DE102016108195A1 - METHOD FOR PRODUCING AN ORGANIC OPTOELECTRONIC COMPONENT AND ORGANIC OPTOELECTRONIC COMPONENT - Google Patents

Abstract

In various embodiments, there is provided a method of making an organic optoelectronic device (10) comprising: forming a first electrode (20); an organic functional layer structure (22) is formed on the first electrode (20); forming a second electrode (23) on the organic functional layer structure (22); forming an encapsulation layer (24) on the second electrode so as to encapsulate the first electrode (20), the organic functional layer structure (22) and the second electrode (23); an adhesive layer (44) is applied to the encapsulant layer (24) in a portion of the encapsulant layer (24); a cover body (38) is arranged on the adhesive layer (44), wherein a first section (46) of the cover body (38) is arranged above the partial area and a second section (48) of the cover body (38) extends over the partial area of the encapsulation layer (24 ) protrudes; the adhesive layer (44) is cured and / or dried; and the second portion (48) of the cover body (38) is removed and the first portion (46) of the cover body (38) remains on the portion of the adhesive layer (44).

Description

The invention relates to a method for producing an organic optoelectronic component and an organic optoelectronic component.

An optoelectronic component may be an electromagnetic radiation emitting component or an electromagnetic radiation absorbing component. An electromagnetic radiation absorbing component may be, for example, a solar cell. Organic-based optoelectronic components, so-called organic optoelectronic components, are increasingly being used. For example, organic light-emitting diodes (organic light-emitting diode (OLED) are increasingly being used in general lighting, for example as area light sources.

An organic optoelectronic component, for example an OLED, may comprise an anode and a cathode and, between them, an organic functional layer system. The organic functional layer system may comprise one or more emitter layers in which electromagnetic radiation is generated, a charge carrier pair generation layer structure each consisting of two or more charge generating layers (CGL) for charge carrier pair generation, and one or more Electron block layers, also referred to as hole transport layers (HTL), and one or more hole block layers, also referred to as electron transport layers (ETLs), for directing the flow of current.

In the production of organic optoelectronic components, these are manufactured on a common carrier and then separated. As one of the last working steps before singulation, a common back cover, in particular an aluminum back cover, which extends over a plurality of organic optoelectronic components on the common carrier, is adhesively bonded to the previously formed layers of the organic optoelectronic components. Subsequently, the backside cover is cut by laser so that a first portion of the back cover is formed directly above the organic optoelectronic devices, with second portions of the back cover being separated from the first portions in the trimming between and / or laterally adjacent to the first Sections are formed. Subsequently, the second sections are removed so that only the first sections remain and each cover one of the organic optoelectronic components. In some cases, the adhesive for fastening the back cover must then be removed in the contact and edge regions of the individual organic optoelectronic components.

For example, as a back cover, an aluminum foil may be adhered to the entire surface by a sheet-like PSA (Pressure Sensitive Adhesive), the stack of aluminum foil and PSA may be cut by laser, and then both the aluminum foil and the PSA may be cut in the second portions and contacts and edge areas are removed. Removing the aluminum foil / PSA laminate is a manual and therefore time-consuming and expensive process. For example, this process can take up to 40 minutes per carrier with several organic optoelectronic components. In addition, this manual process involves the risk of causing defects in the organic optoelectronic devices and is therefore a great risk of yield.

In addition to the back cover, a hardcoat is also regularly formed on the rear side of the organic optoelectronic components, which is applied over the entire surface to the rear sides of the organic optoelectronic components and then restructured and / or removed in a complex process, in particular by the electrical contact surfaces of the organic optoelectronic elements components.

An object of the invention is to provide a method for producing an organic optoelectronic component that is simple, inexpensive and / or fast to carry out.

An object of the invention is to provide an organic optoelectronic device that is simple, inexpensive and / or fast to produce.

An object of the invention is achieved by a method for producing an organic optoelectronic component, in which: a first electrode is formed; an organic functional layer structure is formed on the first electrode; forming a second electrode on the organic functional layer structure; forming an encapsulation layer on the second electrode so as to encapsulate the first electrode, the organic functional layer structure and the second electrode; applying an adhesive layer in a portion of the encapsulant layer to the encapsulant layer; a cover body is disposed on the adhesive layer, wherein a first portion of the cover body is disposed above the portion and a second portion of the cover body protrudes beyond the subregion of the encapsulation layer, the adhesive layer is cured and / or dried; and the second portion of the cover body is removed and the first portion of the cover body remains on the portion of the adhesive layer.

