DE102013202212A1 - Two-stage molded sensor - Google Patents

Abstract

Electronic component, comprising a first circuit carrier (1), at least one electronic element (7, 8, 9) which is connected to the first circuit carrier (1) and at least one first housing (3), wherein the electronic component has at least one Dambar residual structure ( 6) for attachment.

Description

The invention relates to an electronic component, in particular designed as a sensor and / or actuator arrangement or sensor or actuator, a method for producing the electronic component and the use of the electronic component in motor vehicles.

Heretofore, usually thermoset molded, as a first housing, molded magnetic sensors using a carrier or preform with a thermoplastic material, as a second housing. An additional circuit is either mounted in the carrier / pre-molded part or molded together with the sensor transfer. Sensors for acceleration or yaw rate are fitted in a premold or transfer molded. These components are placed on an intermediate carrier, e.g. Printed circuit board, assembled and then mounted in a premold housing.

The invention is based on the object to propose an electronic component and a method for producing such an electronic component, which is relatively inexpensive and / or easy to manufacture and / or it allows in particular, to a carrier or carrier element for producing the second housing in an injection mold to renounce.

This object is achieved by the electronic component according to claim 1 and the method according to claim 12.

It is preferred that the electronic component is designed as a sensor and has at least one sensor element as an electronic element. Alternatively, preferably, the sensor component is designed as an actuator or as a combined sensor actuator.

A circuit carrier is preferably understood to be a leadframe or leadframe.

It is preferred that the electronic component has a fixing / shielding element, in particular comprising a fixing surface or a fixing plate, wherein the fixing / shielding element for positioning or fixing in a tool or injection mold tool for producing the electronic component and / or for shielding the at least one electronic element is formed before electromagnetic radiation. The fixing / shielding element is particularly preferably formed from metal or sheet metal. The fixing / shielding element is expediently designed as a shield.

The fixing / shielding element is preferably connected to the at least one Dambar residual structure, wherein this connection is in particular mechanical and optionally additionally electrical. In the case that the fixing / shielding element is used as a shielding element, it is particularly preferably electrically connected to a ground terminal.

It is expedient that at least one dambar residual structure is fastened to the first housing and in particular is not connected to the first circuit carrier, wherein this at least one dambar residual structure is particularly preferably anchored in the first housing and is electrically insulated within the first housing.

With the formulations at least partially surrounded or at least partially embedded, it is preferably expressed that something is partially or completely surrounded or embedded.

It is preferred that the first housing and the fixing / shielding element are at least partially embedded by a second housing, in particular by injection molding.

The electronic component preferably has, in particular in its first housing, at least one yaw rate sensor element and at least one two- or multi-axis acceleration sensor element or at least two uniaxial acceleration sensor elements, wherein the one or more acceleration sensor elements are designed such that they have a reference to a first sensitive acceleration measuring axis Measuring range, which is designed for an airbag sensor element, and at least with respect to a second sensitive acceleration measuring axis have a measuring range, which is designed for a vehicle dynamics control system sensor element. The first and the second acceleration measuring axis are particularly preferably oriented orthogonal to one another.

The electronic component is expediently designed so that the measuring range relative to the first sensitive acceleration measuring axis is greater than or equal to 25g 8g designed and that the measuring range based on the second sensitive acceleration measuring axis kleingleich 10g or smaller 20g is designed.

Alternatively, the electronic component is preferably designed so that the measuring range based on the first sensitive acceleration measuring axis is smaller than or equal to 8g or 20g or greater than 8g designed and that the measuring range relative to the second sensitive acceleration measuring axis in each case 8g is designed smaller.

The second housing or common housing of the electronic component is preferably formed from duroplastic or elastomer or thermoplastic.

The electronic component expediently comprises at least one magnetic field sensor element, wherein the electronic component is designed in particular as a speed sensor, particularly preferably as a wheel speed sensor, or as a displacement sensor.

The electronic component preferably has no carrier element which is designed for positioning in an injection molding tool and for receiving a raw electronic component. Such a carrier element is referred to in particular as a carrier or carrier element.

It is preferred that the at least first housing is at least partially surrounded by a decoupling cover or protective cover, which is at least partially surrounded by the second housing.

