DE102017214486A1 - Stackable heat sink module - Google Patents

Abstract

A heat sink module (1) is proposed, comprising at least a first cooling surface (6) on a first side (A) of the heat sink module (1) and a second side (B) of the heat sink module (1), and a location (8) for arranging at least one electronic component (8A) between the two sides (A, B), so that the electronic component (8A) can deliver heat to the first cooling surface (6), and a first passage (12) for guiding a flow of a cooling medium from one of the two Sides (A, B) to the other of the two sides (A, B), and a housing (11) which forms a lateral (S) boundary of the first cooling surface (6) and the first passage (12) and these laterally (S ), wherein the heat sink module (1) with the housing (11) is formed with at least one further module (1, 2, 3), in particular a housing module (2, 3) or a similar or identical heat sink module (1), by arrangement of this further module (1, 2, 3) optionally on the first or second side (A, B) to be stacked, wherein a flow guiding means (17) is provided in the first passage (12) so as to be a part of the flow of the cooling medium from the first passage (12) to the first cooling surface (6) directs.

Description

The invention relates to a heat sink module for cooling an electronic component, a heat sink module stack, an electronics module, an inverter and a motor vehicle drive train.

Stackable electronic modules are known which are each arranged on an external cooling plate. There are also superimposed electronics modules known, which are arranged together in a common housing. From such modules, an inverter can be constructed, which can be used for example for the electrical energization of an electric motor of a motor vehicle.

From the EP 2 019 429 A1 a module for power electronics is known, which allows a cooling over two opposite cooling surfaces of the module. The module itself is not stackable.

In the non-pre-published DE 10 2016 223 889.2 The Applicant proposes a stackable electronic module.

The object of the present invention is to improve the state of the art.

This object is achieved by the features specified in the main claims. Preferred embodiments thereof are the dependent claims.

Accordingly, it is proposed: a heat sink module, a heat sink module stack, an electronics module, an inverter and a motor vehicle drive train.

The proposed heat sink module has at least a first cooling surface on a first side of the heat sink module and a second side. The two sides are facing each other in particular. In particular, one of the two sides forms an upper side of the heat sink module and the other of the two sides forms an underside of the heat sink module.

The proposed heat sink module also has a location for arranging at least one electronic component between the two sides, so that the electronic component can deliver heat to the first cooling surface. As a result, the electronic component is coolable. It is also possible to provide a plurality of such locations for a plurality of electronic components between the two sides. As a result, complex electrical circuits can be cooled with the heat sink module.

The cooling surface in particular has a cooling structure with a plurality of projections. This increases the area for dissipating heat from the electronic component. In particular, more than two and in particular more than ten and in particular more than one hundred protrusions are understood to mean a plurality.

Under a projection is understood in particular a material increase starting from a ground plane of the respective cooling surface. Such a projection may in particular be a pin or a rib or a honeycomb. Such a projection projects in the direction of the respective side of the heat sink module from the cooling surface. In particular, such a projection is perpendicular from the ground plane of the respective cooling surface. Such a projection can be formed from solid material of the heat sink module.

For example, the heat sink module may be formed with the protrusions by a pressing process such as a cold pressing process. Alternatively, such a projection or a plurality of such projections may be formed by a cooling surface part arranged on a main body of the heat sink module. Such a projection is in particular significantly larger in comparison to a production-related surface roughness of the respective cooling surface.

The proposed heat sink module also has a first passage for guiding a flow of a cooling medium from one of the two sides to the other of the two sides.

And there is provided a housing which forms a lateral boundary of the first cooling surface and the first passage and encloses this laterally.

• • ein Gehäusemodul, oder
• • ein gleichartig zum vorgeschlagenen Kühlkörpermodul ausgeführtes Modul, oder
• • ein identisch zu dem vorgeschlagenen Kühlkörpermodul ausgeführtes Modul.

The proposed heat sink module is also formed with the housing to be able to be stacked with at least one other module by arranging this further module either on the first or second side. Such a further module is in particular

• • a housing module, or
• A module similar to the proposed heat sink module, or
• A module designed identically to the proposed heat sink module.

By arranging a plurality of such modules to form a module stack, it is thus possible to construct complex electrical circuits that are also easy to cool.

In particular, this means that the heat sink module is designed to be stacked with the other module of choice to the first page or the second page. Thus, the further module can thus be arranged, if necessary, both on the first side, as well as on the second side. Both sides of the heat sink module are therefore equally suitable for arranging the further module thereto.

In the proposed heat sink module, a flow guiding means is provided in the first passage so as to direct a part of the flow of the cooling medium from the first passage to the first cooling surface.

As a result, a certain proportion of the flow of the cooling medium is directed out of the first passage in the direction of the first cooling surface. The volume flow of coolant flowing over the first cooling surface is thus increased. The cooling effect therefore increases.

By the execution of the flow-guiding means, the proportion of the total flow of the cooling medium in the passage can be determined, which is to be directed to the first cooling surface. Thus, the electronic component can be cooled as needed.

In addition, it is possible by a corresponding embodiment of the flow-guiding means to divert different portions of the flow of the cooling medium to different areas of the first cooling surface. Thus, the cooling of the cooling surface can be improved where a lot of heat must be dissipated.

The flow guiding means in particular has a nose or a rib for the corresponding steering of the flow of the cooling medium, or it forms such a nose or rib.

An embodiment of the proposed heat sink module has a second cooling surface on the second side of the heat sink module. The location for arranging the electronic component is in this case arranged so that the electronic component can deliver heat to both the first cooling surface, as well as to the second cooling surface. Thus, the available total cooling surface can be significantly increased. In particular, the location for arranging the electronic component is located between the first and second cooling surfaces.