Since the adhesive layer is applied only in the portion below the first portion, the cover body in the second portion can be easily removed, and subsequently no adhesive layer needs to be removed outside the portion. This contributes to the fact that the organic optoelectronic component can be produced quickly, simply and / or inexpensively. Since the adhesive in the second portion does not need to be removed, an adhesive which has a very high hardness when dried and / or cured can be used. This makes it possible to dispense with PSA and to use the adhesive as a protection against external mechanical effects. In particular, the adhesive layer in the subregion can be used as a so-called hardcoat. This can contribute to the fact that the organic optoelectronic component can be produced quickly, easily and / or inexpensively. In addition, it can be dispensed with the removal of the adhesive outside of the sub-area, in particular by means of the manual process. This contributes to the method being able to be carried out quickly, simply and / or cost-effectively and / or to avoid any damage to the organic optoelectronic component possibly occurring in the process.

The adhesive can be printed structured in the subarea, for example by means of ink-jet printing. After arranging the cover body and drying or curing the adhesive, the cover body in the second sections, below which no adhesive has been printed and which do not adhere to the underlying layers of the organic optoelectronic device, can be easily lifted.

According to a development, after arranging the cover body on the adhesive layer and before removing the second section, the first section is separated from the second section. This contributes to a clean dividing line between the first section and the second section and that, when the second section of the covering body is lifted off, the first section of the covering body is not damaged.

According to a development, the first section is separated from the second section by means of laser cutting. This makes it easy to separate the first section from the second section.

According to a development, a plurality of organic optoelectronic components are formed on a common carrier, that is to say on the plate plane, and the covering body extends over a plurality of the organic optoelectronic components before the removal of the corresponding second portions of the covering body. After removal of the second sections of the cover body, the organic optoelectronic components can be singulated.

According to a development, the adhesive layer has a radically crosslinking adhesive, which is dried and / or cured after application to the subregion on an encapsulation layer facing side of the adhesive layer and in the subregion produces a material connection to the encapsulation layer, which due to the oxygen on the side facing away from the encapsulation layer side of the adhesive layer initially remains sticky and dried only after the application of the covering on the adhesive layer and the associated displacement of the oxygen from the adhesive layer on the side facing the cover body of the adhesive layer on the side facing the cover body of the adhesive layer and / or is cured and produces a material connection to the cover body.

As the radically crosslinking adhesive, for example, an acrylate-based adhesive can be used. This is dried and / or cured, in particular crosslinked, for example by means of UV activation or thermal activation after application to the portion and before arranging the cover body in a first crosslinking step under normal atmosphere, ie in normal air. The radical crosslinking reaction is inhibited by oxygen, as a result of which the half, side and / or surface of the adhesive layer facing the air and facing away from the remaining layers of the organic optoelectronic component remain sticky and only the half, side or surface of the adhesive layer facing the layers of the organic optoelectronic component dries or hardens. Subsequently, the covering body, in particular the aluminum foil, is arranged flat on the adhesive layer and / or laminated, for example by means of vacuum lamination. This is followed by the second crosslinking step, for example by means of UV activation or thermal activation, which takes place in the subregion due to the now glued cover body, in particular the laminated aluminum foil, with exclusion of oxygen. This leads to the complete networking of the Adhesive and permanent adhesion of the cover body in the sub-area.

In a cohesive connection, in principle a first body is connected to a second body by means of atomic and / or molecular forces. A cohesive connection is a non-detachable, in particular non-destructive releasable connection.

An object of the invention is achieved by a method for producing an optoelectronic component, in which: the first electrode is formed; the organic functional layer structure is formed on the first electrode; the second electrode is formed on the organic functional layer structure; forming the encapsulation layer on the second electrode so as to encapsulate the first electrode, the organic functional layer structure, and the second electrode; the adhesive layer in the subregion of the encapsulation layer is applied to the encapsulation layer, wherein the adhesive layer comprises the radically crosslinking adhesive; the adhesive layer is dried and / or cured after application to the partial region on the side of the adhesive layer facing the encapsulation layer, whereby the material-locking connection to the encapsulation layer is produced in the partial region, wherein the adhesive layer is due to oxygen on the side of the adhesive layer facing away from the encapsulation layer side of the adhesive layer facing away from the encapsulation layer initially remains sticky; and the covering body is arranged on the side of the adhesive layer facing away from the encapsulation layer, wherein the covering body is configured and arranged such that it is arranged exclusively over the partial area, and wherein the adhesive is applied to the adhesive layer and the adhesive layer only after the covering body has been applied associated displacement of the oxygen from the adhesive layer on the side facing the cover body side of the adhesive layer is dried and / or cured and so produces a material connection to the cover body.

