DE102017212113A1 - Control arrangement, vehicle control unit and corresponding method and use - Google Patents

Abstract

The invention relates to a control arrangement for providing different voltage and / or power supplies, wherein the control arrangement (1)
a logic unit (3),
an energy management unit (5) and
- Several control components (7, 7A-M), wherein the control components (7, 7A-M) by the power management unit (5) and the logic unit (5) are controllable, and the energy management unit (5) comprises detecting means by which the temperature the control components (7, 7A-M) can be detected and the control arrangement (1) comprises means of change, by means of which the control of the control components (7, 7A-M) is changeable due to the detected temperature.
The invention further relates to a method for providing different current and / or voltage supplies, a use of the control arrangement in a motor vehicle control unit.

Description

The invention relates to a control arrangement for providing different voltage and / or power supplies according to the preamble of claim 1, a method for providing different voltage and / or power supplies according to claim 5, the use of a control arrangement according to claim 9 and a motor vehicle control unit with a control arrangement according to claim 10th

The power supplies for electronic control units in vehicles are becoming more and more complex because of the high power requirement of modern power electronics modules at low supply voltages. For this purpose, it is known in the prior art that in power supplies in addition to a special voltage regulator (often as PMIC, Power Management Integrated Circuit, trained) several small electronic components (satellites) are used. Such a PMIC may provide one or more different power supplies (voltage level) and / or power supplies (current level). For this purpose, when controlling the satellites, e.g. for the current, fixed limit settings provided.

A disadvantage of the fixed limit values is that with different thermal connection (cooling) of the satellites the satellites become differently hot. It is even possible to reach the temperature limit of the satellites. As a result, individual satellites are significantly hotter than others. In extreme cases, some of the satellites are operated in normal operation at their current limiting temperature and other satellites well below the maximum temperature. This leads to earlier failures of the more thermally stressed components.

Another disadvantage with a current limit with a high nominal value everywhere is that, in the case of printed circuit board areas in which the thermally heavily loaded satellites are installed, special precautions may have to be taken, since these become particularly warm. Either temperature-sensitive components in the neighborhood must not be installed at all, or more expensive high-temperature components must be used (for example, high-temperature flash components).

It is therefore the object of the invention to provide a control arrangement in which the above-mentioned disadvantages are eliminated and in particular the service life of the components used is increased.

The object is solved by the independent claims. According to the invention, a control arrangement is provided for providing different power supplies, wherein the control arrangement comprises a logic unit, an energy management unit and a plurality of control components. The control components are controlled by the energy management unit and / or the logic unit. The energy management unit has detection means, by means of which the temperature of one or more of the control components can be determined. In addition, the control arrangement has change means by means of which the control of the control components can be changed on the basis of the detected temperature.

The detection means are preferably designed as an arrangement of a sensor and an evaluation unit for the sensor data. The changing means are e.g. arranged in the energy management unit or in the logic unit, so that changes in the drive either vornehmbar by the energy management unit and / or by the logic unit by means of the change means. Particularly preferably, both the general control of the control components and the communication of the change in the control by either the power management unit or the logic unit is made.

According to the method, the actual heating or the temperature of several of the control components is first determined according to the invention and then the control of the control components is changed.

The invention introduces intelligent power management, which ensures that a uniform thermal aging profile prevails in the control components, thus increasing the lifetime of the overall circuit.

The control arrangement may comprise a printed circuit board on which the logic unit, the energy management unit and the control components are placed. Both the logic unit, the energy management unit and the control components can be designed as SMD components. The logic unit may be, for example, a microcontroller or microprocessor. The energy management unit may include a complex control unit or an integrated microcontroller, which may be the control components, which preferably each contain a current / voltage switching regulator as well as temperature sensor and current limiting electronics.

