DE102016214588A1 - A light emitting assembly and method of making a light emitting assembly - Google Patents

Abstract

In various embodiments, there is provided a light emitting package (20) having a flexible substrate (22), an elongate, flat optical fiber strip (24) formed on an upper surface of the substrate (22) and resting on the substrate (22) a longitudinal direction (26) extends, at least one light emitting diode (28) which is arranged on the upper side of the substrate (22) which is embedded in the optical waveguide strip (24) and the light (30) at least along the longitudinal direction (26) in the Fiber optic strip (24) emitted into it.

Description

The invention relates to a light-emitting assembly and to a method for producing a light-emitting assembly.

A light-emitting module has a substrate and at least one light-emitting diode. The light-emitting diode is typically arranged so that it emits light in the direction away from the substrate. For example, the light-emitting diode can be arranged with an optically non-active rear side on the substrate, so that an optically active front side of the light-emitting diode is remote from the substrate. Alternatively, the light-emitting diode may be disposed on an edge of the substrate so as to emit the light in the direction parallel to a surface of the substrate on which the light-emitting diode is disposed, yet nevertheless, because of its location near the edge of the substrate Light emitted beyond the edge away from the substrate. The latter light-emitting diode can be for example a side emitter and / or so-called "sidelooker".

The light-emitting diode may have, for example, a housing and an LED chip, which is arranged in a recess of the housing. The LED chip can be, for example, a volume emitter or a surface emitter, in particular a top emitter. One or more light-emitting surfaces of the LED chip may be covered with converter material for converting the light generated by the LED chip with respect to its wavelength. Alternatively or additionally, the LED chip may be embedded in the recess of the housing in a potting compound. The potting compound may for example have scattering particles and / or converter material.

Luminous structures having, for example, one, two or more luminescent stripes or consisting of corresponding luminous stripes can be produced by incorporating or applying the structures into light-conducting, transparent and / or translucent rigid supports and arranging the light-emitting diodes so that they couple the light into the carrier (s). The rigid support forms a photoconductive layer and the light coupled into the support is coupled out of the support at the structures, whereby the structures appear luminous. The LEDs are regularly connected to the carrier so that they couple the light at the side edges of the carrier in the carrier.

An object of the invention is to provide a light-emitting assembly which allows a simple and / or cost-effective manner to represent luminous structures.

An object of the invention is to provide a method of producing a light-emitting assembly which makes it possible to display luminous structures in a simple and / or cost-effective manner.

An object of the invention is achieved by a light emitting assembly having a flexible substrate, an elongate, flat optical fiber strip formed on an upper surface of the substrate and extending on the substrate in a longitudinal direction, at least one light emitting diode disposed on the upper side of the substrate Substrate is disposed, which is embedded in the light guide strip and the light emits at least along the longitudinal direction in the light guide strip inside.

In other words, flexible rather than rigid substrates are used and the light coupling is no longer from the side into the substrate, as in the prior art, but the light emitting diode and optionally two or more LEDs, in particular LEDs are mounted on the substrate and couple the emitted light in the light guide strips. This causes the fiber optic strip to light up. The optical waveguide strip represents the luminous structure or at least part of the luminous structure. One, two or more of these optical waveguide strips can now be arranged on the substrate in such a way that desired luminous structures are formed by means of the optical waveguide strip or strips. Alternatively or additionally, one, two or more of these substrates can be arranged on a further body such that desired luminous structures are formed on the substrates by means of the optical waveguide strip (s). This allows a simple and / or cost-effective way to represent luminous structures.

Another advantage of using the flexible substrate with the LEDs embedded in the fiber strips that illuminate the fiber strip is the ductility of the light emitting package. On the one hand, this makes it possible to simulate three-dimensional luminous structures in a simple manner and, on the other hand, the mounting of the LEDs and the light guide strip on the substrate can take place on a two-dimensional mounting surface, which contributes to the fact that standard technologies can be used in the production method. A subsequent shaping can optionally take place subsequently. These advantages also make it possible to present luminous structures in a simple and / or cost-effective manner.

The LEDs can be top or side emitters ("sidelooker"). The LEDs may each have one, two or more LED chips. The LED chips may be, for example, volume emitter or surface emitter. The LED (s) can be arranged exclusively on one longitudinal end of the light guide strip or arranged along the longitudinal direction in the light guide strip.

The substrate can be colored, translucent or transparent. With a transparent substrate, the advantage is that the luminous structures are visible from both sides. In addition, objects located behind the substrate can be detected and spatial effects can be generated. The substrate may comprise conductor tracks for electrically contacting and / or for controlling the light-emitting diodes. In order to obtain as much transparency as possible in the case of a transparent substrate, the conductor tracks may be formed by a transparent material and / or may be made very thin.

