DE102017111927A1 - Organic optoelectronic component, component arrangement, method for producing a component arrangement and method for producing an organic optoelectronic component - Google Patents

Abstract

In various exemplary embodiments, provision is made for an organic optoelectronic component (10) with an organic functional layer structure (22) and with a planar holding body (40) on which the organic functional layer structure (22) is formed and which has at least one first tab (42 ) which is formed integrally with the rest of the holding body (40) and which protrudes from the rest of the holding body (40).

Description

The invention relates to an organic optoelectronic component, a component arrangement, a method for producing a component arrangement and a method for producing an organic optoelectronic component.

Organic-based optoelectronic components, so-called organic optoelectronic components, are increasingly being used. For example, organic light-emitting diodes (OLEDs) are increasingly finding their way into general lighting, for example as surface light sources, but OLEDs are also increasingly used in the automotive sector. Due to the new design possibilities of the OLEDs compared to conventional light sources, in particular with regard to their external shapes, increasingly new concepts for holders for holding the OLEDs are required as the distribution of the OLEDs increases.

An organic optoelectronic component, for example an OLED, may comprise an anode and a cathode and, between them, an organic functional layer system. The organic functional layer system may comprise one or more emitter layers in which electromagnetic radiation is generated, a charge carrier pair generation layer structure each consisting of two or more charge generating layers (CGL) for charge carrier pair generation, and one or more Electron block layers, also referred to as hole transport layers (HTL), and one or more hole block layers, also referred to as electron transport layers (ETLs), for directing the flow of current.

Among the OLEDs, flexible OLEDs, which can easily be brought from their flat form into a curved shape, are very much in demand for certain purposes, and it is frequently desired in the field of general lighting and in the automotive sector in particular that the bent OLEDs be permanently embedded in the OLEDs stay curved shape. In this case, various technical hurdles have to be overcome, such as the avoidance of damage to active layers and / or the outer layers of the OLEDs, where the generated light emerges from the OLEDs, the "in-form holding" during the joining process and / or a high positioning accuracy when attaching to the corresponding bracket. Furthermore, the contact area directed towards the viewer can represent a visual impairment in top emitter OLEDs. For example, for the electrical contacting flexible printed circuit boards are used, which are attached to the contact areas of the OLEDs.

An object of the invention is to provide an organic optoelectronic component which can be fastened to a holder quickly, simply, inexpensively, without or at least with negligible damage and / or precisely in a bent state.

An object of the invention is to provide a component arrangement in which an organic optoelectronic component is fastened in a simple manner, inexpensively, without or at least negligibly little damage and / or precisely in a bent state to a holder.

An object of the invention is to provide a method for producing a component arrangement with a bent organic optoelectronic component which can be carried out quickly, simply, inexpensively, precisely and / or without or at least with negligibly little damage to the organic optoelectronic component.

An object of the invention is to provide a method for producing an organic optoelectronic component which can be carried out quickly, easily and / or inexpensively and which contributes to the fact that the organic optoelectronic component can be quickly, easily, inexpensively, precisely and / or without or at least with negligible damage in a bent state can be attached to a bracket.

An object of the invention is achieved by an organic optoelectronic component having an organic functional layer structure and having a planar holding body on which the organic functional layer structure is formed and which has at least one first tab, which is formed integrally with the rest of the holding body and the the remaining holding body protrudes.

The holding body with the tab allows to clamp the organic optoelectronic device in a bent state in a corresponding holder, wherein the tab on a first Stop element of the holder is applied and another part of the organic optoelectronic component rests against a second stop element of the holder. In other words, the holding body and the tab form an anchor function for attaching the organic optoelectronic component, whereby the organic optoelectronic component can be attached to the holder quickly, easily, inexpensively, without or at least negligibly little damage and / or precisely in a bent state, and although by mechanical anchoring. Since the tab is integrated into the organic optoelectronic component, intrinsically small tolerances result in the attachment of the organic optoelectronic component. The dimensions and positions of the tab can be adapted to the expected forces.

Optionally, the tab can easily be used to make electrical contact with the organic optoelectronic component. If, for example, the tab protrudes on an optically inactive rear side of the organic optoelectronic component, a back contact with the organic optoelectronic component can easily be effected via the tab. In this case, the contacting can be configured such that neither a flexible printed circuit board for electrically contacting the organic optoelectronic component nor a contact region of the organic optoelectronic component is visible to a viewer. For the purpose of electrical contacting, the tab may have a metallization and / or a metal layer. A connecting lead, for example a flexible printed circuit board, can be made before or after the formation of the tab and the corresponding bending of the tab near the later bending edge, for example by means of ACF bonding, soldering or welding.

Alternatively or additionally, the holding body in a region in which the tab is formed, be made mechanically reinforced or bendable by means of a plastically deformable shaped piece. Such a shaped piece can be glued, for example, on the holding body.

Alternatively or additionally, depending on the intended use of the organic optoelectronic component, the tab may be laminated to a potential observer with a cover, for example a scattering foil or other decorative foils.

The holding body has a first main surface and a second main surface facing away from the first main surface. The organic functional layer structure may be formed on the first main surface or on the second main surface. Furthermore, an organic functional layer structure can each be formed on both main surfaces.

The tab may protrude from the remaining holding body on the side of the first main surface or on the side of the second main surface. The organic optoelectronic component can be a top emitter, a bottom emitter or a double-sided emitting OLED, wherein the generated light can optionally be emitted by the holding body, which in this case is translucent or transparent.

That the holding body has the tab means that the tab is formed integrally with the holding body and / or that the tab is formed by a part of the holding body. For example, in the manufacture of the tab, the holding body is severed in a predetermined portion and a part of the holding body is bent away from the rest of the holding body. This bent-away part of the holding body then forms the tab. The tab is thus not formed independently of the holding body and then attached thereto.

According to a development, the organic optoelectronic component has a substrate which has the holding body and a first electrode layer, which is formed on the holding body and on which the organic functional layer structure is formed. In other words, the holding body forms part of the substrate of the organic optoelectronic component on which the first electrode layer and the organic functional layer structure are formed. This makes it possible to form the organic optoelectronic component including holding body particularly thin.

