DE102015200989A1 - Connecting arrangement between a carrier element and an electronic circuit component and circuit carrier - Google Patents

Abstract

The invention relates to a connection arrangement (30) between a carrier element (10) and an electronic circuit component (1; 1a), in particular an IC, wherein the carrier element (10) has a multilayer, sandwich-type construction, wherein in an intermediate layer (13 1a) is formed on at least one side by means of a solder connection (40; 40a) with an electrically conductive layer (12) of the carrier element (10) ), wherein the solder connection (40; 40a) is formed at least by a solder (37) between the electrically conductive layer (12) of the carrier element (10) and the circuit component (1; According to the invention, it is provided that the cavity (20) in the intermediate layer (13) of the carrier element (10) has at least one extension (25a to 25f) which has a space for receiving the solder (37) prior to forming the solder joint (40 40a).

Description

State of the art

The invention relates to a connection arrangement between a carrier element and an electronic circuit component, in particular an IC, according to the preamble of claim 1. Further, the invention relates to a circuit carrier with a support member and a disposed within the support member in a cavity circuit component, wherein the circuit carrier a connection arrangement according to the invention and a method for producing a connection arrangement.

A connection arrangement between a carrier element and an electronic circuit component according to the preamble of claim 1 2 has become known by the company Schweizer Systems under the name P Pack ^® . The known connection arrangement has a carrier element consisting of several layers, wherein the individual layers are arranged one above the other in a sandwich-like arrangement. In particular, the carrier element in an intermediate layer has a cavity for receiving a circuit component in the form of an IC or the like. on. The shape of the cavity is adapted to the shape of the circuit component or the IC such that a circumferential gap is formed between the cavity and the circuit component. Both the underside of the circuit component and the top of the circuit component are electrically contacted or connected to the carrier element. Serve for this purpose, above and below the intermediate layer in the region of the cavity arranged, in particular consisting of copper, electrically conductive layers. While the one, one of the underside of the circuit component associated electrically conductive layer is connected via a (conventional) solder connection to the circuit component, in the upper side of the circuit component associated electrically conductive layer through holes are formed which contact filled with copper corresponding contacting areas on the top of the circuit component , In addition to the two electrically conductive layers mentioned above and the intermediate layer, the carrier element moreover has further, in particular electrically non-conductive layers. Such a construction of a circuit carrier having a carrier element and at least one circuit component can be produced or processed analogously to printed circuit board technology, the circuit component being laminated inside the carrier element. Details regarding the formation of the solder joint between the underside of the circuit component and the associated electrically conductive layer of the carrier element are not known.

In addition, it is from the DE 10 2013 218 423 A1 The applicant is known, in addition to a solder layer for electrically connecting a circuit component with a carrier element, for example a printed circuit board, to use an additional, metal particle-containing layer. It is essential in the case of the last-mentioned layer containing the metal particles that they undergo a heat treatment to form a solder joint, the metal particles initially sintering to form voids or pores. During the further heat treatment and a concomitant increase in temperature, the solder liquefies the solder layer and penetrates into the cavities or pores of the metal particles having layer. The method known from the cited document allows the formation of high quality solder joints.

Disclosure of the invention

Based on the illustrated prior art, the invention has the object, a connection arrangement between a support member and an electronic circuit component according to the preamble of claim 1 such that a high-quality solder joint is formed. In particular, a manufacturing technology advantageous embodiment of the solder joint with a provision of sufficiently large amounts of solder to be made possible even with relatively large-scale circuit components.

This object is achieved in a connection arrangement between a support member and an electronic circuit component with the characterizing features of claim 1, characterized in that the cavity in the intermediate layer of the support member has at least one extension that forms a depot for the solder prior to forming the solder joint.

In other words, this means that the cavity otherwise present in the state of the art, which is adapted exclusively to the shape of the circuit component in order to achieve, for example, a gap that is as uniform as possible between the cavity and the circuit component, is widened according to the invention in at least one place, in order to allow the arrangement of a solder required for soldering in the form of a depot. This in turn means that the provided for forming the solder joint solder is at least substantially prior to forming the solder joint within the extension or in the depot and only during the formation of the solder joint, which usually takes place by a heat treatment in the course of which the solder liquefied, in operative connection with the electrically conductive layer of the carrier element and the corresponding counter layer or the corresponding to be contacted areas of the circuit component passes. The entry or advance of the solder from the depot or the extension into the intermediate space between the electrically conductive layer and the circuit component is effected by capillary effects.