According to a development of the cover body is a metal foil. This can contribute in a simple manner to the fact that the organic optoelectronic component is flexible despite arranging the covering body, in particular a flexible OLED.

According to a development, the adhesive comprises acrylate or is formed thereof. This makes it possible to use the adhesive as part of the cover, in particular as hardcoat, of the organic optoelectronic component.

According to a development, the adhesive is applied to the encapsulation layer by means of a printing process, in particular in the subregion. This makes it possible to apply the adhesive in a structured manner to the encapsulation layer, ie in such a way that it is not arranged on undesired areas, that is to say outside the subarea, and does not have to be removed in these areas subsequently.

According to a development, the adhesive layer on the side facing the encapsulation layer and / or on the side facing the covering body is dried and / or cured by means of ultraviolet radiation and / or by means of heat.

According to a development, the optoelectronic component is an organic light-emitting diode.

An object of the invention is achieved by an organic optoelectronic component comprising: a first electrode, an organic functional layer structure on the first electrode; a second electrode on the organic functional layer structure; an encapsulation layer on the second electrode, the encapsulation layer encapsulating the first electrode, the organic functional layer structure, and the second electrode; an adhesive layer on the encapsulation layer; and a cover body on the side facing away from the encapsulation layer side of the adhesive layer, wherein the adhesive layer has a radically crosslinking adhesive and provides a material connection between the encapsulation layer and the cover body.

The above-explained advantages and / or developments of the methods for producing the organic optoelectronic component can be readily transferred to the organic optoelectronic component itself.

According to a development of the cover body is a metal foil.

According to a development, the adhesive comprises acrylate or is formed thereof.

According to a development, the organic optoelectronic component is designed as an organic light-emitting diode.

Embodiments of the invention are illustrated in the figures and are explained in more detail below.

Show it:

1 a side sectional view of an embodiment of an organic optoelectronic device;

2 a plan view of a plurality of organic optoelectronic devices in a first state during a conventional method for producing an organic optoelectronic device;

3 a plan view of a plurality of organic optoelectronic devices in a second state during the conventional method for producing an organic optoelectronic device;

4 a plan view of a plurality of organic optoelectronic devices in a third state during the conventional method for producing an organic optoelectronic device;

5 a plan view of a plurality of organic optoelectronic devices in a fourth state during the conventional method for producing an organic optoelectronic device;

6 a plan view of a plurality of organic optoelectronic devices in a fifth state during the conventional method for producing an organic optoelectronic device;

7 a plan view of a plurality of organic optoelectronic devices in a first state during an embodiment of a method for producing an organic optoelectronic device;

8th a plan view of a plurality of organic optoelectronic devices in a second state during the embodiment of the method for producing an organic optoelectronic device;

9 a plan view of a plurality of organic optoelectronic devices in a third state during the embodiment of the method for producing an organic optoelectronic device;

10 a plan view of a plurality of organic optoelectronic devices in a fourth state during an embodiment of a method for producing an organic optoelectronic device.

In the following detailed description, reference is made to the accompanying drawings, which form a part of this specification, and in which is shown by way of illustration specific embodiments in which the invention may be practiced. Because components of embodiments may be positioned in a number of different orientations, the directional terminology is illustrative and is in no way limiting. It should be understood that other embodiments may be utilized and structural or logical changes may be made without departing from the scope of the present invention. It should be understood that the features of the various embodiments described herein may be combined with each other unless specifically stated otherwise. The following detailed description is therefore not to be taken in a limiting sense, and the scope of the present invention is defined by the appended claims. In the figures, identical or similar elements are provided with identical reference numerals, as appropriate.

An organic optoelectronic device may be an organic electromagnetic radiation emitting device or an organic electromagnetic radiation absorbing device. An organic electromagnetic radiation absorbing component may be, for example, an organic solar cell or an organic photodetector. In various embodiments, an organic electromagnetic radiation emitting component may be an organic electromagnetic radiation emitting semiconductor component and / or may be formed as a diode emitting organic electromagnetic radiation or as a transistor emitting organic electromagnetic radiation. The radiation may, for example, be light in the visible range, UV light and / or infrared light. In this context, the organic electromagnetic radiation emitting device may be formed, for example, as an organic light emitting diode (OLED) or as an organic light emitting transistor. The organic light emitting device may be part of an integrated circuit in various embodiments. Furthermore, a plurality of organic light-emitting components may be provided, for example housed in a common housing.