According to a development, the organic optoelectronic component has a substrate, which is arranged on the holding body and which has a first electrode layer, on which the organic functional layer structure is formed, wherein the holding body serves as a heat sink. In other words, the first electrode layer and the organic functional layer structure are formed on a substrate which is disposed on the holding body serving as a heat sink of the organic optoelectronic component in this case. This helps to keep the heat generated during the operation of the organic Optoelectronic device is generated in the organic functional layer structure, particularly fast and efficient can be dissipated.

According to a development, the holding body has at least one second lug, which is formed integrally with the rest of the holding body, which protrudes from the rest of the holding body and which is spaced from the first tab. The second tab contributes to the fact that the holding body can be attached to the holder in a particularly stable and / or precise manner.

According to a development, the tabs each have a first main surface, which is formed by a first main surface of the holding body, and a second main surface, which is formed by a second main surface of the holding body, wherein the second major surfaces of the tabs face each other and wherein the Lugs protrude on the side of the holding body of the holding body, on which the second main surface of the holding body is formed. Compared with edges of the tabs connecting the respective major surfaces of the tabs, the major surfaces form relatively wide abutment surfaces for securing the organic optoelectronic device. A mechanical force which acts on the tabs, in particular a restoring force, when the bent organic optoelectronic component is clamped with the lugs on a corresponding holder, can then be distributed to the relatively large main surfaces.

According to a development, the lugs each have a first main surface, which is formed by a first main surface of the holding body, and a second main surface, which is formed by a second main surface of the holding body, wherein the main surfaces of the tabs in each case by a peripheral edge of the corresponding tabs connected to each other and the edges of the two tabs facing each other and wherein the tabs on the side of the holding body protrude from the holding body, on which the second main surface of the holding body is formed. The fact that the edges of the two tabs face each other, causes the mechanical force acting on the tabs, in particular a restoring force, when the bent organic optoelectronic component is clamped with the tabs on a corresponding bracket, orthogonal to the bending direction of the tabs on the Edges of the tabs works. In this direction, the tabs are particularly stable and can accommodate a relatively large restoring force, without being bent themselves.

According to a development, at least one of the tabs is rectangular or trapezoidal in shape, wherein the longer base side projects from the holding body in the trapezoidal shaped tab. Such suitable forms of the tab may have an additional locking, positioning and / or centering function.

An object of the invention is achieved by a component arrangement comprising the above-described organic optoelectronic component and a holder, wherein: the holder has a first stop element and at least one second stop element, which are spaced apart from each other; the first tab bears against the first stop element and another part of the organic optoelectronic component bears against the second stop element; and the organic optoelectronic component is bent and is frictionally fixed to the holder due to a return force established in its bending.

The developments and / or advantages explained above with reference to the organic optoelectronic component can easily be transferred to the component arrangement. Therefore, a renewed presentation of these developments and / or advantages is dispensed with and referred to the above representations.

Due to the fixing of the organic optoelectronic component in the bent state on the holder, the organic optoelectronic component remains permanently in a bent state, without the curved shape having to be held beyond this mechanical fixing. The device arrangement may be formed very flat, since no additional adhesive between the holder and the organic optoelectronic device is necessary. Furthermore, a very filigree and / or extravagant holder design is possible because the restoring force of the organic optoelectronic component itself is used for mounting. For example, the holder may be designed so that no or only a slight visual impairment occurs through it. Optionally, the organic optoelectronic component can be fastened to the holder by means of the adhesive in addition to the mechanical attachment.

If the organic optoelectronic component is designed such that it emits the generated light in the direction of the holder, then the holder is designed such that the corresponding light can still be used. For example, the holder may have a reflective layer that reflects the light impinging on it. Alternatively or additionally, the holder can be translucent or transparent. Alternatively or additionally, the holder may have a kind of window through which the corresponding light can pass.

According to a development, the other part of the organic optoelectronic component which bears against the second stop element is the second lug. In other words, the organic optoelectronic component is fixed by means of the tabs on the stop elements of the holder, in particular clamped. This contributes to a particularly good and / or precise attachment of the organic optoelectronic component to the holder.

According to a development, the holder has a first recess with a first inner wall, wherein the first tab is arranged in the first recess and the first inner wall forms the first stop element. Thus, the first tab is disposed in the first recess and presses against the first inner wall due to the restoring force of the organic optoelectronic component. The other part of the organic optoelectronic component, for example the second tab, presses against the second stop element, whereby the organic optoelectronic component is clamped to the holder.

According to a development, the first recess has a second inner wall, which forms the second stop element. In particular, the first recess is formed so large that both the first tab and the other part of the organic optoelectronic component, for example, the second tab, are arranged in the first recess and press against the corresponding inner wall, whereby the organic optoelectronic component on the holder is clamped.

According to a development, the holder has a second recess, which has a second inner wall, which forms the second stop element. Thus, the other part of the organic optoelectronic component, for example the second tab, is arranged in the second recess. In this case, the other part of the organic optoelectronic component, for example the second tab, presses against the second inner wall of the second recess and the first tab due to the restoring force of the organic optoelectronic component, presses against the first inner wall of the first recess, whereby the organic optoelectronic component on the Holder is clamped.

According to a development, the holder has the first recess, wherein the organic optoelectronic component is at least partially arched into the first recess and the stop elements are formed outside the recess. For example, the holder forms a frame, wherein the organic optoelectronic component is arched into the frame and the tabs of the holding body are arranged outside the frame. Due to the restoring force of the bent organic optoelectronic component, the tabs press from the outside against the frame, whose outer sides form the stop elements.

An object of the invention is achieved by a method for producing a component arrangement, in which: the above-described organic optoelectronic component is bent and the bent organic optoelectronic component is clamped in the previously explained holder in such a way that the first tab on the first stop element the holder bears and the other part of the organic optoelectronic component, for example the second tab, bears against the second stop element of the holder, wherein the organic optoelectronic component is frictionally fixed on the holder due to the restoring force established in its bending.

The organic optoelectronic component can be bent by machine, partially manually or manually and / or fixed to the holder, since the accuracy of the positioning of the organic optoelectronic component in the holder is determined by a suitable positioning and accurate production of the tab.

