DE102017212784A1 - Trim piece for a vehicle and method of making a trim piece - Google Patents

Abstract

The invention relates to a trim part (1) for a vehicle with at least one integrated circuit board (2), which is completely surrounded by at least one thermoplastic component (3, 4) and / or a thermosetting lacquer. The invention further relates to a method for producing a Trim part (1) for a vehicle, wherein at least one printed circuit board (2) is completely surrounded by at least one thermoplastic component (3, 4) and / or a thermosetting paint.

Description

The invention relates to a trim part for a vehicle.

The invention further relates to a method for producing a trim part.

From the DE 10 2007 057 934 A1 is a method for producing a plastic-coated on at least one surface metallic component is known in which a sheet is deep-drawn for the purpose of forming the component, the deep-drawn sheet is introduced into an injection mold and back-injected on a surface with plastic material. After injecting the sheet with a layer of plastic material, the component remains in the injection mold. Within this, the component is with a further plastic material, which is injected into a limited by a slider or a removable cavity of the injection mold cavity mold, back injection molded or overmolded. As a result, a material-uniform support member is formed on the back-injection-molded sheet metal. Furthermore, a designed as a trim part for a vehicle component is described, which is produced by this method.

The invention is based on the object to provide a comparison with the prior art novel trim part for a vehicle and a novel method for producing such a trim part.

With regard to the trim part, the object is achieved by the features specified in claim 1 and in terms of the method by the features specified in claim 16.

Advantageous embodiments of the invention are the subject of the dependent claims.

The decorative part according to the invention for a vehicle comprises at least one integrated circuit board which is completely surrounded by at least one thermoplastic component and / or a thermosetting lacquer. This integration of the printed circuit board in the trim part makes it possible that no additional and adornmentxtemen installation spaces and associated complex electrical and signal couplings of the trim part and the circuit board are required. Furthermore, the integration of the printed circuit board allows functional components of the decorative element, for example electronic components, to be supplied and controlled in a simple manner at the place of their use. Here, too, can be omitted long and expensive electrical and signal couplings of the circuit board with the functional components. This results from the fact that the circuit board is completely surrounded by at least one thermoplastic component and / or the thermosetting paint, a protection of the same against external environmental influences, such as moisture, pollution and UV radiation, and consequent protection against corrosion and delamination of the circuit board.

According to a possible development of the trim part, the printed circuit board is connected to the at least one thermoplastic component and / or the thermosetting lacquer cohesively, at least in the region of a carrier material. Thus, on the one hand, a mechanically particularly stable and on the other hand, a media-tight connection between the circuit board and the at least one thermoplastic component and / or the thermosetting paint can be realized.

In a possible embodiment of the trim part, the printed circuit board comprises at least one electronic component. As a result, no further complicated electrical and / or signaling couplings of the printed circuit board with electronic components are required and the trim part can be designed particularly small.

• - einen optischen Sensor, beispielsweise ein Infrarotsensor oder Lidarsensor,
• - einen akustischen Sensor, beispielsweise ein Ultraschallsensor,
• - einen elektromagnetischen Sensor, beispielsweise einen induktiven Sensor, kapazitiven Sensor oder Radarsensor,
• - einen Beschleunigungssensor,
• - einen Geschwindigkeitssensor,
• - einen Sensor zur Erfassung von Umgebungsparametern, beispielsweise einen Temperatursensor, Feuchtigkeitssensor oder Helligkeitssensor, und/oder
• - eine Lichtquelle, beispielsweise zur Darstellung von Logos, Schriftzügen, Symbolen, Formen oder technischen Strukturen.

In order to integrate a variety of optical and / or sensory functions in the ornamental component, in a further possible embodiment of the trim part, the at least one electronic component comprises at least

• an optical sensor, for example an infrared sensor or lidar sensor,
• an acoustic sensor, for example an ultrasonic sensor,
• an electromagnetic sensor, for example an inductive sensor, capacitive sensor or radar sensor,
• an acceleration sensor,
• - a speed sensor,
• a sensor for detecting environmental parameters, for example a temperature sensor, moisture sensor or brightness sensor, and / or
• - A light source, for example, to display logos, logotypes, symbols, shapes or technical structures.

The at least one electronic component can also be used to generate an optical signal as a warning, directional display, or to output information about vehicle parameters or to generate electromagnetic signals for communication of the vehicle with other vehicles and / or other systems.

