DE102016206879A1 - Encoder scale and manufacturing and mounting method therefor - Google Patents

Abstract

A gage scale displaced relative to a detector head comprises: an insulating substrate; a conductive adhesive layer formed on the insulating substrate; and layers having conductive structures formed on the adhesive layer in a shape that enables the detector head to detect a position, wherein: the adhesive layer electrically connects all the structural layers and includes an out-of-detection region structure different from a position detection region of the Detector head extends outwards; and the out-of-detection area structure is grounded via a conductive element.

Description

BACKGROUND

Field of the invention

The present invention relates to a meter scale and a manufacturing and mounting method thereof, and more particularly, to a meter scale capable of permanently eliminating a phenomenon in which the meter scale is charged with static electricity and a manufacturing and mounting method therefor.

Description of the Related Art

In the related art, such as in the JP-A-2004-333417 described, a (magnetic) linear encoder of the type with electromagnetic induction was used. In the electromagnetic induction type linear encoder, scale coils (layers having conductive structures) are formed in a measuring direction of the encoder scale. In particular, a grounding structure is formed outside the scale coils to ground the grounding structure at a scale base. Accordingly, the static electricity generated in the meter scale is released to the scale base.

The linear transducer of the electromagnetic induction type used in the JP-A-2004-333417 However, it basically serves as an effective countermeasure against static electricity for a part of the encoder scale in which the grounding structure (which may be a conductive structure) is formed. Ie. such a grounding structure may not be effective enough for any part other than the part where the grounding structure is formed.

For example, when the scale coil itself charges with static electricity, an operation failure, malfunction or the like of the electromagnetic linear encoder may be caused by discharging the static electricity accumulated in the scale coils.

SUMMARY

The present invention is designed to solve the aforementioned problem, and an object thereof is to provide a meter scale capable of permanently eliminating a phenomenon in which the meter scale charges with static electricity, and a manufacturing and mounting method therefor.

According to a first aspect of the invention, there is provided an encoder scale which is displaced relative to a detector head and comprises: an insulating substrate; a conductive adhesive layer formed on the insulating substrate; and layers having conductive structures formed on the adhesive layer in a shape that enables the detector head to detect a position, wherein: the adhesive layer electrically connects all the structural layers and includes an out-of-detection region structure different from a position detection region of the Detector head extends outwards; and the out-of-detection area structure is grounded via a conductive element.

According to a second aspect of the invention, the encoder scale according to the first aspect may further comprise an insulating protective layer covering the adhesive layer and all the structural layers in the position detection region.

According to a third aspect of the invention, in the encoder scale according to the second aspect, the conductive member may cover the whole out-of-detection area structure on which the insulating protective layer is not formed.

According to a fourth aspect of the invention, in the encoder scale according to any one of the first to third aspects, the conductive member may comprise a conductive thin film and a resin adhesive film comprising a conductive filler on its lower surface, and the thin film may electrically communicate with the outer Detection area structure can be connected by the out-of-detection area structure is brought into contact with the conductive filler.

According to a fifth aspect of the invention, in the encoder scale according to any one of the first to fourth aspects, the conductive member may include a metallic holding member formed in a shape that elastically deforms to hold the insulating substrate, and when the conductive member is a conductive member thin film, the holding member may clamp the thin film and the insulating substrate to press the thin film against the out-of-detection area structure.

According to a sixth aspect of the invention, in the encoder scale according to any one of the first to fourth aspects, the conductive member may comprise a conductive elastic member, and when the conductive member comprises a conductive thin film, the elastic member may be disposed to abut the thin film against the thin film To press out-of-detection area structure.

According to a seventh aspect of the invention, in the encoder scale according to any one of the first to sixth aspects, the encoder scale may be grounded at only one position.

According to an eighth aspect of the invention, there is provided a method of manufacturing and mounting a transducer scale displaced relative to a detector head, the method comprising the steps of: forming a conductive adhesive layer on an insulating substrate; Forming structural layers having a shape in which the structural layers are electrically connected to each other through the adhesive layer and allowing the detector head to detect a position on the adhesive layer; and grounding an out-of-detection area structure of the adhesive layer that extends outward from a position detection area of the detector head via a conductive member.