The light guide strip has, for example, silicone or / or a silicone matrix or is formed from it. Optionally, scattering particles may be embedded in the light guide strip to enhance the effect of a coherent luminescent structure. Alternatively or additionally, converter material for converting the generated light of the LEDs with respect to its wavelength may be embedded in the optical waveguide strip so as to convert the light into another light color.

That the light guide strip is elongated means that a length of the light guide strip is significantly larger than a width of the light guide strip. For example, the length of the optical waveguide strip may be larger by approximately one, two or three orders of magnitude than the width of the optical waveguide strip. The fact that the light guide strip is formed flat means that the length of the light guide strip is significantly greater than a thickness of the light guide strip. For example, the length of the optical waveguide strip may be larger by approximately one, two or three orders of magnitude than the thickness of the optical waveguide strip.

According to a development, the flexible substrate is elongated and extends parallel to the longitudinal direction. In other words, the substrate is elongated, flat and / or strip-shaped.

According to a further development, a reflective layer is formed at least in partial areas between the substrate and the optical waveguide strip, which reflects the light generated by the light-emitting diode in the direction away from the substrate. The reflective layer enhances the outcoupling of the light toward a surface of the light guide strip facing away from the substrate. Furthermore, the light outcoupling to an underside of the substrate facing away from the optical waveguide strip can be avoided by means of the reflective layer, wherein the substrate itself remains transparent. The reflective layer may, for example, comprise or be formed from metal, for example aluminum or silver. The reflective layer may be in the form of a metallization.

According to a development, the light-emitting diode has an LED chip, which is a volume emitter and which emits the light along the longitudinal direction and along a thickness direction of the optical waveguide strip, wherein the thickness direction of the optical waveguide strip is perpendicular to a surface of the substrate. This can contribute to the fact that the light guide strip is illuminated not only in the longitudinal direction next to the light emitting diode, but also directly above the light emitting diode. Alternatively or additionally, this may make it possible to arrange on a surface of the LED chip facing away from the substrate a converter material which is excited by the light from the light emitting diode for emitting converted light along the longitudinal direction.

According to a development, the light-emitting diode has an LED chip, which is a surface emitter and which emits the light exclusively on a surface of the LED chip, and in which the LED chip is arranged such that the light-emitting surface of the LED chip is arranged parallel or at least approximately parallel to the top of the substrate, on which the light-emitting diode is arranged. This makes it possible to arrange on a surface of the LED chip facing away from the substrate a converter material which is excited by the light from the light emitting diode for emitting converted light along the longitudinal direction.

According to a development, the light-emitting diode is a side emitter and has an LED chip. This allows a simple way to arrange the light-emitting diode so that it emits the light substantially along the longitudinal direction.

According to a development, the light-emitting diode has a converter material for converting the light generated by the LED chip with respect to its wavelength, wherein the converter material covers at least one surface of the LED chip on which the LED chip emits the light. This can help to inexpensively couple light of a desired color into the fiber optic strip. Alternatively or additionally, this makes it possible to use an LED chip which is formed and arranged on the substrate so that it emits the light in the direction away from the substrate, for example perpendicular to the longitudinal direction, this light emitting the converter material for emitting converted light, wherein the converted light can be emitted from the converter material in the longitudinal direction.

According to a development, a light-absorbing or light-reflecting cover material is formed on a surface of the LED chip or of the converter material which is parallel to the upper side of the substrate and which faces away from the substrate. This can help to enhance a light emission along the longitudinal direction. As an alternative or in addition, this can contribute to preventing light emitted by the light-emitting diode in the region of the light-emitting diode increasingly emerging from the light-guide strip in the direction away from the substrate, that is to say, for example, perpendicular to the longitudinal direction. This can help to prevent the light-emitting diodes from being visible from the outside as light spots in the light guide strip. In other words, this can contribute to the fact that the light guide strip has a homogeneous appearance during operation of the light-emitting assembly.

According to one embodiment, conductor tracks are formed on the substrate, wherein the conductor tracks are completely covered by the light guide strip. The conductor tracks are used for electrical contacting and / or for controlling the light-emitting diodes. The complete covering of the conductor tracks by means of the light guide strip can contribute to the fact that the conductor tracks are not visible from the outside.

