DE102015218369A1 - Method for producing a leadframe module and leadframe module - Google Patents

Method for producing a leadframe module and leadframe module Download PDF

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Publication number
DE102015218369A1
DE102015218369A1 DE102015218369.6A DE102015218369A DE102015218369A1 DE 102015218369 A1 DE102015218369 A1 DE 102015218369A1 DE 102015218369 A DE102015218369 A DE 102015218369A DE 102015218369 A1 DE102015218369 A1 DE 102015218369A1
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Prior art keywords
lead frame
components
leadframe
arrangement
module
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DE102015218369.6A
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German (de)
Inventor
Karl Weidner
Stefan Kiefl
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Siemens AG
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Siemens AG
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Priority to DE102015218369.6A priority Critical patent/DE102015218369A1/en
Publication of DE102015218369A1 publication Critical patent/DE102015218369A1/en
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Abstract

Bei dem Verfahren zur Herstellung eines Leiterrahmenmoduls mit einem Leiterrahmen und zumindest zwei oder mehreren an den Leiterrahmen galvanisch angebundenen Bauelementen werden die zumindest zwei Bauelemente in einer Anordnung angeordnet und der Leiterrahmen wird an die Anordnung gesintert. Das Leiterrahmenmodul weist einen Leiterrahmen und zumindest zwei oder mehreren Bauelemente auf. Bei dem Leiterrahmenmodul ist der Leiterrahmen an die Bauelemente gesintert und/oder geklebt und/oder gelötet und/oder kraftbeaufschlagt. Es ist vorzugsweise nach einem Verfahren wie oben genannt hergestellt.In the method for producing a leadframe module having a leadframe and at least two or more components galvanically connected to the leadframe, the at least two components are arranged in an array and the leadframe is sintered to the array. The leadframe module has a leadframe and at least two or more components. In the leadframe module, the leadframe is sintered and / or glued and / or soldered and / or powered by force to the components. It is preferably made by a method as mentioned above.

Description

Die Erfindung betrifft ein Verfahren zur Herstellung eines Leiterrahmenmoduls mit einem Leiterrahmen und zumindest zwei oder mehreren an den Leiterrahmen galvanisch angebundenen Bauelementen sowie ein Leiterrahmenmodul. The invention relates to a method for producing a leadframe module having a leadframe and at least two or more components galvanically connected to the leadframe and a leadframe module.

Bauelemente werden typischerweise auf geeigneten Substraten, z.B. Leiterplatten, DCB-Keramiken oder Leadframes fixiert und mittels Drahtbondtechnik kontaktiert. Die Drahtbonds verbinden hierbei die Kontakte der Bauelemente mit den Kontakten des Substrates oder bei Modulen auch die Kontakte der Bauelemente untereinander. Devices are typically mounted on suitable substrates, e.g. PCBs, DCB ceramics or lead frames fixed and contacted by wire bonding technique. The wire bonds in this case connect the contacts of the components with the contacts of the substrate or, in the case of modules, also the contacts of the components with one another.

Nachteil ist der komplexe Prozessablauf und ein aufwändiges, serielles Drahtbondverfahren, bei dem eine hohe Ausbeute Voraussetzung ist. Ein hohes Risiko stellt die Kurzschlussgefahr durch sich berührende Drähte dar. Die Miniaturisierung ist daher begrenzt und eine Kühlung nach oben ist nicht möglich. Die Lastwechselfestigkeit ist insbesondere für Hochvoltapplikationen begrenzt. Zudem ist zu erwarten, dass die Chips zukünftig dünner werden, bis hin in den Picometerbereich hinein (z.B. SiC-Chips mit kleiner Kontaktierfläche) so dass die Realisierung elektrischer Verbindungen über das Drahtbonden zunehmend problematisch wird. Sehr unterschiedliche thermische Ausdehnungen führen zudem an den Kontakten und Grenzflächen bei zyklischer Temperaturbelastung zu frühen Ausfällen. Disadvantage is the complex process flow and a complex, serial wire bonding process, in which a high yield is a prerequisite. A high risk is the risk of short circuit by touching wires. The miniaturization is therefore limited and an upward cooling is not possible. The fatigue strength is limited in particular for high-voltage applications. In addition, the chips are expected to become thinner in the future, down to the picometer range (for example, SiC chips with a small contact area), so that the realization of electrical connections via wire bonding is becoming increasingly problematic. Very different thermal expansions also lead to early failures at the contacts and interfaces during cyclic temperature loading.