According to the present invention, it is possible to permanently eliminate a phenomenon in which the encoder scale is charged with static electricity.

BRIEF DESCRIPTION OF THE DRAWINGS

The present invention will become more fully understood from the detailed description given hereinbelow and the accompanying drawings, given purely by way of illustration, and thus not restrictive of the present invention. Show it:

1 12 is a schematic diagram illustrating an example of a linear encoder according to a first embodiment of the present invention;

2 a schematic cross-sectional view of a transducer scale of in 1 imaged linear encoder;

3 a schematic plan view of the in 2 illustrated encoder scale;

4A to 4C schematic diagrams of a grounding tab, which are connected to the in 2 mapped encoder scale is connected (where 4A is a front view, 4B a side view is, and 4C a bottom view is);

5A to 5D schematic diagrams illustrating a first half of a process of manufacturing and attaching the in 2 mapped measuring encoder scale;

6A to 6D schematic diagrams illustrating a second half of the process of manufacturing and mounting the in 2 mapped measuring encoder scale;

7 a schematic diagram illustrating an example of a Meßgeberskala according to a second embodiment of the present invention; and

8th a schematic diagram illustrating an example of a Meßgeberskala according to a third embodiment of the present invention.

DETAILED DESCRIPTION OF THE INVENTION

Hereinafter, an example of a first embodiment of the present invention will be described in detail with reference to the accompanying drawings.

First, the entire training of a sensor 100 described.

the encoder 100 is a linear electromagnetic induction inducer of the assembly type and includes a detector head 110 and a gauge scale 120 , which are in a measuring direction X relative to the detector head 110 is shifted, as in 1 displayed. The detector head 110 is from the encoder scale 120 worn, and the encoder scale 120 is from a support element 118 carried. The encoder scale 120 and the detector head 110 are respectively attached to a fixed part and a movable part that moves relative to the fixed part in a device (a measuring device or a machining device) that is not shown. The carrier element 118 has conductivity and is connected to a reference potential via the fixed part of the device, ie it is earthed. The encoder 100 can be incremental or absolute.

In 1 The reference character IR denotes a range (position detection range) in which a position in the encoder scale 120 from the detector head 110 can be detected (In 2 and 3 a position X5 indicates an end of the position detection range IR). The reference OR denotes an area (out-of-detection area) in which a position on the encoder scale 120 from the detector head 110 can not be detected. The reference character MR denotes a region (bearing contact region) in which the encoder scale 120 with a bearing in the detector head 110 is formed, can come into contact (In 2 and 3 a position X4 indicates an end of the bearing contact area MR).

The detector head 110 is from the encoder scale 120 supported so as to face each other, with a plurality of bearings (or rollers) that are not shown (with a mutual distance of, for example, 1 mm or less), and so that they are movable in the measuring direction X. The detector head 110 includes an excitation coil and a detection coil, which are not shown. The detector head 110 induces an induced current to the structural layers 126 the encoder scale 120 from the exciter coil and detects the induced current using the detection coil. By this training, the detector head detected 110 the position of the detector head 110 relative to the encoder scale 120 ,

The encoder scale 120 includes a glass substrate 122 , an adhesive layer 124 , a structural layer 126 and a protective layer 128 , as in 2 and 3 displayed.

The glass substrate 122 is an insulating substrate and has a rectangular parallelepiped shape having longitudinal sides in the measuring direction X, as in FIG 2 and 3 displayed. The glass substrate 122 is formed of normal glass, but may be a glass substrate (which includes a glass-ceramic substrate) having a low coefficient of thermal expansion. The glass substrate 122 has a thermal expansion coefficient lower than that of metal. The glass substrate 122 also has low moisture absorbency. Accordingly, it is possible by the use of the glass substrate 122 to prevent the detection accuracy from greatly changing with a variation in temperature or humidity.