In a possible development of the trim part that is at least one electronic component directly from the at least one thermoplastic Component and / or surrounding the thermosetting paint. As a result, the electronic component is protected from mechanical influences and environmental influences.

Alternatively, the at least one electronic component is surrounded by a cover element which delimits the electronic component from the at least one thermoplastic component and / or the thermosetting lacquer. As a result, protection of the electronic component against high pressures and temperatures can be achieved during application of the at least one thermoplastic component and / or the thermosetting paint. Thus, pressure and / or temperature-sensitive electronic components can be integrated with the printed circuit board in the trim part in a simple manner. In this case, the circuit board in the region of the cover is not surrounded by the at least one thermal component and / or the thermosetting paint.

According to a possible embodiment of the trim part, the cover element forms a shield against electrical and / or magnetic fields. Thus, a reliable operation of the at least one electronic component can be ensured.

For example, the cover is made of metal, at least one plastic and / or at least one resin.

In accordance with a further possible embodiment of the trim part, at least one electrical connection element which is coupled to the printed circuit board is arranged on a target rear side facing away from a trim side and / or on a side trim edge and / or on the trim side, wherein the at least one thermoplastic component and / or the thermosetting paint, the connection element, except for a connection side of the same, media-tight surround and / or enclosing. Thus, the circuit board in the region of the connection element is not surrounded by the at least one thermal component and / or the thermosetting lacquer. Due to the arrangement of the connection element on the ornamental back and / or a lateral trim edge and / or on the ornamental view outside a viewing area is not visible from the outside and protected from mechanical influences and environmental influences electrical and signaling connection of the circuit board and the at least one optionally arranged on this electronic component to a vehicle-side system possible. The connection element is designed, for example, as a socket, plug, outstanding contact, exposed surface, as a cable or as a solder contact.

According to a possible development of the trim part, the at least one thermoplastic component and / or the thermosetting paint on the trim side is or is designed to be translucent or non-transparent. As a result, the printed circuit board and the at least one optionally arranged on this electronic component are not visible. Thus, a visual impairment of the trim part is avoided and ensures maintenance of desired surface properties.

One possible embodiment of the trim part provides that the printed circuit board has an at least substantially planar surface on a front side facing the trim side and / or terminates the circuit board flush with the at least one thermoplastic component on the front side facing the trim side. In order to achieve this, the at least one electronic component according to another possible embodiment of the trim part is arranged on the rear side of the printed circuit board facing away from the trim side. Due to the flat surface and / or the flush-fitting, it is possible that the at least one thermoplastic component and / or the thermosetting lacquer can be applied at least substantially with the same layer thickness on the front side of the circuit board, wherein height jumps are at least almost completely avoided. This results in addition to a visually very high quality design of the at least one thermoplastic component and / or the thermosetting paint on the Zierteilsichtseite also a particularly homogeneous and thus very stable formation of at least one thermoplastic component and / or the thermosetting paint on the Zierteilsichtseite.

A possible development of the trim part provides for the printed circuit board to be surrounded by a first thermoplastic component on the rear side facing away from the trim side, and by a second thermoplastic component and / or the thermosetting paint on the front side facing the trim side, the thermoplastic components being at contact areas and / or the thermosetting paint in a parting plane are integrally connected to each other and the circuit board is arranged in the parting plane between the thermoplastic components. The trim part according to this development can be produced particularly easily. In particular, integration of the printed circuit board and optionally of the at least one electronic component is possible in a simple manner.

For example, a front side or a rear side of the printed circuit board forms a section of the dividing plane.

In a possible embodiment of the trim part, the first thermoplastic component and the second thermoplastic component are formed from the same material.

• - Acrylnitril-Butadien-Styrol-Copolymer (= ABS),
• - Acrylnitril-Styrol-Acrylat-Copolymer (= ASA),
• - Polymethylmethacrylat (= PMMA),
• - Polycarbonat (= PC),
• - Polypropylen (= PP),
• - Polybutylenterephthalat (= PBT),
• - Polyethylenterephthalat (= PET) und/oder
• - eine aus mehreren dieser Kunststoffe gebildete Polymerlegierung oder ein aus mehreren dieser Kunststoffe gebildetes Polymerblend, wie beispielsweise aus Polycarbonat und Acrylnitril-Butadien-Styrol-Copolymer (= PC + ABS), Polycarbonat und Polyethylenterephthalat (= PC + PET) oder Polycarbonat und Polybutylenterephthalat (= PC + PBT). Derartige Kunststoffe eignen sich besonders gut zur Herstellung der zumindest einen thermoplastischen Komponente und sind besonders einfach handhabbar und verarbeitbar.