An object of the invention is achieved by a method for producing the above-described organic optoelectronic component, in which the planar holding body is provided, the organic functional layer structure is arranged or formed over the holding body, and before and / or after the formation of the organic functional layer structure at least the first tab is formed from the holding body so that it protrudes from the remaining holding body.

The fact that the tab is formed before and / or after forming the organic functional layer structure may mean that the tab, including bending the tab, is formed prior to forming the organic functional layer structure such that the tab is devoid of the organic functional layer structure prior to forming the organic functional layer structure remaining holding body is partially separated and bent away from the rest of the holding body after the formation of the organic functional layer structure or that the tab is formed including the partial separation of the tab of the remaining holding body after forming the organic functions layer structure. If the holding body is part of the substrate of the organic optoelectronic component, the tab can be formed corresponding to the preceding one before and / or after the formation of the first electrode layer.

The tab can be separated from the rest of the holding body, for example by means of lasing or punching a corresponding tab structure and by means of subsequent bending of the tab away from the rest of the holding body.

Embodiments of the invention are illustrated in the figures and are explained in more detail below.

• 1 eine seitliche Schnittdarstellung eines Ausführungsbeispiels eines organischen optoelektronischen Bauelements;
• 2 eine seitliche Schnittdarstellung eines Ausführungsbeispiels eines organischen optoelektronischen Bauelements;
• 3 eine Unteransicht eines Ausführungsbeispiels eines Haltekörpers;
• 4 eine seitliche Schnittdarstellung eines Ausführungsbeispiels einer Bauelementanordnung;
• 5 eine seitliche Schnittdarstellung eines Ausführungsbeispiels einer Bauelementanordnung;
• 6 eine seitliche Schnittdarstellung eines Ausführungsbeispiels einer Bauelementanordnung;
• 7 eine seitliche Schnittdarstellung eines Ausführungsbeispiels eines Haltekörpers;
• 8 eine Unteransicht des Haltekörpers gemäß 7;
• 9 eine seitliche Schnittdarstellung eines Ausführungsbeispiels eines Haltekörpers;
• 10 eine Unteransicht des Haltekörpers gemäß 9;
• 11 eine seitliche Schnittdarstellung eines Ausführungsbeispiels einer Bauelementanordnung;
• 12 eine Unteransicht eines Ausführungsbeispiels einer Bauelementanordnung;
• 13 eine seitliche Schnittdarstellung eines Ausführungsbeispiels einer Bauelementanordnung;
• 14 eine seitliche Schnittdarstellung eines Ausführungsbeispiels einer Bauelementanordnung;
• 15 eine seitliche Schnittdarstellung eines Ausführungsbeispiels eines Haltekörpers;
• 16 eine seitliche Schnittdarstellung eines Ausführungsbeispiels eines Haltekörpers;
• 17 eine seitliche Schnittdarstellung eines Ausführungsbeispiels eines Haltekörpers;
• 18 eine seitliche Schnittdarstellung eines Ausführungsbeispiels eines Haltekörpers in einem ersten Zustand;
• 19 eine seitliche Schnittdarstellung des Haltekörpers gemäß 18 in einem zweiten Zustand;
• 20 eine seitliche Schnittdarstellung des Haltekörpers gemäß 18 in einem dritten Zustand.

Show it:

• 1 a side sectional view of an embodiment of an organic optoelectronic device;
• 2 a side sectional view of an embodiment of an organic optoelectronic device;
• 3 a bottom view of an embodiment of a holding body;
• 4 a side sectional view of an embodiment of a component arrangement;
• 5 a side sectional view of an embodiment of a component arrangement;
• 6 a side sectional view of an embodiment of a component arrangement;
• 7 a side sectional view of an embodiment of a holding body;
• 8th a bottom view of the holding body according to 7 ;
• 9 a side sectional view of an embodiment of a holding body;
• 10 a bottom view of the holding body according to 9 ;
• 11 a side sectional view of an embodiment of a component arrangement;
• 12 a bottom view of an embodiment of a component assembly;
• 13 a side sectional view of an embodiment of a component arrangement;
• 14 a side sectional view of an embodiment of a component arrangement;
• 15 a side sectional view of an embodiment of a holding body;
• 16 a side sectional view of an embodiment of a holding body;
• 17 a side sectional view of an embodiment of a holding body;
• 18 a side sectional view of an embodiment of a holding body in a first state;
• 19 a lateral sectional view of the holding body according to 18 in a second state;
• 20 a lateral sectional view of the holding body according to 18 in a third state.

In the following detailed description, reference is made to the accompanying drawings, which form a part of this specification, and in which is shown by way of illustration specific embodiments in which the invention may be practiced. Because components of embodiments may be positioned in a number of different orientations, the directional terminology is illustrative and is in no way limiting. It is understood that others Embodiments used and structural or logical changes can be made without departing from the scope of the present invention. It should be understood that the features of the various embodiments described herein may be combined with each other unless specifically stated otherwise. The following detailed description is therefore not to be taken in a limiting sense, and the scope of the present invention is defined by the appended claims. In the figures, identical or similar elements are provided with identical reference numerals, as appropriate.

An organic optoelectronic device may be an organic electromagnetic radiation emitting device or an organic electromagnetic radiation absorbing device. An organic electromagnetic radiation absorbing component may for example be a solar cell. In various embodiments, an organic electromagnetic radiation-emitting component may be an organic electromagnetic radiation-emitting semiconductor component and / or may be formed as a diode emitting organic electromagnetic radiation or as a transistor emitting organic electromagnetic radiation. The radiation may, for example, be light in the visible range, UV light and / or infrared light. In this context, the organic electromagnetic radiation emitting device may be formed, for example, as an organic light emitting diode (OLED) or as an organic light emitting transistor. The light emitting device may be part of an integrated circuit in various embodiments. Furthermore, a plurality of light-emitting components may be provided, for example housed in a common housing.