1 shows a side sectional view of an embodiment of an organic optoelectronic device 10 , The organic optoelectronic component 10 has a carrier 12 on. The carrier 12 can be translucent or transparent. The carrier 12 serves as a carrier element for electronic elements or layers, for example light-emitting elements. Of the carrier 12 For example, plastic, metal, glass, quartz and / or a semiconductor material can have or be formed from it. Furthermore, the carrier can 12 comprise or be formed from a plastic film or a laminate with one or more plastic films. The carrier 12 can be mechanically rigid or mechanically flexible.

On the carrier 12 an optoelectronic layer structure is formed. The optoelectronic layer structure has a first electrode layer 14 on that a first contact section 16 , a second contact section 18 and a first electrode 20 having. The carrier 12 with the first electrode layer 14 can also be referred to as a substrate. Between the carrier 12 and the first electrode layer 14 For example, a first barrier layer (not shown), for example a first barrier thin layer, may be formed.

The first electrode 20 is from the first contact section 16 by means of an electrical insulation barrier 21 electrically isolated. The second contact section 18 is with the first electrode 20 the optoelectronic layer structure electrically coupled. The first electrode 20 may be formed as an anode or as a cathode. The first electrode 20 can be translucent or transparent. The first electrode 20 has an electrically conductive material, for example, metal and / or a conductive conductive oxide (TCO) or a layer stack of several layers comprising metals or TCOs. The first electrode 20 For example, a layer stack may comprise a combination of a layer of a metal on a layer of a TCO, or vice versa. An example is a silver layer deposited on an indium tin oxide (ITO) layer (Ag on ITO) or ITO-Ag-ITO multilayers. The first electrode 20 may alternatively or in addition to the materials mentioned include: networks of metallic nanowires and particles, for example of Ag, networks of carbon nanotubes, graphene particles and layers and / or networks of semiconducting nanowires.

Above the first electrode 20 is an optically functional layer structure, for example an organic functional layer structure 22 , the optoelectronic layer structure formed. The organic functional layer structure 22 For example, it may have one, two or more sublayers. For example, the organic functional layer structure 22 a hole injection layer, a hole transport layer, an emitter layer, an electron transport layer and / or an electron injection layer. The hole injection layer serves to reduce the band gap between the first electrode and hole transport layer. In the hole transport layer, the hole conductivity is larger than the electron conductivity. The hole transport layer serves to transport the holes. In the electron transport layer, the electron conductivity is larger than the hole conductivity. The electron transport layer serves to transport the electrons. The electron injection layer serves to reduce the band gap between the second electrode and the electron transport layer. Furthermore, the organic functional layer structure 22 one, two or more functional layer structure units, each having said sub-layers and / or further intermediate layers.

Over the organic functional layer structure 22 is a second electrode 23 of the optoelectronic layer structure, which is electrically connected to the first contact section 16 is coupled. The second electrode 23 may according to one of the embodiments of the first electrode 20 be formed, wherein the first electrode 20 and the second electrode 23 may be the same or different. The first electrode 20 serves, for example, as the anode or cathode of the optoelectronic layer structure. The second electrode 23 serves corresponding to the first electrode as the cathode or anode of the optoelectronic layer structure.

The optoelectronic layer structure has an electrically active region and an optically active region 40 on, which overlap. The electrically active region is the region of the organic optoelectronic component 10 in which electrical current for operation of the organic optoelectronic component 10 flows. The optically active area 40 is the range of the organic optoelectronic device 10 in which electromagnetic radiation is generated or absorbed. The optically active area 40 corresponds to a laterally extending overlap region in which the first electrode 20 , the organic functional layer structure 22 and the second electrode 23 overlap. On or above the active area, a getter structure (not shown) may be arranged. The getter layer can be translucent, transparent or opaque. The getter layer may include or be formed of a material that absorbs and binds substances that are detrimental to the active area.