In a further possible embodiment of the trim part, the at least one thermoplastic component comprises at least

• Acrylonitrile-butadiene-styrene copolymer (= ABS),
• Acrylonitrile-styrene-acrylate copolymer (= ASA),
• - polymethylmethacrylate (= PMMA),
• Polycarbonate (= PC),
• - polypropylene (= PP),
• Polybutylene terephthalate (= PBT),
• - Polyethylene terephthalate (= PET) and / or
• a polymer alloy formed from a plurality of these plastics or a polymer blend formed from a plurality of these plastics, such as, for example, polycarbonate and acrylonitrile-butadiene-styrene copolymer (= PC + ABS), polycarbonate and polyethylene terephthalate (= PC + PET) or polycarbonate and polybutylene terephthalate ( = PC + PBT). Such plastics are particularly suitable for producing the at least one thermoplastic component and are particularly easy to handle and process.

In a possible development of the trim part of the thermosetting paint is arranged on the Zierteilsichtseite. By means of such a varnish, which is formed, for example, from polyurethane or polyurea (PUA), qualitatively and visually very high-quality, for example high-gloss or matt, visible surfaces can be produced. Also, the paint can be applied in very thin layers.
According to a possible embodiment of the trim part, the printed circuit board comprises a mechanically flexible support material designed, for example, as a foil. The carrier material is, for example, polyimide. The carrier material may also be formed from at least one of the thermoplastic materials mentioned above for the at least one thermoplastic component. Due to the flexibility, a simple adaptation of the printed circuit board to differently shaped decorative parts is possible. Furthermore, it is possible due to the formation of the carrier material as a film formation of the printed circuit board with a very small thickness and consequently also a design of the trim part with a very small thickness. For example, embodiments of the trim part with a thickness of less than 5 mm or less than 3 mm are possible.

Alternatively, the carrier material of the printed circuit board is semiflexible or rigid, wherein the carrier material comprises, for example, a phenolic resin, epoxy resin, polytetrafluoroethylene and / or a ceramic.

In the method according to the invention for producing a trim part for a vehicle, at least one printed circuit board is completely surrounded by at least one thermoplastic component and / or one thermosetting paint. The method enables a simple integration of the circuit board in the trim part. This integration, in turn, results in no additional and decorative parts external to the frame and the associated complicated electrical and signal-related couplings of the trim part and the printed circuit board being required. Furthermore, the integration of the printed circuit board allows functional components of the decorative element, for example electronic components, to be supplied and controlled in a simple manner at the place of their use. Here, too, can be omitted long and expensive electrical and signal couplings of the circuit board with the functional components. This results from the fact that the circuit board is completely surrounded by at least one thermoplastic component and / or the thermosetting paint that protection of the same against external environmental influences, such as moisture, pollution and UV radiation, and consequent protection against corrosion and delamination of the circuit board given is.

According to a possible development of the method, the printed circuit board is surrounded, in particular extrusion-coated, on a rear side facing away from the ornamental-side viewing side by a first thermoplastic component.

According to a possible embodiment of the method, the printed circuit board is surrounded on a front side facing the trim part side with a second thermoplastic component and / or the thermosetting paint.

According to a further possible embodiment of the method, the second thermoplastic component is sprayed onto the front side of the printed circuit board or the front side of the printed circuit board is coated with the thermosetting lacquer, in particular in a so-called high-pressure reaction injection molding process, HD-RIM process , flooded. As a result, optically high-quality and mechanically stable surfaces can be produced in a particularly simple manner.

By way of example, the printed circuit board is surrounded on the rear side facing away from the decorative side by the first thermoplastic component in such a way that the front side of the printed circuit board is flush-fitted with the first thermoplastic component laterally and rear-coated Parting plane for the second thermoplastic component and / or the thermosetting paint forms. By the flush-fitting, it is possible that the second thermoplastic component and / or the thermosetting paint is applied or at least substantially the same layer thickness on the front of the circuit board, wherein height jumps are at least almost completely avoided. This results in addition to a visually very high quality training of the second thermoplastic component and / or the thermosetting paint on the Zierteilsichtseite also a particularly homogeneous and thus very stable formation of the second thermoplastic component and / or the thermosetting paint on the Zierteilsichtseite.