1 shows a side sectional view of an embodiment of an organic optoelectronic device 10 ,

The organic optoelectronic component 10 has a carrier 12 on. The carrier 12 has an in 1 overhead first major surface and one facing away from the first major surface, in 1 lower second major surface. The carrier 12 can be translucent or transparent. The carrier 12 serves as a carrier element for electronic elements or layers, for example light-emitting elements. The carrier 12 For example, plastic, metal, glass, quartz and / or a semiconductor material can have or be formed from it. Furthermore, the carrier can 12 comprise or be formed from a plastic film or a laminate with one or more plastic films. The carrier 12 can be mechanically rigid or mechanically flexible.

On the first main surface of the carrier 12 an optoelectronic layer stack is formed. The optoelectronic layer stack has a first electrode layer 14 on that a first contact section 16 , a second contact section 18 and a first electrode 20 having. The carrier 12 with the first electrode layer 14 can also be referred to as a substrate. Between the carrier 12 and the first electrode layer 14 For example, a first barrier layer (not shown), for example a first barrier thin layer, may be formed.

The first electrode 20 is with the first contact section 16 electrically coupled, for example, directly physically connected thereto or integrally formed therewith, and of the second contact portion 18 by means of an electrical insulation barrier 21 electrically isolated. The first electrode 20 can be translucent or transparent. The first electrode 20 has an electrically conductive material, for example, metal and / or a conductive conductive oxide (TCO) or a layer stack of several layers comprising metals or TCOs. The first electrode 20 For example, a layer stack may comprise a combination of a layer of a metal on a layer of a TCO, or vice versa. An example is a silver layer deposited on an indium tin oxide (ITO) layer (Ag on ITO) or ITO-Ag-ITO multilayers. The first electrode 20 may alternatively or in addition to the materials mentioned: networks of metallic nanowires and - particles, such as Ag, networks of carbon nanotubes, graphene particles and layers and / or networks of semiconducting nanowires.

Above the first electrode 20 is an organic functional layered structure 22 formed of the optoelectronic layer stack. The organic functional layer structure 22 For example, it may have one, two or more sublayers. For example, the organic functional layer structure 22 a hole injection layer, a hole transport layer, an emitter layer, an electron transport layer and / or an electron injection layer. The hole injection layer serves to reduce the band gap between the first electrode and hole transport layer. In the hole transport layer is the hole conductivity greater than the electronic conductivity. The hole transport layer serves to transport the holes. In the electron transport layer, the electron conductivity is larger than the hole conductivity. The electron transport layer serves to transport the electrons. The electron injection layer serves to reduce the band gap between the second electrode and the electron transport layer. Furthermore, the organic functional layer structure 22 one, two or more functional layer structure units, each having said sub-layers and / or further intermediate layers.

Over the organic functional layer structure 22 is a second electrode 23 formed of the optoelectronic layer stack. The second electrode 23 is with the second contact section 18 electrically coupled, for example, the second electrode extends 23 directly on the second contact section 18 , The second electrode 23 may according to one of the embodiments of the first electrode 20 be formed, wherein the first electrode 20 and the second electrode 23 may be the same or different. The first electrode 20 serves, for example, as the anode or cathode of the optoelectronic layer structure. The second electrode 23 serves corresponding to the first electrode as the cathode or anode of the optoelectronic layer structure.

The optoelectronic layer stack is an electrically and optically active region. This active region is, for example, the region of the optoelectronic component 10 in which electrical current for operation of the optoelectronic component 10 flows and / or in which electromagnetic radiation is generated or absorbed. On or above the active area, a getter structure (not shown) may be arranged. The getter layer can be translucent, transparent or opaque. The getter layer may include or be formed of a material that absorbs and binds substances that are detrimental to the active area.

Above the second electrode 23 and partially over the first contact portion 16 and partially over the second contact portion 18 is an encapsulation layer 24 of the optoelectronic layer stack which encapsulates the optoelectronic layer stack. The encapsulation layer 24 may be formed as a second barrier layer, for example as a second barrier thin layer. The encapsulation layer 24 can also be referred to as thin-layer encapsulation. The encapsulation layer 24 forms a barrier to chemical contaminants or atmospheric substances, in particular to water (moisture) and oxygen. The encapsulation layer 24 may be formed as a single layer, a layer stack or a layer structure.

The encapsulation layer 24 may include or be formed from: alumina, zinc oxide, zirconia, titania, hafnia, tantalum oxide, lanthania, silica, silicon nitride, silicon oxynitride, indium tin oxide, indium zinc oxide, aluminum doped zinc oxide, poly (p-phenylene terephthalamide), nylon 66 , as well as mixtures and alloys thereof. Optionally, the first barrier layer on the carrier 12 corresponding to a configuration of the encapsulation layer 24 be educated.

In the encapsulation layer 24 are above the first contact section 16 a first recess of the encapsulation layer 24 and over the second contact portion 18 a second recess of the encapsulation layer 24 educated. In the first recess of the encapsulation layer 24 is a first contact area 32 exposed and in the second recess of the encapsulation layer 24 is a second contact area 34 exposed. The first contact area 32 serves for electrically contacting the first contact section 16 and the second contact area 34 serves for electrically contacting the second contact section 18 ,

Above the encapsulation layer 24 is an adhesive layer 36 educated. The adhesive layer 36 has, for example, an adhesive, for example an adhesive, for example a laminating adhesive, a lacquer and / or a resin. The adhesive layer 36 For example, it may comprise particles which scatter electromagnetic radiation, for example light-scattering particles.

Over the adhesive layer 36 is a cover body 38 educated. The adhesive layer 36 serves to fasten the cover body 38 at the encapsulation layer 24 , The cover body 38 has, for example, plastic, glass and / or metal. For example, the cover body 38 may be formed essentially of glass and a thin metal layer, such as a metal foil, and / or a graphite layer, such as a graphite laminate, on the glass body. The cover body 38 serves to protect the organic optoelectronic device 10 , for example, from mechanical forces from the outside. Furthermore, the cover body 38 serve for distributing and / or removing heat, in the organic optoelectronic device 10 is produced. For example, the glass of the cover body 38 serve as protection against external influences and the metal layer of the cover body 38 can to Distributing and / or removing the during operation of the organic optoelectronic component 10 serve arising heat.