Es ist daher Aufgabe der Erfindung, ein verbessertes Verfahren zur Herstellung eines Leiterrahmenmoduls mit einem Leiterrahmen und zumindest zwei oder mehreren an den Leiterrahmen galvanisch angebundenen Bauelementen anzugeben. Ferner ist es Aufgabe der Erfindung, ein verbessertes Leiterrahmenmodul anzugeben. It is therefore an object of the invention to specify an improved method for producing a leadframe module with a leadframe and at least two or more components galvanically connected to the leadframe. It is another object of the invention to provide an improved lead frame module.

Diese Aufgabe der Erfindung wird mit einem Verfahren mit den in Anspruch 1 angegebenen Merkmalen sowie mit einem Leiterrahmenmodul mit den in Anspruch 10 angegebenen Merkmalen gelöst. Bevorzugte Weiterbildungen der Erfindung ergeben sich aus den zugehörigen Unteransprüchen, der nachfolgenden Beschreibung und der Zeichnung. This object of the invention is achieved by a method having the features specified in claim 1 and with a lead frame module having the features specified in claim 10. Preferred embodiments of the invention will become apparent from the accompanying dependent claims, the following description and the drawings.

Bei dem erfindungsgemäßen Verfahren zur Herstellung eines Leiterrahmenmoduls mit einem Leiterrahmen und zumindest zwei oder mehreren an den Leiterrahmen galvanisch angebundenen Bauelementen werden die zumindest zwei Bauelemente in einer Anordnung angeordnet. Der Leiterrahmen wird, zweckmäßig zeitgleich und/oder in einem einzigen Prozessschritt, an die Anordnung angebunden.In the method according to the invention for producing a leadframe module with a leadframe and at least two or more components galvanically connected to the leadframe, the at least two components are arranged in an arrangement. The lead frame is connected, expediently at the same time and / or in a single process step, to the arrangement.

Mittels der erfindungsgemäßen elektrischen Ankontaktierung über Leiterrahmenverbindungen können komplexe, hoch zuverlässige elektronische Bauelemente mit hoher Gestaltungsfreiheit kostengünstig für alle Leistungsklassen hergestellt werden. Das erfindungsgemäße Verfahren lässt sich zur Kontaktierung sowohl aktiver als auch passiver Bauelemente einsetzen, insbesondere zur Kontaktierung von IGBTs und MOSFETs sowie Dioden im Falle einer planaren Aufbau- und Verbindungstechnologie, wie insbesondere SiPLIT aus dem Hause Siemens. Das erfindungsgemäße Verfahren stellt somit einen einfachen und stabilen Herstellungprozess mit einem hohen Automatisierungsgrad bereit, wobei zugleich eine hohe Flexibilität hinsichtlich der Abmessungen der einzelnen Bauteile und deren Dicken besteht. Insbesondere lässt sich das erfindungsgemäße Verfahren leicht durch entsprechend vorgesehene Leiterquerschnitte des Leiterrahmens an Nieder- bis Hochvoltanwendungen anpassen. Zugleich ist es mittels des erfindungsgemäßen Verfahrens möglich, eine hohe Verbindungsdichte und somit ein besonders kompaktes Leiterrahmenmodul zu erreichen. Bei dem erfindungsgemäß en Verfahren lässt sich dabei insbesondere das Risiko von Kurzschlüssen zuverlässig reduzieren. By means of the electrical Ankontaktierung invention via lead frame connections complex, highly reliable electronic components with high design freedom can be produced inexpensively for all power classes. The inventive method can be used for contacting both active and passive components, in particular for contacting IGBTs and MOSFETs and diodes in the case of a planar construction and connection technology, in particular SiPLIT from Siemens. The method according to the invention thus provides a simple and stable production process with a high degree of automation, with at the same time a high degree of flexibility with regard to the dimensions of the individual components and their thicknesses. In particular, the inventive method can be easily adapted by appropriately provided conductor cross sections of the lead frame to low to high voltage applications. At the same time, it is possible by means of the method according to the invention to achieve a high connection density and thus a particularly compact lead frame module. In the method according to the invention, in particular the risk of short-circuits can be reliably reduced.