According to a development, the light-emitting module has a carrier and / or a cover body, wherein the substrate is arranged on the carrier and / or the cover body is arranged on the light conductor strip and wherein the carrier and / or the cover body are transparent or translucent. The carrier and / or the cover body can contribute to protect the substrate, the light guide strip and the LEDs from external, for example mechanical, effects and / or to produce one, two or more 3D structures.

An object of the invention is achieved by a method for producing a light-emitting assembly in which a flexible substrate is provided, at least one light-emitting diode is arranged on an upper side of the substrate, an elongated, flat optical waveguide strip is formed on the upper side of the substrate such that it forms extending on the substrate in a longitudinal direction and that the light emitting diode is embedded in the optical waveguide strip, wherein the light emitting diode is disposed on the substrate so that it emits light at least along the longitudinal direction in the light guide strip inside.

The method makes it possible to display luminous structures in a simple and / or cost-effective manner. The advantages and developments explained above in connection with the light-emitting module can be readily transferred to the method for producing the light-emitting module.

According to a development, the flexible substrate is elongated and the light guide strip is formed so that the substrate extends parallel to the longitudinal direction.

According to a further development, a reflective layer is formed on the substrate before the formation of the optical waveguide strip, and the optical waveguide strip is formed at least partially on the reflective layer, wherein the reflective layer is designed such that it directs the light generated by the light diode away from the substrate reflected.

According to a development, before the formation of the optical waveguide strip, a converter material for converting the light generated by an LED chip of the light emitting diode with respect to its wavelength is arranged or formed such that it covers at least one surface of the LED chip on which the LED chip the light emitted.

According to a development, before the formation of the optical waveguide strip and optionally after the formation of the converter material on a surface of the LED chip or of the converter material which is parallel to the upper side of the substrate and which faces away from the substrate, a light-absorbing or light-reflecting material is used educated.

According to a development, the substrate is arranged with the light-emitting diode and the light guide strip between a carrier and a cover body, wherein the carrier and / or the cover body are transparent or translucent. For example, the substrate can be glued to the carrier with the LEDs and the light guide strip. Alternatively or additionally, the substrate can be clamped with the LEDs and the light guide strip between the carrier and the cover body. In this way one, two or more 3D structures can be created. The 3D structures can be formed, for example, by means of a transformation of the light-emitting assembly with the carrier and / or the covering body with the aid of heat.

Embodiments of the invention are illustrated in the figures and are explained in more detail below.

Show it:

1 a plan view of an embodiment of a light-emitting assembly;

2 a side sectional view of the light-emitting assembly according to 1 ;

3 a plan view of an embodiment of a light-emitting assembly;

4 a plan view of an embodiment of a light-emitting assembly;

5 a side sectional view of the light-emitting assembly according to 4 ;

6 a side sectional view of an embodiment of a light-emitting assembly;

7 a detailed sectional side view of an embodiment of a light-emitting assembly;

8th a detailed sectional side view of an embodiment of a light-emitting assembly;

9 a detailed sectional side view of an embodiment of a light-emitting assembly;

10 a detailed sectional side view of an embodiment of a light-emitting assembly;

11 a side sectional view of an embodiment of a light-emitting assembly;

12 a plan view of an embodiment of a light-emitting assembly;

13 a flowchart of an embodiment of a method for producing an optoelectronic assembly.

In the following detailed description, reference is made to the accompanying drawings, which form a part of this specification, and in which is shown by way of illustration specific embodiments in which the invention may be practiced. Because components of embodiments may be positioned in a number of different orientations, the directional terminology is illustrative and is in no way limiting. It should be understood that other embodiments may be utilized and structural or logical changes may be made without departing from the scope of the present invention. It should be understood that the features of the various embodiments described herein may be combined with each other unless specifically stated otherwise. The following detailed description is therefore not to be taken in a limiting sense, and the scope of the present invention is defined by the appended claims. In the figures, identical or similar elements are provided with identical reference numerals, as appropriate.

A light emitting assembly may comprise one, two or more light emitting diodes. Optionally, a light-emitting assembly may also have one, two or more electronic components. An electronic component may have, for example, an active and / or a passive component. An active electronic component may have, for example, a computing, control and / or regulating unit and / or a transistor. A passive electronic component may, for example, comprise a capacitor, a resistor, a diode or a coil. A light emitting diode may be formed, for example, as a light emitting diode (light emitting diode, LED) or as a light emitting transistor.

A body is referred to in this application as elongated, when its extent along a longitudinal direction is significantly greater than its extension along a width direction, wherein the width direction is perpendicular to the longitudinal direction. Illustratively, a body is said to be elongated if the body is significantly longer than it is wide. For example, an elongated body may be longer than about one, about two, or about three orders of magnitude longer than it is wide. For example, the length of an elongated body may be between, for example, 10 and 1000 times, for example 50 times to 500 times, for example, approximately 100 times greater than its width.