It is expedient that the fixing / shielding element has at least one positioning aid, which is designed for positioning in an injection molding tool, in particular in the positioning aid as a recess and / or anchor hole and / or lug to be held, in particular by means of one or more positioning pins of the injection molding tool , educated.

The method for producing an electronic component is preferably based on the idea that at least one electronic element is connected to a first circuit carrier, wherein the first circuit carrier is designed as a leadframe, which comprises a dambar, after which the at least one electronic element and the first circuit carrier at least partially in a first housing is embedded or poured or injected, after which the Dambar is partially removed and at least one Dambar residual structure is retained.

It is preferred that thereafter a fixing / shielding element is attached at least to a dambar residual structure.

The raw electronic component is then expediently positioned and / or fixed by means of the fixing / shielding element in an injection molding train, after which a second housing of injection molding is formed which at least partially embeds the first circuit carrier, the first housing and the fixing / shielding element.

It is expedient that in the injection molding tool at least one positioning of the injection molding tool is positively connected to a positioning of the fixing / shielding and / or that the fixing / shielding of at least two positioning pins, in particular oppositely arranged and opposite each other to movable positioning pins of the injection molding tool is clamped or fixed, after which, during or after the injection molding process to produce the second housing, the at least one positioning or all positioning pins are withdrawn and / or released from the fixing / shielding.

The electronic component preferably comprises, in particular in its first housing, at least one sensor element or sensor for yaw rate, acceleration, magnetic fields and in particular an ASIC, as signal processing circuit.

In addition, the electronic component expediently has additional electronic elements, in particular additional circuit elements, such as R, C, L, links / components, varistors, diodes, protective circuits. These additional electronic elements are preferably fastened to the first circuit carrier or first leadframe or connected thereto, in particular mechanically and electrically, and preferably in a single-or multi-element housing as the first housing or in an additional third housing.

The first and the optional third housing are preferably made of duroplastic or "premold" or "transfermold", ie in particular injection molded plastic.

The second housing or overall housing is preferably formed of "overmold" as injection-molded plastic.

The first housing, hereinafter also sometimes referred to as an IC body, is preferably connected to / on the fixing / shielding element or the fixing surface or mechanically / electrically connected / arranged.

The fixing / shielding element or the fixing surface preferably serves both as a shield against electromagnetic fields and electrostatic fields, as well as a positioning aid during the subsequent Overmoldens in the injection molding tool, whereby the second housing is formed.

It is expedient that further components, such as a permanent magnet, are fastened to this fixing plate, preferably on the side of the first leadframe, that is to say over the at least one electronic component "hanging", ie on the inside of the electronic component, or alternatively preferably on the other, the leadframe facing away, side of the fixing.

Alternatively, instead of the first leadframe, preferably a substrate, such as a printed circuit board or a ceramic carrier, used as a circuit carrier. This is then molded in particular transfer to form the first housing.

The electronic component preferably does not comprise a carrier which is fastened directly or indirectly to the first leadframe and is inserted into an injection-molding tool for encapsulating and forming the second housing according to the prior art.

The electronic component preferably comprises a first and a second interconnected leadframe. In particular, at least one sensor element and an ASIC are arranged on the first leadframe as signal processing circuit, which are injected together into a first housing. In addition, the electronic component has a fixing surface, with which the electronic component is positioned in an injection molding tool, for producing the second housing.

The electronic component expediently comprises an additional second leadframe from which, in particular, the contact connections or pins of a plug or connection terminal are formed.

Preferably, the first and the second leadframe are connected to each other prior to the production of the second housing.

It is expedient that the first housing is formed and the fixing surface is formed and arranged so that the first housing does not touch the fixing / shielding element or the fixing surface or do not touch each other.

It is preferred that in the course of Umspritzungsvorgangs for producing the second housing, ie the overmolding, the injection mold with at least two pins clamps or engages the fixing plate, after which the Overmoldvorgang is initiated, at the end of Overmoldvorgangs these at least two pins are withdrawn and release the fixing plate. Particularly preferably, the tool pins of the injection molding tool grip the fixing plate at at least one point, very particularly preferably at two points, for which purpose at least four tool pins, in each case two pairs, are used. Such a location of the fixing plate, can also be designed as a tab, which is formed in particular together with a Dambar residual structure.

