DE102013219335A1 - Beleuchtungsvorrichtung mit Substratkörper - Google Patents
Beleuchtungsvorrichtung mit Substratkörper Download PDFInfo
- Publication number
- DE102013219335A1 DE102013219335A1 DE102013219335.1A DE102013219335A DE102013219335A1 DE 102013219335 A1 DE102013219335 A1 DE 102013219335A1 DE 102013219335 A DE102013219335 A DE 102013219335A DE 102013219335 A1 DE102013219335 A1 DE 102013219335A1
- Authority
- DE
- Germany
- Prior art keywords
- coating
- substrate body
- lighting device
- surface area
- plastic material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 77
- 239000011248 coating agent Substances 0.000 claims abstract description 99
- 238000000576 coating method Methods 0.000 claims abstract description 99
- 239000000463 material Substances 0.000 claims abstract description 36
- 239000004033 plastic Substances 0.000 claims abstract description 31
- 229920003023 plastic Polymers 0.000 claims abstract description 31
- 230000005693 optoelectronics Effects 0.000 claims abstract description 8
- 230000017525 heat dissipation Effects 0.000 claims abstract description 7
- 239000004020 conductor Substances 0.000 claims description 20
- 238000004519 manufacturing process Methods 0.000 claims description 13
- 238000001746 injection moulding Methods 0.000 claims description 12
- 238000002347 injection Methods 0.000 claims description 8
- 239000007924 injection Substances 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 6
- 238000005286 illumination Methods 0.000 claims description 2
- 239000000843 powder Substances 0.000 claims description 2
- 238000005507 spraying Methods 0.000 claims description 2
- 238000007598 dipping method Methods 0.000 claims 1
- 239000000945 filler Substances 0.000 description 9
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 4
- 229910052799 carbon Inorganic materials 0.000 description 4
- 239000011231 conductive filler Substances 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 238000010292 electrical insulation Methods 0.000 description 3
- 230000009969 flowable effect Effects 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- -1 polypropylene Polymers 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- 239000004952 Polyamide Substances 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- 238000004049 embossing Methods 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 239000003973 paint Substances 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000001228 spectrum Methods 0.000 description 2
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- JUPQTSLXMOCDHR-UHFFFAOYSA-N benzene-1,4-diol;bis(4-fluorophenyl)methanone Chemical compound OC1=CC=C(O)C=C1.C1=CC(F)=CC=C1C(=O)C1=CC=C(F)C=C1 JUPQTSLXMOCDHR-UHFFFAOYSA-N 0.000 description 1
- 239000013590 bulk material Substances 0.000 description 1
- 239000012876 carrier material Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 244000005700 microbiome Species 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000006855 networking Effects 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 238000004382 potting Methods 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 239000012815 thermoplastic material Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/036—Multilayers with layers of different types
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/032—Materials
- H05K2201/0323—Carbon
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09118—Moulded substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
- H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102013219335.1A DE102013219335A1 (de) | 2013-09-25 | 2013-09-25 | Beleuchtungsvorrichtung mit Substratkörper |
CN201480053351.7A CN105580500A (zh) | 2013-09-25 | 2014-09-23 | 具有衬底本体的照明设备 |
PCT/EP2014/070266 WO2015044144A1 (de) | 2013-09-25 | 2014-09-23 | Beleuchtungsvorrichtung mit substratkörper |
EP14772328.2A EP3050408A1 (de) | 2013-09-25 | 2014-09-23 | Beleuchtungsvorrichtung mit substratkörper |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102013219335.1A DE102013219335A1 (de) | 2013-09-25 | 2013-09-25 | Beleuchtungsvorrichtung mit Substratkörper |
Publications (1)
Publication Number | Publication Date |
---|---|
DE102013219335A1 true DE102013219335A1 (de) | 2015-03-26 |
Family
ID=51619168
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE102013219335.1A Ceased DE102013219335A1 (de) | 2013-09-25 | 2013-09-25 | Beleuchtungsvorrichtung mit Substratkörper |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP3050408A1 (zh) |
CN (1) | CN105580500A (zh) |
DE (1) | DE102013219335A1 (zh) |
WO (1) | WO2015044144A1 (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102015106865A1 (de) * | 2015-05-04 | 2016-11-10 | Osram Opto Semiconductors Gmbh | Verfahren zum Herstellen eines Konverterbauteils |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102010017711A1 (de) * | 2009-07-07 | 2011-01-13 | Siteco Beleuchtungstechnik Gmbh | Dreidimensionales LED-Trägerelement mit thermischer Leitfähigkeit |
DE102009054840A1 (de) * | 2009-12-17 | 2011-06-22 | Poly-Tech Service GmbH, 67681 | Leuchtmittel mit einer Mehrzahl von Leuchtdioden |
DE102011086789A1 (de) * | 2011-11-22 | 2013-05-23 | Osram Gmbh | Kühlkörper für Halbleiterleuchtvorrichtung mit Kunststoffteilen |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7196459B2 (en) * | 2003-12-05 | 2007-03-27 | International Resistive Co. Of Texas, L.P. | Light emitting assembly with heat dissipating support |
US7710045B2 (en) * | 2006-03-17 | 2010-05-04 | 3M Innovative Properties Company | Illumination assembly with enhanced thermal conductivity |
KR20100112213A (ko) * | 2009-04-06 | 2010-10-19 | 삼성전기주식회사 | 하이브리드층을 갖는 방열기판 및 조명용 모듈 기판 |
-
2013
- 2013-09-25 DE DE102013219335.1A patent/DE102013219335A1/de not_active Ceased
-
2014
- 2014-09-23 WO PCT/EP2014/070266 patent/WO2015044144A1/de active Application Filing
- 2014-09-23 EP EP14772328.2A patent/EP3050408A1/de not_active Ceased
- 2014-09-23 CN CN201480053351.7A patent/CN105580500A/zh active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102010017711A1 (de) * | 2009-07-07 | 2011-01-13 | Siteco Beleuchtungstechnik Gmbh | Dreidimensionales LED-Trägerelement mit thermischer Leitfähigkeit |
DE102009054840A1 (de) * | 2009-12-17 | 2011-06-22 | Poly-Tech Service GmbH, 67681 | Leuchtmittel mit einer Mehrzahl von Leuchtdioden |
DE102011086789A1 (de) * | 2011-11-22 | 2013-05-23 | Osram Gmbh | Kühlkörper für Halbleiterleuchtvorrichtung mit Kunststoffteilen |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102015106865A1 (de) * | 2015-05-04 | 2016-11-10 | Osram Opto Semiconductors Gmbh | Verfahren zum Herstellen eines Konverterbauteils |
Also Published As
Publication number | Publication date |
---|---|
WO2015044144A1 (de) | 2015-04-02 |
EP3050408A1 (de) | 2016-08-03 |
CN105580500A (zh) | 2016-05-11 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
R163 | Identified publications notified | ||
R082 | Change of representative |
Representative=s name: BOEHMERT & BOEHMERT ANWALTSPARTNERSCHAFT MBB -, DE |
|
R081 | Change of applicant/patentee |
Owner name: SITECO GMBH, DE Free format text: FORMER OWNER: OSRAM GMBH, 80807 MUENCHEN, DE |
|
R082 | Change of representative |
Representative=s name: BOEHMERT & BOEHMERT ANWALTSPARTNERSCHAFT MBB -, DE |
|
R012 | Request for examination validly filed | ||
R002 | Refusal decision in examination/registration proceedings | ||
R003 | Refusal decision now final |