The connection arrangement according to the invention makes it possible, in particular, to arrange the spot provided or required for the formation of the solder connection only selectively by means of a corresponding configuration or dimensioning of the extension. In particular, it is thereby made possible that during the production or assembly of the circuit component within the cavity and the subsequent covering of the cavity with at least one further layer by the circuit component within the cavity, no protrusion of the circuit component beyond the intermediate layer takes place. In other words, this means that the connection arrangement according to the invention makes it possible for the circuit component to be covered with the corresponding further layers immediately after placing in the cavity, wherein the corresponding layers can rest directly on the intermediate layer. An increase in the overall height of the circuit component within the cavity by a prior placement of solder in the intermediate region between the electrically conductive layer and the circuit component does not occur according to the invention.

Advantageous developments of the connection arrangement according to the invention between a carrier element and an electronic circuit component are listed in the subclaims. All combinations of at least two of the features disclosed in the claims, the description and / or the figures fall within the scope of the invention.

The envisaged for the formation of the depot for the solder extension should be made as small as possible in terms of their area. In addition, the simplest possible production or training of the extension is desirable. In a preferred embodiment of the connection arrangement, it is therefore provided that the at least one extension is formed over the entire height of the intermediate layer. Such a design of the extension is achieved, for example, by means of a cutout formed over the entire height of the intermediate layer by means of a corresponding cutting or milling tool. The fact that the entire height of the intermediate layer is utilized to form the extension, the area required for the expansion, based on a certain amount of solder, is minimized.

In principle, very different arrangements of the at least one extension are conceivable. In a preferred first variant of the arrangement of the at least one extension, it is provided that the cavity (for receiving the circuit component) is likewise formed over the entire height of the intermediate layer and has an at least substantially rectangular shape, wherein between the cavity and the circuit component circumferential gap is formed, and that the at least one extension is arranged in a corner region of the cavity.

In a preferred alternative embodiment of the at least one extension, it is provided that the cavity is formed over the entire height of the intermediate layer and has an at least substantially rectangular shape, wherein between the cavity and the circuit component, a circumferential gap is formed, and that the at least one Extension is arranged on a side edge of the cavity. Preferably, that side edge of the cavity is used which has the greater length. As a result, the extension of the extension in a direction away from the cavity direction can be minimized.

Furthermore, it is in the arrangements of the extensions just described advantageous if the at least one extension has an axis of symmetry which is arranged at an angle of 45 ° and 135 ° of side edges in the corner region of the cavity or at right angles to a side edge of the cavity.

In order to enable the solder to uniformly penetrate into the overlapping area between the electrically conductive layer and the circuit component during the formation of the solder joint, it is provided that there are two or four cavities which are symmetrical to an axis of symmetry Cavity are arranged. Such an arrangement makes it possible, in particular, for the solder, for example, to travel the same way out of the individual extensions up to the middle of the circuit component. As a result, in particular a uniform distribution of the solder in the overlapping area with the circuit component is made possible. However, it is also within the scope of the invention, for example, to provide one or three cavities.

In a first concrete embodiment of the solder joint, it may be provided that the circuit component has a metallization on the side facing the electrically conductive layer of the carrier element, and that the solder interconnects the metallization and the electrically conductive layer of the carrier element. Such an arrangement makes it possible in particular, per se to use known or conventional metallization having circuit components.

In an alternative embodiment of the connection arrangement, however, provision may also be made for a further layer comprising metal particles to be arranged between the circuit component and the electrically conductive layer of the carrier element, the layer having the metal particles being designed to sinter after a heat treatment.

In a particularly preferred development of the last-mentioned variant of the connection arrangement, it is provided that the layer comprising metal particles additionally contains a tin-based solder. Such a configuration increases in the heat treatment, in which the solder is liquefied both in the extension and in the layer containing the metal particles, the depth of infiltration and the rate of infiltration of the solder into the pores or cavities formed in the sintering process, so that a particularly high quality , on its surface particularly smooth or pore-free solder joint can be achieved.