Ferner lässt sich mittels des erfindungsgemäß vorgesehenen Leiterrahmens sowohl die anfallende Wärme als auch der erforderliche elektrische Strom flächig verteilen, etwa indem ein metallischer Leiterrahmen zur Realisierung des Leiterrahmenmoduls herangezogen wird. Geeigneterweise lässt sich somit auch eine effizientere Kühlung erreichen. Da bei dem erfindungsgemäßen Verfahren Bonddrähte nicht vorgesehen sein müssen, ist es ferner erfindungsgemäß nicht erforderlich, einen Silikonverguss zur Abdeckung solcher Bonddrähte vorzusehen. Weiterhin erlaubt es das erfindungsgemäße Verfahren bei der Herstellung des Leiterrahmenmoduls Metallflächen und folglich einen hohen Schutz vor elektrostatischen Entladungen vorzusehen. Furthermore, by means of the lead frame provided according to the invention, both the accumulated heat and the required electrical current can be distributed over a wide area, for example by using a metallic leadframe to realize the leadframe module. Suitably, therefore, a more efficient cooling can be achieved. Furthermore, since bonding wires need not be provided in the method according to the invention, it is not necessary according to the invention to provide a silicone casting for covering such bonding wires. Furthermore, the method according to the invention makes it possible to provide metal surfaces in the production of the leadframe module and consequently a high degree of protection against electrostatic discharges.

Bei einer bevorzugten Weiterbildung des erfindungsgemäßen Verfahrens wird der Leiterrahmen derart an die Anordnung angebunden, dass der Leiterrahmen, insbesondere zeitgleich in einem einzigen Prozessschritt, an zwei und ggf. vorzugsweise mindestens drei und/oder idealerweise sämtliche Bauelemente der Anordnung angebunden wird. In a preferred development of the method according to the invention, the leadframe is connected to the arrangement in such a way that the leadframe, in particular at the same time in a single process step, is connected to two and possibly at least three and / or ideally all components of the arrangement.

Vorzugsweise wird bei dem erfindungsgemäßen Verfahren der Leiterrahmen stoffschlüssig an die Anordnung angebunden. Bevorzugt wird bei dem Verfahren gemäß der Erfindung der Leiterrahmen an die Anordnung gesintert. Besonders bevorzugt werden für zwei oder drei und/oder sämtliche Bauteile der Anordnung Verbindungsstellen mit dem Leiterrahmen realisiert. Preferably, in the method according to the invention, the lead frame is firmly bonded to the arrangement. Preferably, in the method according to the invention, the lead frame is sintered to the assembly. Particularly preferred for two or three and / or all components of the arrangement connecting points are realized with the lead frame.

In einer vorteilhaften Weiterbildung des erfindungsgemäßen Verfahrens werden die Bauelemente jeweils zuvor mit einer sinterfähigen Schicht, insbesondere einer mit Silber und/oder Nickel und/oder Gold gebildeten Schicht, versehen. In an advantageous development of the method according to the invention, the components are each provided in advance with a sinterable layer, in particular a layer formed with silver and / or nickel and / or gold.

Alternativ oder zusätzlich und ebenfalls bevorzugt wird bei dem Verfahren gemäß der Erfindung der Leiterrahmen an die Anordnung geklebt und/oder gelötet. Alternatively or additionally and also preferably, in the method according to the invention, the leadframe is glued and / or soldered to the arrangement.

Vorzugsweise wird bei dem erfindungsgemäßen Verfahren der Leiterrahmen derart an die Anordnung angebunden, dass er an die Anordnung kraftschlüssig angebunden und/oder auf die Anordnung zu kraftbeaufschlagt wird. Preferably, in the method according to the invention, the leadframe is connected to the arrangement such that it is frictionally connected to the arrangement and / or subjected to force on the arrangement.

Bei dem erfindungsgemäßen Verfahren werden vorzugsweise als eines, mehrere oder sämtliche der Bauelemente eines oder mehrere Elemente der nachfolgend angegebenen Gruppe herangezogen: Halbleiterchips und/oder Leistungschips und/oder Einzelhalbleiter, insbesondere Dioden und/oder Transistoren und/oder Sensoren und/oder Aktoren und/oder passive Bauelemente, insbesondere Widerstände, Kapazitäten und/oder Induktivitäten und/oder LED-Chips. In the method according to the invention, preferably one, several or all of the components use one or more elements of the group indicated below: semiconductor chips and / or power chips and / or individual semiconductors, in particular diodes and / or transistors and / or sensors and / or actuators and / or or passive components, in particular resistors, capacitors and / or inductors and / or LED chips.