In one possible embodiment of the method, the at least one thermoplastic component and / or the thermosetting lacquer are or will be applied directly to at least one electronic component of the printed circuit board. As a result, the electronic component is protected from mechanical influences and environmental influences.

In an alternative embodiment of the method, at least one electronic component of the printed circuit board is covered with a surrounding covering element prior to applying the at least one thermoplastic component and / or the thermosetting paint, wherein the at least one electronic component by means of the cover of the at least one thermoplastic component and / or the thermosetting paint is delineated. As a result, protection of the electronic component against high pressures and temperatures can be achieved during application of the at least one thermoplastic component and / or the thermosetting paint. Thus, pressure and / or temperature-sensitive electronic components can be integrated with the printed circuit board in the trim part in a simple manner. In this case, the circuit board in the region of the cover is not surrounded by the at least one thermal component and / or the thermosetting paint.

Embodiments of the invention are explained in more detail below with reference to drawings.

• 1 schematisch eine Schnittdarstellung eines möglichen ersten Ausführungsbeispiels eines Zierteils,
• 2 schematisch einen vergrößerten Ausschnitt der Schnittdarstellung gemäß 1,
• 3 schematisch eine Schnittdarstellung eines möglichen zweiten Ausführungsbeispiels eines Zierteils,
• 4 schematisch einen vergrößerten Ausschnitt der Schnittdarstellung gemäß 3,
• 5 schematisch eine Schnittdarstellung eines möglichen dritten Ausführungsbeispiels eines Zierteils,
• 6 schematisch einen vergrößerten Ausschnitt der Schnittdarstellung gemäß 5,
• 7 schematisch eine Schnittdarstellung eines möglichen vierten Ausführungsbeispiels eines Zierteils und
• 8 schematisch einen vergrößerten Ausschnitt der Schnittdarstellung gemäß 7.

Show:

• 1 1 is a schematic sectional view of a possible first exemplary embodiment of a trim part,
• 2 schematically an enlarged section of the sectional view according to 1 .
• 3 1 is a schematic sectional view of a possible second exemplary embodiment of a trim part,
• 4 schematically an enlarged section of the sectional view according to 3 .
• 5 1 is a schematic sectional view of a possible third exemplary embodiment of a trim part,
• 6 schematically an enlarged section of the sectional view according to 5 .
• 7 schematically a sectional view of a possible fourth embodiment of a trim part and
• 8th schematically an enlarged section of the sectional view according to 7 ,

Corresponding parts are provided in all figures with the same reference numerals.

In 1 is a sectional view of a possible first embodiment of a trim part 1 shown. 2 shows an enlarged section of the sectional view.

The trim part 1 is intended for an arrangement and use inside and / or on an outside of a vehicle.

The trim part 1 includes an integrated circuit board 2 which is a carrier material 2.1 and several on the substrate 2.1 arranged electronic components 2.2 to 2.n includes, which by means not shown interconnects of the circuit board 2 electrically contacted.

The carrier material 2.1 For example, it is mechanically flexible and formed, for example, from polyimide or another suitable thermoplastic. Alternatively, the carrier material 2.1 for example, semi-flexible or rigid and formed for example of a phenolic resin, epoxy resin, polytetrafluoroethylene and / or a ceramic.

The electronic components 2.2 to 2.n are for example optical sensors, acoustic sensors, electromagnetic sensors, acceleration sensors, speed sensors, sensors for detecting environmental parameters and / or light sources.

To protect the circuit board 2 This is completely made of two thermoplastic components 3 . 4 and / or a thermosetting paint surrounded.

For example, the circuit board 2 at one of a trim side 1.1 facing front of a second thermoplastic component 3 or the thermosetting varnish and on one of the ornamental-side visible side 1.1 remote rear side of a first thermoplastic component 4 surrounded, wherein the thermoplastic components 3 . 4 and / or the thermosetting paint at contact areas in a parting plane T cohesively connected to each other and the circuit board 1 so in the dividing plane T between the thermoplastic components 3 . 4 or the thermoplastic component 4 and the thermosetting paint is arranged, that the front side of a portion of the parting plane T forms.

Here is the carrier material 2.1 the circuit board 2 at the components 2.2 to 2.n facing away from the front surface cohesively with the second thermoplastic component 3 or and / or the thermosetting paint.

At the back of the circuit board 2 are the electronic components 2.2 to 2.n from a cover 6 Surrounded by the components 2.2 to 2.n from the first thermoplastic component 4 delimit.

Outside the cover 6 is the carrier material 2.1 at the back of the circuit board 2 and on end sides of the same material fit with the first thermoplastic component 4 connected.