A further production-advantageous embodiment of the connection arrangement when using a metal layer containing further layer provides that the metal particles having layer is formed from at least one prefabricated element. Such a prefabricated element is in particular designed as a rigid or solid element which can be positioned by means of a suitable handling device, for example by means of a so-called "pick and place" device, to the space provided for this purpose in the region of the electrically conductive layer of the carrier element , In particular, a considerably simplified handling is thereby achieved, for example in contrast to a customary printing process which is used when using pasty substances on the electrically conductive layer, since the electrically conductive layer in the area of the cavity is surrounded by the intermediate layer and thereby printing is relatively difficult in the area of the cavity.

In order to be able to connect the individual layers of the carrier element to each other before the solder connection is formed on the circuit component and the electrically conductive layer in manufacturing technology preferred embodiment, it is provided that the thickness of the intermediate layer at least substantially the thickness of the circuit component and the solder and possibly of the further metal-containing layer.

Finally, the invention also includes a circuit carrier having a carrier element and a circuit component arranged within the carrier element in a cavity, the circuit carrier having a connection arrangement according to the invention, and a method for producing a connection arrangement. Such a circuit carrier or the manufacturing method also have the advantages described above.

Further advantages, features and details of the invention will become apparent from the following description of preferred embodiments and from the drawing.

This shows in:

1 a cross section through a portion of a circuit substrate, in which a connection arrangement according to the invention is formed,

2 one opposite 1 modified circuit carrier using a metal particle layer between a circuit component and an electrically conductive layer, also in cross section,

3 in plan view, the region of an intermediate layer of a carrier element in the circuit carrier according to 1 or 2 in a first embodiment of extensions according to the invention for receiving solder and

4 one opposite 3 modified embodiment of the extensions in the region of the intermediate layer, also in a simplified plan view.

The same elements or elements with the same function are provided in the figures with the same reference numerals.

In the 1 is a circuit carrier 100 greatly simplified and partially represented, as he example, part of a control device or switching device in an electric or hybrid vehicle o.ä. can be. The circuit carrier 100 comprises a carrier element 10 with at least one, within the carrier element 10 arranged electronic circuit component 1 For example, an IC, an Asics or the like, preferably in the form of a chip. The carrier element 10 has a sandwich-like construction. This includes, by way of example and not limitation, a first insulating layer 11 , a first electrically conductive layer 12 For example, consisting of copper, an intermediate layer 13 , a second electrically conductive layer 14 , also exemplified by copper, as well as a second electrically conductive layer 14 overlapping second electrically insulating layer 15 ,

In the interlayer 13 is a cavity 20 for receiving the circuit component 1 educated. The cavity 20 is preferably over the entire height or thickness of the intermediate layer 13 formed, for example, by a cutout, a punching process, or the like. The geometry, ie the outer contour of the cavity 20 is so on the outline or the shape of the circuit component 1 adapted that according to the representation of 3 and 4 between the cavity 20 and the circuit component 1 , with the exception of extensions described later 25a to 25f , an at least almost uniformly large gap 21 is formed when the circuit component 1 inside the cavity 20 is at its desired position. In addition, the thickness of the intermediate layer 13 such that at one within the cavity 20 arranged circuit component 1 the top of the circuit component 1 on the second electrically conductive layer 14 facing side, the intermediate layer 13 not taller in height.

The circuit component 1 points in the in the 1 illustrated circuit carrier 100 on the first electrically conductive layer 12 facing side of a metallization 22 with a thickness of exemplarily between 1μm and 10μm. On the metallization 22 opposite top of the circuit component 1 this is over in the second electrically conductive layer 14 trained through holes 26 that during the manufacturing process with copper 27 be filled, electrically conductively contacted or connected. In addition, there is between the circuit component 1 and the first electrically conductive layer 12 a connection arrangement according to the invention 30 educated.