Above the second electrode 23 and partially over the first contact portion 16 and partially over the second contact portion 18 is an encapsulation layer 24 the optoelectronic layer structure is formed, which encapsulates the optoelectronic layer structure. The encapsulation layer 24 may be formed as a second barrier layer, for example as a second barrier thin layer. The encapsulation layer 24 can also be referred to as thin-layer encapsulation. The encapsulation layer 24 forms a barrier to chemical contaminants or atmospheric substances, in particular to water (moisture) and oxygen. The encapsulation layer 24 may be formed as a single layer, a layer stack or a layer structure. The encapsulation layer 24 may include or be formed from: alumina, zinc oxide, zirconia, titania, hafnia, tantalum oxide, lanthania, silica, silicon nitride, silicon oxynitride, indium tin oxide, indium zinc oxide, aluminum doped zinc oxide, poly (p-phenylene terephthalamide), nylon 66 , as well as mixtures and alloys thereof. Optionally, the first barrier layer on the carrier 12 corresponding to a configuration of the encapsulation layer 24 be educated.

In the encapsulation layer 24 are above the first contact section 16 a first recess of the encapsulation layer 24 and over the second contact portion 18 a second recess of the encapsulation layer 24 educated. In the first recess of the encapsulation layer 24 is a first contact area 32 exposed and in the second recess of the encapsulation layer 24 is a second contact area 34 exposed. The first contact area 32 serves for electrically contacting the first contact section 16 and the second contact area 34 serves for electrically contacting the second contact section 18 ,

Above the encapsulation layer 24 is an adhesive layer 36 educated. The adhesive layer 36 has, for example, an adhesive, for example an adhesive, for example a laminating adhesive, a lacquer and / or a resin. The adhesive layer 36 For example, it may comprise particles which scatter electromagnetic radiation, for example light-scattering particles.

Over the adhesive layer 36 is a cover body 38 educated. The adhesive layer 36 serves to fasten the cover body 38 at the encapsulation layer 24 , The cover body 38 has, for example, plastic, glass and / or metal. For example, the cover body 38 may be formed essentially of glass and a thin metal layer, such as a metal foil, and / or a graphite layer, such as a graphite laminate, on the glass body. The cover body 38 serves to protect the organic optoelectronic device 10 , for example, from mechanical forces from the outside. Furthermore, the cover body 38 serve for distributing and / or removing heat, in the organic optoelectronic device 10 is produced. For example, the glass of the cover body 38 serve as protection against external influences and the metal layer of the cover body 38 can be used to distribute and / or dissipate during operation of the organic optoelectronic device 10 serve arising heat.

The cover body 38 and the adhesive layer 36 of the completed organic optoelectronic component 10 extend over a portion of the encapsulation layer 24 , The area of the encapsulation layer 24 after completion of the organic optoelectronic device 10 from the cover body 38 and the adhesive layer 36 is therefore referred to in this application as a portion of the encapsulation layer 24 designated. The subregion of the encapsulation layer 24 extends over the optically active area 40 and over a lateral edge region, in the lateral direction the optically active region 40 surrounds, wherein the subregion of the encapsulation layer 24 even a part of the lateral edge area of the active area 40 forms. The elements and sections of the organic optoelectronic device 10 extending laterally outside the cover body 38 and the adhesive layer 36 and thus outside the subregion of the encapsulation layer 24 lie, for example, the contact sections of 32 . 34 , do not belong in this sense to the lateral border area of the active area 40 ,

2 shows a plan view of a plurality of organic optoelectronic devices 10 in a first state during a conventional method of manufacturing one of the organic optoelectronic devices 10 , Upon completion, the organic optoelectronic devices can 10 in each case, for example, essentially the in 1 shown organic optoelectronic device 10 correspond.

In the in 2 shown first state, the carrier extends 12 in one piece over the conventional organic optoelectronic components 10 , Above the carrier 12 are already the first electrode layer 14 , in particular the first electrode 20 , the organic functional layer structure 22 , the second electrode 23 and the encapsulation layer 24 educated. The encapsulation layer 24 is in 2 shown transparent, which is why the optically active areas 40 the organic optoelectronic devices 10 are visible. In reality, the encapsulation layer 24 transparent or not transparent.

Between the optically active areas 40 are essentially no layers on the support 12 educated. This means, for example, that except for the lateral edges of the individual organic optoelectronic components 10 , in particular the lateral edge regions of the optically active regions 40 , no further layer structures between the optically active areas 40 are formed. In other words, the carrier lies 12 between the optically active areas 40 essentially free. In contrast, between the optically active areas 40 for example, the first electrode layer 14 on the carrier 12 be educated.

In the conventional method for producing the organic optoelectronic components 10 becomes in the first state, an adhesive layer over the entire surface over the entire carrier 12 and the optically active regions 40 applied. The adhesive used for the adhesive layer may be, for example, a PSA adhesive.