As in 2 and 3 pictured, is the adhesive layer 124 on a surface 122A the detector head side formed. As in 3 pictured, is the adhesive layer 124 formed in only one part in the Y direction and does not cover the entire surface 122A the detector head side (the adhesive layer is not limited to this configuration, but may be a solid structure covering the entire surface of the detector head side). The adhesive layer 124 however, covers the entire glass substrate 122 with a detection area structure 124B that exists in the position detection area IR and with an out-of-detection area structure 124A which extends outward from the position detection area IR and is present in the out-of-detection area OR in the measuring direction X (ie, the adhesive layer 124 includes the out-of-detection area structure 124A ). The adhesive layer 124 has a constant thickness (for example 50 nm to 100 nm) and connects all structural layers 126 electric. The adhesive layer 124 is a conductive metal foil made of Cr, Ti, Mo, Ni or the like (the adhesive layer is not limited to this configuration but may be made of a conductive inorganic compound such as ITO). The adhesive layer 124 has a good adhesion to the glass substrate 122 and can be formed using a method of forming vacuum foil, such as deposition or sputtering.

As in 2 and 3 Shown are the structural layers 126 on the upper surface 124c the adhesive layer 124 is formed to go across the width of the position X5 of the end of the position detection range IR. The structural layers 126 For example, are a plurality of substantially rectangular coils and are formed in a shape that it is the detector head 110 allows to detect a position (without limitation to the rectangular shape). The structural layers 126 are made of a conductive metal foil (which may be made of Au or Ag) of Cu, Al or the like and has a thickness of, for example, 200 nm to 500 nm. The structural layers 126 For example, from a thin film (having a thickness of, for example, 10 nm to 50 nm) using a vacuum film forming method such as deposition or sputtering, and increasing the thickness thereof by using a wet film molding method such as Galvanizing, be formed. A metal barrier layer (which may be formed of Cr, Ti, Mo, Ni or the like) may be interposed between the structural layers 126 and the adhesive layer 124 be formed so that the materials of the same do not diffuse each other. By forming the metal barrier layer, it is possible to preserve the formation of the layers longer.

The thickness of the adhesive layer 124 For example, it is set to 50 nm to 100 nm. The electrical resistivity of the materials thereof is very different (for example, the ratio of the resistivity of Cu in the structural layers 126 is used, to Cr, in the adhesive layer 124 is used, essentially 1/10). Accordingly, by optimizing the adhesive layer 124 and the structural layers 126 prevents the induced current in the structural layers 126 is induced, the adhesive layer 124 impaired.

The protective layer 128 is an insulating film formed of an organic material such as a resin and up to a position X2 around at least the adhesive layer 124 in the position detection area IR and all the structural layers 126 to cover, as in 2 and 3 displayed. The protective layer 128 is not on the out-of-detection area structure 124A formed between the position X0 and the position X2 in an out-of-detection range OR (In 1 covers the protective layer 128 the adhesive layer 124 and all structural layers 126 in an out-of-range OR). Because the surface of the protective layer 128 is flat, it is possible to permanently prevent the structural layers 126 be missed or the like (without limitation to this embodiment, but depending on the presence of the structural layers, unevenness may be formed on the surface of the protective layer). The protective layer 128 can be formed by coating with a spin coater, a roll coater, a printer or the like.

As in 3 is in the part (an area from the position X0 to the position X2) of the out-of-detection area structure 124A in which the protective layer 128 is not formed, the out-of-detection area structure 124A electrically with a conductive element 130 connected. The conductive element 130 includes an aluminum strip 131 and a grounding tab (holding element) 136 ,

As in 2 pictured, includes the aluminum strip 131 an aluminum foil (conductive thin foil) 132 and a resin adhesive sheet 134 containing a conductive filler on its lower surface. The thickness of the aluminum strip 131 ranges from 50 μm to 100 μm. The aluminum strip 131 is formed from the position X0 to the position X3 in the measuring direction X, around the entire out-of-detection range structure 124A on which the protective layer 128 not formed to cover. The aluminum foil 132 thereby becomes electrically out of detection area structure 124A connected to the out-of-detection area structure 124A in contact with the conductive filler of the resin adhesive sheet 134 is brought. Carbon black, carbon fiber, graphite, metal powder (Au, Ag or the like), metal oxide, metal fiber, synthetic resin having a surface coated with metal, glass beads or the like in the form of flakes, powder or fibers may be used as a conductive filler.

