DE202005018155U1 - Light emitting module for light source of e.g. table lamp, has substrate with recesses for light emitting diode chips, in which sidewalls of recesses have different angles such that light angle of chips is different - Google Patents
Light emitting module for light source of e.g. table lamp, has substrate with recesses for light emitting diode chips, in which sidewalls of recesses have different angles such that light angle of chips is different Download PDFInfo
- Publication number
- DE202005018155U1 DE202005018155U1 DE202005018155U DE202005018155U DE202005018155U1 DE 202005018155 U1 DE202005018155 U1 DE 202005018155U1 DE 202005018155 U DE202005018155 U DE 202005018155U DE 202005018155 U DE202005018155 U DE 202005018155U DE 202005018155 U1 DE202005018155 U1 DE 202005018155U1
- Authority
- DE
- Germany
- Prior art keywords
- light
- recesses
- emitting diode
- different
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 19
- 239000000843 powder Substances 0.000 claims abstract description 22
- 241000218202 Coptis Species 0.000 claims description 6
- 235000002991 Coptis groenlandica Nutrition 0.000 claims description 6
- 238000005286 illumination Methods 0.000 claims description 3
- 239000000126 substance Substances 0.000 description 2
- 108010043121 Green Fluorescent Proteins Proteins 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002918 waste heat Substances 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/49105—Connecting at different heights
- H01L2224/49107—Connecting at different heights on the semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85909—Post-treatment of the connector or wire bonding area
- H01L2224/8592—Applying permanent coating, e.g. protective coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
Abstract
Description
Technisches Gebiettechnical area
Die Erfindung betrifft einen Leuchtdiodenmodul, der eine Vielzahl von Leuchtdioden enthält, die verschiedene Lichtwinkel aufweisen.The The invention relates to a light emitting diode module comprising a plurality of Contains light emitting diodes, which have different angles of light.
Stand der TechnikState of technology
Leuchtdiode ist durch ein kleines Volumen, einen niedrigen Stromverbrauch, eine geringe Abwärme und eine lange Lebensdauer gekennzeichent und wird für Zier-, Taschen-, Fahrzeug-, Verkehrslampe usw. verwendet. Daher wird die Glühlampe immer mehr von der Leuchtdiode ersetzt. Die Leuchtdiode besteht üblicherweise aus einem Substrat, einem Leuchtdiodenchip, der in einer Ausnehmung des Substrates aufgenommen ist und über Goldfäden mit der Schaltung des Substrates verbunden ist, und einem durchsichtigen Gehäuse, das den Leuchtdiodenchip abdeckt.led is by a small volume, low power consumption, one low waste heat and a long life and is used for ornamental, Pocket, vehicle, traffic lamp, etc. used. Therefore, the light bulb more and more replaced by the light emitting diode. The LED is usually from a substrate, a light-emitting diode chip, in a recess of the Substrates is included and over gold thread connected to the circuit of the substrate, and a transparent Casing, covering the LED chip.
Um eine gezielte Lichtfarbe zu erzeugen, kann ein Fluroeszenzstoff in die Ausnehmung des Substrates gefüllt werden. Nach Bestromung der Schaltung des Substrates erzeugt der Leuchtdiodenchip ein Licht, das durch den Fluroeszenzstoff ausgestrahlt wird, wodurch die Wellenlängen des Lichtes des Leuchtdiodenchips und des Fluoreszenzstoffs zusammengesetzt werden, so daß ein sichtbares Licht mit gewünschter Farbe erhalten wird.Around producing a targeted light color can be a fluorescent substance be filled in the recess of the substrate. After energizing the circuit of the substrate, the LED chip generates a light, which is emitted by the fluorescent substance, whereby the wavelengths of the Light of the LED chip and the fluorescent composite so that one visible light with desired Color is obtained.
Aufgabe der ErfindungTask of invention
Die Erfindung hat die Aufgabe, einen Leuchtdiodenmodul zu schaffen, der eine Vielzahl von Leuchtdioden enthält, die verschiedene Lichtwinkel aufweisen, wodurch eine gezielte Beleuchtung erreicht werden kann.The Invention has the task of creating a light-emitting diode module, containing a plurality of light-emitting diodes having different light angles, whereby a targeted lighting can be achieved.
Diese Aufgabe wird durch den erfindungsgemäßen Leuchtdiodenmodul gelöst, der eine Vielzahl von Leuchtdioden enthält, deren Leuchtdiodenchips in den Ausnehmungen eines Substrates aufgenommen sind, das eine Schaltung trägt, wobei die Leuchtdiodenchips jeweils eine Elektrodenschicht aufweisen, die über Goldfäden mit der Schaltung des Substrates verbunden ist, wonach in die Ausnehmungen ein Fluoreszenzpulver gefüllt wird, das eine Fluoreszenzpulverschicht bildet, und schließlich auf der Fluoreszenzpulverschicht ein durchsichtiges Gehäuse erzeugt wird, wobei durch die Oberflächen der Gehäuse mit verschiedenen Krümmungen oder die Gehäusen mit verschiedenen Höhen oder die Ausnehmungen mit verschiedenen Winkeln der Seitenwände die Lichtwinkel der Leuchtdiodenchips verschieden sind, wodurch eine gezielte Beleuchtung erreicht werden kann.These The object is achieved by the light-emitting diode module according to the invention, the contains a plurality of light-emitting diodes whose LED chips in the recesses of a substrate are recorded, which is a circuit wearing, wherein the light-emitting diode chips each have an electrode layer, the above gold thread is connected to the circuit of the substrate, after which in the recesses a Fluorescence powder filled which forms a fluorescent powder layer, and finally the fluorescent powder layer generates a transparent housing being, passing through the surfaces the housing with different curvatures or the housings with different heights or the recesses with different angles of the sidewalls Light angle of the LED chips are different, creating a targeted lighting can be achieved.
