DE102014224628B4 - Method for producing an electronic assembly overmolded with plastic, an electronic assembly of this type, and a capacitive sensor - Google Patents
Method for producing an electronic assembly overmolded with plastic, an electronic assembly of this type, and a capacitive sensor Download PDFInfo
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- DE102014224628B4 DE102014224628B4 DE102014224628.8A DE102014224628A DE102014224628B4 DE 102014224628 B4 DE102014224628 B4 DE 102014224628B4 DE 102014224628 A DE102014224628 A DE 102014224628A DE 102014224628 B4 DE102014224628 B4 DE 102014224628B4
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- Germany
- Prior art keywords
- circuit board
- protective
- electronic assembly
- electronic components
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
- B32B17/067—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of fibres or filaments
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
- B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2214/00—Nature of the non-vitreous component
- C03C2214/02—Fibres; Filaments; Yarns; Felts; Woven material
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2214/00—Nature of the non-vitreous component
- C03C2214/04—Particles; Flakes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09909—Special local insulating pattern, e.g. as dam around component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1333—Deposition techniques, e.g. coating
- H05K2203/1366—Spraying coating
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
Verfahren zur Herstellung einer mit Kunststoff umspritzten Elektronikbaugruppe mit einer Leiterplatte mit den folgenden Verfahrensschritten:a) Bestückung der Leiterplatte mit Elektronikbauteilenb) Aufbringen eines Schutzlacks auf die bestückte Leiterplattea. wobei in einem ersten Arbeitsschritt der Schutzlack im Randbereich der Leiterplatte mit einer Dispenserdüse strichförmig aufgebracht wird, um einen Damm zu bildenb. wobei in einem zweiten Arbeitsschritt der Schutzlack im Innenbereich der Leiterplatte mit einer Flachdüse mit einer Schichtdicke kleiner 200 µm aufgebracht wirdc. wobei der Schutzlack bei 20° C eine Viskosität nach DIN EN ISO 3219 kleiner 1300 mPas aufweist, was einem Wert kleiner 80 s nach DIN EN ISO 2431 entsprichtd. wobei die Bruchgefahr für hohl liegend elektronische Bauteile durch die Unterwanderung der Bauelemente durch den Schutzlack verringert wird.c) Aushärten des Schutzlacks bei Temperaturen zwischen 70 °C und 110°Cd) Umspritzen der bestückten Leiterplatte in einer herkömmlichen Kunststoffspritzgussanlage, so dass der Schutzlack unter die Elektronikbauteile und/oder in den Kabelmantel kriechtMethod for producing an electronic assembly with a printed circuit board overmolded with plastic, comprising the following process steps: a) Fitting the printed circuit board with electronic components b) Applying a protective lacquer to the fitted printed circuit board a. wherein, in a first work step, the protective lacquer is applied in the form of a line in the edge area of the circuit board with a dispenser nozzle in order to form a damb. in a second step, the protective lacquer is applied to the interior of the printed circuit board with a flat nozzle with a layer thickness of less than 200 µm. the protective lacquer having a viscosity according to DIN EN ISO 3219 less than 1300 mPas at 20 ° C., which corresponds to a value less than 80 s according to DIN EN ISO 2431. The risk of breakage for hollow electronic components is reduced by the protective varnish infiltrating the components. c) Curing of the protective varnish at temperatures between 70 ° C and 110 ° Cd) Overmolding of the assembled circuit board in a conventional plastic injection molding system so that the protective varnish is under the Electronic components and / or creeps into the cable jacket
Description
Die Erfindung betrifft ein Verfahren zur Herstellung einer mit thermoplastischen Kunststoff umspritzten Elektronikbaugruppe im konventionellen Spritzgussverfahren, eine derartige Elektronikbaugruppe, sowie einen kapazitiven Sensor mit einer solchen Elektronikbaugruppe, der vorwiegend in der Automatisierungstechnik Anwendung findet.The invention relates to a method for producing an electronic assembly overmolded with thermoplastic in the conventional injection molding process, an electronic assembly of this type, and a capacitive sensor with such an electronic assembly, which is mainly used in automation technology.
Aus der
Aus
Aus der Schrift ist weiterhin bekannt, definierte Bereiche der Oberseite der kombinierten Träger/Leiterplatte mit Lötstoppmasken-Schutzlack zu beschichten.It is also known from the document to coat defined areas of the upper side of the combined carrier / circuit board with solder mask protective lacquer.
Um das Eindringen von Wasser zwischen Vergusskörper und Leiterplatte, ins besondere über Anschlusskabel zu verhindern, wird eine Längswassersperre vorgeschlagen, die zunächst aus aufgerauter, nicht metallisierter Leiterplattenoberfläche und optional aus einer in die Leiterplatte eingearbeitete Rinne besteht.In order to prevent the penetration of water between the potting body and the circuit board, in particular via connection cables, a longitudinal water barrier is proposed, which initially consists of a roughened, non-metallized circuit board surface and optionally a channel incorporated into the circuit board.