The carrier 12 is as a holding body 40 educated. In other words, the holding body 40 from the carrier 12 educated. Thus, the substrate has the holding body 40 and the first electrode layer formed thereon 14 on. The holding body has a first tab 42 and a second tab 44 on. The tabs 42 . 44 are each integral with the holding body 40 educated. The tabs 42 . 44 are each of the same material as the holder body 40 educated. The tabs 42 . 44 make parts of the holding body 40 that of the rest, in other words remaining, holding body 40 partially separated and bent over. In particular, the tabs 42 . 44 so bent in the direction away from the optoelectronic layer stack that they from the rest of the holding body 40 stand in, in 1 downward.

The tabs 42 . 44 each have a first major surface, that of the first main surface of the holding body 40 is formed. The tabs 42 . 44 each have a second major surface, that of the second major surface of the holding body 40 is formed. The first main surfaces of the tabs 42 . 44 are facing away from each other and the second major surfaces of the tabs 42 . 44 are facing each other. In 1 are only the edges of the tabs 42 . 44 to see, with the edges each connect the two main surfaces together. Before bending the tabs 42 . 44 were the tabs 42 . 44 along the edges of the remaining holding body 40 separated. The tabs 42 . 44 serve to attach the organic optoelectronic device 10 on a corresponding bracket (see 4 to 6 and 11 to 14 ).

The tabs 42 . 44 For example, can be formed by the corresponding portions of the holding body 40 from the remaining holding body 40 partially separated, for example by means of laser cutting or by punching, and then these portions of the remaining holding body 40 be bent away.

2 shows a side sectional view of an embodiment of an organic optoelectronic device 10 , which is largely related to 1 explained organic optoelectronic device 10 equivalent. The holding body 40 is in addition to the carrier 12 educated. The carrier 12 is on the holder body 40 trained or arranged. The holding body 40 serves as a heat sink for dissipating heat generated during operation of the organic optoelectronic device 10 arises. The holding body 40 has a material with a high thermal conductivity, for example aluminum or copper. Otherwise, the organic optoelectronic component 10 , in particular the holding body 40 as related to 1 explained organic optoelectronic device 10 or holding body 40 educated.

3 shows a bottom view of an embodiment of a holding body 40 For example, with reference to 1 or 2 explained holding body 40 , 3 shows more edges of the tabs 42 . 44 along which the tabs 42 . 44 before bending it from the rest of the holding body 40 were separated.

4 shows a side sectional view of an embodiment of a component arrangement 46 , The component arrangement 46 has an organic optoelectronic device 10 and a holder 50 on. The organic optoelectronic component 10 may, for example, one of the above-explained organic optoelectronic devices 10 in which, instead of the individual layers of the optoelectronic layer stack, the entire optoelectronic layer stack is shown as a whole for simplified representation and with the reference symbol 48 is marked.

The holder 50 is on one side, where the organic optoelectronic device 10 should be arranged, curved concave. On this side, the bracket points 50 a first recess 52 and a second recess 54 on. The first recess 52 has a first inner wall 56 on. The second recess 54 has a second inner wall 58 on. The first inner wall 56 serves as a first stop element and the second inner wall 58 serves as a second stop element.

The organic optoelectronic component 10 is bent. Due to the elastic flexibility of the organic optoelectronic component 10 practices the organic optoelectronic device 10 a restoring force, which counteracts the force, due to which the organic optoelectronic component 10 is bent. In this bent state, the organic optoelectronic component 10 so on the bracket 50 be attached that first tab 42 in the first recess 52 and the second tab 44 in the second recess 54 are arranged. Due to the restoring force, the main surfaces of the tabs 42 . 44 against the corresponding stop elements, so the inner walls 56 . 58 , the corresponding recess 52 . 54 pressed. This pressure creates a frictional connection between the organic optoelectronic component 10 and the holder 50 , In addition, the organic optoelectronic component 10 then precise on the holder 50 attached. Optionally, the organic optoelectronic component 10 in addition to this mechanical attachment by means of adhesive to the bracket 50 be attached.

The organic optoelectronic component 10 can be designed so that it generates the electromagnetic radiation generated by it 4 radiates upward and / or in 4 down through the holding body 40 and through the bracket 50 radiates. If the organic optoelectronic component 10 at least a portion of the generated electromagnetic radiation towards the holder 50 radiates, so the holding body 40 and the holder 50 be formed translucent or transparent and / or the holder 50 can have a further recess through which the generated electromagnetic radiation can occur. Alternatively or additionally, the first main surface of the holding body 40 or the side of the bracket 50 that the organic optoelectronic device 10 facing, be designed to be reflective of the generated electromagnetic radiation, so that the electromagnetic radiation, which is towards the holder 50 is radiated and reflected back for further use.

Optionally, an electrical contacting of the organic optoelectronic component 10 over the tabs 42 . 44 respectively. For example, at least one of the contact areas 32 . 34 together with the corresponding tab 42 . 44 be bent down. Corresponding can ever a corresponding mating contact in the first recess 52 or the second recess 54 be arranged, in particular on the first inner wall 56 or on the second inner wall 58 , Be the tabs 42 . 44 against the corresponding interior walls 46 . 58 pressed, so are the contact areas 32 . 34 pressed to the corresponding mating contacts, whereby a secure electrical contact of the organic optoelectronic device 10 given is.

5 shows a side sectional view of an embodiment of a component arrangement 10 , For example, the largely explained in the foregoing component arrangement 10 can correspond. The optoelectronic layer stack 48 is on one side of the organic optoelectronic device 10 formed the holder 50 facing, in particular on the second main surface of the holding body 40 , Optionally, the bracket 50 a third recess 60 exhibit. The third recess 60 can serve, for example, the optoelectronic layer stack 48 take.

The organic optoelectronic component 10 can be designed so that it generates the electromagnetic radiation generated by it 5 up through the holding body 40 radiates or in 5 down towards the bracket 50 radiates. If the third recess 60 is present, so the electromagnetic radiation through the third recess 60 be radiated. Alternatively or additionally, the holder 50 be formed translucent or transparent.