Das erfindungsgemäße Leiterrahmenmodul weist einen Leiterrahmen und zumindest zwei oder mehreren Bauelemente auf. Der Leiterrahmen ist an die Bauelemente gesintert und/oder geklebt und/oder gelötet und/oder auf die Bauelemente zu kraftbeaufschlagt. Vorzugsweise ist das Leiterrahmenmodul mit dem erfindungsgemäßen Verfahren wie oben beschrieben hergestellt. The lead frame module according to the invention has a lead frame and at least two or more components. The lead frame is sintered to the components and / or glued and / or soldered and / or force applied to the components. Preferably, the lead frame module is produced by the method according to the invention as described above.

Bevorzugt ist bei dem erfindungsgemäßen Leiterrahmenmodul der Leiterrahmen elastisch federnd an die Bauelemente angebunden. In the case of the leadframe module according to the invention, the leadframe is preferably connected elastically resiliently to the components.

Das erfindungsgemäße Leiterrahmenmodul weist vorzugsweise zumindest einen Wärmepuffer auf, welcher an den Leiterrahmen angebunden ist. The lead frame module according to the invention preferably has at least one heat buffer, which is connected to the lead frame.

Nachfolgend wird die Erfindung anhand eines in der Zeichnung dargestellten Ausführungsbeispiels näher erläutert. Es zeigen: The invention will be explained in more detail with reference to an embodiment shown in the drawing. Show it:

1 eine Anordnung eines Substrats und eines Leiterrahmens vor der Durchführung des erfindungsgemäßen Verfahrens schematisch in einer Draufsicht, 1 an arrangement of a substrate and a lead frame before carrying out the method according to the invention schematically in a plan view,

2 ein mittels der Anordnung gemäß 1 und des erfindungsgemäßen Verfahrens hergestelltes erfindungsgemäßes Leiterrahmenmodul schematisch im Querschnitt, 2 a means of the arrangement according to 1 and the method according to the invention produced lead frame module according to the invention schematically in cross section,

3 das Leiterrahmenmodul gemäß 1 und 2 schematisch im Querschnitt entlang eines Leistungskontakts sowie 3 the ladder frame module according to 1 and 2 schematically in cross section along a power contact as well

4 das Leiterrahmenmodul gem. 1 bis 3 schematisch im Querschnitt entlang eines Signalkontakts. 4 the lead frame module acc. 1 to 3 schematically in cross-section along a signal contact.

Das in den 2 bis 4 dargestellte erfindungsgemäße Leiterrahmenmodul 10 umfasst ein Substrat 20, im dargestellten Ausführungsbeispiel ein DCB-Substrat (DCB = engl. „direct copper bond“), sowie einen Leiterrahmen 30. Der Leiterrahmen 30 ist im gezeigten Ausführungsbeispiel vorgestanzt und bildet ein Flachteil mit einer ersten und einer zweiten, dem Substrat 20 zugewandten, Seite 50. An der dem Substrat 20 zugewandten zweiten Seite 50 ist der Leiterrahmen 30, welcher im Übrigen aus Kupfer besteht, oberflächlich mit einer verhältnismäßig, also gegenüber der Kupferschichtdicke, dünnen Silberschicht versilbert. Es versteht sich, dass in weiteren, nicht eigens dargestellten Ausführungsbeispielen der Leiterrahmen 30 auch abweichend ausgebildet sein kann, beispielsweise aus anderen leitfähigen Materialien, insbesondere Metallen, bestehen kann und der Leiterrahmen 30 beispielsweise vorgeprägt sein kann. That in the 2 to 4 illustrated ladder frame module according to the invention 10 includes a substrate 20 , In the illustrated embodiment, a DCB substrate (DCB = "direct copper bond"), and a lead frame 30 , The ladder frame 30 is pre-cut in the embodiment shown and forms a flat part with a first and a second, the substrate 20 facing, page 50. At the the substrate 20 facing second side 50 is the lead frame 30 which, moreover, consists of copper, superficially silvered with a relatively thin silver layer, that is to say with respect to the copper layer thickness. It is understood that in further, not specifically illustrated embodiments of the lead frame 30 may also be deviating formed, for example, from other conductive materials, in particular metals, and the lead frame 30 for example, can be pre-stamped.