Als nachteilig werden sowohl der Bearbeitungsaufwand der Leiterplatte als auch der Flächenbedarf der Längswassersperre empfunden.
Nachteilig ist weiterhin, dass bei hohen Spritzdrücken hohl liegende elektronische Bauteile zerbrechen können.Both the processing effort of the circuit board and the space required by the longitudinal water barrier are perceived as disadvantageous.
Another disadvantage is that at high injection pressures, hollow electronic components can break.
Die
Als Nachteil werden die lange Härtezeit und der zusätzliche Arbeitsgang beim Auftragen der Harzperlen angesehen.The
The long hardening time and the additional work step when applying the resin beads are viewed as disadvantages.
Aus der
Die integrierte Schaltung wird (unmittelbar) nach ihrer Verbindung mit dem Leadframe mit einem flüssigen Polymer überzogen, um die Anlagerung von Wasser und die damit verbundenen störenden Effekte beim Anspritzen des Kunststoffgehäuses (Popcorn-Effekt) zu verhindern. Für die Umspritzung einer Leiterplatte ist dieses Verfahren wegen der beim Aufbringen und beim Aushärten des aufgetragenen flüssigen Polymers entstehenden Probleme weniger geeignet.From the
The integrated circuit is (immediately) coated with a liquid polymer after it is connected to the leadframe in order to prevent the accumulation of water and the associated disruptive effects when the plastic housing is sprayed on (popcorn effect). This process is less suitable for encapsulating a printed circuit board because of the problems that arise during the application and curing of the applied liquid polymer.
Die Aufgabe der Erfindung besteht darin, diese Nachteile wenigsten zumindest teilweise zu überwinden und ein effizientes und auch sicheres Herstellungsverfahren für eine mit thermoplastischen Kunststoff umspritzte Elektronikleiterplatte anzugeben. Insbesondere sollen die Bearbeitungszeit weiter verkürzt, sowie die mechanische Belastung der elektronischen Bauteile und ihrer Lötstellen während der Umspritzung verringert werden.The object of the invention is to at least partially overcome these disadvantages and to specify an efficient and also safe manufacturing method for an electronic circuit board overmolded with thermoplastic material. In particular, the processing time should be further shortened, and the mechanical stress on the electronic components and their soldered points should be reduced during the encapsulation.
Diese Aufgabe wird mit dem in Patentanspruch 1 angegeben Verfahren gelöst. Die Unteransprüche betreffen die Ausgestaltung des Verfahrens, sowie die erfindungsgemäß hergestellte Elektronikbaugruppe mit einer konventionell umspritzten Leiterplatte.This object is achieved with the method specified in claim 1. The subclaims relate to the configuration of the method and the electronic assembly produced according to the invention with a conventionally molded circuit board.
Das erfindungsgemäße Herstellungsverfahren ist nachfolgend näher erläutert.The manufacturing method according to the invention is explained in more detail below.
Der wesentliche Erfindungsgedanke besteht darin, die mit Elektronikbauteilen bestückte Leiterplatte mit einem Schutzlack zu überziehen, der wegen seiner Viskosität sowohl unter die Elektronikbauteile als auch in einen vorhandenen Kabelmantel oder eine Litzenisolierung kriecht.The essential idea of the invention is to coat the printed circuit board equipped with electronic components with a protective lacquer which, due to its viscosity, creeps under the electronic components as well as in an existing cable sheath or stranded insulation.
Zu diesem Zweck wird der Schutzlack erfindungsgemäß in einem ersten Schritt im Randbereich R der Leiterplatte mit einer Dispenserdüse strichförmig aufgebracht, so das ein Damm entsteht und in einem zweiten Schritt mit einer Flachdüse mit einer Schichtdicke von weniger als 200 µm,vorzugsweise mit einer Dicke zwischen 100 µm und 120 µm aufgebracht.For this purpose, the protective varnish is applied in a first step in the edge area R of the circuit board with a dispenser nozzle in lines, so that a dam is created and in a second step with a flat nozzle with a layer thickness of less than 200 μm, preferably with a thickness between 100 µm and 120 µm applied.
Der Lack wird anschließend in einem Ofen bei Temperaturen zwischen 70°C und 110 °C ausgehärtet und danach in einer konventionellen Spritzgussanlage einlagig oder mehrlagig umspritzt.The paint is then cured in an oven at temperatures between 70 ° C and 110 ° C and then overmolded in one or more layers in a conventional injection molding system.
