DE102013219335A1 - Beleuchtungsvorrichtung mit Substratkörper - Google Patents

Beleuchtungsvorrichtung mit Substratkörper Download PDF

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Publication number
DE102013219335A1
DE102013219335A1 DE102013219335.1A DE102013219335A DE102013219335A1 DE 102013219335 A1 DE102013219335 A1 DE 102013219335A1 DE 102013219335 A DE102013219335 A DE 102013219335A DE 102013219335 A1 DE102013219335 A1 DE 102013219335A1
Authority
DE
Germany
Prior art keywords
coating
substrate body
lighting device
surface area
plastic material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
DE102013219335.1A
Other languages
German (de)
English (en)
Inventor
Matthias Loster
Getrud Kräuter
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siteco GmbH
Original Assignee
Osram GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram GmbH filed Critical Osram GmbH
Priority to DE102013219335.1A priority Critical patent/DE102013219335A1/de
Priority to CN201480053351.7A priority patent/CN105580500A/zh
Priority to PCT/EP2014/070266 priority patent/WO2015044144A1/de
Priority to EP14772328.2A priority patent/EP3050408A1/de
Publication of DE102013219335A1 publication Critical patent/DE102013219335A1/de
Ceased legal-status Critical Current

Links

Images

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0313Organic insulating material
    • H05K1/0353Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/036Multilayers with layers of different types
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203Fillers and particles
    • H05K2201/0206Materials
    • H05K2201/0209Inorganic, non-metallic particles
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03Conductive materials
    • H05K2201/032Materials
    • H05K2201/0323Carbon
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09009Substrate related
    • H05K2201/09118Moulded substrate
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10106Light emitting diode [LED]
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14Related to the order of processing steps
    • H05K2203/1476Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/202Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
DE102013219335.1A 2013-09-25 2013-09-25 Beleuchtungsvorrichtung mit Substratkörper Ceased DE102013219335A1 (de)

Priority Applications (4)

Application Number Priority Date Filing Date Title
DE102013219335.1A DE102013219335A1 (de) 2013-09-25 2013-09-25 Beleuchtungsvorrichtung mit Substratkörper
CN201480053351.7A CN105580500A (zh) 2013-09-25 2014-09-23 具有衬底本体的照明设备
PCT/EP2014/070266 WO2015044144A1 (de) 2013-09-25 2014-09-23 Beleuchtungsvorrichtung mit substratkörper
EP14772328.2A EP3050408A1 (de) 2013-09-25 2014-09-23 Beleuchtungsvorrichtung mit substratkörper

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102013219335.1A DE102013219335A1 (de) 2013-09-25 2013-09-25 Beleuchtungsvorrichtung mit Substratkörper

Publications (1)

Publication Number Publication Date
DE102013219335A1 true DE102013219335A1 (de) 2015-03-26

Family

ID=51619168

Family Applications (1)

Application Number Title Priority Date Filing Date
DE102013219335.1A Ceased DE102013219335A1 (de) 2013-09-25 2013-09-25 Beleuchtungsvorrichtung mit Substratkörper

Country Status (4)

Country Link
EP (1) EP3050408A1 (zh)
CN (1) CN105580500A (zh)
DE (1) DE102013219335A1 (zh)
WO (1) WO2015044144A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102015106865A1 (de) * 2015-05-04 2016-11-10 Osram Opto Semiconductors Gmbh Verfahren zum Herstellen eines Konverterbauteils

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102010017711A1 (de) * 2009-07-07 2011-01-13 Siteco Beleuchtungstechnik Gmbh Dreidimensionales LED-Trägerelement mit thermischer Leitfähigkeit
DE102009054840A1 (de) * 2009-12-17 2011-06-22 Poly-Tech Service GmbH, 67681 Leuchtmittel mit einer Mehrzahl von Leuchtdioden
DE102011086789A1 (de) * 2011-11-22 2013-05-23 Osram Gmbh Kühlkörper für Halbleiterleuchtvorrichtung mit Kunststoffteilen

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7196459B2 (en) * 2003-12-05 2007-03-27 International Resistive Co. Of Texas, L.P. Light emitting assembly with heat dissipating support
US7710045B2 (en) * 2006-03-17 2010-05-04 3M Innovative Properties Company Illumination assembly with enhanced thermal conductivity
KR20100112213A (ko) * 2009-04-06 2010-10-19 삼성전기주식회사 하이브리드층을 갖는 방열기판 및 조명용 모듈 기판

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102010017711A1 (de) * 2009-07-07 2011-01-13 Siteco Beleuchtungstechnik Gmbh Dreidimensionales LED-Trägerelement mit thermischer Leitfähigkeit
DE102009054840A1 (de) * 2009-12-17 2011-06-22 Poly-Tech Service GmbH, 67681 Leuchtmittel mit einer Mehrzahl von Leuchtdioden
DE102011086789A1 (de) * 2011-11-22 2013-05-23 Osram Gmbh Kühlkörper für Halbleiterleuchtvorrichtung mit Kunststoffteilen

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102015106865A1 (de) * 2015-05-04 2016-11-10 Osram Opto Semiconductors Gmbh Verfahren zum Herstellen eines Konverterbauteils

Also Published As

Publication number Publication date
WO2015044144A1 (de) 2015-04-02
EP3050408A1 (de) 2016-08-03
CN105580500A (zh) 2016-05-11

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Legal Events

Date Code Title Description
R163 Identified publications notified
R082 Change of representative

Representative=s name: BOEHMERT & BOEHMERT ANWALTSPARTNERSCHAFT MBB -, DE

R081 Change of applicant/patentee

Owner name: SITECO GMBH, DE

Free format text: FORMER OWNER: OSRAM GMBH, 80807 MUENCHEN, DE

R082 Change of representative

Representative=s name: BOEHMERT & BOEHMERT ANWALTSPARTNERSCHAFT MBB -, DE

R012 Request for examination validly filed
R002 Refusal decision in examination/registration proceedings
R003 Refusal decision now final