A further embodiment of the proposed heat sink module has a second passage for guiding the flow of the cooling medium from one of the two sides to the other of the two sides. The two passages are arranged at opposite ends of the cooling surfaces. Thus, the cooling medium can be led from one of the two passages and flow over the respective cooling surface and be discharged from the other of the two passages. In other words, the passages thus serve to pass the cooling medium through the heat sink module and past the cooling surface (s).

The housing of the heat sink module forms in particular a lateral boundary of both cooling surfaces. The housing thus forms a lateral boundary of the first passage and the second passage. The housing thus encloses the two passages and the one or more cooling surfaces.

Another embodiment of the proposed heat sink module, the flow guiding means is arranged on the housing adjacent to the first and / or the second passage. In this case, the flow guiding means either forms part of the housing or forms an independent component.

In the proposed heat sink module, the cooling structures of the two cooling surfaces may be formed at least partially complementary to each other.

• • ein Bereich der ersten Kühlfläche oder die komplette erste Kühlfläche komplementär zu
• • einem (gegenüberliegenden) Bereich der zweiten Kühlfläche oder der kompletten zweiten Kühlfläche

ausgebildet ist.That means that at least

• • an area of the first cooling surface or the complete first cooling surface complementary to
• • one (opposite) area of the second cooling surface or the complete second cooling surface

is trained.

This applies in particular with regard to the projections of the two cooling surfaces. In regions, it should be understood that the two cooling surfaces each have at least one region that is designed to be complementary.

In the proposed heat sink module has the advantage that the projections of two identical and stacked heat sink modules can interlock by the complementary design of the cooling structures, without that they are in a disturbing manner to each other.

The end faces of the projections in a stack of identical heat sink modules are either laterally past each other by this complementary design or the projections are dimensioned in height so that their end faces can not abut each other and that no continuous bypass over the entire length of the respective cooling surface for gives a cooling medium.

This therefore means, in particular, that projections of one of the two cooling surfaces of the heat sink module are arranged laterally or in their height offset from (opposite) projections of the other of the two cooling surfaces of the heat sink module, at least in a region of the cooling surfaces. Alternatively or additionally, at least in a region of the cooling surfaces, projections of one of the two cooling surfaces of the heat sink module differ in their height from (opposite) projections of the other of the two cooling surfaces of the heat sink module. This may apply to all or only some of the protrusions of the two cooling surfaces.

The electronic component for the arrangement between the cooling surfaces of the heat sink module is in particular a heat-dissipating electronic component during operation. This may in particular be a power electronic component, such as in particular a power semiconductor, such as an IGBT (bipolar transistor with insulated gate electrode) or a MOSFET (metal oxide semiconductor field effect transistor). Alternatively or additionally, the electronic component can also be an electrical ohmic resistance and / or an electrical inductance and / or an electrical capacitance. In particular, the electronic component may be a chip or a printed circuit board or the like, with one or more electrical components arranged thereon or therein.

The first and / or second cooling surface of the heat sink module can be arranged so that they are perpendicular to the stacking direction (= axial direction of the heat sink module), ie perpendicular to the direction in which the modules are stackable. Thus, the cooling surfaces of stacked, identical heat sink modules are always parallel to each other. Alternatively, however, the first and / or second cooling surface may also be inclined to the stacking direction. This can result in an improved flow of cooling medium.

The two cooling surfaces of the heat sink module can be arranged so that they are parallel to each other. Alternatively, they can also be inclined to each other. The two cooling surfaces may also each have a convex or concave shape. As a result, more space for the electronic component between the two cooling surfaces of the heat sink module can be created at a suitable location.

In particular, the first passage and (if present) the second passage may be arranged on the heat sink module such that when stacking two or more identical heat sink modules, first passages of these heat sink modules are arranged in a row and, on the other hand, if present, the second passages these heat sink modules are arranged in a row. Thereby, the one passages may collectively form a manifold (distribution channel) for leading cooling medium to the cooling surfaces of the stacked heat sink modules. The other passages may collectively form a collector (header channel) to remove cooling medium from the cooling surfaces of the stacked heatsink modules.

• • die erste Kühlfläche und, falls vorhanden, die zweite Kühlfläche und
• • der erste Durchgang, und falls vorhanden der zweite Durchgang angeordnet sind.

The housing may be formed in particular frame-shaped or as a frame within which

• • the first cooling surface and, if present, the second cooling surface and
• • the first passage, and if present the second passage are arranged.

As a result, a dense wall can be formed laterally of the cooling surface by means of the housing, in order to guide cooling medium over the cooling surface. Above the respective cooling surface, the housing can then be open. Thus, when two identical heatsink modules are stacked, the two associated housings can abut one another and form a lateral seal for one of the cooling media in the passages and on the cooling surfaces of the two heatsink modules. The first side of the one heat sink module lies in the stack directly opposite the second side of the further heat sink module stacked thereon. Through the passages of the heat sink modules, the cooling medium can then be easily guided to the cooling surfaces of the heat sink modules in the stack and also led away.

The housing accordingly forms a conclusion for the cooling medium laterally to the cooling surface. In the direction of the side of the cooling surfaces, the housing is thus made tight, so that the cooling medium there can not escape uncontrollably or unintentionally in an environment. However, it is optionally possible to provide targeted supply and discharge lines of cooling medium at the side of the housing in order to supply or discharge cooling medium to the heat sink module, that is to its cooling surfaces.