Der Schutzlack ist vorzugsweise ein Lack auf Acrylbasis. Er weist bei 20° C eine Viskosität nach
Die gewünschte Kapillarwirkung und damit auch der erfindungsgemäße Hermetisierungseffekt, wobei der Lack unter die Elektronikbauteile und/oder in den Kabelmantel kriecht, treten bis zu einer Viskosität von ca. 2000 mPas ein.The desired capillary effect and thus also the hermetic sealing effect according to the invention, with the lacquer creeping under the electronic components and / or into the cable jacket, occur up to a viscosity of approx. 2000 mPas.
Die Erfindung ist prinzipiell für alle konventionellen Herstellungsverfahren mit relativ hohen Spritzdrücken bis zu 1200 Bar oder auch mit niedrigen Spritzdrücken und für Temperaturen bis zu 240 °C geeignet.In principle, the invention is suitable for all conventional manufacturing processes with relatively high injection pressures of up to 1200 bar or with low injection pressures and for temperatures of up to 240.degree.
Sie ist nicht auf Leiterplatten mit Kabelanschluss beschränkt, denn die insbesondere bei hohen Spritzdrücken größer 250 Bar bestehende Bruchgefahr für hohl liegend elektronische Bauteile wird durch die oben beschriebene Unterwanderung der Bauelemente durch den Schutzlack deutlich verringert, so dass die Lehre der Erfindung für umspritzte Leiterplatten jeglicher Art anwendbar ist.It is not limited to circuit boards with a cable connection, because the risk of breakage for hollow electronic components, especially at high injection pressures greater than 250 bar, is significantly reduced by the protective lacquer infiltration of the components described above, so that the teaching of the invention for overmolded circuit boards of any kind is applicable.
Das erfindungsgemäße Verfahren ist prinzipiell für alle Sensortypen geeignet, besonders jedoch für kapazitive Sensoren, weil hier keine Sensorbauelemente wie z. B. Fotodioden bei optischen Sensoren oder scharfkantige Schalenkerne bei induktiven Sensoren vorhanden sind.The method according to the invention is in principle suitable for all types of sensors, but especially for capacitive sensors because there are no sensor components such. B. photodiodes for optical sensors or sharp-edged pot cores for inductive sensors are available.
Neben dem Herstellungsverfahren umfasst die Erfindung auch eine Elektronikbaugruppe mit einer erfindungsgemäß hergestellten, konventionell umspritzten Leiterplatte, sowie auf dieser Grundlage hergestellte kapazitive Sensoren.In addition to the manufacturing method, the invention also includes an electronic assembly with a conventionally molded circuit board manufactured according to the invention, as well as capacitive sensors manufactured on this basis.
Die
Claims (4)
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DE102014224628.8A DE102014224628B4 (en) | 2014-12-02 | 2014-12-02 | Method for producing an electronic assembly overmolded with plastic, an electronic assembly of this type, and a capacitive sensor |
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DE102014224628.8A DE102014224628B4 (en) | 2014-12-02 | 2014-12-02 | Method for producing an electronic assembly overmolded with plastic, an electronic assembly of this type, and a capacitive sensor |
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DE102014224628A1 DE102014224628A1 (en) | 2016-06-02 |
DE102014224628B4 true DE102014224628B4 (en) | 2020-12-24 |
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Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2295722A (en) * | 1994-11-30 | 1996-06-05 | Motorola Ltd | Packaging integrated circuits |
US20070289129A1 (en) * | 2004-08-06 | 2007-12-20 | Wing Kenneth E | Selective Encapsulation of Electronic Components |
DE102007045535A1 (en) * | 2007-09-24 | 2009-04-02 | Asm Automation Sensorik Messtechnik Gmbh | angle sensor |
DE202012008508U1 (en) * | 2012-09-06 | 2012-10-24 | Rechner Industrie-Elektronik Gmbh | distance sensor |
-
2014
- 2014-12-02 DE DE102014224628.8A patent/DE102014224628B4/en active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2295722A (en) * | 1994-11-30 | 1996-06-05 | Motorola Ltd | Packaging integrated circuits |
US20070289129A1 (en) * | 2004-08-06 | 2007-12-20 | Wing Kenneth E | Selective Encapsulation of Electronic Components |
DE102007045535A1 (en) * | 2007-09-24 | 2009-04-02 | Asm Automation Sensorik Messtechnik Gmbh | angle sensor |
DE202012008508U1 (en) * | 2012-09-06 | 2012-10-24 | Rechner Industrie-Elektronik Gmbh | distance sensor |
Non-Patent Citations (2)
Title |
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Norm DIN EN ISO 2431 2012-03-00. Beschichtungsstoffe – Bestimmung der Auslaufzeit mit Auslaufbechern (ISO 2431:2011); Deutsche Fassung EN ISO 2431:2011. * |
Norm DIN EN ISO 3219 1994-10-00 Polymere/Harze in flüssigem, emulgiertem oder dispergiertem Zustand. * |
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