For the production of the trim part 1 According to the illustrated first embodiment, first the electronic components 2.2 to 2.n with the cover 6 covered together. In non-illustrated embodiments, the components 2.2 to 2.n also individually or in groups with several cover elements 6 be covered. Also, it is possible that only a part of the components 2.2 to 2.n , in particular thermally sensitive and / or pressure-sensitive components 2.2 to 2.n with at least one cover element 6 be covered.

After this cover is the circuit board 2 on its back and the ends completely with the first thermoplastic component 4 surrounded, for example, over or over sprayed. Also the cover 6 is laterally molded, the back remains free. The cover 6 serves a thermal and mechanical protection of the components 2.2 to 2.n during the application of the first thermoplastic component 4 , Alternatively or additionally forms the cover 6 during operation of the trim part 1 a shield against electrical and / or magnetic fields for the components 2.2 to 2.n ,

For this purpose, the circuit board 2 positioned in one possible embodiment in an injection mold nozzle side, ie it is component side pointing to the vehicle outside pointing to the parting plane T at. The first thermoplastic component 4 flows around the circuit board 2 such that at the back and on a later ornamentation backside 1.2 only the cover 6 sticking out. The remaining circuit board 2 is completely encapsulated and embedded. The outstanding cover element 6 is positioned in a movable tool side in a franking so that a clamping force when closing the injection mold does not damage the cover 6 leads.

A possible contacting of the printed circuit board 2 takes place outside the trim part 1 , For this purpose, the circuit board is placed at a certain position on a sealingly arranged on the circuit board tool parting plane. Thus, contacts of the circuit board 2 from the first thermoplastic component 4 out and contacted as exposed contact points. Here is the circuit board 2 in the area of contacts and discharges not from the first thermal component 4 surround.

Subsequently, the front of the circuit board 2 and sections of the first thermoplastic component 4 in the area of the parting plane T with the second thermoplastic component 3 covered, for example, oversprayed, or flooded with the thermosetting paint.

• - Acrylnitril-Butadien-Styrol-Copolymer,
• - Acrylnitril-Styrol-Acrylat-Copolymer,
• - Polymethylmethacrylat,
• - Polycarbonat,
• - Polypropylen,
• - Polybutylenterephthalat,
• - Polyethylenterephthalat und/oder
• - eine aus mehreren dieser Kunststoffe gebildete Polymerlegierung oder ein aus mehreren dieser Kunststoffe gebildetes Polymerblend, wie beispielsweise aus Polycarbonat und Acrylnitril-Butadien-Styrol-Copolymer, Polycarbonat und Polyethylenterephthalat oder Polycarbonat und Polybutylenterephthalat. Dabei können für die thermoplastischen Komponenten 3, 4 gleiche oder unterschiedliche Materialien verwendet werden.

The thermoplastic components 3 . 4 in each case comprise at least

• Acrylonitrile-butadiene-styrene copolymer,
• Acrylonitrile-styrene-acrylate copolymer,
• - polymethyl methacrylate,
• - polycarbonate,
• - polypropylene,
• Polybutylene terephthalate,
• - Polyethylene terephthalate and / or
• a polymer alloy formed from a plurality of these plastics or a polymer blend formed from a plurality of these plastics, such as, for example, polycarbonate and acrylonitrile-butadiene-styrene copolymer, polycarbonate and polyethylene terephthalate or polycarbonate and polybutylene terephthalate. It can for the thermoplastic components 3 . 4 same or different materials are used.

In particular, when flooding the front of the circuit board 2 and the portions of the first thermoplastic component 4 in the area of the parting plane T is used in place of the second thermoplastic component 3 the thermosetting paint used. The paint includes, for example, polyurethane and / or polyurea.

In one possible embodiment, the thermosetting paint is subjected to a so-called high-pressure Reaction injection molding process, short HD RIM process, introduced into the injection mold. In this case, for example, an effective internal mold pressure of 10 bar is set.

So that the circuit board 2 starting from the ornamental view side 1.1 is not visible to a viewer is the second thermoplastic component 3 or the thermosetting paint according to a possible ornamental side view 1.1 translucent or intransparent trained.

Is in accordance with another embodiment not shown in detail of the trim part 1 at least one of the components 2.2 to 2.n for the emission of light in the direction of the ornamental view side 1.1 formed, is the second thermoplastic component 3 or the thermosetting paint at least in the region of this component 2.2 to 2.n formed transparent or translucent.