So that further modules can be stacked on the heat sink module, the housing is designed accordingly. In particular, the housing has in the direction of the first and the second side of the heat sink module via corresponding interfaces, such as in particular mutually corresponding sealing surfaces, grooves, springs (for a tongue and groove connection) or beads. This makes it possible for an identical or similar heat sink module to be stacked on the heat sink module. However, compatible housing modules or manifolds can also be used on the heat sink module other modules are put on. Housing modules have even no electronic components and serve, for example, only to extend the module stack or for targeted flow control of the cooling medium or for supply or removal of cooling medium or for suspension / storage of the stack.

These measures provide a flexible heat sink module which can be expanded by any number of further modules, in particular identical or similar heat sink modules. At the same time no separate housing is needed for a module stack created with it. In other words, the proposed measures result in a stackability of the heat sink module in the axial direction (in the direction of the first and second sides of the heat sink module) and lateral sealing for the cooling medium (laterally to the cooling surface, laterally to the heat sink module).

The upper and the lower end of a module stack can in particular form housing modules whose upper side or lower side are substantially closed. Such a housing module may form a termination plate which is placed on an axial end of the stack like a normal module.

• • dem Gehäuse angrenzend zu einer der Kühlflächen, oder
• • an Vorsprüngen einer der Kühlflächen

angeordnet sein. Dadurch kann die Strömungsrichtung innerhalb des Kühlkörpermoduls bedarfsweise gelenkt werden, beispielsweise hin zu einer der Kühlflächen oder hinweg von einer der Kühlflächen. Außerdem kann dadurch ein Bypass für das Kühlmedium geschlossen oder dessen Auswirkung vermindert werden. Außerdem können dadurch vorteilhafte Turbulenzen in die Strömung des Kühlmediums eingebracht werden, wodurch dessen Wärmeaufnahme verbessert wird.The heat sink module preferably has at least one further flow guidance means for guiding a cooling medium within the heat sink module. The further flow-guiding means can thereby

• • the housing adjacent to one of the cooling surfaces, or
• • on protrusions of one of the cooling surfaces

be arranged. As a result, the flow direction within the heat sink module can be directed as required, for example, toward one of the cooling surfaces or away from one of the cooling surfaces. In addition, it can be closed by a bypass for the cooling medium or its effect can be reduced. In addition, advantageous turbulence can be introduced into the flow of the cooling medium, whereby its heat absorption is improved.

The further flow-guiding means can also form an independent component which is suitably fastened to the corresponding part of the heat-sink module, for example on the housing. Or the further flow-guiding means may form an integral part of the corresponding part of the heat sink module, so be formed integrally therewith. In the latter case, the further flow guidance means can in particular form a flow guidance contour, which is formed on the corresponding part of the heat sink module. Such a flow guidance contour can also be referred to as an interference contour.

The further flow guidance means can also, for example, form a special shape, such as a nose or rib, which protrudes in order to direct the cooling medium flowing past it in a specific direction.

The further flow guidance means can be embodied as an independent component in particular in a flexible and / or heat-conducting manner. Such a flow guiding means may for example consist of sheet metal. Such a flow guiding means may also consist of a plastic.

In a further possible embodiment of the heat sink module, the heat sink module is designed at least in two parts. In this case, the first part of the heat sink module on the first cooling surface and it forms the first side of the heat sink module. The second part of the heat sink module then has the second cooling surface and forms the second side of the heat sink module. The first part and / or the second part of the heat sink module then have a surface for arranging the electronic component thereon. For example, the electronic component may be soldered or sintered or adhesively bonded or screwed onto this surface, or cast on it with casting compound or otherwise attached thereto. The two parts can, with the exception of the arrangement of the projections on the two cooling surfaces (cooling structure), be identical or mirror-image to each other.

Preferably, one of the two parts of the heat sink module has at least one groove, and the other of the two parts of the heat sink module has at least one spring corresponding thereto. Tongue and groove are intermeshing when the two parts are joined to the heat sink module. As a result, sealing of the electronic component arranged between the two parts can be improved.

In particular, the groove and the associated spring surround the location for arranging the at least one electronic component. Alternatively or additionally, the groove and the associated spring surround the first passage and / or the second passage of the heat sink module. In particular, a sealant, such as a sealant or an O-ring or a cord seal is inserted into the groove.

Preferably, the housing of the heat sink module has laterally to the cooling surfaces at least over an opening for electrical contacting of the electronic component from outside the Housing. As a result, the electrical contacting of the electronic component can be done easily. Preferably, the electronic component is completely contactable via this at least one opening. That is, there is no need for contacts elsewhere in the electronic component. Alternatively or additionally, however, the electrical contacting of the electronic component can take place completely or partially through an electrical interface in the housing to form a further module stacked on the heat sink module.

Preferably, the electronic component is cast by means of casting compound with the heat sink module. In particular, the electronic component with the casting compound is sealed tightly against the cooling medium. Thus, simply a tightness of the electronic component relative to the cooling medium can be effected. The casting compound is preferably a duroplastic, in particular a resin. The casting compound can be cast by injection molding or low pressure casting, for example, or by other suitable means with the heat sink module. Thus, the electronic component is also vibration resistant and electrically isolated connected to the heat sink module. The casting compound can then itself form part of the heat sink module.

The electronic component can be arranged in a depression of the heat sink module. The electronic component may then be placed in the recess on the heat sink module and secured thereto. The electronic component can also be arranged in an opening running parallel to the cooling surfaces in the heat sink module. In particular, it can then be inserted into the heat sink module and its housing. Thus, it can be easily contacted by a side surface of the housing. Here, the opening may extend from a side surface of the housing to the cooling surfaces.

The opening for insertion or placement of the electronic component may also extend from one side surface of the housing through the heat sink to an opposite other side surface of the housing. The electronic component is then in particular pushed through the housing or arranged therein so that it can be electrically contacted by both side surfaces of the housing. Such an opening can be easily made, for example by milling or drilling.