It is expedient that the fixing / shielding element has a fixing surface, in particular as a shield-shaped body with at least one base surface, wherein the fixing surface is arranged above the at least one electronic component or wherein the fixing surface is arranged opposite to a mounting surface of the first leadframe, such that the at least one electronic component / electronic element which is fastened to this assembly surface is arranged between this assembly surface and the fixing surface.

The fixing / shielding element or the fixing surface is preferably designed to be electrically conductive and serves, in particular, as an EMC shielding surface. As a result, the at least one electronic component is electromagnetically shielded from one side by the component surface of the first leadframe and correspondingly shielded from the opposite side by the fixing surface.

The fixing / shielding element or the fixing surface is preferably connected to a residual structure of the dambar at at least one point. The connection or attachment of the fixing surface with one or more residual structures of the dambar has the advantage that they do not electrically fulfill any circuitry task, as most parts of the first lead frame, which would be short-circuited by attachment of the fixing surface. Particularly preferably, the fixing surface is connected to a residual structure of the dambar or dambar residual structure, which is not electrically connected directly to the first or second leadframe, but is held by the first housing made of plastic.

A dambar is preferably understood to mean a component or component that, during the production of the electronic component, in particular prior to the formation of the first housing, connects all legs or strands of at least the first leadframe and has a frame which is used for sealing during the injection molding process, in particular a transfer gold process, is used, in which the first housing is formed. This frame of the dambar or the dambar itself is particularly preferably inserted as a sealing ring in the injection-molded housing / injection mold at least partially or at least partially embraced. Normally, in the further manufacturing process according to the prior art, the dambar is completely removed so that the finished electronic component no longer has residual structures of the dambar, but only the first and / or second leadframes.

It is preferred that at least one dambar residual structure is and remains directly connected to the first and / or second leadframe or the first and / or second circuit carrier. In particular, additionally or alternatively, at least one dambar residual structure is not connected to any of the circuit carriers or leadframes, but only to the fixing shielding element and one or more connected to several housings, optionally with a protective cover.

The electronic component preferably has an acceleration sensor element, in particular a 1-axis, for relatively low accelerations, up to 5 g, as a chassis acceleration sensor element or vehicle dynamics control acceleration sensor element, and / or an acceleration sensor element, in particular a 1-axis, for relatively large accelerations, at least up to 100 g, as the airbag acceleration sensor element.

The connection between the fixing / shielding element or fixing plate and at least one residual structure of the dambar or dambar residual structure preferably takes place by means of welding.

Preferably, the first leadframe is arranged with the first housing and the fixing plate in a trough-shaped, prefabricated housing that is filled with a potting compound, whereby these potting compound and the trough-shaped housing together form the second housing, which then in this embodiment, not by injection molding or Overmolden is generated, see 4 , The trough-shaped premold housing has, in particular, an integrated plug, which has its contact terminals or pins formed by the second leadframe, which is connected to the first leadframe. In addition, the trough-shaped, prefabricated housing expediently comprises a plug collar, in which the contact terminals or pins protrude from the second housing.

It is preferred that the fixing / shielding element or the fixing plate has side skirts, these are used for shielding against electromagnetic radiation from the side and, if necessary, for heat dissipation during overmolding or during encapsulation process of the second housing.

The fixing / shielding element or the fixing plate preferably has mechanical stiffening means, such as stiffening ribs or webs for stiffening. This embodiment is particularly preferred for the arrangement with a plurality of electronic components, which are connected by a common fixing / shielding or fixing plate for the manufacturing process.

Conveniently, the fixing / shielding element or the fixing plate comprises one or more tabs. These are used in particular for the transport in the manufacturing process and / or the heat dissipation during overmolding and, if necessary, the heat dissipation during operation of the finished electronic component and are designed accordingly.

The electronic component alternatively or preferably additionally comprises at least one actuator element, for example a piezoelectric vibrator or an ultrasound transmitter, as the electronic element.

It is preferred that the fixing / shielding element or the fixing surface is formed as part of the second leadframe.