To a high-quality ornamental view page 1.1 when flooding the front of the circuit board 2 to produce with the thermosetting paint, form the first component 4 and the front of the circuit board 2 in the parting plane T an at least substantially flat surface. As a result, there are no height jumps, so that the thermosetting paint can be applied particularly homogeneous and thus a very stable and high-quality ornamental view 1.1 can be generated.

A surface of the ornamental side viewing side 1.1 is designed, for example, high gloss, matt or grained.

In the following, for example, various possible combinations of materials for the first and second thermoplastic component 4 . 3 and during the application of these set process parameters. However, the invention is not limited in its generality by these examples.

Be for the first and second thermoplastic component 4 . 3 Different materials used is the second component 3 for example, polymethyl methacrylate, polycarbonate or acrylonitrile-styrene-acrylate copolymer and the first component 4 Acrylonitrile-butadiene-styrene copolymer, a polymer alloy of polycarbonate and acrylonitrile-butadiene-styrene copolymer or acrylonitrile-styrene-acrylate copolymer formed.

Be for the first and second thermoplastic component 4 . 3 used the same materials, these are formed for example of polymethyl methacrylate, polycarbonate or acrylonitrile-styrene-acrylate copolymer.

If the thermosetting paint is formed, for example, from polyurethane, then the first thermoplastic component 4 for example, formed from a polymer alloy of polycarbonate and acrylonitrile-butadiene-styrene copolymer, polycarbonate and polybutylene terephthalate, polycarbonate and polyethylene terephthalate, acrylonitrile-butadiene-styrene copolymer or polypropylene.

When applying the first component 4 In an injection molding process, for example, acrylonitrile-butadiene-styrene copolymer, which has a melting temperature of 220 ° C, at 230 ° C to 270 ° C, especially 245 ° C to 255 ° C, at 1000 bar to 2000 bar injection pressure, in particular 1000 bar up to 1300 bar, processed.

When applying the first component 4 in an injection molding process or in the training of both components 3 . 4 from the same material and applying both components 3 . 4 In an injection molding process, for example, acrylonitrile-styrene-acrylate copolymer, which has a melting temperature of 220 ° C, at 230 ° C to 270 ° C, especially 245 ° C to 255 ° C, at 1000 bar to 2000 bar injection pressure, in particular 1000 bar up to 1300 bar, processed.

When applying the second component 3 in an injection molding process or in the training of both components 3 . 4 from the same material and applying both components 3 . 4 In an injection molding process, for example, polymethylmethacrylate at 220 ° C to 260 ° C, in particular 245 ° C to 255 ° C, at 1000 bar to 2000 bar injection pressure, in particular 1400 bar to 1600 bar processed.

When applying the first component 4 In an injection molding process, for example, the polymer alloy of polycarbonate and acrylonitrile-butadiene-styrene copolymer at 260 ° C to 290 ° C, in particular 275 ° C to 285 ° C processed to the lowest possible injection pressure of 1000 bar to 2000 bar, in particular 1000 bar to 1300 bar, to realize.

When introducing the thermosetting paint by the high-pressure reaction injection molding process, short HD RIM process, in the injection mold and the use of polyurethane or polyurea as a paint, takes place during the flooding of the injection molding an exothermic reaction of the polyurethane components isocyanate and polyol , This results in reaction temperatures on the first component 4 from 60 ° C to 120 ° C, in particular 70 ° C to 90 ° C, at layer thicknesses of for example 0.1 mm to 1.0 mm, in particular 0.3 mm to 0.4 mm and a pressure of 0 bar to 20 bar, in particular 5 bar to 15 bar formed.

In a possible embodiment of the first embodiment of the trim part 1 are both thermoplastic components 3 . 4 made of the same material. For the production of the trim part 1 becomes the circuit board 2 placed in the injection mold and with a common component completely and without forming a parting plane T molded.

In 3 is a sectional view of a possible second embodiment of a trim part 1 shown. 4 shows an enlarged section of the sectional view.

Unlike in the 1 and 2 shown first embodiment, each electronic component 2.2 to 2.n on circuit board 2 from a separate cover 6 if this from a production point of view and / or during operation of the trim part 1 is required as protection against electrical and / or magnetic fields.