Wie in 2 dargestellt, ist das Substrat 20 als Flachteil ausgebildet und weist eine erste 60 und eine zweite Flachseite 70 auf, welche jeweils mit einer Kupferschicht 80, 90 metallisiert sind. Mit der ersten Flachseite 60 und der daran anliegenden Kupferschicht 80 liegt das Substrat 20 vollflächig an einer als Kühler ausgebildeten Bodenplatte 100 an. As in 2 shown, is the substrate 20 designed as a flat part and has a first 60 and a second flat side 70 on, each with a copper layer 80 . 90 metallized. With the first flat side 60 and the adjacent copper layer 80 lies the substrate 20 over the entire surface of a cooler designed as a bottom plate 100 at.

An der Kupferschicht 90 an der zweiten Flachseite 70 trägt das Substrat 20 flächig anliegend integrierte Bauelemente 110, 120 (sog. (engl.) „Bare-Die-Chips“), welche ihrerseits als Flachteile ausgebildet sind. In Richtung ihrer flächigen Erstreckungen sind die integrierten Bauelemente 110, 120 von einer auf die Kupferschicht 90 aufgetragenen Isolationsschicht 125 elektrisch isoliert. Die integrierten Bauelemente 110, 120 weisen an ihren dem Substrat 20 abgewandten Flachseiten 130, 140 jeweils eine Kontaktfläche 150, 160 auf. At the copper layer 90 on the second flat side 70 carries the substrate 20 flat adjacent integrated components 110 . 120 (so-called "bare die chips"), which in turn are designed as flat parts. In the direction of their planar extensions are the integrated components 110 . 120 from one to the copper layer 90 applied insulation layer 125 electrically isolated. The integrated components 110 . 120 indicate to their the substrate 20 facing flat sides 130 . 140 one contact surface each 150 . 160 on.

Die Kontaktflächen 150, 160 sind gemeinsam mit dem Leiterrahmen 30 kontaktiert. Dazu werden bei der Herstellung des erfindungsgemäßen Leiterrahmenmoduls 10 gemäß dem erfindungsgemäßen Verfahren die Kontaktflächen 150, 160 mit einer sinterfähigen Schicht versehen, im dargestellten Ausführungsbeispiel mit einer Silberschicht versilbert. In weiteren, nicht eigens dargestellten, Ausführungsbeispielen, welche im Übrigen den dargestellten Ausführungsbeispielen entsprechen, kann anstelle der Silberschicht eine sonstige sinterfähige Schicht vorgesehen sein, etwa eine aus einer Nickel-Gold-Legierung gebildete Schicht oder eine Nickelschicht. The contact surfaces 150 . 160 are in common with the ladder framework 30 contacted. For this purpose, in the manufacture of the lead frame module according to the invention 10 according to the inventive method, the contact surfaces 150 . 160 provided with a sinterable layer, silvered in the illustrated embodiment with a silver layer. In other, not specifically illustrated embodiments, which otherwise correspond to the illustrated embodiments, instead of the silver layer, another sinterable layer may be provided, such as a layer formed of a nickel-gold alloy or a nickel layer.

Der Leiterrahmen 30 ist vorab entsprechend dem vorgesehenen Layout des Leiterrahmenmoduls 10 geformt. Die zur Kontaktierung der Kontaktflächen der integrierten Bauelemente 110, 120 vorgesehenen Bereiche des Leiterrahmens 30 sind leicht als Vorsprünge 170 aus dem Leiterrahmen herausgestanzt. The ladder frame 30 is in advance according to the intended layout of the leadframe module 10 shaped. For contacting the contact surfaces of the integrated components 110 . 120 provided areas of the lead frame 30 are easy as protrusions 170 punched out of the ladder frame.

Zur Herstellung des Leiterrahmenmoduls 10 wird zunächst ein Rohteil, welches das Substrat 20 mit den Kupferschichten 80, 90 umfasst, herangezogen. An der Kupferschicht 90 sind in diesem Stadium der Herstellung die integrierten Bauelemente 110, 120 bereits in ihrer endgültigen Anordnung positioniert. Nachfolgend wird der Leiterrahmen 30 mit seiner dünnen Silberschicht an die Kontaktflächen 150, 160 angelegt und in einem einzigen Prozessschritt gesintert. For the production of the lead frame module 10 First, a blank, which is the substrate 20 with the copper layers 80 . 90 includes, used. At the copper layer 90 are at this stage of manufacture the integrated components 110 . 120 already positioned in its final position. The following is the lead frame 30 with its thin silver layer on the contact surfaces 150 . 160 created and sintered in a single process step.