• – perforierte Fläche mit schlitzförmigen, ovalen oder runden Durchbrüchen zur Verbesserung des Moldflusses und zur festeren Verankerung im Mold. Auch nichtperforierte, bzw. durchgängige Flächen sowie partielle Durchbrüche sind möglich.
• – plane oder geformte Fläche. Ausformung so, dass die Seitenflächen wenigstens an einer Seite mit abgeschirmt sind oder über den Einzel-ICs tiefgezogene Taschen gestülpt werden. Fixierfläche liegt über mindestens einem Glied des Moldkörpers, deckt/schirmt dabei insbesondere zumindest den ASIC und das wenigstens eine Sensorelement ab. Die geformte Fläche der Fixierfläche ist besonders bevorzugt wannenförmig ausgebildet.
• – Beschichtung mit magnetischem u/o elektrisch leitfähigem Material zur Verbesserung des EMV- u/o. ESD-Verhaltens des ICs, beispielsweise Beschichtung mit Nickel.
• – An mindestens einer Stelle mit dem Leadframe des IC-Körpers verbunden. Als Verbindungstechnik sind Löten, Kleben, Sintern, Krimpen und Schweißen geeignet.
• – Freigestellte Teilflächen dienen zur Fixierung und Positionierung der Fläche während des Moldvorganges, sodass Positionier- oder Greifwerkzeuge während des Moldvorganges nicht den IC-Körper bzw. das erste Gehäuse berühren.
• – Fixierfläche kann mit Anschraublaschen versehen werden. Elektr. isoliert oder kontaktgebend
• – Fixierfläche ist Teil der Steckerpins bzw. der zweiten Leadframes, der die Steckerpins des Elektronikbauteils aufweist.
• – Fixierfläche ist im Steckerkörper-Vorspritzling vormontiert. IC-Körper wird mit diesem Vorspritzling kontaktiert und anschließend gemoldet.
• – Der erste Leadframe ist so montiert, dass die auf dem Leadframe montierten elektronischen Bauelemente, wie beispielsweise ein IC, Sensorelemente, körperlich zwischen dem ersten Leadframe, insbesondere dessen Bestückfläche, und der Fixierfläche zu liegen kommen. Dies dient zur Verbesserung des EMV-Verhaltens.
• – Fixierfläche kann aus Metall oder Kunststoff bestehen, wobei der Kunststoff ggfs. elektrische leitfähig beschichtet ist.
• – Fixierfläche dient zur mechanischen Versteifung des Mold-Körpers
• – Fixierfläche kann plan oder innerhalb der Fixierfläche gebogen sein. Insbesondere sind dabei die Fixierfläche und der erste Leadframe gleichförmig bzw. zueinander passend gebogen.
• – Fixierfläche dient als Befestigungsfläche für weitere Zusatzkomponenten, wie beispielsweise Magnete.

The fixing / shielding element or the fixing surface expediently has one or more of the following features:

• - perforated surface with slit-shaped, oval or round openings to improve the flow of the mold and to anchor it more firmly in the mold. Even non-perforated or continuous surfaces as well as partial breakthroughs are possible.
• - plane or shaped surface. Forming so that the side surfaces are screened at least on one side with or over the single ICs thermoformed bags are placed. Fixing surface is located over at least one member of the mold body, covers / shields in particular at least the ASIC and the at least one sensor element. The shaped surface of the fixing surface is particularly preferably trough-shaped.
• - Coating with magnetic u / o electrically conductive material to improve the EMC u / o. ESD behavior of the IC, for example coating with nickel.
• - Connected to at least one point with the leadframe of the IC body. As a joining technique soldering, gluing, sintering, crimping and welding are suitable.
• - Separated faces serve to fix and position the surface during the molding process, so that positioning or gripping tools do not touch the IC body or the first housing during the molding process.
• - Fixing surface can be provided with mounting plates. Electrically insulated or contactor
• - Fixing surface is part of the connector pins and the second leadframes, which has the connector pins of the electronic component.
• - Fixing surface is pre-assembled in the plug body pre-molded part. IC body is contacted with this preform and then gemoldet.
• - The first leadframe is mounted so that the electronic components mounted on the leadframe, such as an IC, sensor elements, physically between the first leadframe, in particular its Bestückfläche, and the fixing surface come to rest. This serves to improve the EMC behavior.
• - Fixing surface may be made of metal or plastic, wherein the plastic if necessary. Is coated electrically conductive.
• - Fixing surface is used for mechanical stiffening of the mold body
• - Fixing surface can be flat or bent within the fixation. In particular, the fixing surface and the first leadframe are uniformly bent or matched to one another.
• - Fixing surface serves as a mounting surface for other additional components, such as magnets.