6 shows a side sectional view of an embodiment of a component arrangement 10 , For example, the largely explained in the foregoing component arrangement 10 can correspond. The holder 50 has a highlight 62 on, whose inside serves as a second stop element.

The bent organic optoelectronic component 10 can be so on the bracket 50 be attached that first tab 42 in the first recess 52 is arranged and that another part of the organic optoelectronic device 10 , especially those in 6 left outer edge of the organic optoelectronic device 10 on the inside of the highlighting 62 and thus abuts against the second stop element. Due to the restoring force becomes one of the main surfaces of the first tabs 42 against the first stop element, so the first inner wall 56 pressed and the outer edge of the organic optoelectronic device 10 is against the highlighting 62 pressed. This pressure creates a frictional connection between the organic optoelectronic component 10 and the holder 50 , In addition, the organic optoelectronic component 10 precise on the holder 50 attached.

7 shows a side sectional view of an embodiment of a holding body 40 , The holding body 40 For example, largely one of the above-explained holding body 40 correspond. The holding body 40 has the tabs 42 . 44 on. The tabs 42 . 44 are made of the same material as the holder body 40 educated. The tabs 42 . 44 are integral with the holding body 40 educated. The tabs 42 . 44 are formed so that their inner edges face each other.

If the in 7 shown holding body 40 on one of the above or below explained brackets 50 is attached, so press the edges of the tabs 42 . 44 against the corresponding stop elements, for example, the inner walls 56 . 58 the recesses 42 . 44 or the inside of the highlighting 62 , This pressure acts orthogonal to the bending direction of the tabs 42 . 44 on the edges of the tabs 42 . 44 , Thus, the tabs can 42 . 44 are not bent by this pressure in the direction or opposite to the direction in which they were bent during their manufacture.

8th shows a bottom view of the holding body 40 according to 7 ,

9 shows a side sectional view of an embodiment of a holding body 40 , The holding body 40 For example, largely one of the above-explained holding body 40 correspond. The holding body 40 has the tabs 42 . 44 on. The tabs 42 . 44 are made of the same material as the holder body 40 educated. The tabs 42 . 44 are integral with the holding body 40 educated. The tabs 42 . 44 are formed so that their inner edges face each other.

The tabs 42 . 44 are trapezoidal in such a way that the long bases, so the bases of the corresponding Trapeze of the rest of the holding body 40 are averted.

If the in 8th shown holding body 40 on one of the above or below explained brackets 50 is attached, so press the edges of the tabs 42 . 44 against the corresponding stop elements, for example, the inner walls 56 . 58 the recesses 42 . 44 or the inside of the highlighting 62 , This pressure acts orthogonal to the bending direction of the tabs 42 . 44 on the edges of the tabs 42 . 44 , Thus, the tabs can 42 . 44 are not bent by this pressure in the direction or opposite to the direction in which they were bent during their manufacture.

In addition, the tabs can 42 . 44 due to its trapezoidal shape to a locking of the holding body 40 on the bracket 50 contribute, if the corresponding stop elements, such as the inner walls 56 . 58 the recesses 42 . 44 or the inside of the highlighting 62 , are formed accordingly, as exemplified below with reference to a further embodiment of a component arrangement 46 explained.

10 shows a bottom view of the holding body 40 according to 9 ,

11 shows a side sectional view of an embodiment of a component arrangement 46 , The component arrangement 46 has an organic optoelectronic device 10 on, which is largely one of the above-explained organic optoelectronic devices 10 corresponds, with the tabs 42 . 44 as with the reference to 9 and 10 explained holding body 40 Trapezoidal are formed.

The holder 50 is formed like a frame. The corresponding frame is formed in cross-section, for example, circular. Alternatively, the frame in cross-section also have a different shape, for example a rectangular shape. The frame surrounds the first recess 52 , The first recess 52 is formed in this embodiment so large that both tabs 42 . 44 in the first recess 52 are arranged. In addition, in this embodiment, the organic optoelectronic component 10 bent such that a part of the organic optoelectronic component 10 in the first recess 52 is arched in.

The tabs 42 . 44 are in the holder due to their trapezoidal shape 50 hooked. The first recess 52 has the first inner wall 56 and the second inner wall 58 on, as stop elements for the edges of the tabs 42 . 44 serve.

The organic optoelectronic component 10 is bent. Due to the elastic flexibility of the organic optoelectronic component 10 practices the organic optoelectronic device 10 a restoring force, which counteracts the force, due to which the organic optoelectronic component 10 is bent. Due to the restoring force, the edges of the tabs 42 . 44 against the corresponding stop elements, so the inner walls 56 . 58 , the first recess 52 pressed. This pressure creates a frictional connection between the organic optoelectronic component 10 and the holder 50 , In addition, the organic optoelectronic component 10 precise on the holder 50 attached. Optionally, the organic optoelectronic component 10 in addition to this mechanical attachment by means of adhesive to the bracket 50 be attached.

12 shows a bottom view of the component assembly 46 according to 11 ,

13 shows a side sectional view of an embodiment of a component arrangement 46 , The component arrangement 46 has an organic optoelectronic device 10 on, which is largely one of the above-explained organic optoelectronic devices 10 corresponds, with the tabs 42 . 44 as with the reference to 9 and 10 explained holding body 40 Trapezoidal are formed.

The holder 50 is formed like a frame. The corresponding frame is formed in cross-section, for example, circular. Alternatively, the frame in cross-section also have a different shape, for example a rectangular shape. The frame surrounds the first recess 52 , The first recess 52 is formed in this embodiment so large that both tabs 42 . 44 in the first recess 52 are arranged. In addition, in this embodiment, the organic optoelectronic component 10 bent so that only the two tabs 42 . 44 in the first recess 52 are arranged.

The tabs 42 . 44 are in the holder due to their trapezoidal shape 50 hooked. The first recess 52 has the first inner wall 56 and the second inner wall 58 on, as stop elements for the edges of the tabs 42 . 44 serve.