Kurze Beschreibung der ZeichnungenShort description the drawings
Wege zur Ausführung der ErfindungWays to execute the invention
Wie
aus
Das
Merkmal der Erfindung besteht darin, daß die Seitenwand jeder Ausnehmung
Durch
unterschiedliche Höhe
des Gehäuses kann
ebenfalls unterschiedlicher Lichtwinkel erhalten werden. In den
Durch
unterschiedliche Krümmung
der Oberfläche
des Gehäuses
kann ebenfalls unterschiedlicher Lichtwinkel erhalten werden. In
Der
erfindungsgemäße Leuchtdiodenmodul kann
bei einer Beleuchtungseinrichtung
Aufgrund der obengenannten Tatsachen entspricht die Erfindung in ihrer Verfügbarkeit, Fortschrittlichkeit und Neuheit vollauf den Anforderungen für ein Gebrauchsmuster. Die vorstehende Beschreibung stellt nur die bevorzugten Ausführungsbeispiele der Erfindung dar und soll nicht als Definition der Grenzen und des Bereiches der Erfindung dienen. Alle gleichwertige Änderungen und Modifikationen gehören zum Schutzbereich dieser Erfindung.by virtue of the above facts, the invention corresponds in its availability, Progressiveness and novelty fully on the requirements for a utility model. The above description represents only the preferred embodiments of Invention is not intended as a definition of the limits and the Area of the invention serve. All equivalent changes and modifications are included to the scope of this invention.
Die
Erfindung betrifft einen Leuchtdiodenmodul, der eine Vielzahl von
Leuchtdioden enthält,
deren Leuchtdiodenchips (
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE202005018155U DE202005018155U1 (en) | 2005-11-21 | 2005-11-21 | Light emitting module for light source of e.g. table lamp, has substrate with recesses for light emitting diode chips, in which sidewalls of recesses have different angles such that light angle of chips is different |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE202005018155U DE202005018155U1 (en) | 2005-11-21 | 2005-11-21 | Light emitting module for light source of e.g. table lamp, has substrate with recesses for light emitting diode chips, in which sidewalls of recesses have different angles such that light angle of chips is different |
Publications (1)
Publication Number | Publication Date |
---|---|
DE202005018155U1 true DE202005018155U1 (en) | 2006-04-13 |
Family
ID=36274233
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE202005018155U Expired - Lifetime DE202005018155U1 (en) | 2005-11-21 | 2005-11-21 | Light emitting module for light source of e.g. table lamp, has substrate with recesses for light emitting diode chips, in which sidewalls of recesses have different angles such that light angle of chips is different |
Country Status (1)
Country | Link |
---|---|
DE (1) | DE202005018155U1 (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102012202102A1 (en) * | 2012-02-13 | 2013-08-14 | Osram Gmbh | Lighting device has reflecting partition wall which is arranged between volume emitter LED chips which are arranged on common substrate |
US8523404B2 (en) | 2008-12-08 | 2013-09-03 | Osram Opto Semiconductors Gmbh | LED lighting device with homogeneous light intensity and reduced dazzle action |
WO2015176972A1 (en) * | 2014-05-20 | 2015-11-26 | Koninklijke Philips N.V. | Conformal coated lighting or lumination system |
-
2005
- 2005-11-21 DE DE202005018155U patent/DE202005018155U1/en not_active Expired - Lifetime
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8523404B2 (en) | 2008-12-08 | 2013-09-03 | Osram Opto Semiconductors Gmbh | LED lighting device with homogeneous light intensity and reduced dazzle action |
DE102012202102A1 (en) * | 2012-02-13 | 2013-08-14 | Osram Gmbh | Lighting device has reflecting partition wall which is arranged between volume emitter LED chips which are arranged on common substrate |
WO2015176972A1 (en) * | 2014-05-20 | 2015-11-26 | Koninklijke Philips N.V. | Conformal coated lighting or lumination system |
RU2646071C1 (en) * | 2014-05-20 | 2018-03-06 | Филипс Лайтинг Холдинг Б.В. | Lighting or exposure system with conformal coating |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
R207 | Utility model specification |
Effective date: 20060518 |
|
R150 | Utility model maintained after payment of first maintenance fee after three years |
Effective date: 20090212 |
|
R151 | Utility model maintained after payment of second maintenance fee after six years | ||
R151 | Utility model maintained after payment of second maintenance fee after six years |
Effective date: 20120217 |
|
R152 | Utility model maintained after payment of third maintenance fee after eight years | ||
R152 | Utility model maintained after payment of third maintenance fee after eight years |
Effective date: 20140211 |
|
R071 | Expiry of right | ||
R082 | Change of representative |
Representative=s name: KANDLBINDER, MARKUS, DIPL.-PHYS., DE |