Furthermore, in addition to one of the Zierteilsichtseite 1.1 facing away ornamental back 1.2 one with the circuit board 2 coupled electrical connection element 7 arranged, which except for a connection side of the same media density of the first thermoplastic component 4 is surrounded. For this purpose, the connection element 7 in the in the 1 and 2 The method described is positioned in a franking of the injection mold, wherein the franking in addition to a positioning and orientation of the circuit board 2 can be used in the injection mold.

The application of the thermoplastic components 3 . 4 and / or the thermosetting paint is otherwise analogous to the first embodiment according to the description of the 1 and 2 ,

In a possible embodiment of the second embodiment of the trim part 1 are both thermoplastic components 3 . 4 made of the same material. For the production of the trim part 1 becomes the circuit board 2 placed in the injection mold and with a common component completely and without forming a parting plane T molded.

In 5 is a sectional view of a possible third embodiment of a trim part 1 shown. 6 shows an enlarged section of the sectional view.

Unlike in the 3 and 4 illustrated second embodiment, the electronic components 2.2 to 2.n on the circuit board 2 directly from the first thermoplastic component 4 covered.

The application of the thermoplastic components 3 . 4 and / or the thermosetting paint is otherwise analogous to the first embodiment according to the description of the 1 and 2 ,

In a possible embodiment of the third embodiment of the trim part 1 are both thermoplastic components 3 . 4 made of the same material. For the production of the trim part 1 becomes the circuit board 2 placed in the injection mold and with a common component completely and without forming a parting plane T molded.

In 7 is a sectional view of a possible fourth embodiment of a trim part 1 shown. 8th shows an enlarged section of the sectional view.

Unlike in the 3 and 4 illustrated second embodiment, the electronic components 2.2 to 2.n with a common cover 6 covered. In embodiments not shown, however, also several cover elements 6 for individual components 2.2 to 2.n or groups of these can be provided. Also, single or multiple of the components 2.2 to 2.n not from a cover 6 be covered.

Furthermore, in contrast to the in the 3 and 4 illustrated second embodiment, the electronic components 2.2 to 2.n on the ornamental side viewing side 1.1 facing front of the circuit board 2 arranged and are immediately below the parting line T the first and the second thermal component 4 . 3 or within it. When using thermosetting paint instead of the second thermoplastic component 3 are the electronic components 2.2 to 2.n immediately below the dividing plane T the first thermal component 3 and of the varnish or within it.

For the production of the trim part 1 According to the fourth embodiment, the circuit board 2 with its back and the connection element 7 For example, positioned on a movable mold half of the injection mold. The first thermoplastic component 4 is then completely around the circuit board and the electronic components 2.2 to 2.n or the cover 6 molded.

This encapsulation takes place in such a way that an outer surface of the resulting semi-finished product in the parting plane T no bumps, steps or Material jumps, so that by means of the second thermoplastic component 3 or by means of the thermosetting lacquer a qualitatively very high quality and mechanically stable ornamental view side 1.1 can be generated. In the presence of one or more cover elements 6 projects this or do not protrude beyond the dividing plane T out.

The application of the thermoplastic components 3 . 4 and / or the thermosetting paint is otherwise analogous to the first embodiment according to the description of the 1 and 2 ,

In a possible embodiment of the fourth embodiment of the trim part 1 are both thermoplastic components 3 . 4 made of the same material. For the production of the trim part 1 becomes the circuit board 2 placed in the injection mold and with a common component completely and without forming a parting plane T molded.

LIST OF REFERENCE NUMBERS

1

garnish

1.1

Garnish summary page

1.2

Garnish back

2

circuit board

2.1

support material

2.2 to 2.n

component

3

component

4

component

6

cover

7

connecting element

T

parting plane

QUOTES INCLUDE IN THE DESCRIPTION

This list of the documents listed by the applicant has been generated automatically and is included solely for the better information of the reader. The list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions.

Cited patent literature

• DE 102007057934 A1 [0003]

Claims (21)