The heat sink module may have a breakthrough from said opening for insertion of the electronic component into the interior of the housing. Thus, a direct contact between the electronic component in the heat sink module and the heat sink module flowing through the cooling medium can be produced. This can improve the cooling of the electronic component.

It is noted that the heat sink module and in particular its housing may consist wholly or partly of a highly thermally conductive metal, such as iron or aluminum or copper or silver (this also includes Fe or Al or Cu or Ag alloys). As a result, heat can be dissipated well from the electronic component.

The heat sink module can also consist at least partially of a plastic or of a ceramic. In particular, the heat sink module may consist of several materials, such as at least one metal part and at least one plastic part.

The proposed heatsink module stack has at least two or more of the proposed heatsink modules. Here, the first side of one of the heat sink modules abuts on the second side of the other of the heat sink modules. In other words, the two modules are stacked with said sides one on top of the other. The heat sink modules are in this case arranged so that at least the first passages of the heat sink modules are arranged in a row, so that the distribution channel is formed for the cooling medium. In the distribution channel, the flow guide means is now arranged as an independent component so that it directs a part of the flow of the cooling medium from the distribution channel to the first cooling surface.

In this case, the flow guidance means can extend in particular over a plurality of the heat sink modules in the stack. In particular, it may extend over part of the heatsink module stack or over the entire heatsink module stack. A comparable flow-guiding means may be arranged in the collector channel in order to direct the cooling medium flowing from the cooling surface into the collector channel in the right direction in the collector channel.

In such a heat sink module stack, the above-mentioned further flow guidance means may be arranged on some or all of the projections. The further flow-guiding means can then form a separate component. It can serve to guide the cooling medium in the cooling section between opposite cooling surfaces of two heat sink modules. As a result, the flow of the cooling medium in the cooling section can be targeted. In particular, the further flow guidance means may have one or more so-called turbulators. This is in each case a shaping, for example a recess or indentation, of the flow guidance means for the targeted generation of turbulence in the flow of the cooling medium. As a result, the heat dissipation is improved by the cooling medium.

Alternatively or additionally, the further flow guidance means can also be arranged between some or all of the opposite projections of the stacked heat sink modules. In other words, the flow guiding means is then arranged between the end faces of these opposing projections. In particular, the end faces of these projections then rest against the further flow guidance means from opposite sides. As a result, a bypass for the cooling medium between these end faces of the projections can be closed in a simple manner. This improves the cooling effect of the cooling medium because the bypass is closed.

It is preferably provided that the heat sink module has one or more electronic components for forming an inverter. By means of an inverter, a direct current can be converted into an alternating current and / or vice versa.

The proposed electronic module therefore has at least one proposed heat sink module. This heat sink module then has at least one electrical half-bridge with a first and a second power semiconductor as electronic components.

In particular, the electronic module has a high-side power semiconductor and a low-side power semiconductor, in particular one IGBT or MOSFET each. For example, an electrical full bridge can then be formed from a plurality of identical or comparable electronic modules. For example, with three such electronic modules, which are then preferably stacked directly on one another, a B6 inverter can be formed.

The proposed inverter for electrical energization of an electric motor therefore has several such proposed electronic modules stacked. For example, the electronic modules can be stacked directly on top of each other. As explained, for example, a B6 inverter may be formed by a stack of three such electronic modules. Such an inverter can be constructed inexpensively by the simple mass manufacturability of such electronic modules. The use of additional cooling structures can be omitted. In addition, such an inverter is easily scalable, since any number of modules can be stacked on top of each other.

The also proposed motor vehicle drive train has an electric motor as a traction drive. The electric motor thus serves for vehicle propulsion or vehicle deceleration. During the vehicle deceleration, the electric motor and the inverter preferably operate as generators and charge the battery. The powertrain may therefore serve for a purely electric powered electric vehicle, or it may be used with an internal combustion engine for a hybrid vehicle. The motor vehicle drive train is characterized by the proposed inverter for electrical energization of the electric motor. Thus, as explained, the inverter has a stack of several of the proposed electronic modules. Under such an electric current supply is both a supply of electric currents to understand the electric motor, as well as a discharge of electrical currents from the electric motor.

• 1 eine Schnittdarstellung durch einen Stapel Kühlkörpermodule,
• 2 eine dreidimensionale Schnittdarstellung durch einen Stapel Kühlkörpermodule,
• 3 mehrere übereinander angeordnete Kühlkörpermodule,
• 4 mehrere übereinander angeordnete Kühlkörpermodule,
• 5 eine dreidimensionale Ansicht eines Kühlkörpermoduls,
• 6 eine Schnittdarstellung durch ein Kühlkörpermodul,
• 7 eine Schnittdarstellung durch ein Kühlkörpermodul,
• 8 eine dreidimensionale Ansicht eines Kühlkörpermoduls,
• 9 eine dreidimensionale Schnittdarstellung durch einen Stapel Kühlkörpermodule,
• 10 eine dreidimensionale Ansicht eines Kühlkörpermoduls,
• 11 einen Kraftfahrzeugantriebsstrang.

In the following the invention will be explained in more detail with reference to figures, from which further preferred embodiments and features of the invention can be removed. In each case show in a schematic representation:

• 1 a sectional view through a stack of heat sink modules,
• 2 a three-dimensional sectional view through a stack of heat sink modules,
• 3 several superposed heat sink modules,
• 4 several superposed heat sink modules,
• 5 a three-dimensional view of a heat sink module,
• 6 a sectional view through a heat sink module,
• 7 a sectional view through a heat sink module,
• 8th a three-dimensional view of a heat sink module,
• 9 a three-dimensional sectional view through a stack of heat sink modules,
• 10 a three-dimensional view of a heat sink module,
• 11 a motor vehicle powertrain.