As in 4A to 4C pictured, is the grounding tab 136 a metallic element formed in a shape that can elastically deform around the glass substrate 122 clamped and is formed as a unitary body of a corrosion-resistant metal plate, such as stainless steel. As 4A to 4C pictured, includes the grounding tab 136 a blocking section 136A , a holding section 136B , a leaf spring section 136C and a connection section 136D ,

As in 3 shown, comes the blocking section 136A in contact with the upper surface of the glass substrate 122 if the glass substrate 122 from the holding section 136B is clamped, and limits the movement of the glass substrate 122 up. The holding section 136B is at the lower end of the blocking section 136A educated.

As in 4A to 4C shown, the holding section 136B a substantially U-shaped cross-section capable of supporting the glass substrate 122 from the surface 122A clamp the detector head side and the back side thereof (in the substantially U-shaped form, two ends are slightly opened and the parts just inside the ends approach each other). The leaf spring section 136C is arranged to be inclined at the lower end of the holding portion 136B to extend.

As in 4A to 4C pictured is the leaf spring section 136C a section that serves to connect the connection section 136D at the lower end of the leaf spring section 136C is formed, against the support element 118 to press. The connecting section 136D has a leaf spring structure which has a substantially O-shaped cross-section and is electrically connected to the carrier element 118 connected is.

As in 2 Pictured, clamps the grounding tab 136 the aluminum strip 131 and the glass substrate 122 together to the aluminum strip 131 (or the aluminum foil 132 the same) against the out-of-detection area structure 124A to press. The earthing strap 136 is over the support element 118 grounded. For example, the earthing strap 136 only in the out-of-range range OR at the right end of the encoder scale 120 arranged in 1 is shown. Ie. the encoder scale 120 is only in one position through the earthing tab 136 grounded.

A process of manufacturing and attaching the encoder scale 120 will be referred to below mainly with reference to 5A to 5D and 6A to 6D described.

First, using a method of forming vacuum film such as deposition or sputtering, a uniform adhesive layer is formed 124 on the glass substrate 122 educated. For example, Cr is used as the material for this.

Then a uniform functional layer 125 as structural layers 126 serves, on the adhesive layer 124 educated. Now the functional layer becomes 125 by forming a thin film using a vacuum film forming method such as deposition or sputtering, and increasing the thickness thereof by using a wet film forming method such as plating. For example, Cu is used as the material for this.

Since a Cr metal foil as an adhesive layer 124 first on the glass substrate 122 is formed, it is possible the adhesive strength between the glass substrate 122 and the adhesive layer 124 to reinforce. Because different metals are used, however Cu metal foil is formed on the Cr metal foil using the same method of forming vacuum foil, it is possible that the adhesive strength between the adhesive layer 124 and the Cu metal foil remains high. Since the Cu metal foil is plated with the same material Cu using the other method of forming foil, it is possible that the adhesion strength between the Cu metal foil and the Cu plating foil remains high. Ie. it is possible the adhesive strength between the glass substrate 122 and the functional layer 125 reinforcing the Cu metal foil and the Cu plating foil. The functional layer is not limited to this embodiment, but the functional layer may be formed by using thermal spraying or printing or the like.

As in 5A Imaged, then a uniform resist layer RL on the functional layer 125 formed using a rotary coater, a roller coater or the like.

As in 5B Then, the resist layer RL is formed in a mask shape around the pattern layers 126 using a lithography method or the like.

As in 5C then becomes the functional layer 125 in a region which is not masked with the resist layer RL formed in the mask shape, using a dry etching method or a wet etching method to remove the pattern layers 126 to build. The structural layers 126 have a shape that makes it the detector head 110 allows to detect a position. At this point, the adhesive layer becomes 124 not etched, but remains in a uniform thickness. Accordingly, all structural layers 126 through the adhesive layer 124 electrically connected.

As in 5D is imaged, then the resist layer RL formed in the mask shape is removed.

As in 6A Imaged, then becomes the insulating protective layer 128 in width across the position detection area IR of the detector head 110 educated. The protective layer 128 can be formed by having a part of the out-of-detection area structure 124A precluded in advance and applied, such as printing. Alternatively, the protective layer 128 on the entire surface of the glass substrate 122 what is the part of the out-of-detection area structure 124A heard, and the protective layer 128 of the part of the out-of-detection area structure 124A can be removed later.