According to one embodiment of the invention, the control arrangement comprises one or more heat dissipation units. One or more of Control components are thermally connected to heat dissipation units or connected to them, so that the heating of the control components can be reduced via this thermal connection. The heat dissipation units can be designed, for example, as a heat sink. These may be provided as, for example, SMD components on a printed circuit board. Alternatively, the heat dissipation units may for example also be designed as a cover or housing of the control arrangement. The control components are then thermally connected to the heat sinks, the housing and / or the lid so that heat can be dissipated by the control components via the thermal connection to the heat sinks, the housing and / or the lid. By providing heat dissipation units or by cooling the control components, the individual control components can take on larger currents or a higher permissible current intensity can be set for these control components. This also provides a larger bandwidth of power supplies.

In a preferred development of the invention, the control arrangement has test means by means of which the thermal connection of the control components can be tested for their effectiveness. By testing the control components for their effectiveness, it is easy to detect changes or damage at an early stage. In this case, it is preferably proposed to investigate the temperature or the heating of the control components in the context of a read-back option in order in particular to test the thermal coupling. Here, for example, in the manufacture of the module and a setting of known currents successively to individual control components (for example, by current limitation), the thermal gradient as well as the absolute temperature can be determined. If, with the same power loss in one control component, the temperature rise is faster or higher over time than with another one, the quality of each thermal coupling (cooling effect) can be deduced. Thereafter, it is preferred to use e.g. a shift of the power loss to cooler places causes.

In a further preferred embodiment of the invention, the energy management unit is also equipped with the function of a control component. Thus, the provision of a (further independent) control component can be omitted.

In a further preferred development of the invention, the control arrangement has a plurality of voltage paths / current paths, wherein each of the voltage paths / current paths can provide a supply voltage or a current. In one or more of the voltage paths / current paths, a plurality of the control components are preferably arranged, which are particularly preferably connected in parallel. Particularly preferably, a plurality of control components are arranged in each of the voltage paths / current paths.

In a further preferred embodiment of the invention, the logic unit, the energy management unit and the control components via at least one bus indirectly or directly connected to each other so that they can communicate with each other via this at least one bus. In particular, the logic unit is connected to the energy management unit via a bus and the control components are connected to each other and to the energy management unit via at least one further bus.

In a further preferred development of the invention, the different control components on the bus are characterized by programming or by wiring with different resistances. Thus, it is possible that the energy management unit can control each individual control component and read its temperature. The permissible maximum currents or temperatures for each control component, in particular for each switching regulator of a control component, are written by the energy management unit into the control component. For example, this information can be stored in a register.

In a further preferred embodiment of the invention, the control components can be designed as different types. The various types of control components may, for example, different housing shapes or different interpretations with respect to the switching regulator (maximum possible current) have. However, embodiments are also possible in which the control components are designed as double components with two or more switching regulator components.

In a further preferred embodiment of the invention, some of the control components are cooled particularly well, for example, by being connected to heat dissipation units, which have a particularly high heat capacity or convection to the environment, so that the number of control components can be reduced.

According to the method, a change of the control of the control components is preferably made such that a uniform temperature distribution over all control components is present. In other words, the control components are controlled such that all control components have substantially the same temperature. This has the advantage that a uniform aging of the control components is given. For this control, in particular the current temperature of the Regulated components and their specific heat dissipation (connection to heat sink) considered.

In a particularly preferred development of the invention, control components which are located in the vicinity of other components or circuit areas, in particular sensitive circuit areas, are assigned a lower current load and thus lower self-heating, so that these other components or circuit areas are not so thermally so strong be charged. In this case, therefore, one or more of the control components have a different, lower temperature than the rest of the control components. The control components of this lower temperature are located near other components / circuit areas which would be overburdened by a non-reduced temperature. For example, these components / circuit areas have a temperature limit, which can be taken into account for the change in the control.

Preferably, the adaptation of the control components is made in their power output or voltage supply according to their temperature situation and taking into account the entire necessary supply current / supply voltage.