3 shows a plan view of the plurality of organic optoelectronic devices 10 in a second state during the conventional process for producing the organic optoelectronic devices 10 , In the second state, the cover body 38 over the carrier 12 and the optically active regions 40 arranged directly on the adhesive layer. The cover body 38 extends integrally over the plurality of organic optoelectronic devices 10 , The cover body 38 may be formed for example by an aluminum foil.

4 shows a plan view of the plurality of organic optoelectronic devices 10 in a third state during the conventional process for producing the organic optoelectronic devices 10 , In the third state, along the lateral outer edges of the subregions of the encapsulation layer 24 cut lines 42 formed, the first portions of the cover body 38 , which lie over the subregions, of second sections of the cover body 38 physically separate, lying outside of the sections. The cut lines 42 can be formed for example by means of laser cutting, in particular by means of a laser beam.

5 shows a plan view of the plurality of organic optoelectronic devices 10 in a fourth state during the conventional process for producing the organic optoelectronic devices 10 , In the fourth state, the second portion (s) of the cover body become 38 removed, for example by hand, in other words by means of one hand 44 , Because the second sections of the cover body 38 due to the adhesive layer on the encapsulation layer 24 Sticking is in the conventional method for producing the organic optoelectronic devices 10 removing the second portions of the cover body 38 a very complex and costly effort.

6 shows a plan view of the organic optoelectronic devices 10 in a fifth state during the conventional process for producing the organic optoelectronic devices 10 , In the fifth state, the second portions of the cover body became 38 completely removed, leaving essentially only the active areas 40 and the lateral edge regions of the active regions 40 the individual organic optoelectronic components 10 , ie the corresponding subregions of the encapsulation layer 24 , from the first sections of the cover body 38 are covered. The following may be the organic optoelectronic components 10 to be isolated. In particular, the carrier may 12 appropriately cut and / or sawn.

7 shows a plan view of a plurality of organic optoelectronic devices 10 in a first state during one embodiment of a method of making an organic optoelectronic device 10 , After completion, the organic optoelectronic components 10 largely in the 1 shown organic optoelectronic device 10 correspond. The in 7 shown first state of the embodiment of the method for producing the organic optoelectronic devices 10 is the in 2 shown first state of the conventional method for producing the organic optoelectronic devices 10 ahead. In particular, in the in 7 shown first state of the one-piece carrier 12 provided, which is about several of the organic optoelectronic devices 10 extends. The organic optoelectronic components 10 each have the first electrode layer 14 , in particular the first electrode 20 , the organic functional layer structure 22 and the second electrode 23 on. Further, the encapsulation layer 24 be formed so that they at least largely the electrically active areas and completely the optically active areas 40 the organic optoelectronic devices 10 covered. The encapsulation layer 24 In particular, it is designed to spread over the entire carrier 12 and the organic optoelectronic devices 10 extends. Alternatively, the encapsulation layer 24 be designed so that they are only over the optically active areas 40 extends or that at least the contact areas 32 . 34 free from the encapsulation layer 24 stay. The encapsulation layer 24 may be transparent or non-transparent.

On each of the organic optoelectronic components 10 is ever an adhesive layer 44 applied such that they the corresponding portions of the encapsulation layer 24 , So at least the optically active areas 40 and the lateral border areas around the active areas 40 , covered. The areas above the vehicle 12 extending laterally between and adjacent to the organic optoelectronic devices 10 are present, and the areas of the encapsulation layer 24 outside the individual subregions of the encapsulation layer 24 stay free of adhesive layers 44 , The adhesive layers 44 can be applied for example by means of a printing process, in particular by means of ink-jet printing.

Optionally, a radically crosslinking adhesive may be used as the adhesive. As the radically crosslinking adhesive, for example, an acrylate-based adhesive can be used. This becomes after the application of the appropriate adhesive layers 44 dried on the subregions in a first crosslinking step under normal atmosphere, ie in normal air, and / or cured, in particular crosslinked, for example by means of UV activation or thermal activation. The radical crosslinking reaction is oxygen-inhibited, which leaves the air-facing and remaining layers of the organic optoelectronic components 10 remote halves, sides and / or surfaces of the adhesive layers 44 sticky and only the layers of organic optoelectronic devices 10 facing halves, sides or surfaces of the adhesive layers 44 dry or harden.