Es versteht sich, dass in weiteren Ausführungsbeispielen, welche im Übrigen dem dargestellten Ausführungsbeispiel entsprechen, nicht lediglich zwei Bauteile 110, 120, sondern drei oder mehr Bauteile in einer Anordnung angeordnet werden und der Leiterrahmen 30 in einem einzigen Prozessschritt an die Bauteile gesintert wird. It is understood that in other embodiments, which otherwise correspond to the illustrated embodiment, not just two components 110 . 120 but three or more components are arranged in an array and the lead frame 30 is sintered in a single process step to the components.

In weiteren Ausführungsbeispielen sind die Bauelemente 110, 120 nicht an den Leiterrahmen 30 gesintert wie zuvor beschrieben sondern geklebt oder gelötet. In further embodiments, the components 110 . 120 not on the ladder frame 30 sintered as described above but glued or soldered.

Die Vorsprünge 170 des Leiterrahmens 30 sind an die Kontaktflächen 150, 160 der Bauteile 110, 120 gesintert, sodass die Sinterverbindung leitende Kontaktierungen der Bauteile 110, 120 bilden. An der dem Substrat 20 abgewandten Flachseite 40 des Leiterrahmens 30 sind an den Leiterrahmen 30 Wärmespreizelemente 180, 190 angelötet, welche als massive Kupferfquader ausgebildet sind und so effektiv die Dicke des Leiterrahmens 30 an denjenigen Bereichen, an welchen der Leiterrahmen 30 an die integrierten Bauelemente 110, 120 angesintert ist, auf etwa das Vierfache vergrößern. Auf diese Weise kann sich die Wärme, welche von den integrierten Bauelementen 110, 120 im Betrieb ausgeht, leicht verteilen. The projections 170 of the ladder frame 30 are at the contact surfaces 150 . 160 of the components 110 . 120 sintered, so that the sintered connection conductive contacts of the components 110 . 120 form. At the the substrate 20 facing away flat side 40 of the ladder frame 30 are on the ladder frame 30 Wärmespreizelemente 180 . 190 soldered, which are designed as massive copper cube and thus effectively the thickness of the lead frame 30 at those areas where the lead frame 30 to the integrated components 110 . 120 is sintered, increase to about four times. In this way, the heat can be absorbed by the integrated components 110 . 120 Running out, distribute easily.

Von den integrierten Bauelementen 110, 120, den Vorsprüngen 170 des Leiterrahmens 30 sowie den Wärmespreizelementen 180, 190 beabstandet ist eine Leiterplatte 200 angeordnet, welche mit den integrierten Bauelementen 110, 120, den Vorsprüngen 170 des Leiterrahmens 30 sowie den Wärmespreizelementen 180, 190 einen zwischenliegenden Freiraum ausbildet. Die Leiterplatte 200 ist mittels eines PCT-Prepregs (harzimprägniertes Fasergewebe) gebildet. Die Leiterplatte 200 bildet eine elektronische Steuereinheit des Leiterrahmenmoduls 10 aus. Die Leiterplatte 200 weist an einer dem Leiterrahmen 30 zugewandten Flachseite 210 Leistungskontakte 220 und Signalkontakte 230 auf. From the integrated components 110 . 120 , the projections 170 of the ladder frame 30 and the heat spreading elements 180 . 190 spaced is a printed circuit board 200 arranged, which with the integrated components 110 . 120 , the projections 170 of the ladder frame 30 and the heat spreading elements 180 . 190 forms an intermediate space. The circuit board 200 is formed by means of a PCT prepreg (resin-impregnated fiber fabric). The circuit board 200 forms an electronic control unit of the lead frame module 10 out. The circuit board 200 points to a ladder frame 30 facing flat side 210 power contacts 220 and signal contacts 230 on.