Preferably, the first housing is plasma treated prior to molding to remove contaminants and improve the adhesion of the overmold material to the IC body / housing.

The first leadframe is preferably bent in the region of the connection pins in a freely selectable angle relative to the first housing and its orientation and thus gemoldet / overmolded.

The molding process, in particular overmolding, is preferably carried out as an injection molding, transfer molding, RIM, hotmelt, compression molding or casting process.

The fixing / shielding element or the fixing surface is preferably positioned in the injection molding tool via at least one movable positioning pin or hold-down device. During the molding process, these hold-downs are withdrawn and the liberated cavities filled with mold material.

The fixing / shielding element or shielding / fixing surface preferably contains holes and / or outbreaks and / or slots for transport, for adjustment and for fixing. This is advantageous for the overmold equipment or the alignment and / or attachment and / or positioning in the injection molding tool.

The fixing / shielding element or the shielding / fixing surface is preferably carried out with side skirts for better EMC protection and as additional heat dissipation (mold flow baffle).

The fixing / shielding element or the shielding / fixing surface may expediently also serve for fastening a plurality of sensors or a common network / bundle / module / cluster of electronic components which have a common fixing / shielding element. This allows the sensors to be positioned very accurately to each other.

By means of special stiffening ribs or formations of the fixing / shielding element or the fixing surface, preferably an increased rigidity can be achieved and a curvature of the net / bundle / module / cluster of electronic components as a result of the overmold process can be prevented.

The fixing / shielding element or shielding plate / the fixing surface preferably contains formations acting as a fastening clip. As a result, the first housing or the IC is fixed so that it remains on the fixing plate or the fixing surface during the subsequent process steps. In addition, the clamp serves as a heat sink / Wärmeleitblech during Overmoldvorganges and during operation.

On the fixing / shielding element or in the shielding plate, additional plastic clips are preferably applied, which serve for fixing the first housing or ICs. In addition, the clips serve as thermal protection during the overmold process. These clips can be molded, glued or mechanically fastened (e.g., riveted) to the fixation plate.

In addition to or as an alternative to the sensor elements for the yaw rate and the acceleration, other sensor elements, at least one other sensor element, for physical measured variables, such as, for example, can also be used. Pressure, magnetic fields, temperature, sound, structure-borne noise in the IC or first housing are used.

The decoupling cover or protective cover is expediently formed partially or over the entire surface. This sleeve is used in particular for stress decoupling of the first housing and is designed accordingly, this stress arises during a temperature change between the first housing and the overmold material. In addition, it serves as a heat shield during the overmold process by preventing direct contact of the first housing with the overmold material. The wrapping material is particularly preferably made of a flexible material, e.g. Silicone or PU material, in particular silicone gel.

In addition, the invention preferably relates to an arrangement in which a common fixing / shielding element or a common fixing surface connects a plurality of electronic components. In this case, the fixing surface in particular holding elements, such as holes / index holes or slots, with which the entire assembly can be moved or transported in the course of production, in particular on a common conveyor belt. The fixing surface particularly preferably ensures defined relative positions between the electronic components of the arrangement and / or serves for the adjustment. For the exemplary embodiment of such an arrangement, see 6 ,

The invention also relates to the use of the electronic component in motor vehicles.

Further preferred embodiments will become apparent from the subclaims and the following descriptions of exemplary embodiments with reference to figures.