• - Feststellen der (aktuellen) Temperatur der Regelbauteile,
• - Ermitteln der maximalen thermischen Belastbarkeit von Nachbarbauteilen (Bauteilen in der Umgebung der Regelbauteile),
• - Ermittlung der aktuellen Belastung der Nachbarbauteile,
• - Ermittlung der Entfernung zwischen den Nachbarbauteilen und den Regelbauteilen,
• - Ermittlung der zukünftigen Beeinflussung der Nachbarbauteile durch die Temperatur der Regelbauteile,
• - Identifizierung von Regelbauteilen, deren Temperatur reduziert werden sollte, um die Nachbarbauteile zu schützen,
• - Ermittlung eines gemeinsamen angestrebten Temperaturlevels der Regelbauteile, ggf. unter Berücksichtigung von geringeren Temperaturen bei einzelnen Regelbauteilen durch umliegende Nachbarbauteile,
• - Berechnung einer Änderung in der Ansteuerung von einzelnen oder allen Regelbauteilen durch die Logikeinheit oder durch die Energiemanagementeinheit auf Grundlage von einzelnen oder mehreren der o.g. Informationen bzw. Berechnung einer Umverteilung von Stromlast/Spannungsbereitstellung durch die Regelbauteile.

The process steps may concern:

• - determining the (current) temperature of the control components,
• Determining the maximum thermal load capacity of neighboring components (components in the vicinity of the control components),
• - determination of the current load of the neighboring components,
• Determination of the distance between the neighboring components and the control components,
• Determination of the future influence of the neighboring components by the temperature of the control components,
• - Identification of control components whose temperature should be reduced to protect neighboring components,
• Determination of a common desired temperature level of the control components, possibly taking into account lower temperatures for individual control components by surrounding neighboring components,
• - Calculation of a change in the control of individual or all control components by the logic unit or by the energy management unit based on individual or more of the above information or calculation of a redistribution of power load / voltage supply by the control components.

The invention further relates to the use of the control arrangement in a motor vehicle and a motor vehicle control unit which comprises an above-mentioned control arrangement.

Further preferred embodiments will become apparent from the subclaims and the following description of exemplary embodiments with reference to figures.

• 1 eine schematische Darstellung einer erfindungsgemäßen Steueranordnung,
• 2 eine schematische Seitenansicht eines Teils eines erfindungsgemäßen Bremssteuergeräts, insbesondere zur Darstellung der Wärmeableitungseinheiten sowie
• 3 eine Draufsicht auf eine Leiterplatte für eine erfindungsgemäße Steueranordnung.

In a schematic representation, by way of example:

• 1 a schematic representation of a control arrangement according to the invention,
• 2 a schematic side view of a portion of a brake control device according to the invention, in particular for the representation of the heat dissipation units and
• 3 a plan view of a printed circuit board for a control arrangement according to the invention.

1 shows a control arrangement 1 comprising a logic unit 3 , which is designed in particular as a microprocessor or microcontroller. Furthermore, the control arrangement comprises 1 an energy management unit 5 - which may include complex control units or a microcontroller - and several control components 7 , By way of example, here is a single voltage path 9 shown, which the control components 7 assigned. The different control components 7 have different thermal resistances (thermal derivatives, see arrow symbols with S1 . S2 . S3 in 1 ). Each control component 7 thus has a different thermal connection S1 . S2 . S3 (see different size of the arrows), which define the thermal load capacity of each control component - and thus in total that of the overall system. To the control components 7 while switching controller typical coils and capacitors are connected to the output; various transistor switches, diodes and a drive logic are preferably integrated (not shown).

The control arrangement 1 can still have one or more consumers 13 include. Furthermore, the energy management unit 5 and the control components 7 over a first bus 15 connected with each other. About this first bus 15 can the power management unit 5 with the control components 7 communicate and control these and / or the thermal state of the control components 7 determine or read the temperature. The address of the individual control components 7 with which the Energy management unit 5 the individual control components 7 can address, for example, with different resistances R1 . R2 . R3 on the control components 7 set. Alternatively, a daisy-chain method can also be used. Between the energy management unit 5 and the logic unit 3 is a second bus 17 provided over which the logic unit 3 and the energy management unit 5 can communicate with each other.