The organic optoelectronic component 10 is bent. Due to the elastic flexibility of the organic optoelectronic component 10 practices the organic optoelectronic device 10 a restoring force, which counteracts the force, due to which the organic optoelectronic component 10 is bent. Due to the restoring force, the edges of the tabs 42 . 44 against the corresponding stop elements, so the inner walls 56 . 58 , the first recess 52 pressed. This pressure creates a frictional connection between the organic optoelectronic component 10 and the holder 50 , In addition, the organic optoelectronic component 10 precise on the holder 50 attached. Optionally, the organic optoelectronic component 10 in addition to this mechanical attachment by means of adhesive to the bracket 50 be attached.

14 shows a side sectional view of an embodiment of a component arrangement 46 , The component arrangement 46 has an organic optoelectronic device 10 on, which is largely one of the above-explained organic optoelectronic devices 10 corresponds, with the tabs 42 . 44 as with the reference to 9 and 10 explained holding body 40 Trapezoidal are formed.

The holder 50 is formed like a frame. The corresponding frame is formed in cross-section, for example, circular. Alternatively, the frame in cross-section also have a different shape, for example a rectangular shape. The frame surrounds the first recess 52 , The tabs 42 . 44 are outside the bracket 50 arranged. The outsides of the holder 50 serve as stop elements for the tabs 42 . 44 , In addition, in this embodiment, the organic optoelectronic component 10 bent so that it is in the first recess 52 is arched in.

The tabs 42 . 44 are in the holder due to their trapezoidal shape 50 hooked. The first recess 52 has the first inner wall 56 and the second inner wall 58 on, as stop elements for the edges of the tabs 42 . 44 serve. The organic optoelectronic component 10 is bent. Due to the elastic flexibility of the organic optoelectronic component 10 practices the organic optoelectronic device 10 a restoring force, which counteracts the force, due to which the organic optoelectronic component 10 is bent. Due to the restoring force, the edges of the tabs 42 . 44 against the corresponding stop elements, ie the outer sides of the holder 50 pressed. This pressure creates a frictional connection between the organic optoelectronic component 10 and the holder 50 , In addition, the organic optoelectronic component 10 precise on the holder 50 attached. Optionally, the organic optoelectronic component 10 in addition to this mechanical attachment by means of adhesive to the bracket 50 be attached.

15 shows a side sectional view of an embodiment of a holding body 40 , The holding body 40 points to the first major surface in the area of the tabs 42 . 44 reinforcements 64 on, focusing on the first major surfaces of the tabs 42 . 44 extend. The reinforcements 64 serve the tabs 42 . 44 to stabilize.

16 shows a side sectional view of an embodiment of a holding body 40 ,

The holding body 40 has covers on the first main surface 65 on, which cover the recesses, due to the bending of the tabs 42 . 44 in the holding body 40 arise. The covers 65 may be, for example, scattering films or decorative films. The covers 65 can serve to avoid the tabs 42 . 44 and the corresponding recesses from the side on which the tabs 42 . 44 are formed, are visible.

The holding body 40 points to the second major surface in the area of the tabs 42 . 44 reinforcements 64 on, referring to the second major surfaces of the tabs 42 . 44 extend. The reinforcements 64 serve the tabs 42 . 44 to stabilize. The reinforcements 64 may alternatively or in addition to the covers 65 be educated.

17 shows a side sectional view of an embodiment of a holding body 40 , on the first main surface of which the first electrode layer 14 with the first contact section 16 and the second contact portion 18 and the isolation barrier 21 are formed. In other words shows 17 the substrate of one of the above-explained optoelectronic devices 10 ,

The tabs 42 . 44 are designed so that the contact areas 32 . 34 the corresponding contact sections 16 . 18 along with the tabs 42 . 44 in 17 bent down. This allows the contact sections 16 . 18 from the side of the holding body 40 from, on the second main surface of the holding body 40 is arranged to contact electrically, for example by means of corresponding mating contacts, for example in the recesses 52 . 54 and / or highlighting 62 ,

In the 18 to 20 are a method for producing a substrate for an organic optoelectronic device 10 For example, for one of the above-mentioned organic optoelectronic devices 10 , and a method for electrically contacting the substrate explained. In the 18 to 20 are the remaining layers of the optoelectronic layer stack of the organic optoelectronic component 10 not shown for simplified representation. These layers can be before in 18 shown first state, after the first state and before in 19 shown second state, after the second state and before in 20 shown third state or after in 20 shown third state can be formed.

18 shows a side sectional view of an embodiment of a holding body 40 in a first state. On the holding body 40 is the first electrode layer 14 educated. The holding body 40 has two cut edges 66 on, which are the partial areas of the holding body 40 of which the tabs 42 . 44 are formed, from the rest of the holding body 40 partially separate. The cut edges 66 can be formed for example by means of laser or by punching. The cut edges 66 may be before or after forming the first electrode layer 14 be formed.

19 shows a side sectional view of the holding body 40 according to 18 in a second state. In the second state is a connection line 68 at the second contact portion 18 attached and electrically connected to this. The connection cable 68 may for example have or be a flexible circuit board. The connection cable 68 For example, by bonding, for example by means of ACF bonding, soldering or welding, at the second contact portion 18 be attached. Optionally, a further connecting line to the first contact section 16 be attached.

20 shows a side sectional view of the holding body 40 according to 18 in a third state. In the third state are the tabs 42 . 44 in 20 bent down. The connection cable 68 is partially along with the second tab 44 bent down. If the first contact section 16 has not been connected to a corresponding connection line in the second state, it can now be electrically contacted from below.