A body is referred to in this application as flat when its extent along its longitudinal direction is significantly greater than its extension along a thickness direction, wherein the thickness direction is perpendicular to the longitudinal direction and perpendicular to the width direction. Illustratively, a body is said to be flat when the body is significantly longer than it is high. For example, an elongated body may be longer than about one, about two, or about three orders of magnitude longer than it is wide. For example, the length of an elongated body may be between, for example, 10 and 1000 times, for example 50 to 500 times, for example, approximately one hundred times greater than its width.

1 shows a plan view of an embodiment of a light-emitting assembly 20 and 2 shows a side sectional view of the light-emitting module 20 according to 1 ,

The light-emitting assembly 20 has a flexible substrate 22 , a fiber optic strip 24 and light-emitting diodes 28 on.

The flexible substrate 22 is so flexible that it is easy to bend, especially by hand, nondestructive. The flexible substrate 22 is formed strip-shaped. In other words, the flexible substrate 22 elongated and flat. Alternatively, the flexible substrate 22 flat, so nothing stripy and / or elongated, and flat, such as film-like, be formed. The elongated, flat flexible substrate 22 extends substantially along a longitudinal direction 26 , The longitudinal direction 26 extends parallel to an upper side of the flexible substrate 22 on which the light emitting diodes 28 are arranged. The flexible substrate 22 For example, it may comprise or be formed from PET or PI or the flexible substrate 22 may be formed by a very thin FR4 printed circuit board, for example from a FR4 printed circuit board, which has a thickness between, for example, 50 .mu.m and 250 .mu.m, for example between 100 .mu.m and 200 .mu.m, for example approximately 150 .mu.m. The flexible substrate 22 can be transparent or translucent. The flexible substrate 22 can be colored, for example. The flexible substrate 22 has a length L. The flexible substrate 22 points in 1 not shown interconnects for electrically contacting and / or controlling the LEDs 28 on.

The fiber optic strip 24 is elongated and flat. In other words, the fiber optic strip 24 formed strip-shaped. The fiber optic strip 24 extends substantially along the longitudinal direction 26 , The fiber optic strip 24 has the length L, a width B and a thickness D. In particular, the light guide strip 24 in the longitudinal direction 26 the length L, the width B in the width direction and the thickness D in the thickness direction. The length L is much larger than the width B and the thickness D. The light guide strip 24 is as long as the flexible substrate 22 educated. Alternatively, the fiber optic strip 24 longer or shorter than the flexible substrate 22 be educated. The fiber optic strip 24 is slightly narrower than the flexible substrate 22 , Alternatively, the fiber optic strip 24 be made as wide as the flexible substrate 22 , The fiber optic strip 24 is on top of the flexible substrate 22 educated. The fiber optic strip 24 For example, it may comprise or be formed from silicone and / or synthetic resin, for example epoxy resin. In the fiber optic strip 24 Optionally scattering particles can be embedded for scattering light. In the fiber optic strip 24 Optionally converter material can be embedded to convert the wavelength of light. For example, the converter material by means of the light emitting diode 28 converted light into white light.

The light-emitting diodes 28 are on top of the flexible substrate 22 arranged. For example, the light-emitting diodes 28 be arranged at a distance of 1 cm to 50 cm, for example from 2 cm to 20 cm, for example of about 10 cm. The light-emitting diodes 28 are in the fiber optic strips 24 embedded. In other words, the LEDs border 28 on several of its sides, for example on four of its sides, directly to the material of the light guide strip 24 , Alternatively to the two in 1 shown LEDs 28 can only a light emitting diode 28 or there may be three or more light emitting diodes 28 on the flexible substrate 22 arranged and in the light guide strip 24 be embedded.

The light-emitting diodes 28 For example, top emitters or side emitters ("sidelooker") may be provided, with provision being made in the case of top emitters that the light 30 essentially along the longitudinal direction 26 is emitted, for example by means of converter material and / or cover material explained below. The light-emitting diodes 28 each have at least one LED chip. The light-emitting diodes 28 have no housing, with the LED chips without housing directly on the substrate 22 are arranged. Alternatively, the LEDs 28 each have a housing and in each case at least one arranged in the housing LED chip. The LED chip (s) may be volume emitters or surface emitters, in particular if they are "naked", ie without a housing, on the flexible substrate 22 are arranged. The LED chips can be, for example, low-power LEDs ("low power LEDs"). The LED chips can be volume emitter or surface emitter. The LED chips may, for example, be sapphire chips, for example sapphire flip chips, and / or emit blue light, or the LED chips may be UX: 3 bar chips.

