DE102014220525A1 - Removal strategy during laser cutting - Google Patents
Removal strategy during laser cutting Download PDFInfo
- Publication number
- DE102014220525A1 DE102014220525A1 DE102014220525.5A DE102014220525A DE102014220525A1 DE 102014220525 A1 DE102014220525 A1 DE 102014220525A1 DE 102014220525 A DE102014220525 A DE 102014220525A DE 102014220525 A1 DE102014220525 A1 DE 102014220525A1
- Authority
- DE
- Germany
- Prior art keywords
- sector
- sectors
- area
- removal
- cooling air
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
- B23K26/384—Removing material by boring or cutting by boring of specially shaped holes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
- B23K26/389—Removing material by boring or cutting by boring of fluid openings, e.g. nozzles, jets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/001—Turbines
Abstract
Durch eine Verfahrstrategie, für Materialabtrag einer abzutragenden Fläche (1) wird diese in Sektoren (40) unterteilt, wobei der Materialabtrag im Randbereich (4) beginnt und nachfolgend zum Mittelpunkt fortgeführt wird.By a movement strategy, for material removal of a surface to be removed (1) this is divided into sectors (40), wherein the material removal begins in the edge region (4) and is subsequently continued to the center.
Description
Die Erfindung betrifft eine Abtragstrategie, das heißt die Laserführung beim Bearbeiten eines Substrats, bei dem Material abgetragen wird, insbesondere um ein Durchgangsloch zu erzeugen. The invention relates to a removal strategy, that is to say the laser guidance when machining a substrate, in which material is removed, in particular in order to produce a through hole.
Laserbohrverfahren sind Stand der Technik um metallische, keramische oder Schichtsysteme aus metallischem Substrat mit keramischen Schichten darauf zu bearbeiten und Durchgangslöcher durch diese Materialien zu erzeugen. Laser drilling methods are prior art for machining metallic, ceramic or layer systems of metallic substrate with ceramic layers thereon and for producing through-holes through these materials.
Dabei kommt es je nach Material zu einer stärker beanspruchten Zone im Randbereich, das heißt der inneren Umfangsfläche eines Lochs, die vermieden werden sollte. Depending on the material, this leads to a more stressed zone in the edge area, ie the inner peripheral surface of a hole, which should be avoided.
Es ist daher Aufgabe der Erfindung eine Abtragstrategie aufzuzeigen, die oben genanntes Problem löst. It is therefore an object of the invention to show a removal strategy that solves the above-mentioned problem.
Die Aufgabe wird gelöst durch ein Verfahren gemäß Anspruch 1. The object is achieved by a method according to
In den Unteransprüchen sind weitere vorteilhafte Maßnahmen aufgelistet, die beliebig miteinander kombiniert werden können, um weitere Vorteile zu erzielen. In the dependent claims further advantageous measures are listed, which can be combined with each other in order to achieve further advantages.
Es zeigen Show it
Die Figuren und die Beschreibung stellen nur Ausführungsbeispiele der Erfindung dar. The figures and the description represent only embodiments of the invention.
In
Ganz allgemein kann die abzutragende, lokale Fläche
Vorab wird die abzutragende Fläche
Zum Abtragen von Material, das vorzugsweise schichtweise erfolgt, wird eine erste Abtragslinie dadurch abgetragen, dass nur sektorweise Material abgetragen wird. For removing material, which preferably takes place in layers, a first removal line is removed by removing material only sector by sector.
Begonnen wird in einem beliebigen Sektor, hier der Sektor
Im nachfolgenden wird Material in den weiteren Sektoren
Dies ist vorzugsweise dann zuerst der Sektor
Ein vorzugweises Beispiel für einen einzelnen Sektor
Der Materialabtrag beginnt an einer Seite
Man beginnt den Materialabtrag in den Sektoren vorzugsweise immer von der Seitenlinie
In der
Ebenso wird diese Fläche wieder in mehrere Sektoren, hier vorzugsweise vier Sektoren
Um ausgehend von
Ein Bauteil kann mehrere solche Durchgangslöcher oder abzutragende Flächen
Bei einer solchen Kühlluftreihe
Sind alle erste Sektoren (
Am Ende dieses ersten Schritts ist in der Kühlluftreihe
Nachfolgend erfolgt der Abtrag für die anderen Sektoren. Subsequently, the removal takes place for the other sectors.
