to form a passage for the cooling medium, wherein within the distance (X) and on the two cooling surfaces (6, 7), a flexible cooling structure (22) is arranged. Heatsink module (1) for forming a device according to Claim 1 comprising a first cooling surface (6) on a first side (A) of the heat sink module (1), and a second cooling surface (7) on a second side (B) of the heat sink module (1) opposite the first side (A), and a Position (8) for arranging at least one electronic component (8A) between the two cooling surfaces (6, 7) of the heat sink module (1), so that the electronic component (8A) can deliver heat to these two cooling surfaces (6, 7), wherein at least one the two cooling surfaces (6, 7) a flexible cooling structure (22) is arranged Device (1 ') after Claim 1 or heat sink module (1) after Claim 2 wherein the cooling structure (22) is made of sheet metal. Device (1 ') after Claim 1 or heat sink module (1) after Claim 2 wherein the cooling structure (22) is formed by a stamped part. Device (1 ') after Claim 1 or heat sink module (1) after Claim 2 wherein the cooling structure (22) is attached to at least one of the two cooling surfaces (6, 7). Device (1 ') after Claim 1 or heat sink module (1) after Claim 2 , wherein the cooling structure (22) consists of several rows of meandering material strips. Device (1 ') after Claim 1 or heat sink module (22) after Claim 2 in which the first side (A) has a first housing part (11A) which • extends in the direction of the first side (A) and • projects beyond the first cooling surface (6) in the direction of the first side (A); B) has a second housing part (11B) which • extends in the direction of the second side (B) and • projects beyond the second cooling surface (7) in the direction of the second side (B), the two housing parts (11A, 11B) abutting one another are arranged. Heat sink module (1) after Claim 2 wherein the heat sink module (1) is designed to be provided with at least one further module (1, 2, 3), in particular a housing module (2, 3) or a similar or identical heat sink module (1), by arranging this further module (1, 2, 3) optionally to be stacked on the first or second side (A, B). Electronic module, at least comprising a heat sink module (1) according to one of the preceding Claims 1 to 8th , wherein this heat sink module (1) has at least one electrical half-bridge with a first and a second power semiconductor as electronic components (8A). Inverter (19) for the electrical energization of an electric motor (18), characterized by a plurality of stacked electronic modules according to Claim 8 , Motor vehicle drive train with an electric motor (18) as traction drive, characterized by an inverter (19) according to Claim 9 for electrical energization of the electric motor (18).

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