During operation of the light-emitting module 20 emit the light emitting diodes 28 light 30 at least along the longitudinal direction 26 , Thus, the LEDs emit 28 the light 30 in the fiber optic strips 24 into it. For example, the LEDs emit 28 the light 30 essentially along the longitudinal direction 26 or substantially in the light guide strips 24 into it. That means a lot of the light 30 is emitted along optical paths having a directional component parallel to the longitudinal direction 26 is. For example, between 50% and 100%, for example, between 70% and 95%, for example between 80 and 90% of the light 30 along beam paths having a directional component parallel to the longitudinal direction 26 is. In 1 becomes the light 30 starting from the LEDs 28 along the longitudinal direction 26 emitted from left to right. Alternatively or additionally, the light-emitting diodes 28 the light 30 starting from the LEDs 28 along the longitudinal direction 26 emit from right to left.

During operation of the light-emitting module 20 the fiber optic strip appears 24 as a luminous structure, in particular as a luminous strip.

3 shows a plan view of an embodiment of a light-emitting assembly 20 , for example, largely related to the 1 and 2 explained light emitting assembly 20 can correspond. For clarity, is in 3 that of the LEDs 28 emitted light 30 not shown.

On the flexible substrate 22 are tracks 32 for electrically contacting and / or controlling the light-emitting diodes 28 arranged. Alternatively to the two tracks each 32 , the two of the light-emitting diodes 28 connect, the light-emitting diodes 28 only with a conductor track 32 or with more tracks 32 be electrically connected. The tracks 32 can be formed so thin and / or transparent so that they are in operation of the light-emitting module 20 and / or outside the operation of the light-emitting assembly 20 are not visible from the outside. The tracks 32 are completely from the fiber optic strip 24 covered. Alternatively, the tracks 32 only partially or not at all from the fiber optic strip 24 be covered. The tracks 32 For example, in the form of metal layers, such as aluminum layers or silver layers, on the flexible substrate 22 be educated.

The tracks 32 are electrically connected to an energy source not shown in the figures and / or a control unit, not shown in the figures. The power source and / or the control unit may be part of the light-emitting assembly 20 be. The power source and / or the control unit may be on the flexible substrate 22 be arranged. Alternatively, the power source and / or the control unit may be related to the light-emitting assembly 20 and / or with respect to the flexible substrate 22 be arranged externally.

The in the 1 and 2 shown light emitting assembly 20 can also do the tracks 32 exhibit.

4 shows a plan view of an embodiment of a light-emitting assembly 20 , for example, largely related to the 1 and 2 explained light emitting assembly 20 can correspond. 5 shows a side sectional view of the light emitting assembly according to 4 , For clarity, is in 3 that of the LEDs 28 emitted light 30 not shown.

On the flexible substrate 22 are tracks 32 for electrically contacting and / or controlling the light-emitting diodes 28 arranged. Alternatively to the ever one trace 32 , the two of the light-emitting diodes 28 connects, the light emitting diodes 28 with two or more tracks 32 be electrically connected. The tracks 32 may be formed so wide that they almost completely over the area between the light guide strip 24 and the flexible substrate 22 extend. The tracks 32 are mirror-formed so that they are in operation of the light-emitting assembly 20 the light 30 that meets them, reflect outward. The tracks 32 For example, in the form of metal layers, such as aluminum layers or silver layers, on the flexible substrate 22 be educated.

The tracks 32 are electrically connected to an energy source not shown in the figures and / or a control unit, not shown in the figures. The power source and / or the control unit may be part of the light-emitting assembly 20 be. The power source and / or the control unit may be on the flexible substrate 22 be arranged. Alternatively, the power source and / or the control unit may be related to the light-emitting assembly 20 and / or with respect to the flexible substrate 22 be arranged externally.

The in the 1 and 2 shown light emitting assembly 20 can also do the tracks 32 exhibit.

6 shows a side sectional view of an embodiment of a light-emitting assembly 20 , for example, largely related to the 1 and 2 explained light emitting assembly 20 can correspond. Between the top of the flexible substrate 22 and the fiber optic strip 24 is a reflective layer 34 educated. The reflective layer 34 extends at least completely over the area between the light guide strip 24 and the flexible substrate 22 , For example, the reflective layer 34 over the entire top of the flexible substrate 22 extend. The reflective layer 34 reflected during operation of the light-emitting module 20 the light striking her 30 , The reflective layer 34 For example, a metallization, for example an aluminum layer or a silver layer, a white lacquer and / or titanium dioxide may be present or formed therefrom.