In the figures, identical or at least functionally identical elements are provided with the same reference numerals.

1 shows an exemplary stack of three identical heat sink modules 1 , Above is the stack through a housing module 2 completed in the form of a dense cover plate. Below is the stack through another housing module 3 completed. This housing module 3 has at least one inlet 4 and a process 5 for a cooling medium, for supplying and discharging cooling medium to the individual heat sink modules 1 ,

An alternative stack of heat sink modules 1 has more or less such heat sink modules 1 on. In addition, in the stack no or other housing modules 2 . 3 be provided.

The heat sink module 1 has a first cooling surface 6 on a first page A of the heat sink module 1 , For example, a top. And the heatsink module 1 has an optional second cooling surface 7 on a second page B of the heat sink module 1 , for example, a bottom. In the stack here are the first pages A the heat sink modules 1 each on second pages B the heat sink modules 1 stacked. As a result, the first cooling surfaces are in the stack 6 one of the heat sink modules 1 the second cooling surfaces of the heatsink module stacked thereon 1 across from.

There is also a job 8th for arranging at least one electronic component 8A between the two cooling surfaces 6 . 7 intended. By arranging the electronic component 8A to the heat sink module 1 can be an electronics module 1' be formed (see 3 and 4 ). The spot 8th is chosen so that the electronic component 8A to both cooling surfaces 6 . 7 Can give off heat. The spot 8th is exemplified by a side of the heat sink module 1 accessible opening or depression formed. In this opening or recess, the electronic component 8A be inserted or inserted. In particular, the electronic component 8A attached to it. This can be done, for example, to the heat sink module 1 soldered or welded. It may alternatively or additionally also with the heat sink module 1 Casting by casting.

The electronic component 8A In particular, it may comprise one or more power semiconductors, such as an IGBT or MOSFET. The electronic component 8A In particular, it may comprise a printed circuit board (PCB) or a ceramic substrate on which one or more power semiconductors are arranged. The electronic component 8A may form an electrical half-bridge with at least two power semiconductors.

The two cooling surfaces 6 . 7 each have a cooling structure with a plurality of protrusions. These cooling structures are formed in the figures by way of example by so-called pin-fin structures, also called pin cooler. The projections are thus formed by individual pins. However, other designs for the cooling structures are possible. For example, optionally or alternatively also rib and / or honeycomb structures can be used. Some or all of the protrusions are then formed accordingly by ribs or honeycombs.

The projections have a certain height H on. The height here is the distance between a ground plane of the associated cooling surface 6 . 7 and the apex or end face of the projection.

The cooling surfaces 6 . 7 are flowed around by cooling medium. As a result, they can give off heat or absorb heat. Depending on the design, the cooling surface 6 . 7 thus serve to dissipate heat to the cooling medium or for heat absorption from the cooling medium. In the latter case, the cooling surface is used 6 . 7 So for cooling the cooling medium.

In the 1 shown heat sink modules 1 each have a housing 11 , This case 11 encloses the two cooling surfaces 6 . 7 laterally. It thus forms a lateral boundary of the two cooling surfaces 6 . 7 , The housing 11 thus prevents accidental leakage of cooling medium laterally to the cooling surfaces 6 . 7 , Towards the first and second pages A . B is the case 11 however open. Thus, cooling medium in the direction of the first and second side A . B from the single case 11 escape. Accordingly, the cooling medium in the heat sink module stack between the individual heat sink modules 1 flow through or circulate.

The housing 11 is exemplified frame-shaped. Inside the frame are the cooling surfaces 6 . 7 arranged, as well as the intermediate point 8th for arranging the electronic module. The housing 11 is thus formed substantially rectangular. However, other shapes are possible, such as a round or oval shape.

In the present case, passage openings are provided in the region of the outer corners of the rectangular shape. Through each of these, a screw or a bolt can be made to the stacked modules 1 . 2 . 3 to tense each other. However, there are alternative ways to use the modules 1 . 2 . 3 firmly together.

For a free exchange of cooling medium between the first and second cooling surface 6 . 7 (and thereby between the heat sink modules 1 in the stack), has the heat sink module 1 inside the case 11 a first pass 12 for a cooling medium from one of the two cooling surfaces 6 . 7 to the other of the two cooling surfaces 6 . 7 on. In addition, the heat sink module has 1 a second passage 13 for the cooling medium of one of the two cooling surfaces 6 . 7 to the other of the two cooling surfaces 6 . 7 inside the case 11 on. The two passes 12 . 13 are here at opposite ends of the cooling surfaces 6 . 7 arranged. This allows cooling medium through the first passage 12 to the two cooling surfaces 6 . 7 get past them and through the second passage 13 be discharged again.

The heat sink modules 1 in the stack are arranged so that the first and second passes 12 . 13 are arranged one behind the other, ie in series with each other (see, for example 2 ). This forms the first passages 12 together a distribution channel. The second passes 13 together form a collector channel. The distribution channel is at the inlet 4 connected. As a result, cooling medium can be supplied to the distribution channel. The collector channel is at the outlet 5 connected. As a result, cooling medium can be removed from the collector channel. Thus, simply a cooling circuit for the heat sink modules 1 be generated in the stack.

The heat sink modules 1 with the respective housings 11 are each designed to be with another module, in particular the housing modules 2 . 3 or similar or identical heat sink modules 1 to be stacked. These are the two sides A . B of the heat sink module 1 equally for placing the further module thereon 1 . 2 . 3 educated. In particular, the two sides A . B a heat sink module 1 , in particular in the area of the housing 11 formed complementary to each other. For example, corresponding grooves or springs on the sides A . B be educated. For example, according to 2 the first page A on the housing 11 a feather 9 on, and the second page B indicates the housing 11 one with the spring 9 complementary groove 10 on. In the groove 10 For example, a sealant such as an o-ring or cord seal or sealant may be incorporated.