2 shows a schematic side view and sectional view of a brake control unit with a circuit board 19 on which different control components 7 are placed. Furthermore, heat dissipation units 21 . 23 and 25 shown. The heat dissipation unit 21 is designed as a cover of the brake control unit, while the heat dissipation unit 25 represents a part of a housing of the brake control unit. The heat dissipation unit 23 however, is designed as a heat sink, which is formed for example as an SMD component or as in 2 , Reference numeral 23 , shown, partially in the circuit board 19 is introduced. Thus, various types of heat dissipation units are presented, including the control components 7 each have a thermal connection (not shown). The thermal connection can be made in each case, for example, via thermal paste or soldering. About this thermal connection, the respective control components 7 Heat to the heat dissipation units 21 . 23 . 25 give off and thus reduce temperature. The control component 7A For example, with the housing cover 21 thermally connected. The control component 7B is with a heat sink 21 thermally connected while the control component 7C a temperature reduction via the connection to the housing 25 can obtain. The control component 7D is only on the PCB 19 and the surrounding air thermally connected. The heat dissipation units 21 . 23 . 25 are preferably designed as heat sinks and thereby for example made of metal.

3 shows a circuit board 19 in a plan view, being on the circuit board 19 an energy management unit 5 is arranged. Moreover, in 3 a consumer 13 on the circuit board 19 placed and there are different control components 7E-M shown. Furthermore, two less resilient components (= neighboring components) 27A . 27B arranged on the circuit board. The control component 7M What near the less thermally resistant components 27A . 27B is arranged, is preferably driven with reduced power or reduced power dissipation. This will be the less resilient components 27A . 27B spared. The control components 7H under 7I are examples of a different voltage path than the control components 7E-G and 7J-M , The other voltage path, which with the control components 7H and 7I equipped, it is thus possible for another consumer or a different voltage level of the same consumer ( 13 ) operate with electricity, as the control components 7E-G and 7J-M , which eg the power supply for the consumer 13 provide.

LIST OF REFERENCE NUMBERS

1

control arrangement

3

logic unit

5

Energy management unit

7, A-D, E-M

regulation component

9

voltage path

11

supply voltage

13

consumer

15

first bus

17

second bus

19

circuit board

21

Heat dissipation unit

23

Heat dissipation unit

25

Heat dissipation unit

27A + B

thermally less resilient components / neighboring components

S1, S2, S3

Thermal dissipation potential

R1, R2, R3

resistance

Further details of the invention will be apparent from the following information:

In order to allow a good adaptability of the output power, several satellites (= control components) can be connected in parallel to provide the necessary supply current to a voltage path. The satellites of one or more strands are then connected to the PMIC (energy management unit) by a bus system. The different satellites on a bus can be identified by programming or wiring eg with different resistances. The PMIC can thus address each individual satellite separately via bus communication. The PMIC can read the temperature at each satellite. The satellites are electronic, integrated circuits, each of which can provide / regulate a voltage supply with a current as a switching regulator, wherein the components include a temperature sensor and can be controlled via a bus. The components may point to a voltage written across the bus and do this up to a set maximum temperature or maximum current.

The PMIC ensures that the supply voltages / currents are provided to the powerful microprocessor and possibly other components. When the supply voltage 11 is applied to the system, the PMIC can independently (as it is programmed or set, the supply voltages in the supply line 9 cause. Now eg also logic unit (microprocessor) can start to work. At this point, the process of the invention begins and the temperatures are balanced. Advantageously, fewer satellites are required compared to the prior art with a longer service life for the system. In addition, thermally critical components in the vicinity of a controller component are not overloaded.

The permissible maximum currents for which the satellite (switching regulator of the respective satellite) is designed by the manufacturer or which are desired, are written by the PMIC into the satellite. There are different types of satellite switching controllers. That Housing forms but also interpretations regarding switching regulators (amperage) and double-satellite modules with two or more switching modules.