Zur Kontaktierung der Leistungskontakte 220 und der Signalkonktakte 230 sind aus dem Leiterrahmen 30 elastisch flexible Federkontakte 240, 250 herausgebogen. Die Federkontakte 240 zur Kontaktierung der Leistungskontakte 220 weisen jeweils Kontaktstreifen 260 auf, welche mittels, verglichen mit diesen schmaleren, Stegen 270 an den übrigen Leiterrahmen 30 angebunden sind. Die schmalen Stege 270 sind dabei derart umgebogen, dass sich diese bis zur Leiterplatte 200 strecken und dort in die Kontaktstreifen 260 übergehen. Die Kontaktstreifen 260 liegen flächig an den Leistungskontakten 220 an. Die Kontaktstreifen 260 sind an die Leistungskontakte 220 angelötet. Die Federkontakte 250 zur Kontaktierung der Signalkontakte 230 hingegen sind durchgängig als schmale Stege 280 ausgebildet, sodass die mit den Signalkontakten 230 korrespondierenden Kontaktflächen der Federkontakte 250 durch einen Abschnitt des Steges 280 selbst gebildet sind und sich nicht durch eine flächige Verbreiterung der Stege 280 abgrenzen. Diese schmalere Geometrie der Kontaktflächen verglichen mit den Kontaktstreifen 260 geht mit dem Erfordernis einer geringeren Leistungsübertragung mittels der Signalkontakte 230 einher. Die Federkontakte 240 zur Kontaktierung der Leistungskontakte 220 und die Federkontakte 250 zur Kontaktierung der Signalkontakte 230 sind jeweils an die Leistungskontakte 220 und die Signalkontakte 230 angelötet. In weiteren, nicht eigen dargestellten Ausführungsbeispielen können auch Federkontakte an weitere Bauelemente geklebt oder an Bauelementen federnd auf diese Bauelemente zu kraftbeaufschlagt sein. For contacting the power contacts 220 and the signal contacts 230 are from the ladder frame 30 elastically flexible spring contacts 240 . 250 bent. The spring contacts 240 for contacting the power contacts 220 each have contact strips 260 on which, compared with these narrower, webs 270 on the other ladder frames 30 are connected. The narrow bridges 270 are bent in such a way that this up to the circuit board 200 stretch and there in the contact strips 260 pass. The contact strips 260 lie flat on the power contacts 220 at. The contact strips 260 are to the power contacts 220 soldered. The spring contacts 250 for contacting the signal contacts 230 however, are consistently as narrow bridges 280 designed so that the with the signal contacts 230 corresponding contact surfaces of the spring contacts 250 through a section of the bridge 280 themselves are formed and not by a flat broadening of the webs 280 delimit. This narrower geometry of the contact surfaces compared to the contact strips 260 goes with the requirement of a lower power transmission by means of the signal contacts 230 associated. The spring contacts 240 for contacting the power contacts 220 and the spring contacts 250 for contacting the signal contacts 230 are each to the power contacts 220 and the signal contacts 230 soldered. In other, not self-illustrated embodiments also spring contacts can be glued to other components or be resiliently applied to components on components to these components.

Fern den Leistungskontakten 220 und Signalkontakten 230 sind an der Leiterplatte 200 weitere Bauteile in der Art von SMD-Bauteilen (SMD = (engl.) „surface-mounted device“) angebunden. Far from the power contacts 220 and signal contacts 230 are on the circuit board 200 other components in the form of SMD components (SMD = (engl.) "surface-mounted device") connected.

Das Leiterrahmenmodul wie oben beschreiben weist zudem eine Umhausung 270 auf, die die Teile wie oben beschrieben umhaust. The ladder frame module as described above also has a housing 270 which surrounds the parts as described above.

Claims (12)

Verfahren zur Herstellung eines Leiterrahmenmoduls (10) mit einem Leiterrahmen (30) und zumindest zwei oder mehreren an den Leiterrahmen galvanisch angebundenen Bauelementen (110, 120), bei welchem die zumindest zwei Bauelemente (110, 120) in einer Anordnung angeordnet werden und der Leiterrahmen (30) an die Anordnung angebunden wird. Method for producing a leadframe module ( 10 ) with a lead frame ( 30 ) and at least two or more of the lead frame electrically-connected components ( 110 . 120 ), in which the at least two components ( 110 . 120 ) are arranged in an array and the lead frame ( 30 ) is attached to the arrangement. Verfahren nach Anspruch 1, bei welchem der Leiterrahmen (30) derart an die Anordnung angebunden wird, dass der Leiterrahmen (30) an jedes Bauelement (110, 120) der Anordnung angebunden wird. The method of claim 1, wherein the lead frame ( 30 ) to the arrangement Tethered is that the lead frame ( 30 ) to each component ( 110 . 120 ) of the arrangement is connected. Verfahren nach einem der vorhergehenden Ansprüche, bei welchem der Leiterrahmen (30) stoffschlüssig an die Anordnung angebunden wird. Method according to one of the preceding claims, in which the leadframe ( 30 ) is firmly bonded to the arrangement. Verfahren nach dem vorhergehenden Anspruch, bei welchem der Leiterrahmen (30) an die Anordnung gesintert wird. Method according to the preceding claim, in which the lead frame ( 30 ) is sintered to the arrangement. Verfahren nach dem vorhergehenden Anspruch, bei welchem die Bauelemente (110, 120) jeweils zuvor mit einer sinterfähigen Schicht, insbesondere einer mit Silber und/oder Nickel und/oder Gold gebildeten Schicht, versehen werden. Method according to the preceding claim, in which the components ( 110 . 120 ) are each provided in advance with a sinterable layer, in particular a layer formed with silver and / or nickel and / or gold. Verfahren nach einem der Ansprüche 3 bis 5, bei welchem der Leiterrahmen an die Anordnung geklebt wird. A method according to any one of claims 3 to 5, wherein the lead frame is adhered to the assembly. Verfahren nach einem der Ansprüche 3 bis 6, bei welchem der Leiterrahmen an die Anordnung gelötet wird. The method of any of claims 3 to 6, wherein the leadframe is soldered to the assembly. Verfahren nach einem der vorhergehenden Ansprüche, bei welchem der Leiterrahmen (30) derart an die Anordnung angebunden wird, dass er an die Anordnung kraftschlüssig angebunden und/oder auf die Anordnung zu kraftbeaufschlagt wird. Method according to one of the preceding claims, in which the leadframe ( 30 ) is connected to the arrangement such that it is frictionally connected to the arrangement and / or force applied to the arrangement. Verfahren nach einem der vorhergehenden Ansprüche, bei welchem als eines, mehrere oder sämtliche der Bauelemente (110, 120) eines oder mehrere Elemente der nachfolgend angegebenen Gruppe herangezogen werden: Halbleiterchips und/oder Leistungschips und/oder Einzelhalbleiter, insbesondere Dioden und/oder Transistoren und/oder Sensoren und/oder Aktoren und/oder passive Bauelemente, insbesondere Widerstände, Kapazitäten und/oder Induktivitäten und/oder LED-Chips. Method according to one of the preceding claims, in which as one, several or all of the components ( 110 . 120 ) one or more elements of the group indicated below are used: semiconductor chips and / or power chips and / or individual semiconductors, in particular diodes and / or transistors and / or sensors and / or actuators and / or passive components, in particular resistors, capacitances and / or inductances and / or LED chips. Leiterrahmenmodul mit einem Leiterrahmen (30) und zumindest zwei oder mehreren Bauelementen (110, 120), bei welchem der Leiterrahmen (30) an die Bauelemente (110, 120) gesintert und/oder geklebt und/oder gelötet und/oder kraftbeaufschlagt ist, vorzugsweise hergestellt nach einem Verfahren nach einem der vorhergehenden Ansprüche. Lead frame module with a lead frame ( 30 ) and at least two or more components ( 110 . 120 ), in which the lead frame ( 30 ) to the components ( 110 . 120 ) is sintered and / or glued and / or soldered and / or kraftbeaufschlagt, preferably prepared by a method according to any one of the preceding claims. Leiterrahmenmodul nach dem vorhergehenden Anspruch, bei welchem der Leiterrahmen (30) elastisch federnd an die Bauelemente angebunden ist. Lead frame module according to the preceding claim, in which the lead frame ( 30 ) is resiliently connected to the components. Leiterrahmenmodul nach einem der vorhergehenden Ansprüche, welches Wärmepuffer und/oder Wärmespreizer (180, 190) aufweist, welche an den Leiterrahmen (30) angebunden sind. Lead frame module according to one of the preceding claims, which heat buffer and / or heat spreader ( 180 . 190 ), which on the lead frame ( 30 ) are connected.
DE102015218369.6A 2015-09-24 2015-09-24 Method for producing a leadframe module and leadframe module Withdrawn DE102015218369A1 (en)

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