In particular, the pages form A . B of the heat sink module 1 (of the housing 11 ) Sealing surfaces. The two cooling surfaces 6 . 7 are exemplary parallel to these sealing surfaces and thus also parallel to each other. Thus lie the cooling surfaces 6 . 7 in a stack of identical heat sink modules 1 always parallel to each other.

It is alternatively possible, the cooling surface 6 . 7 To perform angled to the sealing surfaces. It is alternatively possible, the cooling surface 6 . 7 to perform angled to each other. It is also possible that one or both of the cooling surfaces 6 . 7 are convex or concave.

For a better understanding of the directions are exemplary in 1 the directions "below and above the heat sink module 1" (= axial directions) and the direction "laterally" shown by arrows. Here, U = means below the heat sink module 1 and O = above the heat sink module 1 and S = laterally. In the other figures, this applies accordingly.

The cooling structures of the two cooling surfaces 6 . 7 a heat sink module 1 are optionally at least partially complementary to each other. These are projections of these cooling surfaces 6 . 7 executed complementary to each other. This can be effected by opposing projections of the two cooling surfaces 6 . 7 a heat sink module 1 in their height H offset from each other or are different heights H exhibit. Alternatively or additionally, opposite projections of the two cooling surfaces 6 . 7 a heat sink module 1 be laterally offset from each other.

So that means a head start on the first page A of the heat sink module 1 offset laterally or in height to the opposite projection on the second side B of the heat sink module 1 is. Or it means having a head start on the first page A of the heat sink module 1 different height to the opposite projection on the second side B of the heat sink module 1 is.

According to the in 1 illustrated embodiment, the projections of the first cooling surface 6 of the heat sink module 1 opposite the projections of the opposite second cooling surface 7 of the heat sink module 1 laterally offset.

This results in that in the stack of identical heat sink modules 1 the opposite projections of the abutting heat sink modules 1 reaching past each other - or in other words: the projections are pointing past each other. The projections of the first cooling surface 6 fit into spaces between the projections of the second cooling surface 7 and vice versa.

This is based on the in 1 marked line G can be seen, extending in the longitudinal direction of the heat sink module stack by the local heat sink modules 1 extends. The line G passes exactly through one of the protrusions on the first sides A (Cooling surface 6 ). On the opposite second sides B (Cooling surfaces 7 ) runs the line G exactly by a gap between the projections there.

This becomes clear at the in 2 illustrated stack of identical heat sink modules 1 , These heat sink modules 1 correspond essentially to those from 1 ,

In contrast to 1 are just the heights H the protrusions of the first cooling surface 6 opposite the housing 11 on this page A elevated. These projections protrude on the first page A over the housing 11 out.

In contrast, the heights H the protrusions of the second cooling surface 7 the same size or even smaller than the case 11 on this page B , As a result, the projections protrude on the second side B not over the case 11 out.

The projections of the first cooling surface 6 are thus different from the projections of the second cooling surface 7 ,

In completely identical or mirror-image pages A . B of the heat sink module 1 the end faces of the projections opposite the stack would now abut each other directly. Between the cases 11 There would then be a gap through which cooling medium could emerge laterally out of the stack.

According to 2 are (analogous to 1 ) at the heat sink modules 1 the protrusions of the first cooling surface 6 to the projections of the second cooling surface 7 however laterally offset (= complementary). As in 2 clearly visible, grab and thus fit the projections of the page B of the upper heat sink module 1 in spaces between the protrusions on the side A of the lower heat sink module 1 ,

As a result, on the one hand, a bypass for cooling medium between the end faces of the projections opposite the stack is avoided. And second, there is a side gap between the housings 11 avoided.

3 and 4 show a view from above ( 3 ) and a view from below ( 4 ) on a fanned stack of three identical electronic modules 1' ,

Each of the electronic modules 1' is through a heat sink module 1 with an electronic component arranged thereon 8A educated. As 3 and 4 is removable, is in every electronics module 1' the electronic components 8A in a lateral openings of the respective heat sink module 1 arranged. The opening extends from a side surface of the respective heat sink module 1 to the opposite other side surface. This allows the electronic component 8A be contacted on both sides electrically. Corresponding electrical connections 14 are on the side of the heat sink modules 1 intended.

The electronic component 8A is here in particular with the heat sink module 1 shed. This means that the electronic component 8A with casting compound, in the heat sink module 1 is shed. The casting compound may be in the area of the connections 14 forming a plug or socket, whereby the electronic component 8A is electrically contactable.

The remaining version of the heat sink module 1 in 3 and 4 equals that of 1 or 2 , The explanations for this apply accordingly to 3 and 4 ,

5 shows a part of another embodiment of a heat sink module 1 , Here is only the second page B to see. The first page A is in 5 not shown.

According to 5 has the second cooling surface 7 an area 7A within which the protrusions are made increased compared to the protrusions outside this range 7A , Thus, these projections protrude over the remaining projections of the cooling surface 7 out. These projections also protrude over the housing 11 on this page B out. The area 7A has a particularly large surface for heat dissipation. The area 7A So it is especially arranged where a lot of heat has to be dissipated. This is especially an area 7A which is at a highly heat-dissipating part of the electronic component 8A lies.

Otherwise, the embodiment of the heat sink module corresponds 1 in 5 of those 1 or 2 , The explanations for this apply accordingly also for the embodiment according to 5 ,

6 shows a part of another embodiment of a heat sink module 1 , Here are the heat sink module 1 exemplarily above and below each another identical heat sink module 1 stacked.