The connection arrangement according to the invention 30 includes in the in the 3 illustrated first embodiment four, in the respective corner regions of the otherwise at least substantially a rectangular base surface having cavity 20 arranged extensions 25a to 25d whose shape is identical in each case. The extensions 25a to 25d each have an axis of symmetry 31 on, by an angle α of 45 ° and by an angle ß of 135 ° to the respective side edges 32 . 33 the cavity 20 are arranged. In other words, this means that the extensions 25a to 25d in kind of diagonals from the cavity 20 face away.

The extensions 25a to 25d By way of example, they have a first area, which is rectangular in each case in a plan view 34 on, at the bottom of the cavity 20 opposite side a roughly circular second area 35 followed. The extensions 25a to 25d are also symmetrical to an axis of symmetry 41 the cavity 20 arranged. The extensions 25a to 25d each form a depot for receiving a solder 37 out. The lot 37 serves the electrical connection between the circuit component 1 and the first electrically conductive layer 12 , To form a solder joint 40 through the lot 37 is during the manufacture of the circuit component 100 this undergoes a heat treatment, in which the extensions 25a to 25d stocked Lot 37 is liquefied and by capillary action in the gap between the circuit component 1 and the first electrically conductive layer 12 penetrates and there the solder joint 40 formed.

In the 4 are two extensions 25e . 25f provided in the form of half-oval or semicircles, which are also symmetrical to an axis of symmetry 41 the cavity 20 are arranged and in the range of the longer side edges 33 are located.

The Indian 2 illustrated circuit carrier 100 is different from that in the 1 illustrated circuit carrier 100 in that between the circuit component 1a and the first electrically conductive layer 12 another layer 42 is arranged. In addition, depending on the application, if necessary, in the case of the circuit component 1 planned metallization 22 be waived. The further layer 42 contains metal particles and additives. The metal particles are in particular, but not limited to particles of copper, bronze, nickel, zinc, brass or the like, with a particle size between 1 .mu.m and 50 .mu.m. Furthermore, metal particles of iron, titanium and their alloys are conceivable. The layer thickness of the further layer 42 is typically between 10μm and 150μm. For the additives in the further layer 42 in particular, they are fluxes, but other additives may alternatively or additionally be used. In particular, it may be provided that the material of the further layer 42 additionally contains a tin-based solder. The proportion of tin-based soft solder on the further layer 42 is between 1% by weight and 40% by weight, preferably between 5% by weight and 15% by weight. The tin-based soft solder in the further layer 42 is selected, for example, from the group SnCu, SnAgCu, SnBi, SnSb, SnIn or SnZn or a mixture of the specified soft solders.

In the formation of the solder joint 40a at the circuit carrier 100 according to the 2 takes place during the heat treatment of the circuit carrier 100 first a sintering of the metal particles in the further layer 42 under formation of pores or cavities. During the further heating or during the further heat treatment both the melting of the soft solder takes place in the material of the further layer 42 , as well as the solder 37 in the extensions 25a to 25f , It penetrates the material of the lot 37 , in analogy to the embodiment according to the 1 , By capillary action in the remaining, so far by the soft solder of the material of the other layer 42 not yet filled pores or cavities and closes them.

The further layer 42 can both in the form of a paste, and preferably in the form of prefabricated elements on the first electrically conductive layer 12 to be ordered. The latter prefabricated elements are readily tradable as solid, dried elements, for example by means of a so-called "pick and place" device, and into the cavity 20 insertable as well as at the designated locations on the electrically conductive layer 12 positionable.

The connection arrangement described so far 30 or the circuit carrier 100 can be modified or modified in many ways without departing from the spirit of the invention.

QUOTES INCLUDE IN THE DESCRIPTION

This list of the documents listed by the applicant has been generated automatically and is included solely for the better information of the reader. The list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions.