They show in a schematic, exemplary representation

1 an embodiment of the electronic component without second encapsulation / Overmold from the side view and top view; the dambar residual structures, which remain stationary and continue to be used in the electronic component, for example for fixing the fixing surface, are marked gray,

2 an exemplary electronic component with a second housing made of overmold from the side view and top view, wherein in the plan view tabs of the fixing surface are shown for attachment, which are connected to the dambar residual structures. These tabs are shown in the leftmost plan view and one at the top and one at the bottom in the region of the first housing,

3 an embodiment in which the first housing is surrounded by a decoupling cover or protective cover, which is then embedded by the second housing in its overmold,

4 an exemplary embodiment in which instead of an overmold housing as a second housing, a premold housing is used, in which the arrangement of the first leadframe, first housing with additional protective cover, for example, silicone gel, and fixing surface is arranged in and is cast with potting compound. The second leadframe or connector leadframe is integrated in the premold housing,

5 an electronic component formed by way of example as a pressure sensor, as well as

6 an arrangement of a plurality of pressure sensors according to 5 , which are connected by means of a common fixing surface and positioned to each other and form a cluster or array.

The embodiment of the electronic component 1 includes a first leadframe 1 on which a sensor element 7 and a signal processing circuit / ASIC 8th , Are arranged on a mounting island, not shown, and in the first housing 3 are embedded from duroplastic. The electronic component includes a dambar 13 of the first leadframe 1 or assigned to this. The gray marked areas become after removal of the other Dambarteile as Dambar remainder structures 6 stand or remain. On the dambar rest structures 6 are connection points 16 , marked as small squares, on which the Dambar residual structures by means of connecting webs with a fixing / shielding element 5 or a fixing plate are connected. The electronic component also has an additional third housing 4 thermoset on, which also with the first leadframe 1 is connected, and in which additional circuit elements or protective circuit elements 14 are integrated. The ends 15 of the first leadframe 1 are formed as contact terminals or pins of the electronic component.

Starting from 1 is in 2 an embodiment of the electronic component shown, which is a second housing 10 as an overall housing made of overmold, in which the first leadframe 1 except for its ends as contact terminals, the first and second housings 3 . 4 and the fixing / shielding element 5 are embedded. The dambar remnants are also in second housing 10 embedded. On fixing / shielding element 5 is on the inside of the electronic component, a magnet or permanent magnet 17 arranged by way of example.

Based on 3 an embodiment of the electronic component is illustrated, wherein the first housing 3 from a decoupling cover 11 or protective cover from Globe Top or a silicone gel is surrounded. decoupling sleeve 11 and fixing / shielding element 5 are of second housing 10 surrounded by overmold together. First leadframe 1 is with a second leadframe 2 at a junction 18 connected, for example by welding. Second leadframe 2 partially protrudes from second housing 10 out, which is a plug collar 21 forms, in which contact terminals or connecting pins are formed by the second leadframe.

4 shows an embodiment of an electronic component, wherein the second housing 10 through a prefabricated trough-shaped body 19 , for example from Premold, as well as potting material 20 is formed. First leadframe 1 , with the first case 3 The example according to a decoupling cover 11 is embedded, and the fixing plate 5 are in trough-shaped, prefabricated housing 19 arranged that with potting compound 20 is filled up. The trough-shaped premold housing 19 has an integrated plug or plug collar 21 on, whose contact terminals or pins through the second leadframe 2 be formed with the first leadframe 1 in the connection area 18 connected is.

5 show an exemplary electronic component with first leadframe 1 on which a pressure sensor element 7 and an electronic signal processing circuit 8th , jointly embedded in the first housing 3 , as well as additional circuit elements 14 , embedded in third case 4 , are arranged. The electronic component has dambar residual structure 6 on, by means of which, inter alia, fixing / shielding 5 is attached. There is also a second leadframe 2 for contacting to the outside or for contacting other electronic components, connected to the first leadframe. The electronic component has a membrame 24 which is arranged in a channel to the pressure sensor element 7 leads. The electronic component comprises a common overmold housing, as a second housing 10 ,

Based on 6 is an exemplary arrangement or a cluster of several electronic components, for example, as in 5 illustrated, illustrated. The electronic components have a common fixing / shielding element 5 on which positioning aids 12a and 12b includes, for positioning and fixing in an injection molding tool. First leadframes 1 are with the second leadframe 2 at joints 18 connected. The two electronic components each comprise a first and a second housing 3 . 4 made of thermoset, dambar residual structures 6 to which the fixing / shielding element 5 is attached and a common second housing 10 , Second, common housing 10 made of overmold includes placket collar 21 in which the contact terminals of the second leadframe 2 flow through an assembly aid 23 are supported.