Example: Will now be at a voltage level, e.g. 1.2V, a maximum current of 7A (A = Ampere) required by the electronics circuit and are available to 3A rated satellites, so all satellites are usually used at 3A rated power. If e.g. 16A requires and has satellites with 5A rated current, at least four satellites each with 5A are installed.

Applications of PMICs with satellites preferably set identical current values and also identical temperature values on a string with the same satellites. If individual satellites are cooled by special techniques, eg direct thermal connection to metallic heatsinks or graphene heatsinks (graphene = very good thermally conductive graphite material) or by cooling, eg by thermal paste, directly or through the circuit carrier, the components can handle significantly higher power losses without overheating, or without going into accelerated aging. For example, a component designed for 3A rated power can definitely tolerate 3.8A and more, for example. A 5A Component quite 6.2A or more.

It should be provided in connection with the invention, a method preferably in the PMIC, which adapts the satellite according to their temperature situation in their current output / voltage supply, taking into account the necessary total supply current / supply voltage. The manipulation is carried out according to the invention such that one or more satellites running hotter in relation to the other satellites of the strand are withdrawn with respect to the output current, thus establishing a more uniform thermal aging profile and ultimately increasing the lifetime of the overall circuit. According to training, a higher permissible amperage can be set for the satellites than for satellites without major cooling measures, provided that they do not run too high thermally.

In the context of the invention, the number of satellites can be reduced if individual satellites are cooled particularly well and thereby take over a larger current. Instead of serving 16 A total of four 5A satellites as in Example 16A above, only three satellites can be used if e.g. a satellite is cooled particularly well, the current limit is set high and it is e.g. instead of 5A, for example, can withstand 6A or 6.5A. Of course, two or all three satellites can be cooled better and used better with a new threshold. Thermal differences can then correct the PMIC by driving the satellites.

In addition to reducing the number of satellites and increasing the lifetime, the method also offers the possibility of thermally less stressing circuit areas in the neighborhood (neighboring components) by taking over the satellites in the areas of less power load.

In addition to the described fields of application of the new method, the possibility of reading back the temperature of the satellites is proposed in order to test the thermal coupling / connection of the satellites in an assembly. Here, e.g. in the manufacture of the assembly and adjustment of known currents one after the other at individual satellites (e.g., by current limitation), the thermal gradient as well as the absolute temperature are determined. If, with the same power loss in one satellite, the temperature increase is faster or higher over time than with another one, the thermal coupling can be concluded. By means of this technique, changes can be detected at an early stage during production as well as in the course of operation.

Similar to a satellite, such a satellite function can be integrated in the PMIC itself. Then, e.g. one satellite less needed.

The method is preferably also designed to combine satellites with a wide variety of permissible drivers or loss lines and to approach satellite-specific optimum temperature ranges. By way of example, the control of the satellites with respect to temperature and thus life etc. should be done by the PMIC itself. As a variant, a Durchgrifffunktion is provided by a microprocessor system by the PMIC itself to set the optimized limits.

Important points in connection with the invention are the manipulation of the currents in individual satellites with knowledge of the satellite temperature for life extension and / or for reducing the number of satellites, in particular by different cooling / cooling options on individual satellites or around temperature ranges of the circuit board in which or more satellites, which are less to heat.

Also important is the integration of the novel power distribution method in the PMIC itself or in a microprocessor system which can access the data (in particular temperature data) of the satellites and then adjust current values by accessing the PMIC or passing through the PMIC.

In the method, the invention relates to counteracting the reduction in the temperature of the control components which are well cooled by the good thermal connection by displacing higher currents onto them and / or relieving the less thermally connected control components by lowering the load currents concerned. It is thus made a distribution of the currents or voltages on the control components such that takes place to relieve individual control components, a shift of currents / voltage to other components. Overall, this results in a uniform temperature distribution over all control components.