Then, as in 6B pictured, the aluminum strip 131 Bonded to the entire out-of-detection area structure 124A to cover that not with the protective layer 128 covered but exposed.

As in 6C then becomes the part of the glass substrate 122 that with the aluminum strip 131 is bonded, with the grounding tab 136 clamped.

As in 6D pictured, then becomes the grounding tab 136 with the carrier element 118 connected to earth. Ie. the out-of-detection area structure 124A gets over the aluminum strip 131 and the earthing tab 136 that is the conductive element 130 are, grounded.

As described above, according to this embodiment, the adhesive layer 124 is only a uniform layer, is not a step of etching to make the adhesive layer 124 in the same form as the structural layers 126 necessary. It is also necessary to have a grounding structure on the encoder scale 120 to recreate. Accordingly, it is possible to prevent the number of steps for manufacturing and mounting the encoder scale 120 elevated.

In this embodiment, the adhesive layer 124 and the structural layers 126 on the glass substrate 122 educated. Accordingly, the adhesive layer 124 using an optimal material to maintain the adhesion between the glass substrate 122 and the structural layers 126 be formed with an optimal thickness. In addition, the structural layers 126 be formed using an optimal material with an optimum thickness to the detector head 110 to allow to detect a position. Ie. because the adhesive layer 124 and the structural layers 126 are formed, it is possible to use the functions for the encoder scale 120 free to optimize. Accordingly, it is possible in this embodiment, the adhesiveness of the structural layers 126 on the glass substrate 122 to improve and the structural layers 126 optimally trained for detection. In this embodiment, all structural layers 126 from the uniform adhesive layer 124 be worn, it is possible to prevent part of the structural layers 126 is missed.

In this embodiment, the adhesive layer bonds 124 all structural layers 126 electrically and earth them, regardless of the structural forms of the structural layers 126 , Accordingly, it is possible, for example, even if static electricity due to the contact of the detector head 110 With a bearing is generated, the static electricity from the structural layers 126 to let go and the occurrence of a discharge or the like between the detector head 110 and prevent the structural layers.

In this embodiment, the protective layer is 128 formed to the adhesive layer 124 and all structural layers 126 in the position detection area IR. Accordingly, it is possible to prevent corrosion, such as rust, of the adhesive layer 124 and the structural layers 126 to prevent. Ie. it is possible to use the encoder scale 120 To age and to ensure a high durability and resistance to environmental influences. Without being limited to this embodiment, the protective layer may be formed so as to cover only a part of the adhesive layer or the structural layers in the position detecting region IR, or the protective layer may not be formed at all.

In this embodiment, the aluminum strip 131 formed around the entire out-of-detection area structure 124A to cover on the protective layer 128 not formed. Accordingly, it is possible to prevent the corrosion of the out-of-detection area structure 124A to reduce and achieve a higher resistance to environmental influences. Without being limited to this embodiment, the aluminum strip may be formed so as to cover only a part of the non-detection area structure on which the protective layer is not formed, or may not cover the extra-detection area structure in which the protective layer is not formed , The covering may be done with a conductive adhesive, such as conductive silicon, or another conductive element instead of the aluminum strip.

In this embodiment, the conductive element comprises 130 the aluminum strip 131 who made the aluminum foil 132 and the adhesive sheet of resin 134 comprising the conductive filler on its lower surface. The aluminum strip 131 includes a passive coating on its surface. Accordingly, it is possible the corrosion of the aluminum foil 132 prevent yourself. The aluminum foil 132 is over the conductive filler of the adhesive film of resin 134 electrically with the out-of-detection area structure 124A connected. The aluminum foil 132 itself has a high ductility and the adhesive film made of resin 134 is between the aluminum foil 132 and the out-of-detection area structure 124A inserted. Accordingly, it is possible to prevent a gap between the aluminum foil 132 and the out-of-detection area structure 124A forms and moisture or the like penetrates therein. In addition, the aluminum foil 132 and the adhesive layer 124 not directly electrically connected. Accordingly, it is possible to avoid the occurrence of electric corrosion based on the ionization tendency or the like. Consequently, it is possible to prevent the out-of-detection area structure 124A or the structural layers 126 due to electrical corrosion, which can cause an error in position detection.