8th shows a plan view of the organic optoelectronic devices 10 in a second state during the embodiment of the method for producing the organic optoelectronic components 10 , In the second state, the cover body 38 over the carrier 12 arranged so that it is above all organic optoelectronic devices 10 extends and that he is in direct physical contact with the adhesive layers 44 is. The cover body 38 For example, an aluminum foil, was flat on the adhesive layers 44 arranged and / or laminated, for example by Vakuumlamination. This is followed by a second crosslinking step, for example by means of UV activation or thermal activation, in the subregions of the encapsulation layer 24 due to the now glued cover body 38 , in particular the laminated aluminum foil, takes place under exclusion of oxygen. This leads to complete crosslinking of the adhesive and permanent adhesion of the cover body 38 at and in the subregions of the encapsulation layer 24 , Outside the partial areas, the covering body adheres 38 not at the encapsulation layer 24 because there is no glue there.

9 shows a plan view of the organic optoelectronic devices 10 in a third state during the embodiment of the method for producing the organic optoelectronic components 10 , In the third state, along the lateral outer edges of the subregions of the encapsulation layer 24 cut lines 42 formed, the first portions of the cover body 38 , which lie over the subregions, of second sections of the cover body 38 physically separate, lying outside of the sections. The cut lines 42 can be formed for example by means of laser cutting, in particular by means of a laser beam.

10 shows a plan view of the plurality of organic optoelectronic devices 10 in a fourth state during the embodiment of the method for producing the organic optoelectronic components 10 , In the fourth state, the second portion (s) of the cover body became 38 away. Because the second sections of the cover body 38 not at the encapsulation layer 24 In the exemplary embodiment, the method for producing the organic optoelectronic components is adhesive 10 removing the second portions of the cover body 38 very easy, fast and precise possible. The following may be the organic optoelectronic components 10 are singulated, for example by cutting and / or sawing the carrier 12 ,

Alternatively to the in 8th shown second step and the in 9 shown third step, in which the cover body 38 over several of the organic optoelectronic components 10 extending over the vehicle 12 is arranged and subsequently cut, the individual cover body 38 each in pre-cut condition on the adhesive layers 44 on the corresponding subregions of the encapsulation layer 24 are glued, especially when used as an adhesive, the radically injurious adhesive.

The invention is not limited to the specified embodiments. For example, the organic optoelectronic components 10 , in particular the subregions, the optically active regions 40 and / or the finished cover body 38 in plan view have a different shape than those shown in the figures, for example, a round or angular, polygonal, in particular rectangular, square, or honeycomb-shaped. Furthermore, before the separation of the organic optoelectronic components 10 the one-piece carrier 12 over more or less than four organic optoelectronic devices 10 extend.

LIST OF REFERENCE NUMBERS

 10

optoelectronic component

12

carrier

14

 electrically conductive layer

16

first contact section

18

second contact section

20

first electrode

22

organic functional layer structure

23

 second electrode

24

 encapsulation

32

first contact area

34

 second contact area

36

 Adhesive layer

38

covering

40

optically active area

42

cut lines

44

adhesive layer

Claims (15)