An exception can be made for the protection of temperature-sensitive neighboring components in the vicinity of control components. In this case, the temperature of individual control components, which would influence the neighboring components too much, compared to the other control components is reduced so that a temperature limit is not exceeded in the neighboring components. Thus, no even temperature distribution over all control components is given, but for example only over the majority of the control components with the exception of individual, reduced in temperature control components. In other words, the proportionate power dissipation distribution in a power supply string is changed dynamically over the operating time, taking into account the temperature of the individual control components and temperature limits or maximum temperature loads of neighboring components.

When the neighboring components are taken into account, information about the distance between neighboring component and control component, the temperature limit value of the neighboring component and the current temperature of the control component are preferably included. In particular, an estimate / a calculation can be made as to whether the temperature limit value of the neighboring component is exceeded at the given distance and the current temperature of the control component at a specific time. Thereafter, the affected control component is driven accordingly - namely, e.g. such that the temperature limit of the neighboring component is not exceeded. Information about the heat dissipation capability of the individual components may also be included in this estimation / calculation. Data can be stored in registers, for example.

Claims (10)

Control arrangement for providing different voltage and / or power supplies, wherein the control arrangement (1) - a logic unit (3), - an energy management unit (5) and - a plurality of control components (7, 7A-M), wherein the control components (7, 7A -M) by the energy management unit (5), and the energy management unit (5) has detection means by means of which the temperature of the control components (7, 7A-M) can be determined, characterized in that the control components (7, 7A-M) in addition by the logic unit (5) are controllable and the control arrangement (1) has means of change by means of which the control of the control components (7, 7A-M) can be changed on the basis of the detected temperature. Control arrangement according to one of the preceding claims, characterized in that the control arrangement (1) comprises one or more heat dissipation units (21, 23, 25) and one or more of the control components (7, 7A-M) thermally with one or more of the heat dissipation units ( 21, 23, 25) are connected and via this thermal connection, the temperature of the control components (7, 7A-M) can be reduced. Control arrangement according to one of the preceding claims, characterized in that the control arrangement (1) comprises test means by means of which the thermal connection of the control components (7, 7A-M) can be tested for their effectiveness. Control arrangement according to one of the preceding claims, characterized in that the control arrangement comprises a plurality of voltage paths (9), each comprising at least one control component (7, 7A-M) and by means of which in each case a supply voltage can be provided. Method for providing different voltage and / or power supplies (11) by means of a control arrangement (7, 7A-M), wherein the control arrangement (1) - a logic unit (3), - an energy management unit (5) and - several control components (7, 7A-M), wherein the control components (7, 7A-M) are controlled by the power management unit (5) or by the logic unit (3) to provide a voltage or current and the following steps are performed: - detecting the temperature of the control components (7, 7A-M) by means of the energy management unit (5), - changing the control of the control components (7, 7A-M) by the energy management unit (5) or by the logic unit (3) based on the detected temperature of the control components (7, 7A-M). Method according to Claim 5 , characterized in that the following step is performed: - Changing the control of the control components (7, 7A-M) such that a uniform temperature distribution over all control components (7, 7A-M) is present. Method according to Claim 6 , characterized in that the control of one or more of the control components (7M) deviating from a uniform temperature distribution over all control components (7, 7A-M) is changed such that the temperature of one or more adjacent components (27A, 27B), the are arranged in the vicinity of the one or more control components (7M), does not exceed a limit. Method according to one of Claims 5 to 7 characterized in that the control arrangement (1) comprises at least one heat dissipation unit (21, 23, 25) and one or more of the control components (7, 7A-M) are thermally connected to one or more of the heat dissipation units (21, 23, 25) and the control arrangement (1) has test means, wherein the thermal connection of the control components (7, 7A-M) is tested for their effectiveness by means of the test means. Use of a control arrangement (1) according to one of Claims 1 to 4 in a motor vehicle. Motor vehicle control unit for a motor vehicle, wherein the motor vehicle control unit, the control arrangement (1) according to one of Claims 1 to 4 having.

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