DE102017200055A1 - MEMS-Sensorvorrichtung und Verfahren zum Herstellen einer MEMS-Sensorvorrichtung - Google Patents

MEMS-Sensorvorrichtung und Verfahren zum Herstellen einer MEMS-Sensorvorrichtung Download PDF

Info

Publication number
DE102017200055A1
DE102017200055A1 DE102017200055.4A DE102017200055A DE102017200055A1 DE 102017200055 A1 DE102017200055 A1 DE 102017200055A1 DE 102017200055 A DE102017200055 A DE 102017200055A DE 102017200055 A1 DE102017200055 A1 DE 102017200055A1
Authority
DE
Germany
Prior art keywords
layer
sections
sensor device
piezoelectric
sensor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE102017200055.4A
Other languages
German (de)
English (en)
Inventor
Thomas Buck
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Priority to DE102017200055.4A priority Critical patent/DE102017200055A1/de
Priority to PCT/EP2017/082020 priority patent/WO2018127355A1/fr
Publication of DE102017200055A1 publication Critical patent/DE102017200055A1/de
Pending legal-status Critical Current

Links

Images

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B81B3/0018Structures acting upon the moving or flexible element for transforming energy into mechanical movement or vice versa, i.e. actuators, sensors, generators
    • B81B3/0021Transducers for transforming electrical into mechanical energy or vice versa
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R17/00Piezoelectric transducers; Electrostrictive transducers
    • H04R17/02Microphones
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/01Manufacture or treatment
    • H10N30/08Shaping or machining of piezoelectric or electrostrictive bodies
    • H10N30/081Shaping or machining of piezoelectric or electrostrictive bodies by coating or depositing using masks, e.g. lift-off
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/30Piezoelectric or electrostrictive devices with mechanical input and electrical output, e.g. functioning as generators or sensors
    • H10N30/302Sensors
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00Specific applications of microelectromechanical systems
    • B81B2201/02Sensors
    • B81B2201/0257Microphones or microspeakers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00Basic microelectromechanical structures
    • B81B2203/01Suspended structures, i.e. structures allowing a movement
    • B81B2203/019Suspended structures, i.e. structures allowing a movement characterized by their profile
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2201/00Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
    • H04R2201/003Mems transducers or their use

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Micromachines (AREA)
DE102017200055.4A 2017-01-04 2017-01-04 MEMS-Sensorvorrichtung und Verfahren zum Herstellen einer MEMS-Sensorvorrichtung Pending DE102017200055A1 (de)

Priority Applications (2)

Application Number Priority Date Filing Date Title
DE102017200055.4A DE102017200055A1 (de) 2017-01-04 2017-01-04 MEMS-Sensorvorrichtung und Verfahren zum Herstellen einer MEMS-Sensorvorrichtung
PCT/EP2017/082020 WO2018127355A1 (fr) 2017-01-04 2017-12-08 Dispositif capteur à mems à structure piézoélectrique et procédé de fabrication associé

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102017200055.4A DE102017200055A1 (de) 2017-01-04 2017-01-04 MEMS-Sensorvorrichtung und Verfahren zum Herstellen einer MEMS-Sensorvorrichtung

Publications (1)

Publication Number Publication Date
DE102017200055A1 true DE102017200055A1 (de) 2018-07-05

Family

ID=60857036

Family Applications (1)

Application Number Title Priority Date Filing Date
DE102017200055.4A Pending DE102017200055A1 (de) 2017-01-04 2017-01-04 MEMS-Sensorvorrichtung und Verfahren zum Herstellen einer MEMS-Sensorvorrichtung

Country Status (2)

Country Link
DE (1) DE102017200055A1 (fr)
WO (1) WO2018127355A1 (fr)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140339657A1 (en) 2008-06-30 2014-11-20 The Regents Of The University Of Michigan Piezoelectric mems microphone

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20040103977A (ko) * 2002-04-17 2004-12-09 (주)엠투엔 마이크로 압전 액추에이터 및 그 제조 방법
US8379888B2 (en) * 2008-01-18 2013-02-19 National Taiwan University Flexible piezoelectric sound-generating devices

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140339657A1 (en) 2008-06-30 2014-11-20 The Regents Of The University Of Michigan Piezoelectric mems microphone

Also Published As

Publication number Publication date
WO2018127355A1 (fr) 2018-07-12

Similar Documents

Publication Publication Date Title
EP1550349B1 (fr) Membrane et procede de realisation associe
DE102006055147B4 (de) Schallwandlerstruktur und Verfahren zur Herstellung einer Schallwandlerstruktur
DE102008043524B4 (de) Beschleunigungssensor und Verfahren zu seiner Herstellung
DE102012200929B4 (de) Mikromechanische Struktur und Verfahren zur Herstellung einer mikromechanischen Struktur
DE10160830A1 (de) Mikromechanische Sensoren und Verfahren zur Herstellung derselben
DE19632060A1 (de) Verfahren zur Herstellung eines Drehratensensors
EP1198695B1 (fr) Procede de production d'un ressort a torsion
DE102006053290B4 (de) Beschleunigungssensor
DE102014225934A1 (de) Elektrostatisch auslenkbares mikromechanisches Bauelement
DE102011080978A1 (de) Verfahren zur Herstellung einer mikromechanischen Struktur und mikromechanische Struktur
WO2020207798A1 (fr) Composant micromécanique pour dispositif de capteur ou de commutateur capacitif
DE102013217111A1 (de) Mikromechanisches Bauteil und Verfahren zur Herstellung eines mikromechanischen Bauteils
DE102020108433B4 (de) Vorrichtung mit einer Membran und Herstellungsverfahren
DE102015212669B4 (de) Kapazitive mikroelektromechanische Vorrichtung und Verfahren zum Ausbilden einer kapazitiven mikroelektromechanischen Vorrichtung
DE102017200108A1 (de) Mikromechanische Schallwandleranordnung und ein entsprechendes Herstellungsverfahren
DE102010061795A1 (de) Verfahren zum Erzeugen einer mikromechanischen Membranstruktur und MEMS-Bauelement
DE102008054553B4 (de) Beschleunigungssensor
DE102016107059A1 (de) Integriertes Halbleiterbauelement und Herstellungsverfahren
DE102017200055A1 (de) MEMS-Sensorvorrichtung und Verfahren zum Herstellen einer MEMS-Sensorvorrichtung
DE102018222615A1 (de) Bauelement mit einer optimierten mehrlagigen Torsionsfeder
DE102010062056B4 (de) Mikromechanisches Bauteil
DE102011081014B4 (de) Mikromechanisches Bauteil und Herstellungsverfahren für ein mikromechanisches Bauteil
DE10200903A1 (de) Beschleunigungssensor und Verfahren zum Herstellen desselben
DE102008001038B4 (de) Mikromechanisches Bauelement mit Schrägstruktur und entsprechendes Herstellungsverfahren
DE102005010393A1 (de) Halbleitersensor zur Erfassung einer dynamischen Grösse

Legal Events

Date Code Title Description
R012 Request for examination validly filed