According to 6 alternate the heights H the projections of the cooling surfaces 6 . 7 , This is the heat sink module 1 according to 6 a high projection (high altitude H ) always surrounded by low protrusions (low height H ) of the heat sink module 1 , Conversely, the same applies.

According to 6 are the projections of the two cooling surfaces 6 . 7 of the heat sink module 1 in addition to each other laterally offset. Thus, in the stack, the projections of a cooling surface engage 6 . 7 corresponding 1 and 2 so in interspaces of the opposite other cooling surface 6 . 7 ,

However, this does not necessarily have to be the case. Through the alternating heights H the projections, it is possible that the heat sink module 1 Projections with a high height H on the first cooling surface 6 those with a low height H on the second cooling surface 7 (exactly) opposite. For a stack of such heat sink module 1 lie down then although the front sides of projections exactly opposite. Due to the different heights H But then there is a gap between the end faces. Although this gap forms a local bypass for cooling medium, through the alternating heights H However, this bypass does not extend over the entire length of the cooling surfaces 6 . 7 ,

Similarly, it is possible that the protrusions in their height H are alternately offset from each other. That means the heights H The individual projections are identical per se, but the projections alternately in the direction of the first and second side A . B are offset.

Otherwise, the embodiment of the heat sink module corresponds 1 in 6 of those 1 or 2 , The explanations for this apply accordingly also for the embodiment according to 6 ,

7 shows a section through a further embodiment of a heat sink module 1 , In this case, the projections of the first cooling surface 6 a lower height H on, as the opposite projections of the second cooling surface 7 , This indicates the second cooling surface 7 compared to the first cooling surface 6 a larger area and thus an increased ability to dissipate heat.

In 7 is clearly visible that the heat sink module 1 with the housing 11 can be made in several parts. An example is the heat sink module 1 in 7 executed in two parts. One part (top part) 11A forms the first page A with the first cooling surface 6 off and the other part (lower part) 11B forms the second page B with the second cooling surface 7 out. This advantageous division of the housing 11 is also removable from other figures.

The housing parts 11A . 11B can have complementary grooves 15 and feathers 16 feature. These can be on the parting plane of the parts 11A . 11B the passages 12 . 13 and / or the job 8th for arranging the electronic component 8A surround. In the groove 15 may be arranged sealing material, such as an O-ring or a sealing cord or sealant.

Otherwise, the embodiment of the heat sink module corresponds 1 in 7 of those 1 or 2 , The explanations for this apply accordingly also for the embodiment according to 7 ,

8th shows a three-dimensional detail view of a heat sink module 1 , It is here from diagonally above on the first page A with the first cooling surface 6 looked. In the area of the transition from the first cooling surface 6 for laterally adjacent wall of the housing 11 is in this embodiment of the heat sink module 1 as a flow guidance contour 6A trained flow guide means provided. This consists in the present case, by way of example of a series of half projections extending along the wall of the housing 11 from the first round 12 to the second passage 13 extends. As a result, the flow of the cooling medium is influenced in a targeted manner. There is thus no bypass for the cooling medium in this area, if it is from the first pass 12 over the first cooling surface 6 to the second passage 13 flows. The flow guidance contour 6A can therefore also be referred to as interference contour. The housing 11 is preferably also in the region of the second cooling surface 7 equipped with an identical or comparable flow guidance contour.

Corresponding flow guidance contours are also in the 2 . 3 . 4 . 5 recognizable. It is noted that the flow guide contour 6A In principle, it can also be designed differently. For example, it can form an independent component.

Otherwise, the embodiment of the heat sink module corresponds 1 in 8th of those 1 or 2 , The explanations for this apply accordingly also for the embodiment according to 8th ,

9 shows a three-dimensional partial view of a section through a stack of three identical heat sink modules 1 , The individual heat sink modules 1 correspond to the one out 7 , The explanations for this apply accordingly also for the embodiment according to 9 ,

According to 9 are the individual heatsink modules 1 stacked up so that the passages 12 arranged in a row (comparable to the stacks in 1 . 2 . 3 . 4 ). The passages 12 thereby form a common distribution channel.

According to 9 it is now provided that in the distribution channel a flow guiding means 17 is arranged. This serves to a certain proportion of the flow of the cooling medium in the distribution channel to the opposite cooling surfaces 6 . 7 to direct. The flow guide means 17 has correspondingly shaped noses or ribs 17A , A corresponding flow guiding means may optionally be in the through the passages 13 be formed collector channel formed. This then serves to that of the cooling surfaces 6 . 7 in the collector channel flowing cooling medium in the right direction to steer.

In the present case is the flow guiding means 17 exemplified as an independent component (for example, an insert), which extends over several of the heat sink modules 1 extends in the stack. This is attached to the stack in a suitable manner. Alternatively, the heat sink modules 1 in each case via a corresponding flow guiding means 17 feature. This can be a corresponding nose or rib 17A on the housing 11 in the area of the respective passage 12 . 13 be arranged. This can be an independent component or a part of the housing 11 ,

Analogously designed flow guidance means 17 . 17A can basically in all heat sink modules shown in the figures 1 or heatsink module stacks are used.

In 9 For example, various portions of the flow of the cooling medium are shown as arrows. It can be seen that the flow guide means 17 a certain proportion towards the cooling surfaces 6 . 7 directs. The thickness of the arrows represents the volume flow rate of the flow that flows in the respective direction.

10 shows a three-dimensional view of a two-part heat sink module 1 , The two parts 11A and 11B are separated from each other for better intuition. This provides the view of the complementary grooves provided 15 and feathers 16 free. These each surround the passages 12 and 13 , As a result, they can be sealed well.