7 shows a detailed side sectional view of an embodiment of a light emitting assembly 20 , For example, one of the above-explained light-emitting assemblies 20 , The light-emitting diode 28 is a side emitter ("sidelooker"), which is the light 30 in 7 emitted exclusively to the right. The light-emitting diode 28 has an in 7 not shown on the LED chip.

8th shows a detailed side sectional view of an embodiment of a light-emitting assembly 20 , For example, one of the above-explained light-emitting assemblies 20 , The light-emitting diode 28 is a side emitter ("sidelooker"), which is the light 30 in 8th emitted exclusively to the right. The light-emitting diode 28 has an LED chip 29 which is a surface emitter and which is arranged to receive the light 30 in 8th emitted exclusively to the right. The light-emitting diode 28 also has a converter material 36 , For example, a converter body, on, in the beam path of the light 30 after the LED chip 29 is arranged. The converter material 36 converts this by means of the LED chip 29 generated light 30 in terms of its wavelength. For example, the LED chip emits 29 blue light and the converter material 36 converts a portion of the blue light and passes a portion of the blue light through, leaving the converter material 36 Total mixed light emitted, which is white.

On the LED 28 , especially on the LED chip 29 and / or on the converter material 36 , may be a light-absorbing or light-reflecting cover material 38 be arranged. The converter material 36 basically emits the converted light in all spatial directions. However, the LED chip blocks in one spatial direction 29 the converted light, in a spatial direction optionally blocks the cover material 38 the converted light off and through the substrate 22 through block the tracks 32 and / or optionally the reflective layer 34 the converted light.

9 shows a detailed side sectional view of an embodiment of a light-emitting assembly 20 , For example, one of the above-explained light-emitting assemblies 20 , The light-emitting diode 28 has an LED chip 29 which is a volume emitter and which is the light 30 emitted in all spatial directions. The light-emitting diode 28 further indicates the converter material 36 , For example, the converter body, on, in the beam path of the light 30 after the LED chip 29 is arranged. The converter material 36 converts this by means of the LED chip 29 generated light 30 in terms of its wavelength. For example, the LED chip emits 29 blue light and the converter material 36 converts a portion of the blue light and passes a portion of the blue light through, leaving the converter material 36 Total mixed light emitted, which is white.

On the LED 28 , especially on the LED chip 29 and / or on the converter material 36 , the light absorbing or light reflective cover material 38 be arranged. The converter material 36 basically emits the converted light in all spatial directions. However, if necessary, the cover material blocks in one spatial direction 38 the converted light off and through the substrate 22 through block the tracks 32 and / or optionally the reflective layer 34 the converted light.

10 shows a detailed side sectional view of an embodiment of a light-emitting assembly 20 , For example, one of the above-explained light-emitting assemblies 20 , The light-emitting diode 28 has an LED chip 29 which is a surface emitter and which is the light 30 in 10 emitted to the top. The LED chip 29 can be for example a UX: 3 bar chip. The LED chip 29 For example, by means of a bonding wire 40 with one of the tracks 32 be electrically connected. The light-emitting diode 28 further indicates the converter material 36 , For example, the converter body, on, in the beam path of the light 30 after the LED chip 29 , so in 10 over the LED chip 29 , is arranged. The converter material 36 converts this by means of the LED chip 29 generated light 30 in terms of its wavelength. For example, the LED chip emits 29 blue light and the converter material 36 converts a portion of the blue light and passes a portion of the blue light through, leaving the converter material 36 Total mixed light emitted, which is white.

On the converter material 36 , the light absorbing or light reflective cover material 38 be arranged. The converter material 36 basically emits the converted light in all spatial directions. However, if necessary, the cover material blocks in one spatial direction 38 the converted light and in a spatial direction blocks the LED chip 29 the converted light.

11 shows a side sectional view of an embodiment of a light-emitting assembly 20 , For example, the largely one of the above-explained light-emitting assemblies 20 can correspond. The light-emitting assembly 20 has a carrier 42 and a cover body 44 on. The flexible substrate 22 with the fiber optic strip 24 and the light emitting diodes 28 is between the carrier 42 and the cover body 44 arranged. For example, the flexible substrate 22 on the carrier 42 glued. For example, the cover body 44 on the fiber optic strip 24 glued. For example, the flexible substrate 22 with the fiber optic strip 24 and the light emitting diodes 28 between the carrier 42 and the cover body 44 trapped.