Da man bei dieser Vorgehensweise nicht nur im Randbereich beginnt, und dann zum Inneren verläuft, sondern für die erste abzutragende Fläche
Die Laserstrahlen werden vorzugsweise geradlinig geführt. So werden bei der Erzeugung eines Materialabtrags in einem Sektor
Ebenso können mehrere, voneinander getrennte, abzutragende lokale Flächen (
insbesondere einer Kühlluftreihe (
wobei zuerst ein erster Sektor (
der Laserstrahl entlang einer Längsausrichtung der Kühlluftreihe (
und der erste Sektor (
bis alle erste Sektoren (
dann entsprechend die anderen Sektoren einzeln und nacheinander der benachbarten Flächten (
in particular a cooling air row (
first a first sector (
the laser beam along a longitudinal orientation of the cooling air row (
and the first sector (
until all first sectors (
then, corresponding to the other sectors, one after the other and the adjacent ones (
Claims (10)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102014220525.5A DE102014220525A1 (en) | 2014-10-09 | 2014-10-09 | Removal strategy during laser cutting |
PCT/EP2015/072695 WO2016055349A1 (en) | 2014-10-09 | 2015-10-01 | Removal strategy during lasering |
EP15774905.2A EP3191252A1 (en) | 2014-10-09 | 2015-10-01 | Removal strategy during lasering |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102014220525.5A DE102014220525A1 (en) | 2014-10-09 | 2014-10-09 | Removal strategy during laser cutting |
Publications (1)
Publication Number | Publication Date |
---|---|
DE102014220525A1 true DE102014220525A1 (en) | 2016-04-14 |
Family
ID=54251507
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE102014220525.5A Withdrawn DE102014220525A1 (en) | 2014-10-09 | 2014-10-09 | Removal strategy during laser cutting |
Country Status (3)
Country | Link |
---|---|
EP (1) | EP3191252A1 (en) |
DE (1) | DE102014220525A1 (en) |
WO (1) | WO2016055349A1 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102017218441A1 (en) * | 2017-10-16 | 2019-04-18 | Siemens Aktiengesellschaft | Removal strategy for creating a surface structure in which material is removed in several transitions in a surface |
WO2021104792A1 (en) * | 2019-11-26 | 2021-06-03 | Siemens Energy Global GmbH & Co. KG | Procedure for laser drilling a plurality of holes on the basis of the focal position |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10062706C1 (en) * | 2000-12-06 | 2002-07-18 | Baasel Carl Lasertech | Laser machining method, for providing flat recess in workpiece surface, has laser beam moved along recess contour line for providing slot around central region removed subsequently |
EP2286955A1 (en) * | 2009-08-17 | 2011-02-23 | Siemens Aktiengesellschaft | Method for making a hole using different laser positions |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
ES2212364T3 (en) * | 1998-09-30 | 2004-07-16 | Lasertec Gmbh | PROCEDURE AND DEVICE FOR THE ELIMINATION OF MATERIAL FROM A SURFACE OF A PART. |
DE10032981A1 (en) * | 2000-07-10 | 2002-01-24 | Alltec Angewandte Laser Licht | Process for material processing by laser |
DE10345080A1 (en) * | 2003-09-26 | 2005-05-12 | Peguform Gmbh | Method and device for layer-removing 3-dimensional material processing |
-
2014
- 2014-10-09 DE DE102014220525.5A patent/DE102014220525A1/en not_active Withdrawn
-
2015
- 2015-10-01 EP EP15774905.2A patent/EP3191252A1/en not_active Withdrawn
- 2015-10-01 WO PCT/EP2015/072695 patent/WO2016055349A1/en active Application Filing
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10062706C1 (en) * | 2000-12-06 | 2002-07-18 | Baasel Carl Lasertech | Laser machining method, for providing flat recess in workpiece surface, has laser beam moved along recess contour line for providing slot around central region removed subsequently |
EP2286955A1 (en) * | 2009-08-17 | 2011-02-23 | Siemens Aktiengesellschaft | Method for making a hole using different laser positions |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102017218441A1 (en) * | 2017-10-16 | 2019-04-18 | Siemens Aktiengesellschaft | Removal strategy for creating a surface structure in which material is removed in several transitions in a surface |
WO2021104792A1 (en) * | 2019-11-26 | 2021-06-03 | Siemens Energy Global GmbH & Co. KG | Procedure for laser drilling a plurality of holes on the basis of the focal position |
US20230001515A1 (en) * | 2019-11-26 | 2023-01-05 | Siemens Energy Global GmbH & Co. KG | Procedure for laser drilling a plurality of holes on the basis of the focal position |
Also Published As
Publication number | Publication date |
---|---|
WO2016055349A1 (en) | 2016-04-14 |
EP3191252A1 (en) | 2017-07-19 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
R163 | Identified publications notified | ||
R119 | Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee |