DE102014212839A1 - Device for checking at least one property of a bonder - Google Patents
Device for checking at least one property of a bonder Download PDFInfo
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- DE102014212839A1 DE102014212839A1 DE102014212839.0A DE102014212839A DE102014212839A1 DE 102014212839 A1 DE102014212839 A1 DE 102014212839A1 DE 102014212839 A DE102014212839 A DE 102014212839A DE 102014212839 A1 DE102014212839 A1 DE 102014212839A1
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- Prior art keywords
- bonder
- measuring device
- bonding
- contraption
- load cell
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- 238000002604 ultrasonography Methods 0.000 claims abstract description 21
- 238000000034 method Methods 0.000 description 5
- 238000000418 atomic force spectrum Methods 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 2
- 238000012795 verification Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 1
- 230000007717 exclusion Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 230000002123 temporal effect Effects 0.000 description 1
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01H—MEASUREMENT OF MECHANICAL VIBRATIONS OR ULTRASONIC, SONIC OR INFRASONIC WAVES
- G01H3/00—Measuring characteristics of vibrations by using a detector in a fluid
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01H—MEASUREMENT OF MECHANICAL VIBRATIONS OR ULTRASONIC, SONIC OR INFRASONIC WAVES
- G01H11/00—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties
- G01H11/06—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties by electric means
- G01H11/08—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties by electric means using piezoelectric devices
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/16—Measuring force or stress, in general using properties of piezoelectric devices
- G01L1/162—Measuring force or stress, in general using properties of piezoelectric devices using piezoelectric resonators
- G01L1/167—Measuring force or stress, in general using properties of piezoelectric devices using piezoelectric resonators optical excitation or measuring of vibrations
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/04—Analysing solids
- G01N29/11—Analysing solids by measuring attenuation of acoustic waves
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/04—Analysing solids
- G01N29/12—Analysing solids by measuring frequency or resonance of acoustic waves
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/34—Generating the ultrasonic, sonic or infrasonic waves, e.g. electronic circuits specially adapted therefor
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2291/00—Indexing codes associated with group G01N29/00
- G01N2291/26—Scanned objects
- G01N2291/267—Welds
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/78252—Means for applying energy, e.g. heating means in the upper part of the bonding apparatus, e.g. in the capillary or wedge
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78343—Means for applying energy, e.g. heating means by means of pressure by ultrasonic vibrations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
Abstract
Es wird eine Vorrichtung (10) zur Überprüfung mindestens einer Eigenschaft eines Bonders (12) mit einem Ultraschallwandler (14) und einem Bondkeil (16) vorgeschlagen. Die Vorrichtung (10) weist eine erste Messvorrichtung (18) zur Erfassung mindestens einer Schwingungseigenschaft eines von dem Ultraschallwandler (14) ausgesendeten Ultraschalls auf. Die Vorrichtung (10) weist eine zweite Messvorrichtung (20) zur Erfassung einer von dem Bondkeil (16) auf eine Bondoberfläche (22) aufgebrachten Kraft auf.A device (10) for checking at least one property of a bonder (12) with an ultrasonic transducer (14) and a bonding wedge (16) is proposed. The device (10) has a first measuring device (18) for detecting at least one vibration characteristic of an ultrasound emitted by the ultrasound transducer (14). The device (10) has a second measuring device (20) for detecting a force applied by the bonding wedge (16) to a bonding surface (22).
Description
Stand der TechnikState of the art
Aus dem Stand der Technik sind verschiedene Fügeverfahren zur Erzeugung einer elektrischen Verbindung bekannt. Ein Fügeverfahren ist das Bonden. Das Bonden ist in der Elektronikindustrie und in der Automobilelektronik ein etabliertes Verfahren. Dabei wird zwischen Wedge-Wedge-Bonden und Ball-Wedge-Bonden unterschieden. Ebenso wird zwischen Dünndraht-, Dickdraht- und Bändchenbonden unterschieden. Various joining methods for producing an electrical connection are known from the prior art. A joining process is the bonding. Bonding is an established process in the electronics and automotive electronics industries. A distinction is made between wedge-wedge bonding and ball-wedge bonding. Likewise, a distinction is made between thin-wire, thick-wire and ribbon bonding.
Grundlage bei allen Bondverfahren ist das Zusammenspiel von Ultraschall, Bondkraft, Bondzeit und den Fügepartnern. Wesentlich ist die Einbringung von Ultraschall mit einer definierten Kraft in die Verbindungszone. Diese Grundlage wird von einer Reihe von Randbedingungen begleitet, die entscheidenden Einfluss auf das Bondergebnis, das heiß die Einbringung des Ultraschalls in die Fügezone, haben.The basis of all bonding processes is the interaction of ultrasound, bonding force, bonding time and joining partners. Essential is the introduction of ultrasound with a defined force in the connection zone. This basis is accompanied by a number of boundary conditions that have a decisive influence on the bonding result, which is hot the introduction of the ultrasound into the joining zone.
Um den Ultraschall zu definieren, stehen verschiedene Messgeräte zur Verfügung. Das wohl verbreitetste Messgerät ist ein Vibrometer, mit dem die Schwingungen, insbesondere deren Frequenz und Amplitude, gemessen werden können. Eine weitere Messgröße ist die Kraft, mit der der Bondkeil des Bonders den Draht bzw. das Bändchen auf die Kontaktoberfläche drückt. Hier gibt es verschiedene Messmöglichkeiten, wobei eine davon diejenige mittels Piezokraftmessdose ist.To define the ultrasound, various measuring devices are available. Probably the most widely used measuring device is a vibrometer with which the vibrations, in particular their frequency and amplitude, can be measured. Another measure is the force with which the bonding wedge of the bonder pushes the wire or ribbon onto the contact surface. There are different measuring options, one of which is the one with a piezo load cell.
Trotz der durch diese Messgeräte bewirkten Verbesserungen besteht nach wie vor ein Optimierungspotenzial bekannter Überprüfungsgeräte. So kommt es beim Bonden immer wieder zu Problemen und der Bonder steht in Verdacht, nicht immer einwandfrei zu arbeiten. Es besteht Unsicherheit darüber, ob der Ultraschallwandler richtig arbeitet und ob die Kraft richtig aufgebracht wird. Beides kann einzeln teilweise betrachtet werden, nicht aber gleichzeitig und aktiv. Despite the improvements made by these meters, there is still potential for optimization of known verification equipment. So it always comes with bonding problems and the Bonder is suspected of not always working properly. There is uncertainty as to whether the ultrasonic transducer is working properly and whether the force is applied properly. Both can be viewed individually, but not simultaneously and actively.
Offenbarung der ErfindungDisclosure of the invention
Es wird dementsprechend eine Vorrichtung zur Überprüfung mindestens einer Eigenschaft eines Bonders vorgeschlagen, welche die Nachteile bekannter Vorrichtungen zur Überprüfung zumindest weitgehend vermeidet und die eine Aussage darüber treffen lässt, ob der Bonder korrekt arbeitet.Accordingly, a device is proposed for checking at least one characteristic of a bonder which at least largely avoids the disadvantages of known devices for checking and which makes it possible to determine whether the bonder is working correctly.
Eine erfindungsgemäße Vorrichtung zur Überprüfung mindestens einer Eigenschaft eines Bonders mit einem Ultraschallwandler und einem Bondkeil umfasst eine erste Messvorrichtung zur Erfassung mindestens einer Schwingungseigenschaft eines von dem Ultraschallwandler ausgesendeten Ultraschalls und eine zweite Messvorrichtung zur Erfassung einer von dem Bondkeil auf eine Bondoberfläche aufgebrachten Kraft.A device according to the invention for checking at least one property of a bonder with an ultrasonic transducer and a bonding wedge comprises a first measuring device for detecting at least one vibration characteristic of an ultrasound emitted by the ultrasound transducer and a second measuring device for detecting a force applied by the bonding wedge to a bonding surface.
Unter einer Schwingungseigenschaft ist im Rahmen der vorliegenden Erfindung jede Eigenschaft zu verstehen, die eine Schwingung quantifiziert und/oder qualifiziert. Im Rahmen der vorliegenden Erfindung wird die Schwingungseigenschaft mittels der Amplitude und/oder Frequenz charakterisiert.In the context of the present invention, a vibration characteristic is any property that quantifies and / or qualifies a vibration. In the context of the present invention, the vibration characteristic is characterized by means of the amplitude and / or frequency.
Die erste Messvorrichtung kann im Wesentlichen senkrecht zu einer Aufbringungsrichtung der Kraft des Bondkeils auf die Bondoberfläche orientiert sein. Die erste Messvorichtung kann einen Vibrometer aufweisen. Die erste Messvorrichtung kann insbesondere zur Erfassung einer Frequenz und einer Amplitude des von dem Ultraschallwandler ausgesendeten Ultraschalls ausgebildet sein. Die zweite Messvorrichtung kann eine Kraftmessdose aufweisen. Die Bondoberfläche kann auf der Kraftmessdose angeordnet sein. Beispielsweise ist die Kraftmessdose eine Piezokraftmessdose. Die Vorrichtung kann zum gleichzeitigen Betreiben der ersten Messvorrichtung und der zweiten Messvorrichtung zur Überprüfung der mindestens einen Eigenschaft des Bonders ausgebildet sein. Die Vorrichtung kann in den Bonder integrierbar sein.The first measuring device may be oriented substantially perpendicular to a direction of application of the force of the bonding wedge on the bonding surface. The first measuring device can have a vibrometer. The first measuring device can be designed in particular for detecting a frequency and an amplitude of the ultrasound emitted by the ultrasound transducer. The second measuring device may have a load cell. The bonding surface can be arranged on the load cell. For example, the load cell is a piezoelectric load cell. The device may be designed for simultaneously operating the first measuring device and the second measuring device for checking the at least one property of the bonder. The device can be integrated in the bonder.