Cited patent literature

• DE 102013218423 A1 [0003]

Claims (13)

Connection arrangement ( 30 ) between a carrier element ( 10 ) and an electronic circuit component ( 1 ; 1a ), in particular an IC, wherein the carrier element ( 10 ) has a multilayer, sandwich-like construction, wherein in an intermediate layer ( 13 ) of the carrier element ( 10 ) a cavity ( 20 ) for receiving the circuit component ( 1 ; 1a ), wherein the circuit component ( 1 ; 1a ) on at least one side by means of a soldered connection ( 40 ; 40a ) with an electrically conductive layer ( 12 ) of the carrier element ( 10 ) and wherein the solder joint ( 40 ; 40a ) at least by a Lot ( 37 ) between the electrically conductive layer ( 12 ) of the carrier element ( 10 ) and the circuit component ( 1 ; 1a ), characterized in that the cavity ( 20 ) in the intermediate layer ( 13 ) of the carrier element ( 10 ) at least one extension ( 25a to 25f ) having a space for receiving the solder ( 37 ) before forming the solder joint ( 40 ; 40a ) trains. Connecting arrangement according to claim 1, characterized in that the at least one extension ( 25a to 25f ) over the entire height of the intermediate layer ( 13 ) is trained. Connecting arrangement according to claim 1 or 2, characterized in that the cavity ( 20 ) over the entire height of the intermediate layer ( 13 ) is formed and has an at least substantially rectangular shape, wherein between the cavity ( 20 ) and the circuit component ( 1 ; 1a ) a circumferential gap ( 21 ), and that the at least one extension ( 25a to 25d ) in a corner region of the cavity ( 20 ) is arranged. Connecting arrangement according to claim 1 or 2, characterized in that the cavity ( 20 ) over the entire height of the intermediate layer ( 13 ) is formed and has an at least substantially rectangular shape, wherein between the cavity ( 20 ) and the circuit component ( 1 ; 1a ) a circumferential gap ( 21 ), and that the at least one extension ( 25e . 25f ) in the region of a side edge ( 33 ) of the cavity ( 20 ) is arranged. Connecting arrangement according to claim 3 or 4, characterized in that the at least one extension ( 25a to 25f ) an axis of symmetry ( 31 ) which at an angle (α, β) of 45 ° and 135 ° of side edges ( 32 . 33 ) in the corner region of the cavity ( 20 ) or at right angles to a side edge ( 33 ) of the cavity ( 20 ) is arranged. Connecting arrangement according to one of claims 1 to 5, characterized in that two or four cavities ( 20 ) are provided, which are symmetrical to an axis of symmetry ( 41 ) of the cavity ( 20 ) are arranged. Connecting arrangement according to one of claims 1 to 6, characterized in that the circuit component ( 1 ) on the electrically conductive layer ( 12 ) of the carrier element ( 10 ) facing side a metallization ( 22 ), and that the solder ( 37 ) the metallization ( 22 ) and the electrically conductive layer ( 12 ) of the carrier element ( 10 ) connects to each other. Connecting arrangement according to one of claims 1 to 6, characterized in that between the circuit component ( 1a ) and the electrically conductive layer ( 12 ) of the carrier element ( 10 ) another metal-particle-containing layer ( 42 ), wherein the layer comprising metal particles ( 42 ) is adapted to sinter after a heat treatment. Connecting arrangement according to claim 8, characterized in that the metal particles having layer ( 42 ) additionally contains a tin-based soft solder. Connecting arrangement according to claim 8 or 9, characterized in that the metal particles having layer ( 42 ) is formed of at least one prefabricated element. Connecting arrangement according to one of claims 1 to 10, characterized in that the thickness of the intermediate layer ( 13 ) at least substantially the thickness of the circuit component ( 1 ; 1a ) and the lot ( 37 ) and possibly the further layer ( 42 ) corresponds. Circuit carrier ( 100 ), with a carrier element ( 10 ) as well as within the carrier element ( 10 ) in a cavity ( 20 ) arranged circuit component ( 1 ; 1a ), wherein the circuit carrier ( 100 ) a connection arrangement ( 30 ) according to one of claims 1 to 11. Method for producing a connection arrangement ( 30 ) between a carrier element ( 10 ) and an electronic circuit component ( 1 ; 1a ), in particular a connection arrangement ( 30 ) according to one of claims 1 to 11, characterized in that in an extension ( 25a to 25f ) of a cavity ( 20 ) an intermediate layer ( 13 ) of the carrier element ( 10 ) before forming a solder joint ( 40 ; 40a ) between an electrically conductive layer ( 12 ) of the carrier element ( 10 ) and the electronic circuit component ( 1 ; 1a ) Lot ( 37 ) is introduced.

Images