The carrier 42 and / or the cover body 44 may have a three-dimensional shape to which the flexible substrate 22 with the fiber optic strip 24 adapts. Optionally, the carrier 42 and / or the cover body 44 be formed of a thermally deformable material. For example, the carrier can 42 and the cover body 44 initially be flat when the flexible substrate 22 with the fiber optic strip 24 and the light emitting diodes 28 between the carrier 42 and the cover body 44 is arranged. Subsequently, the carrier can 42 and the cover body 44 thermally deformed so that they subsequently maintain the appropriate shape, wherein the flexible substrate 22 and the fiber optic strip 24 inevitably permanently adapt to this form.

12 shows a plan view of an embodiment of a light-emitting assembly 20 , For example, the largely one of the above-explained light-emitting assemblies 20 can correspond. The light-emitting assembly 20 has a flat substrate 22 and a plurality of optical fiber strips 24 on. In the fiber optic strip 24 are in 12 not shown light-emitting diodes 28 embedded. The fiber optic strips 24 can have different rectilinear, polygons, round and / or curved shapes in plan view.

13 shows a flowchart of an embodiment of a method for producing an optoelectronic assembly, for example, one of the above-explained optoelectronic assemblies 20 ,

In one step 50 For example, a flexible substrate is provided, such as the flexible substrate discussed above 22 , The flexible substrate 22 can be provided, for example, by being trained.

In one step 52 Optionally, a reflective layer can be formed on the flexible substrate, for example, the reflective layer 34 on the flexible substrate 22 be formed.

In one step 54 For example, one, two or more light-emitting diodes are arranged on the flexible substrate and are electrically contacted with conductor tracks of the flexible substrate. For example, the one, two or more light-emitting diodes 28 on the flexible substrate 22 and / or optionally on the reflective layer 34 arranged and electrically connected to the tracks 32 of the flexible substrate 22 contacted. Optionally, in the step 54 the converter material 36 and / or the cover material 38 be formed as explained above.

In one step 56 For example, a light guide strip is formed on the flexible substrate so as to embed the light-emitting diodes and to be elongated and flat. For example, the elongated, flat fiber optic strip 24 the light-emitting diodes 28 embedding on the flexible substrate 22 educated.

In an optional step 58 For example, the flexible substrate with the light guide strip and the light-emitting diodes can be arranged between a support and a cover body. For example, the flexible substrate 22 with the fiber optic strip 24 and the light emitting diodes 28 between the carrier 42 and the cover body 44 arranged as explained above. Optionally, the carrier 42 and the cover body 44 as previously explained thermally deformed.

The invention is not limited to the specified embodiments. For example, the light-emitting assemblies 20 only a light emitting diode 28 or more than two or three, for example, four or more light-emitting diodes 28 exhibit. Furthermore, a light-emitting assembly 20 more than a fiber optic strip 24 and corresponding LEDs 28 exhibit. Furthermore, the above-described light-emitting assemblies may be used 20 be combined with each other. For example, in a light-emitting assembly 20 the various types of light-emitting diodes explained above 28 be combined.

LIST OF REFERENCE NUMBERS

20

 Light-emitting module

22

 substratum

24

 Light guide strips

26

 longitudinal direction

28

 led

29

 LED chip

30

 light

32

 conductor path

34

 reflective layer

36

 converter material

38

 cover material

40

 bonding wire

42

 carrier

44

 covering

50 to 58

 steps

Claims (16)