Die beschriebene Vorrichtung kann Teil eines Bonders sein, der einen Ultraschallwandler und einen Bondkeil aufweist. Dabei ist die Vorrichtung zumindest zeitweise in den Bonder integriert.The described device may be part of a bonder having an ultrasonic transducer and a bonding wedge. The device is at least temporarily integrated into the bonder.
Durch die erfindungsgemäße Vorrichtung kann überprüft werden, ob der Ultraschallwandler und der Bondkeil korrekt arbeiten. Beides kann aktiv und unter normalen Betriebsbedingungen des Bonders analysiert werden. Daher kann eine Aussage darüber getroffen werden, ob der Bonder korrekt arbeitet. So kann beispielsweise festgestellt werden, dass der von dem Ultraschallwandler ausgesendete Ultraschall unter Last, wie beispielsweise unter Bondkraft oder einem Bewegungswiderstand durch Reibung, zusammenbricht. Entsprechend kann die Funktion des Bonders im Einsatz analysiert werden und nicht nur einzelne Funktionen betrachtet werden. Ein Grundgedanke der vorliegenden Erfindung ist deshalb die Kombination von zwei Messgeräten zur Überprüfung der Funktion eines Bonders. Dieses Überprüfungsgerät kann und sollte in den Bonder integriert werden, damit jederzeit eine schnelle und einfache, aber aussagekräftige Prüfung erfolgen kann. Es ist aber ebenfalls denkbar, die Vorrichtung als mobiles Messgerät auszuführen und in den Bonder kurzzeitig zu integrieren.By the device according to the invention can be checked whether the ultrasonic transducer and the bonding wedge work correctly. Both can be analyzed actively and under normal operating conditions of the bonder. Therefore, a statement can be made as to whether the bonder is working properly. For example, it can be stated that the ultrasound emitted by the ultrasound transducer collapses under load, such as, for example, under bonding force or a movement resistance due to friction. Accordingly, the function of the bonder can be analyzed in use and not just individual functions are considered. A basic idea of the present invention is therefore the combination of two measuring devices for checking the function of a bonder. This verification device can and should be integrated into the Bonder, so that a quick and easy, but meaningful check can be made at any time. However, it is also conceivable to design the device as a mobile measuring device and to integrate it into the bonder for a short time.
Nur die Messung des Ultraschalls mit Ermittlung des Frequenzverlaufs und der Amplitude bei gleichzeitiger Ermittlung des Kraftverlaufs gibt einen Aufschluss über den Zustand des Bonders. Ansonsten kann der Zustand nur durch umfangreiche Versuche über Ausschlussverfahren bewertet werden.Only the measurement of the ultrasound with determination of the frequency curve and the amplitude with simultaneous determination of the force curve gives an indication of the condition of the bonder. Otherwise, the condition can only be assessed by extensive experiments on exclusion procedures.
Die Kombination von Analyse des Ultraschalls, bevorzugt mittels eines Vibrometers, bei gleichzeitiger Analyse des Kraftverlaufs ermöglicht eine fundierte Aussage über den Bonder. Entscheidend ist, dass auf einer definierten Oberfläche gebondet wird und dass immer genau im Messbereich des Vibrometers gebondet wird. Dann ist eine grafische Auswertung von Frequenz, Amplitude und Kraft in Abhängigkeit der Zeit möglich. Die Bondoberflache muss deshalb auf der Kraftmessdose fixiert werden. The combination of analysis of the ultrasound, preferably by means of a vibrometer, with simultaneous analysis of the force curve allows a sound statement about the bonder. It is crucial that bonding takes place on a defined surface and that bonding is always carried out exactly in the measuring range of the vibrometer. Then a graphical evaluation of frequency, amplitude and force as a function of time is possible. The bond surface must therefore be fixed to the load cell.
Kurze Beschreibung der ZeichnungenBrief description of the drawings
Weitere optionale Einzelheiten und Merkmale der Erfindung ergeben sich aus der nachfolgenden Beschreibung bevorzugter Ausführungsbeispiele, welche in der Figur schematisch dargestellt sind. Further optional details and features of the invention will become apparent from the following description of preferred embodiments, which are shown schematically in the figure.
Es zeigt:It shows:
Ausführungsformen der ErfindungEmbodiments of the invention
Die erste Messvorrichtung
Die zweite Messvorrichtung
Die Vorrichtung
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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DE102014212839.0A DE102014212839A1 (en) | 2014-07-02 | 2014-07-02 | Device for checking at least one property of a bonder |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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DE102014212839.0A DE102014212839A1 (en) | 2014-07-02 | 2014-07-02 | Device for checking at least one property of a bonder |
Publications (1)
Publication Number | Publication Date |
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DE102014212839A1 true DE102014212839A1 (en) | 2016-01-07 |
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DE102014212839.0A Withdrawn DE102014212839A1 (en) | 2014-07-02 | 2014-07-02 | Device for checking at least one property of a bonder |
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DE (1) | DE102014212839A1 (en) |
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2014
- 2014-07-02 DE DE102014212839.0A patent/DE102014212839A1/en not_active Withdrawn
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