Claims (15)

Electronic component comprising a first circuit carrier ( 1 ), at least one electronic element ( 7 . 8th . 9 ), which is connected to the first circuit carrier ( 1 ), and at least one first housing ( 3 ), characterized in that the electronic component has at least one Dambar residual structure ( 6 ) for attachment. Electronic component according to claim 1, characterized in that this is designed as a sensor and at least one sensor element as an electronic element ( 7 . 8th . 9 ) having. Electronic component according to Claim 1 or 2, characterized in that it has a fixing / shielding element ( 5 ), which is designed for positioning in a tool for producing the electronic component and / or for shielding the at least one electronic element from electromagnetic radiation. Electronic component according to at least one of claims 1 to 3, characterized in that the fixing / shielding element ( 5 ) with the at least one Dambar residual structure ( 6 ) connected is. Electronic component according to at least one of claims 1 to 4, characterized in that at least one dambar residual structure ( 6 ) on the first housing ( 3 ) and in particular not with the first circuit carrier ( 1 ) connected is. Electronic component according to at least one of claims 1 to 5, characterized in that the first housing ( 3 ) as well as the fixing / shielding element ( 5 ) at least partially from a second housing ( 10 ), in particular formed from injection molding, are embedded. Electronic component according to at least one of claims 1 to 6, characterized in that this, in particular in its first housing ( 3 ), at least one yaw rate sensor element and at least one two- or multi-axis acceleration sensor element or at least two uniaxial acceleration sensor elements, wherein the one or more acceleration sensor elements are configured so that they have at least with respect to a first sensitive acceleration measuring axis a measuring range, which is designed for an airbag sensor element , and at least with respect to a second sensitive acceleration measuring axis have a measuring range, which is designed for a vehicle dynamics control system sensor element. Electronic component according to claim 7, characterized in that the measuring range based on the first sensitive acceleration measuring axis is the same size 25g designed and that the measuring range based on the second sensitive acceleration measuring axis kleinergleich 10g is designed. Electronic component according to at least one of claims 1 to 8, characterized in that it has no carrier element, which is designed for positioning in an injection molding tool and for receiving a raw electronic component. Electronic component according to at least one of claims 1 to 9, characterized in that the at least first housing ( 3 ) at least partially by a decoupling cover ( 11 ) surrounded at least partially by the second housing ( 10 ) is surrounded. Electronic component according to at least one of claims 1 to 10, characterized in that the fixing / shielding element ( 5 ) at least one positioning aid ( 12 ), which is designed for positioning in an injection molding tool, in particular, the positioning aid is a recess and / or or anchoring hole and / or tab for holding are formed. Method for producing an electronic component, in particular an electronic component according to at least one of claims 1 to 11, wherein at least one electronic element ( 7 . 8th . 9 ) with a first circuit carrier ( 1 ), wherein the first circuit carrier is designed as a leadframe, which has a dambar ( 6 . 13 ), whereby the at least one electronic element ( 7 . 8th . 9 ) and the first circuit carrier ( 1 ) at least partially into a first housing ( 3 ), characterized in that thereafter the dambar ( 13 ) is partially removed and at least one Dambar residual structure ( 6 ) preserved. Method according to claim 12, characterized in that a fixing / shielding element ( 5 ) at least on a Dambar residual structure ( 6 ) is attached. A method according to claim 13, characterized in that the raw electronic component by means of the fixing / shielding ( 5 ) is positioned and / or fixed in an injection molding train, after which a second housing ( 10 ) is formed from injection molding, which the first circuit carrier ( 1 ), the first housing ( 3 ) as well as the fixing / shielding element ( 5 ) at least partially embeds. A method according to claim 13 or 14, characterized in that in the injection molding tool at least one positioning of the injection molding tool with a positioning aid of the fixing / shielding ( 5 ) is positively connected and / or that the fixing / shielding ( 5 ) is clamped by at least two positioning pins of the injection molding tool, after which during or after the injection molding process to produce the second housing ( 10 ) the at least one positioning pin or all positioning pins are withdrawn and / or from the fixing / shielding element ( 5 ) are solved.

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