Without being limited to this embodiment, the conductive member may include an aluminum foil which does not include the resin adhesive sheet in the aluminum tab (a Cu foil may be used). Alternatively, a conductive inorganic compound foil of ITO or the like may be used instead of the aluminum foil. In this case, the film and the out-of-detection area structure can be electrically connected to a pressing force of the grounding tab. Alternatively, the grounding tab may be directly electrically connected to the out-of-detection area structure. Alternatively, the grounding tab can not be used, but the conductive member may include only a coated wire, a wire mesh, or the like. Alternatively, the conductive element may comprise only a conductive adhesive, such as conductive silicon, or another conductive element.

In this embodiment, the conductive element comprises 130 the earthing strap 136 , The earthing strap 136 clamps the aluminum foil 132 and the glass substrate 122 stuck to the aluminum foil 132 against the out-of-detection area structure 124A to press. Accordingly, the electrical connection between the out-of-detection area structure 124A and the aluminum strip 131 be further stabilized. In addition, an effortless attachment and detachment of the encoder scale 120 on or from the carrier element 118 possible while the encoder scale 120 is sufficiently grounded. The earthing strap 126 can also be easily replaced. Without limitation to this design, the earthing strap may have a different shape than that in 4A to 4C have pictured forms.

In this embodiment, the encoder scale is 120 grounded at one position only. Accordingly, it is possible to prevent the encoder scale 120 forms an electrical circuit, ie a training as an "antenna". Ie. It is possible to prevent electrical noise to the encoder scale 120 is transmitted. Without limiting this training, the encoder scale can be grounded at multiple locations. In this case, it is possible to reduce the noise by using a filter or the like.

Ie. In this embodiment, it is possible to permanently eliminate a phenomenon in which the encoder scale 120 charged with static electricity.

Although the present invention has been described above in connection with the first embodiment, the present invention is not limited to the aforementioned embodiment. Ie. the present invention can be improved and changed in structure without departing from the spirit of the present invention.

For example, the encoder 100 In the first embodiment, an electromagnetic induction type linear encoder, however, the present invention is not limited to this embodiment. For example, the encoder may include only one photoelectric encoder or may include both a photoelectric encoder and an electromagnetic induction type encoder. For example, if the encoder comprises a photoelectric encoder, materials having a different reflection factor and other methods of forming film may be used for the adhesive layer and the structural layers (for example, a high reflectivity of Al over Cu, Ti, or Cr may be used). or a transparent material such as ITO is used as the adhesive layer). Alternatively, as in the second embodiment 7 Mapped, can be removed structures 224A in which an adhesive layer 224 partially removed, between the structural layers 226 be formed to increase the reflection factor. When the encoder comprises a photoelectric encoder, it is preferable that the protective layer is formed of a transparent material. Thus, if the transmitter includes a photoelectric encoder, it is possible to prevent the encoder from operating due to adhesion of dust or particles based on the static electricity while preventing static electricity from discharging. The encoder may be a rotary encoder and the encoder scale may be a disk, or the encoder may be cylindrical and the encoder scale may be cylindrical.

In the first embodiment, the glass substrate becomes 122 used as the insulating substrate, but the present invention is not limited to this embodiment. For example, the insulating substrate may be a plate on which circuit components such as a glass-epoxy substrate or a ceramic substrate are mounted, or may be a substrate that uses a Si substrate as its base and only one surface of which is subjected to an insulating process , Alternatively, a sapphire substrate or a quartz substrate may be used.

In the first embodiment, the encoder is 100 in the manner of an assembly, a bearing is in the detector head 110 installed, and the bearing comes into contact with the encoder scale 120 However, the present invention is not limited to this embodiment. For example, the encoder may be a separate model in which the transmitter is separated into the detector head and the encoder scale. In this case, the detector head does not include a bearing, the detector head is carried by a moving part of a device, and the gauge scale is carried by a stationary part of the device. The detector head and the encoder scale are contactless with respect to each other with a small gap (for example, 100 microns or less). The electrostatic countermeasure is very effective because the bearing can come into contact and there is a possibility that static electricity is generated depending on the distance relationship between the detector head and the encoder scale, a use environment of the encoder (high or low temperature and humidity, high or low) little dust or particles) or the like.