The invention is not limited to the specified embodiments. For example, the embodiments may be combined. For example, all embodiments by means of the reference to 1 or by means of the reference to 2 explained organic optoelectronic device 10 will be realized. Furthermore, in all embodiments, the optoelectronic layer stack 48 on the side of the holder body 40 be formed on the first main surface of the holding body 40 lies, or on the side of the holding body 40 on which the second major surface of the holding body 40 lies. Furthermore, in all embodiments on both sides of the holding body 40 one optoelectronic each layer stack 48 be educated. Furthermore, the tabs 42 . 44 be designed in all embodiments so that their major surfaces or edges are facing each other. Furthermore, in all embodiments, the tabs 42 . 44 be rectangular or trapezoidal. Furthermore, all of the organic optoelectronic components 10 Be top emitter, bottom emitter or both sides emitting organic optoelectronic devices or organic solar cells, wherein the corresponding holding body 40 and / or mount 50 if necessary transparent or translucent may be formed or may have corresponding window-like recesses for transmitting the generated or the light to be absorbed. Furthermore, all embodiments shown can only one tab 42 or more than the tabs shown 42 . 44 exhibit. Furthermore, in all embodiments, the holder 50 only a recess 52 or more than the recesses shown 52 . 54 exhibit. Furthermore, all embodiments can highlight 62 or two or more corresponding highlights 62 exhibit. Furthermore, in all exemplary embodiments, the corresponding organic optoelectronic components 10 with reference to the holder 50 be curved convex or concave. Further, in all embodiments, the gains 64 be formed on the first major surface and / or the second major surface. Furthermore, in all embodiments, the covers 65 for covering the recesses in the holding body 40 be arranged. Furthermore, in all embodiments, the contact portions 16 . 18 be so designed that they are with the appropriate tab 42 . 44 are bent over. Furthermore, the contact sections 16 . 18 be formed so that they are on the same side of the organic optoelectronic device 10 For example, are formed side by side, in which case both contact portions of the 16, 18 on only one of the tabs 42 . 44 can be trained and with this tab 42 . 44 can be bent over. Furthermore, in all embodiments, the electrical contacting of the organic optoelectronic component 10 over the tabs 42 . 44 and optionally via corresponding mating contacts in the recesses 52 . 54 and / or highlighting 62 respectively.

LIST OF REFERENCE NUMBERS

Organic optoelectronic component 10 carrier 12 first electrode layer 14 first contact section 16 second contact section 18 first electrode 20 isolation barriers 21 organic functional layer structure 22 second electrode 23 encapsulation 24 first contact area 32 second contact area 34 Adhesive layer 36 covering 38 holding body 40 first tab 42 second tab 44 component assembly 46 Optoelectronic layer stack 48 bracket 50 first recess 52 second recess 54 first inner wall 56 second inner wall 58 third recess 60 emphasis 62 reinforcement 64 cover 65 cutting edge 66 connecting cable 68

Claims (15)

An organic optoelectronic component (10), having an organic functional layer structure (22) and having a planar holding body (40) on which the organic functional layer structure (22) is formed and which has at least one first tab (42) integral with the remaining holding body (40) is formed and which protrudes from the remaining holding body (40). Organic optoelectronic component (10) according to Claim 1 lens, comprising a substrate having the holding body (40) and a first electrode layer (14) formed on the holding body (40) and on which the organic functional layer structure (22) is formed. Organic optoelectronic component (10) according to Claim 1 , comprising a substrate, which is arranged on the holding body (40) and which has a first electrode layer (14), on which the organic functional layer structure (22) is formed, wherein the holding body (40) is formed as a heat sink. Organic optoelectronic component (10) according to one of the preceding claims, in which the holding body (40) has at least one second lug (44) which is formed integrally with the remaining holding body (40) which protrudes from the remaining holding body (40) and which is spaced from the first tab (42). Organic optoelectronic component (10) according to Claim 4 wherein the tabs (42, 44) each have a first major surface formed by a first major surface of the holder body (40) and a second major surface formed by a second major surface of the holder body (40); second major surfaces of the tabs (42, 44) facing each other and wherein the tabs (42, 44) project on the side of the holding body (40) of the holding body (40) on which the second main surface of the holding body (40) is formed. Organic optoelectronic component (10) according to Claim 4 in that the tabs (42, 44) each have a first major surface formed by a first major surface of the holder body (40) and a second major surface formed by a second major surface of the holder body (40), the major surfaces the tabs (42, 44) are each connected to each other by a peripheral edge of the respective tabs (42, 44) and the edges of the two tabs (42, 44) facing each other and wherein the tabs (42, 44) on the side of the Holder body (40) from the holding body (40) protrude, on which the second main surface of the holding body (40) is formed. Organic optoelectronic component (10) according to one of the preceding claims, wherein at least one of the tabs (42, 44) is rectangular or trapezoidal, wherein in the trapezoidal shaped tab (42, 44) the longer base side protrudes from the holding body (40) , Component arrangement (46) having an organic optoelectronic component (10) according to one of the Claims 1 to 7 and with a holder (50) for holding the organic optoelectronic component (10), wherein the holder (50) has a first stop element and at least one second stop element, which are spaced from each other, the first tab (42) bears against the first stop element and another part of the organic optoelectronic component (10) rests against the second stop element, and the organic optoelectronic component (10) is bent and fixed non-positively on the holder (50) due to a return force established in its bending. Component arrangement (46) according to Claim 8 in which the other part of the organic optoelectronic component (10), which bears against the second stop element, is the second tab (44). Component arrangement (46) according to one of Claims 8 or 9 , comprising a first recess (52) having a first inner wall (56), wherein the first inner wall (56) forms the first stop member and the first tab (42) is disposed in the first recess (52). Component arrangement (46) according to Claim 10 in that the first recess (52) has a second inner wall (58) forming the second stop element. Component arrangement (46) according to Claim 10 with a second recess (54) having a second inner wall (58) forming the second stopper member. Component arrangement (46) according to one of Claims 8 or 9 , with a first recess (52), wherein the organic optoelectronic component (10) is at least partially bulged into the first recess (52) and the stop elements are formed outside the first recess (52). Method for producing a component arrangement (46), in which an organic optoelectronic component (10) according to one of the Claims 1 to 7 is bent, and the bent organic optoelectronic component (10) in such a holder (50) according to one of Claims 8 to 13 is clamped such that the first tab (42) bears against the first stop element of the holder (50) and another part of the organic optoelectronic component (10) bears against the second stop element of the holder (50), wherein the organic optoelectronic component (10) is fixed non-positively on the holder (50) due to a restoring force in its bending. Method for producing an organic optoelectronic component (10), in which a planar holding body (40) is provided, an organic functional layer structure (22) is arranged or formed over the holding body (40), and Before and / or after the formation of the organic functional layer structure (22), at least one first tab (42) is formed from the holding body (40) so that it protrudes from the remaining holding body (40).

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