Decorative part (1) for a vehicle with at least one integrated circuit board (2), which is completely surrounded by at least one thermoplastic component (3, 4) and / or a thermosetting lacquer. Trim part (1) to Claim 1 , wherein the circuit board (2) at least in the region of a carrier material (2.1) is materially connected to the at least one thermoplastic component (3, 4) and / or the thermosetting lacquer. Trim part (1) to Claim 1 or 2 wherein the printed circuit board (2) comprises at least one electronic component (2.2 to 2.n). Trim part (1) to Claim 3 , wherein the at least one electronic component (2.2 to 2.n) at least - an optical sensor, - an acoustic sensor, - an electromagnetic sensor, - an electromagnetic transmitter, - an electromagnetic receiver, - an acceleration sensor, - a speed sensor, - a Sensor for detecting environmental parameters and / or - a light source comprises. Trim part (1) to Claim 3 or 4 wherein the at least one electronic component (2.2 to 2.n) is surrounded directly by the at least one thermoplastic component (3, 4) and / or the thermosetting lacquer. Trim part (1) to Claim 3 or 4 wherein the at least one electronic component (2.2 to 2.n) is surrounded by a cover element (6), which surrounds the at least one electronic component (2.2 to 2.n) of the at least one thermoplastic component (3, 4) and / or demarcated the thermosetting paint. Trim part (1) to Claim 6 wherein the cover member (6) forms a shield from electrical and / or magnetic fields. Decorative part (1) according to one of the preceding claims, wherein - At one of a Zierteilsichtseite (1.1) facing away from ornamental back (1.2) and / or at a side trim edge and / or on the Zierteilsichtseite outside a viewing area at least one with the circuit board (2) coupled electrical connection element (7) is arranged, and - The at least one thermoplastic component (3, 4) and / or the thermosetting paint, the connection element (7), except for a connection side of the same, media-tight enclosure or encloses. Decorative part (1) according to one of the preceding claims, wherein the at least one thermoplastic component (3, 4) and / or the thermosetting lacquer on a decorative side view page (1.1) is translucent or non-transparent. Decorative part (1) according to one of the preceding claims, wherein - The printed circuit board (2) on one of a Zierteilsichtseite (1) facing the front has an at least substantially planar surface and / or - The circuit board (2) on the ornamental view page (1) facing the front flush with the at least one thermoplastic component (3, 4) closes. Decorative part (1) according to one of the preceding claims, wherein the printed circuit board (2) is surrounded on a side facing away from a decorative side (1.1) by a first thermoplastic component (4) and on a front side facing the decorative side (1.1) by a second thermoplastic component (3) and / or the thermosetting paint, - The thermoplastic components (3, 4) and / or the thermosetting paint at contact areas in a parting plane (T) are integrally connected to each other and - The circuit board (2) in the parting plane (T) between the thermoplastic components (3, 4) and / or the thermosetting paint is arranged. Trim part (1) to Claim 11 wherein the first thermoplastic component (4) and the second thermoplastic component (3) are formed of the same material. Decorative part (1) according to one of the preceding claims, wherein the at least one thermoplastic component (3, 4) at least Acrylonitrile-butadiene-styrene copolymer, Acrylonitrile-styrene-acrylate copolymer, - polymethyl methacrylate, - polycarbonate, - polyurethane, - polypropylene, Polybutylene terephthalate, - polyethylene terephthalate, - Polyurea and / or a polymer alloy formed from a plurality of these plastics or a polymer blend formed from a plurality of these plastics. Decorative part (1) according to one of the preceding claims, wherein the thermosetting lacquer is arranged on a decorative side view page (1.1). Decorative part (1) according to one of the preceding claims, wherein the printed circuit board (2) comprises a mechanically flexible carrier material (2.1). Method for producing a trim part (1) for a vehicle, wherein at least one printed circuit board (2) is surrounded by at least one thermoplastic component (3, 4) and / or a thermosetting lacquer. Method according to Claim 16 , wherein the printed circuit board (2) is surrounded, in particular encapsulated, with a first thermoplastic component (4) on a rear side facing away from a decorative side view side (1.1). Method according to Claim 16 or 17 , wherein the printed circuit board is surrounded on one of a Zierteilsichtseite (1.1) facing the front side with a second thermoplastic component (3) and / or the thermosetting paint. Method according to Claim 18 in which - the second thermoplastic component (3) is sprayed onto the front side of the printed circuit board (2) or - the front side of the printed circuit board (2) is flooded with the thermosetting lacquer. Method according to one of Claims 16 to 19 wherein the at least one thermoplastic component (3, 4) and / or the thermosetting lacquer is applied directly to at least one electronic component (2.2 to 2.n) of the printed circuit board (2). Method according to one of Claims 16 to 20 wherein, before the application of the at least one thermoplastic component (3, 4) and / or the thermosetting paint, at least one electronic component (2.2 to 2.n) of the printed circuit board (2) is covered by a covering element (6) surrounding it wherein the at least one electronic component (2.2 to 2.n) is delimited by the cover element (6) from the at least one thermoplastic component (3, 4) and / or the thermosetting lacquer.

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