In the first embodiment, the support member carries 118 the encoder scale 120 directly, but the present invention is not limited to this embodiment. For example, the gauge scale may be attached directly to a fixed part of a device using a mounting member or the like (which includes an adhesive), or the gauge scale may be connected to a reference potential of the device, ie, it may be grounded.

In the first embodiment, the adhesive layer 124 and the structural layer 126 on the surface 122A the detector head side of the glass substrate 122 formed, but the present invention is not limited to this training. For example, the adhesive layer and the structural layers may be formed on the opposite surface of the detector head side (back side) of the glass substrate. When the glass substrate is very thin, advantageous effects similar to those in the first embodiment can be obtained.

In the first embodiment, the conductive element comprises 120 the earthing strap 136 However, the present invention is not limited to this embodiment. For example, a training that in a third embodiment of 8th is pictured, used. In the third embodiment, a conductive elastic member 338 instead of the grounding tab, between a metal member such as an aluminum frame forming the support member and the glass substrate. For example, a conductive resin, elastomer or via as an elastic member 338 be used. In this case, the elastic element 338 between a glass substrate 322 and the Carrier element arranged around the aluminum foil 332 against an out-of-detection area structure 324A to press. Accordingly, the elastic element 338 a uniform pressure on the aluminum foil 332 exercise, with the surface of the glass substrate 322 is facing. Ie. In this embodiment, the same operational advantages as those of the first embodiment can be obtained, and it is also possible to realize the electrical connection of the out-of-detection area structure 324A with the aluminum strip 331 continue to stabilize. The ground tab may be combined, and the ground tab may only clamp the elastic member or the glass substrate and the elastic member together.

The present invention is broadly applicable to insulating gage scales that are displaced relative to a detector head.

QUOTES INCLUDE IN THE DESCRIPTION

This list of the documents listed by the applicant has been generated automatically and is included solely for the better information of the reader. The list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions.

Cited patent literature

• JP 2004-333417 A [0002, 0003]

Claims (8)

Transducer scale displaced relative to a detector head, comprising: an insulating substrate; a conductive adhesive layer formed on the insulating substrate; and Layers of conductive structures formed on the adhesive layer in a form that enable the detector head to detect a position, wherein: the adhesive layer electrically connects all the structural layers and includes an out-of-detection area structure that extends outward from a position detection area of the detector head; and the out-of-detection area structure is grounded via a conductive element. An encoder scale according to claim 1, further comprising an insulating protective layer covering the adhesive layer and all the structural layers in the position detection area. A gauging scale according to claim 2, wherein the conductive element covers the entire out-of-detection area structure on which the insulating protective layer is not formed. A gauging scale according to claim 1, wherein: the conductive member comprises a conductive thin film and a resin adhesive film comprising a conductive filler on its lower surface; and the thin film is electrically connected to the out-of-detection area structure by bringing the out-of-detection area structure into contact with the conductive filler. A gauging scale according to claim 1, wherein: the conductive member comprises a metallic holding member formed in a shape that elastically deforms to hold the insulating substrate; and when the conductive member comprises a conductive thin film, the holding member clamps the thin film and the insulating substrate together to press the thin film against the out-of-detection area structure. A gauging scale according to claim 1, wherein: the conductive element comprises a conductive elastic element; and when the conductive member comprises a conductive thin film, the elastic member is arranged to press the thin film against the out-of-detection-area structure. The encoder scale of claim 1, wherein the encoder scale is grounded at only one position. A method of manufacturing and mounting a gage scale displaced relative to a detector head, the method comprising the steps of: Forming a conductive adhesive layer on an insulating substrate; Forming structural layers having a shape in which the structural layers are electrically connected to each other by the adhesive layer and which enables the detector head to detect a position on the adhesive layer; and Grounding an out-of-detection area structure of the adhesive layer that extends outward from a position detection area of the detector head via a conductive element.

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