In addition, the parts have 11A and 11B each have a recess for receiving the electronic component 8A , Each of the parts 11A and 11B therefore has a job 8th for arranging the electronic component 8A , The recesses form in the assembled state of the heat sink module 1 an opening extending from a side surface of the heat sink module 1 extends to the opposite other side surface. So that can be the electronic module 1' according to 3 and 4 be formed.

Otherwise, the embodiment of the heat sink module corresponds 1 in 10 of those 1 or 2 , The explanations for this apply accordingly also for the embodiment according to 10 ,

From each of the heat sink modules shown in the figures 1 can by arranging an electronic component 8A to the appropriate place 8th an electronic module 1' be created (see, for example 3 and 4 ).

11 shows a motor vehicle drive train, comprising an electric motor 18 as a traction drive and an inverter 19 for electrical energization of the electric motor 18 , In the electric motor 18 in particular, it may be an induction machine, such as a synchronous or asynchronous machine. The electric machine 18 is via phase lines with alternating current from the inverter 19 provided. The inverter 19 draws the necessary electrical energy via DC lines from an electrical energy storage 20 , such as from an accumulator or capacitor. The electrical energy storage 20 thus supplies a direct current. This one is from the inverter 19 in alternating current for the electric motor 18 changed. The electric machine 18 then drives, for example, vehicle wheels 21 at.

The inverter 19 is present from a stack of electronic modules 1' built up. These are two or more of the proposed electronic modules 1' with the appropriate heat sink modules 1 used. The inverter 19 for example, a stack of heatsink modules 1 according to one of 1 . 2 . 3 . 4 . 6 . 9 have or be constructed with it. The axial ends of the stack can, as in 1 visible, from housing modules 2 . 3 be formed.

LIST OF REFERENCE NUMBERS

1

Heat sink module

1'

electronic module

2

housing module

3

housing module

4

Intake

5

procedure

6

cooling surface

6A

Flow guide means

7

cooling surface

7A

Area

8th

Job

8A

electronic component

9

feather

10

groove

11

Housing, frame

11A

Part of the housing / frame

11B

Part of the housing / frame

12

passage

13

passage

14

electrical connection

15

groove

16

feather

17

Flow guide means

17A

Nose, rib

18

E-machine

19

inverter

20

energy storage

21

vehicle wheels

A

Side, top

B

Side, bottom

G

line

H

height

O

Direction above a heat sink module 1, axial direction

U

Direction below a heat sink module 1, axial direction

S

lateral direction

QUOTES INCLUDE IN THE DESCRIPTION

This list of the documents listed by the applicant has been generated automatically and is included solely for the better information of the reader. The list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions.

Cited patent literature

• EP 2019429 A1 [0003]
• DE 102016223889 [0004]

Claims (10)

Heatsink module (1), at least comprising a first cooling surface (6) on a first side (A) of the heat sink module (1) and a second side (B) of the heat sink module (1), and a location (8) for arranging at least one electronic component ( 8A) between the two sides (A, B) so that the electronic component (8A) can deliver heat to the first cooling surface (6), and a first passage (12) for guiding a flow of a cooling medium from one of the two sides (A, B) to the other of the two sides (A, B), and a housing (11) which forms a lateral (S) boundary of the first cooling surface (6) and the first passage (12) and this laterally encloses (S), wherein the heat sink module (1) with the housing (11) is designed with at least one further module (1, 2, 3), in particular a housing module (2, 3) or a similar or identical heat sink module (1), by arranging this further Module (1, 2, 3) optionally on the first or second Sei te (A, B), characterized in that a flow guiding means (17) in the first passage (12) is provided so that this part of the flow of the cooling medium from the first passage (12) to the first cooling surface (12) 6) directs. Heat sink module (1), after Claim 1 , with a second cooling surface (7) on the second side (A) of the heat sink module (1), wherein the point (8) is arranged so that the electronic component (8A) heat to the first and the second cooling surface (6, 7 ). Heat sink module (1) after Claim 2 , with a second passage (13) for guiding the flow of cooling medium from one of the two sides (A, B) to the other of the two sides (A, B), the two passages (12, 13) being at opposite ends of the cooling surfaces (13). 6, 7) are arranged. The heat sink module (1) according to any one of the preceding claims, wherein the flow guide means (17) is disposed on the housing (11) adjacent to the passage (12, 13). Heat sink module (1) according to one of the preceding claims, wherein the flow guiding means (17) forms a part of the housing (11) or forms an independent component. Heat sink module (1) according to one of the preceding claims, wherein the flow guiding means (17) comprises or forms a nose or rib. Heatsink module stack, comprising at least two heat sink modules (1) which are each designed according to one of the preceding claims, wherein the first side (A) of one of the heat sink modules (1) bears against the second side (B) of the other of the heat sink modules (1), wherein the heat sink modules (1) are arranged such that the first passages (12, 13) of the cooling medium modules (1) for the cooling medium are arranged in a row, so that a distribution channel for the cooling medium is formed, wherein in the distribution channel, the flow guide means (17) is arranged as an independent component so that this part of the flow of the cooling medium from the distribution channel to the first cooling surface (6) directs. Electronic module (1 '), at least comprising a heat sink module (1) according to one of the preceding Claims 1 to 6 , wherein this heat sink module (1) has at least one electrical half-bridge with a first and a second power semiconductor as electronic components (8A). Inverter (19) for the electrical energization of an electric motor (18), characterized by a plurality of stacked electronic modules (1 ') after Claim 8 , Motor vehicle drive train with an electric motor (18) as traction drive, characterized by an inverter (19) according to Claim 9 for electrical energization of the electric motor (18).

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