Light emitting assembly ( 20 ), with a flexible substrate ( 22 ) an elongated, flat fiber optic strip ( 24 ) placed on top of the substrate ( 22 ) is formed and on the substrate ( 22 ) in a longitudinal direction ( 26 ), at least one light emitting diode ( 28 ), which are on top of the substrate ( 22 ) arranged in the optical waveguide strip ( 24 ) is embedded and the light ( 30 ) at least along the longitudinal direction ( 26 ) in the light guide strips ( 24 ) is emitted into it. Light emitting assembly ( 20 ) according to claim 1, wherein the flexible substrate ( 22 ) is elongated and parallel to the longitudinal direction ( 26 ). Light emitting assembly ( 20 ) according to one of the preceding claims, in which at least in partial regions between the substrate ( 22 ) and the light guide strip ( 24 ) a reflective layer ( 34 ) is formed, which by the light emitting diode ( 28 ) generated light ( 30 ) in the direction away from the substrate ( 22 ) reflected. Light emitting assembly ( 20 ) according to one of the preceding claims, in which the light-emitting diode ( 28 ) an LED chip ( 29 ), which is a volume emitter and the light ( 30 ) along the longitudinal direction ( 26 ) and along a thickness direction of the optical waveguide strip ( 24 ), wherein the thickness direction of the optical waveguide strip ( 24 ) perpendicular to a surface of the substrate ( 22 ) stands. Light emitting assembly ( 20 ) according to one of Claims 1 to 3, in which the light-emitting diode ( 28 ) an LED chip ( 29 ), which is a surface emitter and the light ( 30 ) exclusively on an upper side of the LED chip ( 29 ) and in which the LED chip ( 29 ) is arranged so that the surface on which the LED chip ( 29 ) emits the light, parallel to an upper side of the substrate ( 22 ) is arranged, on which the light emitting diode ( 28 ) is arranged. Light emitting assembly ( 20 ) according to one of Claims 1 to 3, in which the light-emitting diode ( 28 ) an LED chip ( 29 ) and is a side emitter. Light emitting assembly ( 20 ) according to one of Claims 4 to 6, in which the light-emitting diode ( 28 ) a converter material ( 36 ) for converting the from the LED chip ( 29 ) generated light ( 30 ) with respect to its wavelength, wherein the converter material ( 36 ) at least one surface of the LED chip ( 29 ) at which the LED chip ( 29 ) the light ( 30 ) emitted. Light emitting assembly ( 20 ) according to any one of the preceding claims, wherein on a surface of the LED chip ( 29 ) or the converter material ( 36 ) parallel to the top of the substrate ( 22 ) and that of the substrate ( 22 ) is turned away, the light ( 30 ) absorbing or the light ( 30 ) reflective cover material ( 38 ) is trained. Light emitting assembly ( 20 ) according to any one of the preceding claims, wherein on the substrate ( 22 ) Conductor tracks ( 32 ) are formed, wherein the conductor tracks ( 32 ) completely from the fiber optic strip ( 24 ) are covered. Light emitting assembly ( 20 ) according to one of the preceding claims, comprising a carrier ( 42 ) and / or a cover body ( 44 ), wherein the substrate ( 22 ) on the support ( 42 ) is arranged and / or the cover body ( 44 ) on the light guide strip ( 24 ) and wherein the carrier ( 42 ) and / or the cover body ( 44 ) are transparent or translucent. Method for producing a light-emitting assembly ( 20 ), in which a flexible substrate ( 22 ), at least one light-emitting diode ( 28 ) on an upper side of the substrate ( 22 ), an elongated, flat optical waveguide strip ( 24 ) on the substrate ( 22 ) is formed so that it is on the substrate ( 22 ) in a longitudinal direction ( 26 ) and that the light emitting diode ( 28 ) in the light guide strips ( 24 ) is embedded, wherein the light emitting diode ( 28 ) so on the substrate ( 22 ) is arranged to light ( 30 ) at least along the longitudinal direction ( 26 ) in the light guide strips ( 24 ) is emitted into it. Method according to claim 11, wherein the flexible substrate ( 22 ) is elongated and the light guide strip ( 24 ) is formed so that the substrate ( 22 ) parallel to the longitudinal direction ( 26 ). Method according to one of claims 11 or 12, wherein prior to the formation of the optical waveguide strip ( 24 ) a reflective layer ( 34 ) on the substrate ( 22 ) is formed and the light guide strip ( 24 ) at least partially on the reflective layer ( 34 ) is formed, wherein the reflective layer ( 34 ) is formed such that it from the light emitting diode ( 28 ) generated light ( 30 ) in the direction away from the substrate ( 22 ) reflected. Method according to one of claims 11 to 13, wherein prior to the formation of the optical waveguide strip ( 24 ) a converter material ( 36 ) for converting the from a LED chip ( 29 ) of the light emitting diode ( 28 ) generated light ( 30 ) is arranged or formed with respect to its wavelength such that it has at least one surface of the LED chip ( 29 ) at which the LED chip ( 29 ) the light ( 30 ) emitted. Method according to one of claims 11 to 14, wherein prior to the formation of the optical waveguide strip ( 24 ) and optionally after forming the converter material ( 36 ) on a surface of the LED chip ( 29 ) or the converter material ( 36 ) parallel to the top of the substrate ( 22 ) and that of the substrate ( 22 ) is turned away, the light ( 30 ) absorbing or the light ( 30 ) reflective cover material ( 38 ) is formed. Method according to one of Claims 11 to 15, in which the substrate ( 22 ) with the light-emitting diode ( 28 ) and the light guide strip ( 24 ) between a carrier ( 42 ) and a cover body ( 44 ), the support ( 42 ) and / or the cover body ( 44 ) are transparent or translucent.

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