Method for producing an organic optoelectronic component ( 10 ), in which a first electrode ( 20 ), an organic functional layer structure ( 22 ) on the first electrode ( 20 ) is formed; a second electrode ( 23 ) on the organic functional layer structure ( 22 ) is formed; an encapsulation layer ( 24 ) on the second electrode ( 23 ) is formed so that it the first electrode ( 20 ), the organic functional layer structure ( 22 ) and the second electrode ( 23 encapsulated; an adhesive layer ( 44 ) in a subregion of the encapsulation layer ( 24 ) on the encapsulation layer ( 24 ) is applied; a cover body ( 38 ) on the adhesive layer ( 44 ), a first section ( 46 ) of the cover body ( 38 ) is arranged above the subarea and a second section ( 48 ) of the cover body ( 38 ) over the subregion of the encapsulation layer ( 24 ) protrudes, the adhesive layer ( 44 ) is hardened and / or dried, and the second section ( 48 ) of the cover body ( 38 ) and the first section ( 46 ) of the cover body ( 38 ) on the portion of the adhesive layer ( 44 ) remains. Method according to claim 1, wherein before the removal of the second section ( 48 ) the first paragraph ( 46 ) of the second section ( 48 ) is separated. Method according to Claim 2, in which the first section ( 46 ) of the second section ( 48 ) is separated by laser cutting. Method according to one of the preceding claims, in which a plurality of organic optoelectronic components ( 10 ) on a common carrier ( 12 ) are formed and in which the cover body ( 38 ) before removing the corresponding second sections ( 48 ) of the cover body ( 38 ) over a plurality of the organic optoelectronic components ( 10 ). Method according to one of the preceding claims, in which the adhesive layer ( 44 ) has a radically crosslinking adhesive, which after application to the subregion on one of the encapsulation layer ( 24 ) facing side of the adhesive layer ( 44 ) is dried and / or hardened and in the subregion a cohesive connection to the encapsulation layer ( 24 ) due to the oxygen on the surface of the encapsulation layer ( 24 ) facing away from the adhesive layer ( 44 ) initially sticky and only after the application of the cover body ( 38 ) on the adhesive layer ( 44 ) and the associated displacement of the oxygen from the adhesive layer ( 44 ) on the cover body ( 38 ) facing side of the adhesive layer ( 44 ) on the cover body ( 38 ) facing side of the adhesive layer ( 44 ) is dried and / or cured and a cohesive connection to the cover body ( 38 ). Method for producing an organic optoelectronic component ( 10 ), in which a first electrode ( 20 ), an organic functional layer structure ( 22 ) on the first electrode ( 20 ) is formed; a second electrode ( 23 ) on the organic functional layer structure ( 22 ) is formed; an encapsulation layer ( 24 ) on the second electrode ( 23 ) is formed so that it the first electrode ( 20 ), the organic functional layer structure ( 22 ) and the second electrode ( 23 encapsulated; an adhesive layer ( 44 ) in a subregion of the encapsulation layer ( 24 ) on the encapsulation layer ( 24 ) is applied, wherein the adhesive layer ( 44 ) has a radically crosslinking adhesive; the adhesive layer ( 44 ) after application to the subregion on one of the encapsulation layer ( 24 ) facing side of the adhesive layer ( 44 ) is dried and / or hardened, whereby in the subregion a cohesive connection to the encapsulation layer ( 24 ) due to the oxygen on the surface of the encapsulation layer ( 24 ) facing away from the adhesive layer ( 44 ) of the encapsulation layer ( 24 ) side facing away from the adhesive layer ( 44 ) remains sticky at first; and a cover body ( 38 ) on the of the encapsulation layer ( 24 ) facing away from the adhesive layer ( 44 ) is arranged, wherein the cover body ( 38 ) is designed and arranged so that it is arranged exclusively over the sub-area, and wherein the adhesive is applied only after the application of the covering body ( 38 ) on the adhesive layer ( 44 ) and the associated displacement of the oxygen from the adhesive layer ( 44 ) on the cover body ( 38 ) facing side of the adhesive layer ( 44 ) is dried and / or hardened and thus a cohesive connection to the cover body ( 38 ). Method according to one of the preceding claims, in which the covering body ( 38 ) is a metal foil.  A method according to any preceding claim, wherein the adhesive comprises or is formed from acrylate. Method according to one of the preceding claims, in which the adhesive is applied by means of a printing process to the encapsulation layer ( 24 ) is applied. Method according to one of the preceding claims, in which the adhesive layer ( 44 ) at the encapsulation layer ( 24 ) facing side and / or on the cover body ( 38 ) side by means of ultraviolet radiation and / or dried by means of heat and / or cured. Method according to one of the preceding claims, in which the organic optoelectronic component ( 10 ) is an organic light emitting diode. Organic optoelectronic component ( 10 ), with a first electrode ( 20 ), an organic functional layer structure ( 22 ) on the first electrode ( 20 ); a second electrode ( 23 ) on the organic functional layer structure ( 22 ); an encapsulation layer ( 24 ) on the second electrode ( 23 ), wherein the encapsulation layer ( 24 ) the first electrode ( 20 ), the organic functional layer structure ( 22 ) and the second electrode ( 23 encapsulated; an adhesive layer ( 44 ) on the encapsulation layer ( 24 ); and a cover body ( 38 ) on the of the encapsulation layer ( 24 ) facing away from the adhesive layer ( 44 ), wherein the adhesive layer ( 44 ) has a radically crosslinking adhesive and a cohesive connection between the encapsulation layer ( 24 ) and the cover body ( 38 ). Organic optoelectronic component ( 10 ) according to claim 12, wherein the covering body ( 38 ) is a metal foil. Organic optoelectronic component ( 10 ) according to one of claims 12 or 13, wherein the adhesive comprises or is formed from acrylate. Organic optoelectronic component ( 10 ) according to one of claims 12 to 14, in which the organic optoelectronic component ( 10 ) is designed as an organic light-emitting diode.

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